CN101305495A - Waveguide junction - Google Patents
Waveguide junction Download PDFInfo
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- CN101305495A CN101305495A CNA2006800422651A CN200680042265A CN101305495A CN 101305495 A CN101305495 A CN 101305495A CN A2006800422651 A CNA2006800422651 A CN A2006800422651A CN 200680042265 A CN200680042265 A CN 200680042265A CN 101305495 A CN101305495 A CN 101305495A
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- ground floor
- waveguide junction
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- 230000008878 coupling Effects 0.000 claims abstract description 49
- 238000010168 coupling process Methods 0.000 claims abstract description 49
- 238000005859 coupling reaction Methods 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000011810 insulating material Substances 0.000 claims description 5
- 238000009413 insulation Methods 0.000 claims description 5
- 238000003801 milling Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000004809 Teflon Substances 0.000 description 3
- 229920006362 Teflon® Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S13/00—Systems using the reflection or reradiation of radio waves, e.g. radar systems; Analogous systems using reflection or reradiation of waves whose nature or wavelength is irrelevant or unspecified
- G01S13/88—Radar or analogous systems specially adapted for specific applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/28—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring the variations of parameters of electromagnetic or acoustic waves applied directly to the liquid or fluent solid material
- G01F23/284—Electromagnetic waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
- G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P5/00—Coupling devices of the waveguide type
- H01P5/08—Coupling devices of the waveguide type for linking dissimilar lines or devices
- H01P5/10—Coupling devices of the waveguide type for linking dissimilar lines or devices for coupling balanced lines or devices with unbalanced lines or devices
- H01P5/107—Hollow-waveguide/strip-line transitions
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Computer Networks & Wireless Communication (AREA)
- Thermal Sciences (AREA)
- Fluid Mechanics (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Waveguides (AREA)
Abstract
According to one exemplary embodiment of the present invention, a waveguide junction is specified for a filling level radar, which junction has a printed circuit board in which a resonator is integrated. The resonator is used together with a coupling element to output radio-frequency waves from a supply line, which is likewise integrated in the printed circuit board, into a waveguide which is screwed to the printed circuit board. There is therefore no need for any external resonator.
Description
Related application
The present invention requires the priority of U.S. Provisional Patent Application of submitting on November 14th, 2,005 60/736,460 and the German patent application of submitting on November 14th, 2,005 102005054233.6, and its content is incorporated herein by reference.
Technical field
The present invention relates to level gauging.Especially, the present invention relates to a kind of waveguide junction that is used for fill level radar, a kind of fill level radar that is used for determining jar material level is used for the application of level gauging and a kind of method that is used to make this waveguide junction with waveguide junction.
Background technology
The disclosed apparatus for measuring charge level that utilizes electromagnetic wave to measure material level has the electromagnetic electronic equipment of generation.The electromagnetic wave that is generated for example is directed to antenna by coaxial conductor subsequently, and is coupled by corresponding Coupling device and is input in the antenna.
US0030141940A1 and US0030168674A1 have exemplarily addressed two kinds of little band waveguide junctions, and wherein high frequency substrate and coupling element all together stretch in the waveguide respectively.Yet in two documents, waveguide all must be sealed with resonator at the opposite side of circuit board.This resonator must very accurately align.For (under the identical pack situation of the radiation that antenna sent) reduces device size, what be worth expectation is to improve the electromagnetic frequency that is generated.Yet, also improved requirement thus, and also improved requirement receiving element and analytic unit for the electromagnetic electronic equipment of generation.Especially, it is important in this that the electromagnetic wave that realization will send in the waveguide maybe will be from the electromagnetic more pure coupling input or the coupling output of waveguide reception, wherein should be coupled input or coupling output link to each other antenna with electronic equipment.
Summary of the invention
Task of the present invention is that improved coupling output or the coupling input of high frequency waves from conductor to waveguide is provided.
According to one embodiment of present invention, a kind of waveguide junction that is used for fill level radar is provided, the coupling output unit that this waveguide junction comprises multilayer circuit board, is used for the lead-in wire of guide electromagnetic waves and is used for electromagnetic wave is outputed to from the lead-in wire coupling waveguide, this coupling output unit comprises the coupling element resonant cavity, and wherein this resonant cavity is integrated in the circuit board.
Therefore, waveguide junction has coupling device, and this coupling device is integrally embedded in the circuit board, does not need external resonator.Or rather, electromagnetic wave directly carries out in circuit board from the coupling output that goes between to waveguide.Be integrated in the circuit board by the output unit that will be coupled, can during the manufacture process of circuit board or the course of processing, integrally make the coupling output unit.Because be not designed for the external resonator of coupling output unit, thus the problem related do not had at this with mechanical tolerance yet, and this problem can occur under situation about resonator being installed on the circuit board.
Circuit board has a plurality of track plans (Leitungsebenen), and these track plans are connected with each other by electric penetrating part (Druchfuehrungen), and can support corresponding electronic unit.
According to another embodiment of the present invention, circuit board comprises the ground floor and the second layer, and the output unit that wherein is coupled is integrated in the ground floor, and wherein the second layer has insulating material, and wherein the second layer is arranged on the ground floor, makes it cover the coupling output unit.
According to another embodiment of the present invention, waveguide junction comprises the 3rd layer in addition, and the 3rd layer is arranged between the ground floor and the second layer, and wherein ground floor is embodied as the circuit board substrate material of insulation, and wherein the 3rd layer be the metallide that approaches.
According to this embodiment of the invention, the resonator of the coupling output unit circuit board substrate material that is positioned at insulation wherein can cover with metallide.On this metallide, can the second layer be set in the mode of plate subsequently.Thus, form the sandwich-like thing that constitutes by the circuit board substrate and the second layer, between the circuit board substrate and the second layer, be provided with metallide.This metallide is used as the ground plane (Masseflaeche) of the microstripline on the second layer on the one hand, on the other hand as the wave guide wall in the resonator of coupling output unit.
According to another embodiment of the present invention, ground floor contains metal.
In this case, need not the metallide of the 3rd layer of form.
According to another embodiment of the present invention, the coupling output unit is embodied as the coupling element that links to each other with resonator.
Resonator can be the cavity in the ground floor, and this cavity for example generates by etching technics, milling process or bore process or the like.
According to another embodiment of the present invention, resonator has and the corresponding degree of depth of the thickness of ground floor.
In this case, the cavity of resonator for example can be simply, and (with the form of the through hole of ground floor) got out by ground floor, and perhaps ground floor can be simply by erosion is saturating fully.
According to another embodiment of the present invention, the second layer is a high frequency substrate.
At this, for example can relate to Rogers RT Duroid.Thus, the coupling of the high frequency waves propagated in the second layer may be input in the resonator, make high frequency waves further to be coupled to be input in (for example outside) waveguide.
According to another embodiment of the present invention, ground floor is a high frequency substrate.
According to another embodiment of the present invention, resonator is filled with dielectric.
According to another embodiment of the present invention, the second layer has the penetrating part in the zone of coupling output unit, so that provide pressure balance between resonator and environment.
Thus, when high temperature fluctuation occurring, can avoid the cracking of multilayer.Otherwise this temperature fluctuation meeting causes the huge pressure differential between resonator inside and the environment.
According to another embodiment of the present invention, lead-in wire is integrated in the second layer basically.
Possible in this way is that coupling output unit and lead-in wire integrally are fabricated during the manufacture process of support plate.In this case, the mechanical registeration between coupling output unit and the lead-in wire no longer is necessary, because these two is integrated in the support plate regularly.
According to another embodiment of the present invention, lead-in wire is implemented as little band.
According to another embodiment of the present invention, lead-in wire is implemented as and is used to guide the electromagnetic wave with the frequency between 60GHz to 100GHz, and the output unit that wherein is coupled is implemented as the electromagnetic wave that is used for having in the frequency between the 60GHz to 100GHz and outputs to waveguide from the lead-in wire coupling.
Thus, provide the coupling output of frequency electromagnetic waves from circuit board to waveguide, this coupling output is also implemented the frequency that surpasses 60GHz, and can appearance and mechanical tolerance or the related problem of aligning at this.
According to another embodiment of the present invention, waveguide junction is integrally made in course of manufacturing printed circuit board.
According to another embodiment of the present invention, provide a kind of fill level radar, this fill level radar is implemented the material level that is used for determining jar.This fill level radar comprises: be used to launch and/or receive electromagnetic antenna, be used for electromagnetic wave is presented feeding means to antenna, wherein feeding means has the waveguide that is used for electromagnetic wave transmission between antenna and lead-in wire in addition, and wherein feeding means has above-mentioned waveguide junction.
This fill level radar does not have outside resonator, is input in the waveguide with the high frequency waves coupling that will be generated.Or rather, resonator directly is integrated in the circuit board.Thus, the tolerance issues of having avoided resonator to install.In addition, reduced the number of machine components, this causes mounting cost to reduce again.Especially, this fill level radar also is suitable for surpassing the high frequency radiation of 60GHz.
According to another embodiment of the present invention, waveguide links to each other with support plate by fixture, makes electromagnetic wave to output to the waveguide from the lead-in wire coupling by the coupling output unit.
In addition, the present invention has also illustrated the application that will waveguide junction according to the present invention be used for level gauging.
In addition, a kind of method that is used to make this waveguide junction is provided, ground floor wherein is provided, made up and be used for electromagnetic wave is outputed to resonator waveguide, the ground floor from lead-in wire coupling, made up the second layer, and made up be used for guide electromagnetic waves, basically at the lead-in wire of the second layer, wherein resonator is integrated in the ground floor.
Thus, provide a kind of method, provide the whole waveguide junction of making during the circuit board manufacture process by this method.At this, resonator is the whole part of circuit board.
According to another embodiment of the present invention, this method also has the 3rd layer structure, and the 3rd layer is arranged between the ground floor and the second layer, and wherein ground floor is embodied as the circuit board substrate material of insulation, and wherein the 3rd layer contain metal.
According to another embodiment of the present invention, the structure of coupling output unit comprises etch step, milling step or laser drill step, in case of necessity, has followed metallization step after this step.
Additional embodiments of the present invention, task and advantage are by obtaining in the dependent claims.
Hereinafter with reference to accompanying drawing the preferred embodiments of the present invention are described.
Fig. 1 shows the schematic sectional view of waveguide junction according to an embodiment of the invention.
Fig. 2 shows the schematic sectional view of waveguide junction according to another embodiment of the present invention.
Fig. 3 shows the schematic plan of waveguide junction according to an embodiment of the invention.
Fig. 4 shows the schematic diagram of fill level radar according to another embodiment of the present invention.
Fig. 5 shows exemplary prior art.
View in the accompanying drawing is schematically and not to conform with ratio.During accompanying drawing was below described, identical or similar element used identical reference number.
The schematic sectional view of the waveguide junction that Fig. 1 shows is according to an embodiment of the invention, be used for fill level radar.As seeing in Fig. 1, waveguide junction 100 mainly has circuit board 120, and this circuit board is made of a plurality of layers (104,105,115), and resonant cavity 102 is embedded in these layers.Downside at circuit board 120 is provided with the layer that high frequency substrate 105 constitutes tabularly.Microstripline 107 (to this also can referring to Fig. 3) is arranged on high frequency substrate 105, and this microstripline is used for electromagnetic wave is transferred to coupling element 121 from signal source (not shown in Figure 1).Coupling element 121 for example is the extension of microstripline 107, and this extension guides in the waveguide that is made of guide blocks (Hohlleiterstueck) 103 resonant cavity 102.
Lead-in wire 107 for example also may be embodied as strip line or implements in tri-plate (Triplate).In tri-plate, lead-in wire 107 is arranged in internal layer.
Waveguide 103 is connected on the high frequency substrate 105, and wherein this high frequency substrate for example can be RogersRT Duroid or teflon (Teflon) or another insulating material.Waveguide can be adhered on the substrate 105 at this.Perhaps as shown in fig. 1, waveguide can by fixture 110,111 and waveguide junction 100 twist close, riveted joint, bolt be connected, perhaps otherwise fix.In present case, fixture 111 is flanges, and it links to each other with waveguide is fastening.Fixture 110 for example is a screw rod, and this screw rod passes sandwich-like thing 120 and locks with corresponding nut 116 overleaf.
Resonant cavity is for example made by milling or boring.If forward little size to, then particularly also can consider lithographic method, as in the course of manufacturing printed circuit board or employed in the semiconductor processing techniques.Especially, by photolithographic structuresization and lithographic method, can be implemented in micrometer range or more among a small circle in size.
The possibility that another kind is used to make resonator is a laser drill, wherein by laser beam circuit board material is removed.
During making waveguide junction 100, resonant cavity 102 is introduced in the board layer 104.Board layer 104 for example can be glass fiber-reinforced epoxy resin net (for example FR-4).Ifs circuit flaggy 104 is made of insulating material, then is provided with metallide 106 at the back side of board layer 104, and this metallide can be applied in after the resonant cavity 102 of will leaving a blank out.Subsequently, high frequency substrate 105 is adhered to, and this high frequency substrate 105 for example has the thickness of 0.127mm.Nature, according to electromagnetic frequency or requirement, other thickness also may.
According to one embodiment of present invention, the degree of depth 112 of resonant cavity is corresponding to the thickness 113 of board layer 104.In present case, the degree of depth 112 of resonant cavity is less than the thickness 113 of board layer 104.The diameter of resonant cavity 102 is for example corresponding to the diameter of waveguide 103.
In addition, designed passage (via) 108, it passes high frequency substrate 105 metal level 106 between high frequency substrate 105 and the board layer 104 is linked to each other with the back side 117 of high frequency substrate 105.This path 10 8 is for example implemented circularly.Nature, other cross sections also are possible.In addition, path 10 8 can be used to aim at waveguide 103.For this reason, waveguide 103 can have locking pin, and it is coupled in the recess of path 10 8.Yet this locking pin 118 is optional.
Waveguide junction is formed by circuit board 120, and wherein this circuit board is embodied as multilayer circuit board (Multilayer).Multilayer circuit board comprises board layer 104 and the setting board layer 115 thereon that supports resonant cavity 102 at this, and this board layer 115 is for example implemented by exotic material (for example FR-4).Between two board layers 104,115, for example be provided with metal level 119.In addition, passage 114 (via) can be set, it is connected with the metallide on the downside of the upside of the board layer 115 on top and high frequency substrate 105 and/or with layer 119 or 106 conduction of inside.
Upside at board layer 115 can be provided with electronic unit 122,109, and these electronic units for example can be analytical electron equipment, perhaps also can be the electronic equipment that is used to generate high frequency waves.
In addition, resonant cavity can be filled with suitable dielectric (for example teflon or circuit board material).
Fig. 2 shows the schematic sectional view of waveguide junction according to another embodiment of the present invention.Waveguide junction shown in Fig. 2 corresponds essentially to the waveguide junction among Fig. 1.Yet layer 104 is not to be embodied as insulating circuit board at this, but is embodied as metallic plate, and this metallic plate has the hole that mills out that is used for resonant cavity 102.
Because the enforcement metal of plate 104, conduction is so need not metal level 106 between plate 104 and high frequency substrate 105.Fastening screw 110 can be directly and metallic plate 104 twist and close, perhaps otherwise be fixed on the metallic plate 104.Fastening screw 110 is unnecessary by the penetrating part of whole multilayer circuit board 120.
Fig. 3 shows the schematic diagram of waveguide junction according to an embodiment of the invention with vertical view.As can see from Figure 3, little band waveguide junction has lead-in wire, and this lead-in wire is embodied as microstripline by the metallide 107 of band shape on high frequency substrate 105 back sides.This lead-in wire is used for frequency electromagnetic waves is guided to coupling element 121 and resonant cavity 102 (and reverse leading) from signal source.
In addition, designed path 10 8,302,303,304,305,306,307, they are connected to each other to two metallization object planes on the upside of major general's high frequency substrate 105 and the downside.These passages also can pass through the entire circuit plate, and thus a plurality of metal layers (for example 105,119) are connected to each other.These path 10s 8,302 to 307 for example can be implemented circularly, and advantageously, additionally can also be used for the aligning purpose of waveguide 103.For this reason, corresponding locking pin 118 can be installed in waveguide 103.Yet this is not must be necessary, because waveguide 103 also can otherwise be adjusted.
In addition, can see hole 301 in Fig. 3, it is used for the air balance between resonant cavity and environment or waveguide.
The size of little band waveguide junction can be at the frequency of for example 60GHz to 100GHz and is designed.Little band waveguide junction according to the present invention also can be implemented at higher frequency simply, and its mode is that size is correspondingly reduced.
Fig. 4 shows the schematic diagram of fill level radar according to an embodiment of the invention.The fill level radar that is designed for the material level in determining jar comprises the antenna 401 that is used to launch or receive electromagnetic wave 403,404 at this, and comprises and be used for electromagnetic wave is presented feeding means 402 to antenna.Feeding means has waveguide 103 in addition, is used at the antenna 401 and the transmission electromagnetic wave 403,404 between 107 that goes between.In addition, feeding means 402 has as the little band waveguide junction described at Fig. 1 to 3.
Figure 5 illustrates from microstripline 107 to waveguide 103 a kind of disclosed knot.High-frequency signal by the microstripline guiding arrives waveguide 103 by coupling element 121, and this waveguide one side is with resonator 102 sealings.Resonator for example is embodied as and covers 501, and it has the blind hole as resonant cavity.This lid 501 now or be screwed onto, adhere to, snap into or otherwise method be fixed on the circuit board 105.At this, note the accurate aligning of cover gab and waveguide openings.Simultaneously, locating circuit board accurately.Another disadvantage of this device is, cannot placing component in the scope of lid 501 at the back side of circuit board 105.
Replenish ground, it is to be noted that " comprising " do not get rid of other features or step, " one " or " one " does not get rid of a plurality of.It is to be noted in addition, also can be used in combination with other features or the step of other the foregoing descriptions with reference to described feature of one of the foregoing description or step.Reference marker in the claims should not be considered as restriction.
Claims (20)
1. waveguide junction that is used for fill level radar, described waveguide junction comprises:
Multilayer circuit board (120);
The lead-in wire (107) that is used for guide electromagnetic waves; And
The coupling output unit that comprises coupling element (121) resonant cavity (102), this coupling output unit are used for electromagnetic wave is outputed to waveguide (103) from lead-in wire (107) coupling;
Wherein said resonant cavity (102) is integrated in the described circuit board (120).
2. waveguide junction according to claim 1,
Wherein circuit board (120) comprises the ground floor (104) and the second layer (105);
The resonant cavity (102) of output unit of wherein being coupled is integrated in the ground floor (104);
Wherein the second layer (105) has insulating material; And
Wherein the second layer (105) is arranged on the ground floor (104), makes the second layer (105) cover resonant cavity (102).
3. waveguide junction according to claim 2 comprises in addition:
The 3rd layer (106), described the 3rd layer is arranged between the ground floor (104) and the second layer (105);
Wherein ground floor (104) is embodied as the circuit board substrate material of insulation; And
Wherein the 3rd layer (106) contain metal.
4. waveguide junction according to claim 2, wherein ground floor (104) contains metal.
5. according to each the described waveguide junction in the claim 2 to 4,
Wherein resonator (102) has the degree of depth (112) corresponding to the thickness (113) of ground floor (104).
6. according to each the described waveguide junction in the claim 2 to 5,
Wherein the second layer (105) is a high frequency substrate.
7. according to each the described waveguide junction in the claim 2 to 6,
Wherein ground floor (104) is a high frequency substrate.
8. according to each the described waveguide junction in the claim 2 to 5,
Wherein resonator (102) is filled with dielectric.
9. according to each the described waveguide junction in the claim 2 to 8,
Wherein the second layer (105) has penetrating part (301) in the zone of coupling output unit, so that provide pressure balance between resonator (102) and environment.
10. according to each the described waveguide junction in the claim 2 to 9,
Wherein lead-in wire (107) is integrated in the second layer (105) basically.
11. according to each the described waveguide junction in the aforesaid right requirement,
Wherein lead-in wire (107) is implemented as little band.
12. according to each the described waveguide junction in the aforesaid right requirement,
Wherein lead-in wire (107) is implemented as and is used to guide the electromagnetic wave with the frequency between 60GHz to 100GHz, and
The output unit that wherein is coupled is implemented as the electromagnetic wave that is used for having in the frequency between the 60GHz to 100GHz and outputs to waveguide (103) from the lead-in wire coupling.
13. according to each the described waveguide junction in the aforesaid right requirement,
Wherein waveguide junction is integrally made in course of manufacturing printed circuit board.
14. a fill level radar that is used for definite jar material level, described fill level radar comprises:
Be used for emission and/or receive electromagnetic wave (403; 404) antenna (401);
Be used for electromagnetic wave (403; 404) present feeding means (402) to antenna (401);
Wherein feeding means (402) has waveguide (103), and this waveguide (103) is used to make electromagnetic wave (403; 404) transmission between antenna (401) and lead-in wire (107); And
Wherein feeding means (402) has according to each the described waveguide junction in the claim 1 to 13.
15. fill level radar according to claim 14,
Wherein waveguide (103) is by fixture (110; 111) link to each other with circuit board (120), make electromagnetic wave (403; 404) can output to the waveguide (103) from lead-in wire (107) coupling by the coupling output unit, wherein said coupling output unit comprises resonator (102) and coupling element (121).
16. an application wherein will be used for level gauging according to each the described waveguide junction in the claim 1 to 13.
17. a method that is used for making according to each described waveguide junction of claim 1 to 13 said method comprising the steps of:
Ground floor (104) is provided;
Structure is used for electromagnetic wave is outputed to resonator (102) waveguide (103), the ground floor (104) from lead-in wire (107) coupling;
Make up the second layer (105); And
Structure be used for guide electromagnetic waves, basically at the lead-in wire (107) of the second layer (105);
Wherein resonator (102) is integrated in the ground floor (104).
18. method according to claim 17,
Wherein the second layer (105) has insulating material; And
Wherein the second layer (105) is arranged on the ground floor (104), makes the second layer (105) cover resonator (102).
19., may further comprise the steps in addition according to claim 17 or 18 described methods:
Make up the 3rd layer (106), described the 3rd layer is arranged between the ground floor (104) and the second layer (105);
Wherein ground floor (104) is embodied as the circuit board substrate material of insulation; And
Wherein the 3rd layer (106) contain metal.
20. according to each the described method in the claim 17 to 19,
Wherein the structure of the resonator (102) in ground floor (104) comprises etch step, milling step or laser drill.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US73646005P | 2005-11-14 | 2005-11-14 | |
| DE200510054233 DE102005054233A1 (en) | 2005-11-14 | 2005-11-14 | Waveguide junction for level radar, has decoupling unit with coupling unit and resonating cavity for decoupling of electromagnetic waves into waveguide, where resonating cavity is integrated in printed circuit board |
| US60/736,460 | 2005-11-14 | ||
| DE102005054233.6 | 2005-11-14 | ||
| PCT/EP2006/010863 WO2007054355A1 (en) | 2005-11-14 | 2006-11-13 | Waveguide junction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101305495A true CN101305495A (en) | 2008-11-12 |
| CN101305495B CN101305495B (en) | 2013-01-16 |
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ID=37982682
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200680042265.1A Active CN101305495B (en) | 2005-11-14 | 2006-11-13 | Level radar and method for manufacturing waveguide junction in level radar |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101305495B (en) |
| DE (1) | DE102005054233A1 (en) |
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| US9851235B2 (en) | 2012-05-09 | 2017-12-26 | Endress + Hauser Gmbh + Co. Kg | Apparatus for determining and/or monitoring at least one process variable of a medium |
| CN108291833A (en) * | 2015-11-13 | 2018-07-17 | 恩德莱斯和豪瑟尔欧洲两合公司 | Filling level sensor based on radar |
| CN108801398A (en) * | 2018-06-27 | 2018-11-13 | 福州盛博电子有限公司 | A kind of 120GHz frequency modulated continuous wave radars level meter and distance measuring method |
| CN109428142A (en) * | 2017-08-28 | 2019-03-05 | Vega格里沙贝两合公司 | For filling the waveguide coupled structure of level radar |
| CN110006504A (en) * | 2017-12-04 | 2019-07-12 | Vega格里沙贝两合公司 | Circuit board for the radar level gauge with Waveguide coupling arrangement |
| CN110582891A (en) * | 2017-02-03 | 2019-12-17 | Ami 研发有限责任公司 | Dielectric traveling wave waveguide with varactors for controlling beam direction |
| CN112203414A (en) * | 2019-07-07 | 2021-01-08 | 深南电路股份有限公司 | Embedded circuit board and manufacturing method thereof |
| CN113258273A (en) * | 2020-01-28 | 2021-08-13 | 克洛纳测量技术有限公司 | Radar apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE102011010801B4 (en) * | 2011-02-09 | 2016-01-07 | Krohne Messtechnik Gmbh | Microwave transmitter and level gauge |
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| JP2605654B2 (en) * | 1995-03-31 | 1997-04-30 | 日本電気株式会社 | Composite microwave circuit module and method of manufacturing the same |
| EP0874415B1 (en) * | 1997-04-25 | 2006-08-23 | Kyocera Corporation | High-frequency package |
| DE10023497A1 (en) * | 2000-05-13 | 2001-11-15 | Endress Hauser Gmbh Co | Microwave-type level gauge for industrial applications, is equipped with a plate for positioning the microwave generator |
| JP3988453B2 (en) * | 2001-12-07 | 2007-10-10 | 株式会社村田製作所 | Multilayer electronic components |
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2005
- 2005-11-14 DE DE200510054233 patent/DE102005054233A1/en not_active Withdrawn
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| Publication number | Publication date |
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| CN101305495B (en) | 2013-01-16 |
| DE102005054233A1 (en) | 2007-05-16 |
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