CN101290868A - Preparing method of reference power supply with adjustable voltage - Google Patents
Preparing method of reference power supply with adjustable voltage Download PDFInfo
- Publication number
- CN101290868A CN101290868A CN 200810028786 CN200810028786A CN101290868A CN 101290868 A CN101290868 A CN 101290868A CN 200810028786 CN200810028786 CN 200810028786 CN 200810028786 A CN200810028786 A CN 200810028786A CN 101290868 A CN101290868 A CN 101290868A
- Authority
- CN
- China
- Prior art keywords
- voltage
- ref
- power supply
- time
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000000463 material Substances 0.000 claims abstract description 25
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000012360 testing method Methods 0.000 claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 claims abstract description 8
- 238000003466 welding Methods 0.000 claims abstract description 8
- 238000004381 surface treatment Methods 0.000 claims abstract description 7
- 239000010931 gold Substances 0.000 claims description 16
- 229910052737 gold Inorganic materials 0.000 claims description 13
- 238000002360 preparation method Methods 0.000 claims description 12
- 239000007788 liquid Substances 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 239000003814 drug Substances 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 4
- 244000247747 Coptis groenlandica Species 0.000 claims description 4
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005868 electrolysis reaction Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 240000007594 Oryza sativa Species 0.000 claims description 2
- 235000007164 Oryza sativa Nutrition 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 238000005238 degreasing Methods 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- 238000010926 purge Methods 0.000 claims description 2
- 235000009566 rice Nutrition 0.000 claims description 2
- 230000002000 scavenging effect Effects 0.000 claims description 2
- 238000000926 separation method Methods 0.000 abstract description 2
- 238000009954 braiding Methods 0.000 abstract 2
- 238000009434 installation Methods 0.000 abstract 1
- 238000005457 optimization Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005022 packaging material Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000004017 vitrification Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
Abstract
Description
Product | Range of regulation | Motional impedance | Accuracy rating | Working temperature | Temperature coefficient |
Product according to this explained hereafter | 2.5~40V | 200mΩ | ±0.5%~± 1.5% | -40~125 ℃ | 30ppm/℃ |
Domestic like product | 2.5~18V | 200mΩ | ±0.5%~±2 % | 0~125℃ | 50ppm/℃ |
External like product | 2.5~36V | 500mΩ | ±0.5%~±2 % | -40~85℃ | 50ppm/℃ |
Cure stage | Temperature change trend (℃) | Retention time (MIN) |
Phase I | RT~60 | 20 |
Second stage | 60~175 | 60 |
Phase III | 175 | 40 |
The quadravalence section | 175~80 | 60 |
Mold temperature | Clamping pressure | Curing time | Injection pressure | Injection time |
170±5℃ | 30~60ton | 45~90S | 1.2~2.0ton | 5-15S |
Electrolysis liquid medicine temperature | Liquid medicine proportion | Water spray pressure | Steel band speed | Faradaic current |
60±5℃ | 6~8 mother-in-law | 300~600kg | 2.0~6.0m/min | 150-300A |
Laser scanning speed | Laser energy | The braid temperature | The braid time |
1200~1500mm/s | 50%~70% | 250±20℃ | 120~180ms |
Composition | Au(%) | Ag(ppm) | Cu(ppm) | Fe(ppm) | Mg(ppm) | Pd(ppm) | Si(ppm) |
Content | ≥99.99 | ≤2.0 | ≤1.0 | ≤2.0 | ≤3.0 | ≤2.0 | ≤2.0 |
Spun gold diameter (um) | Model | Fracture load (CN) | Elongation (%) |
25 | KG2 | >5 | 2~8 |
Project | Unit | Specification |
Color | - | Black |
Diameter | mm | 16±0.2 |
Highly | mm | 16±0.1 |
Weight | g | 4.1±0.2 |
Helical flow length | cm(inch) | 91.44±12.7(36±5) |
Gel time | sec | 25±5 |
The Shore red hardness | - | Min 70 |
Thermalexpansioncoefficient 1 | 1×E-6/℃ | 17.0±5.0 |
Thermalexpansioncoefficient 2 | 1×E-6/℃ | 65.0±5.0 |
Vitrification point | ℃ | Min 150 |
Proportion | - | 1.80±0.2 |
Bending strength A (25 ℃) | Kgf/mm 2 | 13.0±3.0 |
Bending modulus A (25 ℃) | Kgf/mm 2 | 1300±300 |
Thermal conductivity | Cal/cm.sec.℃ | Min 1.0×10 -3 |
Water absorption | % | MAX 0.3 |
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200810028786 CN100590791C (en) | 2008-06-11 | 2008-06-11 | Preparing method of reference power supply with adjustable voltage |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200810028786 CN100590791C (en) | 2008-06-11 | 2008-06-11 | Preparing method of reference power supply with adjustable voltage |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101290868A true CN101290868A (en) | 2008-10-22 |
CN100590791C CN100590791C (en) | 2010-02-17 |
Family
ID=40035060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 200810028786 Expired - Fee Related CN100590791C (en) | 2008-06-11 | 2008-06-11 | Preparing method of reference power supply with adjustable voltage |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100590791C (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101989535A (en) * | 2009-08-05 | 2011-03-23 | 深圳市远望工业自动化设备有限公司 | All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method |
CN102565721A (en) * | 2010-12-10 | 2012-07-11 | 三星Led株式会社 | System and method for manufacturing power supply unit, and flicker measurement apparatus |
CN102602568A (en) * | 2012-02-22 | 2012-07-25 | 格兰达技术(深圳)有限公司 | Rotary detection marking and taping machine for IC (integrated circuit) block materials and working method of rotary detection marking and taping machine |
CN103354270A (en) * | 2013-07-01 | 2013-10-16 | 宁波康强电子股份有限公司 | Process for removing spilling of EMC packaging LED lead frame |
CN104752386A (en) * | 2013-12-25 | 2015-07-01 | 天水华天科技股份有限公司 | High reliability small outline package (SOP) lead frame and production method of packaging piece |
-
2008
- 2008-06-11 CN CN 200810028786 patent/CN100590791C/en not_active Expired - Fee Related
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101989535A (en) * | 2009-08-05 | 2011-03-23 | 深圳市远望工业自动化设备有限公司 | All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method |
CN101989535B (en) * | 2009-08-05 | 2013-09-18 | 深圳市远望工业自动化设备有限公司 | All-in-one machine of semiconductor device for testing, sorting, marking and braiding and one-stop processing method |
CN102565721A (en) * | 2010-12-10 | 2012-07-11 | 三星Led株式会社 | System and method for manufacturing power supply unit, and flicker measurement apparatus |
US8816601B2 (en) | 2010-12-10 | 2014-08-26 | Samsung Electronics Co., Ltd. | System for manufacturing power supply unit and method for manufacturing supply unit, and flicker measurement apparatus |
CN102565721B (en) * | 2010-12-10 | 2015-01-14 | 三星电子株式会社 | System and method for manufacturing power supply unit, and flicker measurement apparatus |
CN102602568A (en) * | 2012-02-22 | 2012-07-25 | 格兰达技术(深圳)有限公司 | Rotary detection marking and taping machine for IC (integrated circuit) block materials and working method of rotary detection marking and taping machine |
CN103354270A (en) * | 2013-07-01 | 2013-10-16 | 宁波康强电子股份有限公司 | Process for removing spilling of EMC packaging LED lead frame |
CN103354270B (en) * | 2013-07-01 | 2016-08-24 | 宁波康强电子股份有限公司 | A kind of EMC encapsulation LED lead frame goes flash technique |
CN104752386A (en) * | 2013-12-25 | 2015-07-01 | 天水华天科技股份有限公司 | High reliability small outline package (SOP) lead frame and production method of packaging piece |
Also Published As
Publication number | Publication date |
---|---|
CN100590791C (en) | 2010-02-17 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: GUANGZHOU YUEJING HIGH TECHNOLOGY CO., LTD. ZHAOQI Free format text: FORMER OWNER: ZHAOQING FENGHUA NEO-VALLEY MICRO-ELECTRONICS CO., LTD. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20110513 Address after: 526020 Guangdong city of Zhaoqing province Fenghua Fenghua Electronic Industrial City Road No. 18 Co-patentee after: Guangzhou Yuejing High Technology Co., Ltd. Patentee after: Guangdong Fenghua Advanced Technology (Holding) Co., Ltd. Co-patentee after: Zhaoqing Fenghua Neo-valley Micro-electronics Co., Ltd. Address before: 526020 Guangdong city of Zhaoqing province Fenghua Fenghua Electronic Industrial City Road No. 18 Co-patentee before: Zhaoqing Fenghua Neo-valley Micro-electronics Co., Ltd. Patentee before: Guangdong Fenghua Advanced Technology (Holding) Co., Ltd. |
|
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: 526020 Guangdong city of Zhaoqing province Fenghua Fenghua Electronic Industrial City Road No. 18 Patentee after: Guangdong Fenghua Advanced Technology (Holding) Co., Ltd. Patentee after: Guangdong Fenghua Semiconductor Technology Co., Ltd. Patentee after: Zhaoqing Fenghua Neo-valley Micro-electronics Co., Ltd. Address before: 526020 Guangdong city of Zhaoqing province Fenghua Fenghua Electronic Industrial City Road No. 18 Patentee before: Guangdong Fenghua Advanced Technology (Holding) Co., Ltd. Patentee before: Guangzhou Yuejing High Technology Co., Ltd. Patentee before: Zhaoqing Fenghua Neo-valley Micro-electronics Co., Ltd. |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160310 Address after: 526020 Guangdong city of Zhaoqing province Fenghua Fenghua Electronic Industrial City Road No. 18 Patentee after: Guangdong Fenghua Advanced Technology (Holding) Co., Ltd. Patentee after: Guangdong Fenghua Semiconductor Technology Co., Ltd. Address before: 526020 Guangdong city of Zhaoqing province Fenghua Fenghua Electronic Industrial City Road No. 18 Patentee before: Guangdong Fenghua Advanced Technology (Holding) Co., Ltd. Patentee before: Guangdong Fenghua Semiconductor Technology Co., Ltd. Patentee before: Zhaoqing Fenghua Neo-valley Micro-electronics Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100217 Termination date: 20210611 |