CN201364899Y - Integrated circuit lead frame of ring plated welding zone - Google Patents
Integrated circuit lead frame of ring plated welding zone Download PDFInfo
- Publication number
- CN201364899Y CN201364899Y CN 200920142081 CN200920142081U CN201364899Y CN 201364899 Y CN201364899 Y CN 201364899Y CN 200920142081 CN200920142081 CN 200920142081 CN 200920142081 U CN200920142081 U CN 200920142081U CN 201364899 Y CN201364899 Y CN 201364899Y
- Authority
- CN
- China
- Prior art keywords
- chip island
- welding zone
- silver
- plated
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a technology for fabricating an integrated circuit lead frame product, so as to overcome the defects of waste of precious metal and inconsistent performance of the silver plated welding zone of the existing similar product. The integrated circuit lead frame product comprises a chip island (6) bearing an integrated circuit chip and a plurality of guide pins (4) distributed around the chip island (6), silver is plated in the root welding zones (5), which are near to the chip island (6), of the guide pins (4); the silver plated root welding zones (5) surround the chip island (6), the silver is plated on a rectangular frame (10) on the front surface of the chip island (6), the region positioned on the inner side of the rectangular frame (10) keeps the pure copper surface, and pits (9) which are regularly arranged are evenly distributed on the back surface of the chip island (6). A plurality of grooves (7) and ditches (8) are respectively arranged between the front surface and the back surface of the root welding zones (5) of the guide pins (4) and the surfaces of the guide pins (4). The product greatly simplifies the engraving of a plating template, the shape of the silver plated welding zone after the processing is consistent, and the performance of the finished product is stable.
Description
Technical field
The utility model relates to the manufacturing technology field of semiconductor electronic components and parts, especially refers to a kind of lead foot welding zone structure technology of circuit lead frame.
Background technology
Along with the fast development of microelectronics and mechanics of communication, the profile of semiconductor integrated circuit components and parts more and more become miniaturization and microminiaturization, therefore supporting with it also miniaturization day by day, slimming of leadframe parts.Traditional lead frame is all made by fine copper basically at present, needs to connect at the lead foot root weld Herba Anoectochili roxburghii of lead frame when mounting electronic chip.Be the firm welding of guarantee fund's silk thread, these welding regions need silver-plated, to guarantee the firm welding of Herba Anoectochili roxburghii and fine copper spare.Common plating mode mainly contains full plating and puts two kinds of platings at present, and the former full plating mode has been wasted a large amount of silver-colored precious metals, and cost improves; The latter's some plating mode is then more time-consuming, and the finished product consistency is poor.For this reason, people expect to invent a kind of regular circuit lead frame product of welding zone of electroplating, and to improve the end properties of lead frame, reduce the precious metal consumption, promote the market competitiveness.
The utility model content
The technical problems to be solved in the utility model is to overcome full plating mode product waste precious metal, some plating mode product processing time consuming and inconsistent defective of silver-plated welding zone performance and the deficiency that existing like product exists, provide a kind of regular circuit lead frame product of welding zone of electroplating to society, to improve the end properties of lead frame, reduce the precious metal consumption, promote the market competitiveness.
The technical scheme that its technical problem that solves the utility model adopts is: the circuit lead frame of ring plating welding zone, comprise the chip island of bearing integrated chip and be periphery in around a plurality of lead foots, described lead foot is silver-plated near the root welding zone of described chip island; Silver-plated described root welding zone is around described chip island; The rectangular shaped rim in described chip island front is silver-plated, is positioned at described rectangular shaped rim area inside and keeps the fine copper surface; The described chip island back side is evenly equipped with regularly arranged pit.
Be respectively equipped with multiple tracks groove and groove between the positive and negative surface of root welding zone of described lead foot and the lead foot surface.
The circuit lead frame of the utility model ring plating welding zone, silver-plated welding zone part is around described chip island, and is regular, simplified greatly and electroplated scribing of masterplate; Silver-plated welding zone shape unanimity after the processing, end properties is stable.Chip island is positioned at the rectangular shaped rim area inside not to be electroplated, and keeps the fine copper surface with the combine firmness of raising with integrated circuit (IC) chip.When using this product encapsulated integrated circuit, plastics envelope material is filled in the uniform pit in the groove at groove, the back side of described silver-plated welding zone front edge and the described chip island back side, strengthened the adhesion of lead frame fine copper base material and plastics envelope material greatly, help the raising of sealing and waterproof and dampproof performance, thereby final anti-mechanical shock of integrated circuit finished product and heat-resistant anti-fatigue intensity are obviously promoted, and product prolongs useful life.
Description of drawings
Fig. 1 is the utility model product structure schematic diagram.
Fig. 2 is the A portion enlarged drawing of Fig. 1.
Fig. 3 is the rearview of Fig. 2.
Fig. 4 is that the B-B of Fig. 1 is to the cross section structure schematic diagram.
Fig. 5 is that the A-A of Fig. 2 is to the cross section structure schematic diagram.
Embodiment
As depicted in figs. 1 and 2, the circuit lead frame of the utility model ring plating welding zone, comprise the chip island 6 of central area and be periphery in around a plurality of lead foots 4, described chip island 6 is used for the bearing integrated chip; Described lead foot 4 is provided with dowel 3 each other and is connected.Described lead foot 4 is silver-plated near the root welding zone 5 of described chip island 6; Silver-plated root welding zone 5 is around described chip island 6; The rectangular shaped rim 10 in described chip island 6 fronts is silver-plated, is positioned at described rectangular shaped rim 10 area inside and keeps the fine copper surface.
As Fig. 3, Fig. 4 and shown in Figure 5, described chip island 6 back sides are evenly equipped with regularly arranged pit 9; Be respectively equipped with multiple tracks groove 7 and groove 8 between the positive and negative surface of described root welding zone 5 and the lead foot 4.
Continue in conjunction with the accompanying drawings the operation principle of summary the utility model product below.Requirement according to encapsulation factory processes the lead frame product that two rows are connected by sideband 2 in being equipped with the milling train of corresponding mould, to enhance productivity, reduce the loss of fine copper raw material.When silver-plated, just, used for the spun gold welding in the described lead foot 4 root welding zones 5 around described chip island 6 and the rectangular shaped rim 10 in described chip island 6 fronts; Described chip island 6 is positioned at rectangular shaped rim 10 area inside not to be electroplated, and keeps the fine copper surface with the combine firmness of raising with integrated circuit (IC) chip.When using this product encapsulated integrated circuit, plastics envelope material is filled in the uniform pit 9 in the groove 8 at groove 7, the back side of described root welding zone 5 front edge and described chip island 6 back sides, strengthened the adhesion of lead frame fine copper base material and plastics envelope material greatly, help the raising of sealing and waterproof and dampproof performance, thereby final anti-mechanical shock of integrated circuit finished product and heat-resistant anti-fatigue intensity are obviously promoted, and product prolongs useful life.
Claims (2)
1, a kind of circuit lead frame that encircles the plating welding zone, comprise the chip island (6) of bearing integrated chip and be periphery in around a plurality of lead foots (4), it is characterized in that: the root welding zone (5) of the close described chip island (6) of described lead foot (4) is silver-plated; Silver-plated described root welding zone (5) around described chip island (6) all around; The rectangular shaped rim (10) in described chip island (6) front is silver-plated, is positioned at described rectangular shaped rim (10) area inside and keeps the fine copper surface; Described chip island (6) back side is evenly equipped with regularly arranged pit (9).
2, encircle the circuit lead frame of plating welding zone according to claim 1, it is characterized in that: be respectively equipped with multiple tracks groove (7) and groove (8) between the positive and negative surface of root welding zone (5) of described lead foot (4) and lead foot (4) surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920142081 CN201364899Y (en) | 2009-03-19 | 2009-03-19 | Integrated circuit lead frame of ring plated welding zone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200920142081 CN201364899Y (en) | 2009-03-19 | 2009-03-19 | Integrated circuit lead frame of ring plated welding zone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201364899Y true CN201364899Y (en) | 2009-12-16 |
Family
ID=41475570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200920142081 Expired - Lifetime CN201364899Y (en) | 2009-03-19 | 2009-03-19 | Integrated circuit lead frame of ring plated welding zone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201364899Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856217A (en) * | 2011-06-30 | 2013-01-02 | 飞思卡尔半导体公司 | Machine and method for molding semiconductor device |
| CN103227162A (en) * | 2013-04-17 | 2013-07-31 | 日月光封装测试(上海)有限公司 | Wire frame and packaging structure thereof |
| CN104752386A (en) * | 2013-12-25 | 2015-07-01 | 天水华天科技股份有限公司 | High reliability small outline package (SOP) lead frame and production method of packaging piece |
| CN116666344A (en) * | 2023-07-26 | 2023-08-29 | 深圳市锐骏半导体股份有限公司 | Frame structure |
-
2009
- 2009-03-19 CN CN 200920142081 patent/CN201364899Y/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102856217A (en) * | 2011-06-30 | 2013-01-02 | 飞思卡尔半导体公司 | Machine and method for molding semiconductor device |
| CN102856217B (en) * | 2011-06-30 | 2018-05-22 | 恩智浦美国有限公司 | For the apparatus and method of molding semiconductor device |
| CN103227162A (en) * | 2013-04-17 | 2013-07-31 | 日月光封装测试(上海)有限公司 | Wire frame and packaging structure thereof |
| CN104752386A (en) * | 2013-12-25 | 2015-07-01 | 天水华天科技股份有限公司 | High reliability small outline package (SOP) lead frame and production method of packaging piece |
| CN116666344A (en) * | 2023-07-26 | 2023-08-29 | 深圳市锐骏半导体股份有限公司 | Frame structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20091216 |
|
| CX01 | Expiry of patent term |