CN101274701A - Custody apparatus - Google Patents
Custody apparatus Download PDFInfo
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- CN101274701A CN101274701A CNA2008100902024A CN200810090202A CN101274701A CN 101274701 A CN101274701 A CN 101274701A CN A2008100902024 A CNA2008100902024 A CN A2008100902024A CN 200810090202 A CN200810090202 A CN 200810090202A CN 101274701 A CN101274701 A CN 101274701A
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- reception room
- storage appts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Warehouses Or Storage Devices (AREA)
- Filtering Of Dispersed Particles In Gases (AREA)
Abstract
This invention provides a safe deposit, by which the deterioration of a chemical filter can be effectively inhibited even the outer gas has high-concentration pollutant. The safe deposit (1) comprises: a containing chamber (13) for storing articles, chemical filters (40, 50) disposed at upper side of the containing chamber (13), a blower (60) for blowing gas purified by the chemical filters (40, 50) into the containing chamber (13), and a circulation loop (31) that is disposed along side wall (11) of the containing chamber (13) and is used for circulating the purified gas blew into the containing chamber (13).
Description
Technical field
The present invention relates to storage appts, particularly relate to storage appts with chemical filter.
Background technology
For the invasion and attack of the pollutant substance protecting article not to be subjected in the extraneous gas to be contained are taken care of; conventional example device described as follows: it is the sterile board (clean box) at inside keeping semiconductor wafer; wherein; the air that has purified with chemical filter is sent in trip side-blown from it, and this air that has purified is directly discharged (for example patent documentation 1) from downstream end.
Patent documentation 1: Japanese kokai publication hei 7-283092 communique
But, there are the following problems in above-mentioned prior art: all directly discharge from sterile board by purifying air behind the semiconductor wafer, when therefore for example the pollutant concentration of extraneous gas is higher, can cause the deterioration of chemical filter etc. sharp.
Summary of the invention
The present invention finishes in view of the above problems, and one of its purpose is to provide a kind of storage appts, even this storage appts when externally the pollutant concentration of gas is higher, also can suppress the deterioration of chemical filter effectively.
The storage appts of an embodiment of the invention that are used to address the above problem is characterised in that it possesses: accommodate article reception room, be arranged on the chemical filter of the upstream side of described reception room, the circulation stream that will be blown into the blowing engine in the described reception room by the gas that described chemical filter has purified and be used to make the Purge gas circulation that is blown in the described reception room and be provided with along the sidewall of described reception room.In this storage appts,, also can suppress the deterioration of chemical filter effectively even when the pollutant concentration of extraneous gas is higher.
In addition, described circulation stream also can be arranged on the downstream of described chemical filter, and at least a portion that is blown into the Purge gas in the described reception room is in the circulation of the downstream of described chemical filter.The deterioration that can more effectively suppress at this moment, chemical filter.
In addition, also can have the let-in door of taking-up that is used to be housed in the described article in the described reception room in the downstream of described reception room, described blowing engine is according to disposing from the mode of described reception room to described door air-supply.At this moment, can suppress the interior pollution of reception room effectively.
In addition, also can have the let-in door of taking-up that is used to be housed in the described article in the described reception room in the downstream of described reception room, and described chemical filter, described blowing engine, described reception room and the in series configuration of described door.At this moment, the simple in structure and miniaturization of storage appts can be made, and the pollution in the reception room can be suppressed effectively.
In addition, described circulation stream also can have: the primary flow path that extends to the secondary flow road of upstream side, extends to upstream side and form less than the mode on described secondary flow road with the ventilation resistance of Purge gas along another part of described sidewall from the downstream of described reception room along the part of described sidewall from the downstream of described reception room.At this moment, can Purge gas be circulated effectively with low cost.
Description of drawings
Fig. 1 is the birds-eye view of the storage appts of an embodiment of the invention.
Fig. 2 is the lateral plan of the storage appts of an embodiment of the invention.
Fig. 3 is the birds-eye view of the storage appts of object as a comparison.
Nomenclature
Streams, 33 back streams, 40 inlet filters, 41 inlet baffles, 50 internal ramps, 51 fore filters (prefilter), 60 blowing engines, 61 S. A.s, 62 blade parts, 100 comparison devices before the outer walls before 1 storage appts, 10 resettlement sections, 11 madial walls, 12 cups, 13 reception rooms, 14 resettlement section baffle plates (damper), 20 chest portion, 21 lateral walls, 22,23 openings, 24,25 chest portion baffle plates, 30 circulation stream portions, 31 effluent roads, 32.
The specific embodiment
Storage appts to an embodiment of the invention describes with reference to the accompanying drawings.In addition, in the present embodiment, adopting the article of the semiconductor wafer of temporary transient keeping in the process of its Fabrication procedure as the keeping object, is that example describes with this situation.
Fig. 1 is the cutaway view when overlooking the storage appts 1 of present embodiment.Fig. 2 is the cutaway view when seeing the storage appts 1 of present embodiment from the left side.As depicted in figs. 1 and 2, storage appts 1 possesses: accommodate the reception room 13 of semiconductor wafer W, the inlet filter 40 of upstream side that is arranged on this reception room 13 and internal ramp 50, will be blown into the blowing engine 60 in this reception room 13 and be used to make Purge gas circulation that is blown in this reception room 13 and be arranged on by the gas that this inlet filter 40 and internal ramp 50 have purified this reception room 13 around circulation stream portion 30.
In this reception room 13, a plurality of semiconductor wafer W are separated from each other with predetermined distance, and dispose side by side with respect to the air supply direction (direction of arrow B indication illustrated in figures 1 and 2) of the blowing engine 60 in this reception room 13.
The never graphic power supply of this blowing engine 60 is powered to motor section, by blade part 62 around S. A. 61 rotation, can be from the upstream side of this blowing engine 60 side downstream, along the direction blow gas of this S. A. 61.
As the first internal ramp 50a and the second internal ramp 50b, so long as can remove the filter of the chemical pollutant in the gas, promptly there be not special the qualification, can select any filter for use, for example, can with the kind of the chemical pollutant that can remove or quantity mutually 2 kinds of different chemical filters be used in combination.In the present embodiment, use can be removed mold pressing (mold) the type chemical filter of the organic substance in the gas as the first internal ramp 50a, and use can be removed the honeycomb type chemical filter of the alkaline matter in the gas as the second internal ramp 50b.
As the 3rd internal ramp 50a, so long as can remove the desired kind in the gas and the filter of particle of size, promptly there is not special qualification according to purpose, can select any filter for use.In the present embodiment, use ULPA (ultra high efficiency air, Ultra Low Penetration Air) filter as the 3rd internal ramp 50a.
In addition, in resettlement section 10, blowing engine 60 and internal ramp 50 are formed with cup 12 with the predetermined distance separate configuration between them.
In addition, resettlement section 10 is arranged on the inside of chest portion 20.That is, storage appts 1 has the chest portion 20 in the outside that covers resettlement section 10.The shape of this chest portion 20 and resettlement section 10 is accordingly and forms rectangular shape, and has four lateral walls 21 that the air supply directions in the reception room 13 extend.That is, chest portion 20 comprises: pair of right and left left-external side wall 21a in opposite directions and right lateral wall 21b and a pair of up and down lateral wall 21c and the following lateral wall 21d of going up in opposite directions.
And, the left-external side wall 21a of these chest portion 20, right lateral wall 21b, go up lateral wall 21c and down lateral wall 21d according to respectively with left madial wall 11a, the Right Inboard wall 11b of resettlement section 10, go up madial wall 11c and down the outside face mode in opposite directions of madial wall 11d be provided with.Chest portion 20 also has the preceding outer wall 22 that is provided with according to the mode of blocking its upstream extremity.Should be formed with opening 23 on the part of preceding outer wall 22.
In addition, chest portion 20 has the door 24 that is provided with according to the mode of blocking its downstream end (being the downstream end of storage appts 1).But this 24 is arranged to switch, puts into so that the user of storage appts 1 can be housed in the taking-up of the semiconductor wafer W in the reception room 13.
This inlet filter 40 is the chemical filters that can remove the chemical pollutant in the gas that sucks in the storage appts 1.As inlet filter 40, so long as remove the chemical filter of the chemical pollutant in the gas, promptly there be not special the qualification, can select any filter for use, for example can adopt the chemical filter of the organic substance removed in the gas, acidic materials, alkaline matter etc.In the present embodiment, employing can be removed the mold pressing type chemical filter of the organic substance in the gas as inlet filter 40.
In addition, storage appts 1 has the pair of right and left inlet baffle 41 of the aperture area that is used to regulate inlet filter 40.This inlet baffle 41 is plate-shaped members of pair of right and left, and is arranged to and can slides along the outside face of inlet filter 40.Therefore, by switch inlet baffle 41, can adjust the aperture opening ratio of the outside face of inlet filter 40.By adjusting this aperture opening ratio, can adjust the amount of the new extraneous gas that sucks in the storage appts 1 and the internal circulating load of the Purge gas in this storage appts 1 etc.
Effluent road 31 has respectively left madial wall 11a, Right Inboard wall 11b and the left stream 31a, the right stream 31b that are provided with of these three madial walls of madial wall 11d and stream 31c down down in four madial walls 11 that constitute resettlement section 10.That is, left stream 31a, right stream 31b and down stream 31c be separately positioned between left madial wall 11a and the left-external side wall 21a, between Right Inboard wall 11b and the right lateral wall 21b, and down between madial wall 11d and the following lateral wall 21d.
At this, in three effluent roads 31, following stream 31c compares with right stream 31b with other two left stream 31a, and the ventilation resistance during the Purge gas circulation is littler.Promptly, in the present embodiment, the height of following circulation stream 31c (distance between following madial wall 11d and the following lateral wall 21d) is greater than the height (distance between distance between left madial wall 11a and the left-external side wall 21a and Right Inboard wall 11b and the right lateral wall 21b) of left side circulation stream 31a and right side circulation stream 31b.
In addition, circulation stream portion 30 comprises: be arranged on the preceding stream 32 between the upstream extremity of the preceding outer wall 22 of chest portion 20 and resettlement section 10 and be arranged on the downstream end of this resettlement section 10 and the back stream 33 between the door 24.That is, preceding stream 32 is arranged between inlet filter 40 and the blowing engine 60, and back stream 33 is arranged between the downstream end and door 24 of reception room 13.
In addition, storage appts 1 have be used for to Purge gas from the resettlement section the 10 resettlement section baffle plates of regulating to the discharge of circulation stream portion 30 14.This resettlement section baffle plate 14 switchably is arranged on the part of madial wall 11 of resettlement section 10.That is, in the present embodiment, resettlement section baffle plate 14 is provided with pair of right and left on the part in the downstream of left madial wall 11a and Right Inboard wall 11b.Each resettlement section baffle plate 14 is made of 2 plate-shaped members that are formed with a plurality of holes (being stamped metal in the present embodiment), and can slide along left madial wall 11a or Right Inboard wall 11b.2 stamped metals of this each resettlement section baffle plate 14 are slided, overlapping situation according to these holes changes aperture opening ratio, the downstream end of left madial wall 11a and Right Inboard wall 11b and the distance between the door 24 are changed, can regulate to the discharge of circulation stream portion 30 from reception room 13 Purge gas thus.
In addition, storage appts 1 has and is used for chest portion baffle plate 25 that Purge gas is regulated to exterior discharge from the inside of this storage appts 1.This chest portion baffle plate 25 is identical with resettlement section baffle plate 14, switchably is arranged on the part of lateral wall 21 of chest portion 20.Promptly.In the present embodiment, chest portion baffle plate 25 is provided with pair of right and left on the part in the downstream of left-external side wall 21a and right lateral wall 21b.And, slide by 2 stamped metals that make each chest portion baffle plate 25, according to the overlapping situation in these holes aperture opening ratio is changed, can regulate to the exterior discharge of chest portion 20 from circulation stream portion 30 Purge gas thus.
In this storage appts 1, if make blowing engine 60 action, the outer gas of this storage appts 1 is by inlet filter 40, is inhaled into along the direction of arrow A indication illustrated in figures 1 and 2.At this moment, the major part of the chemical pollutant that is contained in the extraneous gas by inlet filter 40 is removed by this inlet filter 40.
The gas that has purified by inlet filter 40 flows in the preceding stream 32 in the chest portion 20.Purge gas before flowing in the stream 32 flows in the cup 12 of resettlement section 10 by blowing engine 60.The Purge gas that flows in the cup 12 flows in the reception room 13 by internal ramp 50 again.
At this moment, the chemical pollutant that is contained in the gas by internal ramp 50 is removed by the first internal ramp 50a and the second internal ramp 50b, and in addition, the particulate that is contained in this gas is removed by the 3rd internal ramp 50c.Therefore, by inlet filter 40 and internal ramp 50 high purifications gas flow in the reception room 13.
Flow in the reception room 13 Purge gas from upstream side downstream side by being configured between a plurality of semiconductor wafers in this reception room 13.Then, flow out to the stream 33 of back by the downstream end (being the downstream end of resettlement section 10) of the Purge gas behind the reception room 13 from this reception room 13.In addition, Purge gas can be regulated by the extent of opening of resettlement section baffle plate 14 to the discharge of this back stream 33.
The door 24 that the outlet of 10 Purge gas that flow out is plugged the downstream end of the air supply direction in this resettlement section 10 from the resettlement section blocks.Its result, the Purge gas of back stream 33 turn back to the upstream side of resettlement section 10 by circulation stream portion 30.
That is, three effluent roads 31 that at least a portion by the Purge gas behind the reception room 13 is provided with by 10 the next door along the resettlement section are flow through outside this resettlement section 10 in the direction superinverse opposite with air supply direction this resettlement section 10 in, turn back to preceding stream 32.Specifically, Purge gas flows through in the left stream 31a along the direction of arrow C shown in Figure 11 indication, flows through in the right stream 31b along the direction of arrow C shown in Figure 12 indications, flow through down stream 31c along the direction of arrow C shown in Figure 23 indications in.
In addition, at this moment, can regulate the internal circulating load of Purge gas, for example, the part by the Purge gas behind the reception room 13 is flowed out outside the storage appts 1, make remaining Purge gas be circulated to preceding stream 32 simultaneously by the extent of opening of chest portion baffle plate 25.
Its result converges in preceding stream 32 from the direction of arrow D1 illustrated in figures 1 and 2, arrow D2 and arrow D3 indication by the Purge gas behind left stream 31a, right stream 31b and the following stream 31c.Then, the on-cycle Purge gas with after the Purge gas that flows into again from the outside of storage appts 1 by inlet filter 40 is mixed, flows in the resettlement section 10 in circulation stream portion 30 (stream 32 particularly) again.
Like this, in storage appts 1, the gas that has purified by inlet filter 40 and internal ramp 50 is circulated in this storage appts 1.Therefore, for example with in the past like that Purge gas all be discharged to the outer situation of device and compare, can reduce amount by the extraneous gas of inlet filter 40.Therefore, even when for example the concentration of the pollutant substance that is contained in the outer gas of storage appts 1 is higher, also can suppress the deterioration of inlet filter 40 effectively.And, reduce the concentration of the pollutant substance that is contained in the gas by internal ramp 50, also can suppress the deterioration of this internal ramp 50 thus effectively.
In addition, the integral body of circulation stream portion 30 is arranged on the downstream of inlet filter 40.Therefore, the gas that has purified by inlet filter 40 and internal ramp 50 is mixed with the extraneous gas that does not purify, but circulate in the downstream of this inlet filter 40.Therefore, the deterioration of inlet filter 40 and internal ramp 50 can be suppressed effectively, the cleanliness level in the reception room 13 can be kept simultaneously to heavens.
In addition, blowing engine 60 is according to being provided with from the mode of reception room 13 to door 24 air-supplies.Therefore, for example to be housed in the semiconductor wafer W in the reception room 13 and to open door at 24 o'clock in order to take out the user of storage appts 1, also can prevent effectively that thus extraneous gas from flowing into the pollution that is caused in this reception room 13 by making Purge gas outside this reception room 13 continues to flow out to this storage appts 1.
In addition, in series configuration of inlet filter 40, blowing engine 60, reception room 13, door 24.Promptly, in the upstream side resettlement section 10 that side is extended point-blank downstream, blowing engine 60, internal ramp 50, reception room 13 are provided with integratedly, and this resettlement section 10, inlet filter 40, door 24 are configured on the straight line of the air supply direction in this resettlement section 10 simultaneously.Therefore, the simple in structure and miniaturization of storage appts 1 can be made, the pollution of reception room 13 grades brought along with switch door 24 can be suppressed simultaneously effectively.
In addition, among the following stream 31c in three effluent roads 31, compare with right stream 31b with other left stream 31a toward each other, the ventilation resistance of Purge gas is littler.Therefore, can make Purge gas preferentially by the following stream 31c in the effluent road 31, thereby be recycled to upstream side from the downstream of reception room 13.Therefore, can carry out the circulation of the Purge gas in the storage appts 1 with low cost effectively.
In addition, madial wall 11c setting is not promptly gone up along the part of four madial walls 11 in effluent road 31.Therefore, can realize the miniaturization of storage appts 1, for example also help piling up the situation of a plurality of storage appts 1.In addition, owing to can reduce the volume on effluent road 31, thus reduce the amount that remains on the Purge gas in the storage appts 1, therefore can suppress the deterioration of inlet filter 40 and internal ramp 50 effectively.
In addition, in this storage appts 1, gas is all undertaken by a blowing engine 60 from exterior suction, Purge gas circulation, the gas communication such as circulation of Purge gas in circulation stream portion 30 in reception room 13.Therefore, can Purge gas be circulated effectively with low cost.
[embodiment]
Then, the inlet filter 40 that makes the Purge gas circulation time in storage appts 1 and the purifying property of internal ramp 50 and the object lesson of estimating service life are described.
In the present embodiment, adopted following storage appts 1: possess remove organic substance mold pressing type chemical filter as the inlet filter 40 and the first internal ramp 50a, possess remove acidic materials the honeycomb type chemical filter as the second internal ramp 50b, possess ulpa filter as the 3rd internal ramp 50c.
The external surface area of the suction gas of the inlet filter 40 and the first internal ramp 50a is 450mm * 450mm, thickness (length on the direction that gas passes through) is 15mm, the external surface area of the second internal ramp 50b is that 450mm * 450mm, thickness are 140mm, and the external surface area of the 3rd internal ramp 50c is that 450mm * 450mm, thickness are 65mm.
In addition, contrast as a comparison as shown in Figure 3, has been adopted not make Purge gas circulation but once all from the device 100 of downstream end discharge (below be called " comparison device 100 ").That is, as shown in Figure 3,, adopted to have blowing engine 60, internal ramp 50, the reception room 13 identical and have device with resettlement section 10 same configuration of this storage appts 1 with storage appts 1 as this comparison device 100.
Therefore, in this comparison device 100, extraneous gas passes through internal ramp 50 by means of dust suction with fore filter 51, blowing engine 60 and cup 12, the gas that has purified by this internal ramp 50, all is discharged to outside this comparison device 100 from a pair of baffle plate 14 of the downstream end that is formed on this reception room 13 by behind the reception room 13 along the direction of arrow X indication shown in Figure 3.
And, will be with 1300 μ g/m
3Concentration contain propylene glycol monomethyl ether acetate (PGMEA) as organic pollution materials, with 10 μ g/m
3Concentration when containing acetic acid and using as extraneous gas as the air of acid pollution material, 90% of initial vapor concentration, inlet filter 40 and internal ramp 50 in these storage appts 1 and the comparison device 100 removed bimetry and 80% removes bimetry and estimate.Extraneous gas is 0.15m/ second to the inflow velocity of storage appts 1 and comparison device 100.In addition, in storage appts 1, make by the Purge gas behind the reception room 13 15% outside chest portion baffle plate 25 is discharged to this storage appts 1, make remaining 85% Purge gas circulation (circulation rate that is Purge gas is 85%).
Specifically, the concentration of PGMEA in the cup 12 of storage appts 1 and comparison device 100 and acetic acid is measured as first initial vapor concentration, the concentration of PGMEA in the reception room 13 and acetic acid is measured as second initial vapor concentration.The concentration of these PGMEA and acetic acid is measured by elution gas chromatography.
Then, removing bimetry and 80% with following method to 90% removes bimetry and estimates.That is, will be by the PGMEA in the gas before inlet filter 40 or the internal ramp 50 or the concentration C of acetic acid
iBe made as 100% o'clock, along with use, the performance of removing of this inlet filter 40 or internal ramp 50 descends, thus by the PGMEA remaining in the object gas after this inlet filter 40 or the internal ramp 50 or the concentration C of acetic acid
oRise, estimate and change to 10% and 20% period of service (rate of removing of PGMEA or acetic acid is reduced to 90% and 80% period of service) respectively, it is removed bimetry and 80% as 90% remove bimetry.Specifically, 90% removes bimetry and 80% removes bimetry except that the said determination condition, also adopt in inlet filter 40 and the internal ramp 50 to material transport coefficient of gas cleaning actv. face area, PGMEA and acetic acid etc., according to theoretical pattern, calculate by the numerical analysis that adopts method of finite difference to carry out according to the diffusion phenomena of Fick law.In addition, the rate of removing (%) of PGMEA and acetic acid is obtained by following formula (I).
Its result, for PGMEA, first initial vapor concentration of measuring by above-mentioned method is 91 μ g/m in storage appts 1
3, be 1300 μ g/m in comparison device 100
3, second initial vapor concentration is 2.2 μ g/m in storage appts 1
3, and be 91 μ g/m in comparison device 100
3For acetic acid, first initial vapor concentration is 1.6 μ g/m in storage appts 1
3, be 10 μ g/m in comparison device 100
3, second initial vapor concentration is 0.03 μ g/m in storage appts 1
3, be 0.06 μ g/m in comparison device 100
3
And, removing bimetry by 90% of said method evaluation is 398 hours concerning the inlet filter 40 of storage appts 1, concerning the first internal ramp 50a of storage appts 1 and comparison device 100, be respectively 1519 hours and 398 hours, concerning the second internal ramp 50b of storage appts 1 and comparison device 100, be 35.1.In addition, 80% to remove bimetry be 767 hours concerning the inlet filter 40 of storage appts 1, concerning the first internal ramp 50a of storage appts 1 and comparison device 100, be respectively 2210 hours and 767 hours, concerning the second internal ramp 50b of storage appts 1 and comparison device 100, be 44.3.
In addition, storage appts of the present invention is not limited to above-mentioned example.That is, in above-mentioned example, 31 of offside streams are illustrated along three situations about being provided with in four madial walls 11 of resettlement section 10, but also can be along the integral body setting of this madial wall 11.At this moment, for example can make in four effluent roads 31 a following stream 31c according to the ventilation resistance of Purge gas less than other three (left stream 31a, right stream 31b and be arranged on madial wall 11c and last lateral wall 21c between the upside stream) mode form.In addition, for example in the effluent road 31 in opposite directions a pair of (for example upside stream and downside stream 31c) also can form according to the ventilation resistance of Purge gas mode less than another a pair of (for example left stream 31a and right stream 31b) in opposite directions.Like this, circulation stream portion 30 is so long as comprise: the pair circulation stream of a part of sidewall setting in a plurality of sidewalls of resettlement section 10 and the other a part of sidewall setting in these a plurality of sidewalls and according to the ventilation resistance of Purge gas less than the major cycle stream that the mode of this pair circulation stream forms, then be not limited to above-mentioned example.
In addition, can at random select the chemical filter that is adopted as inlet filter 40 and internal ramp 50 with the filter of the corresponding kind of purpose for use.Promptly, as inlet filter 40, for example can adopt the chemical filter that can wait chemical pollutants such as the organic substance remove in the gas, acidic materials, alkaline matter by absorption, can by absorption etc. remove the foreign odor composition in the gas odor removal filter, can decompose the catalyst filter of removing the chemical pollutant in the gas etc.At this moment, for example can use active carbon, duolite, zeolite, photocatalyst, Mn catalyst, copper Mn catalyst etc. as employed functional agent in the inlet filter 40.When use has duolite as the chemical filter of functional agent, for example can preferably adopt following filter: the appendix duolite that has acidic materials in pair gas and alkaline matter to carry out effective chemical absorption to high-density on the structure that with inorganic fibre is skeleton with a large amount of spaces.
In addition, can at random select for use and the dust suction filter of the corresponding kind of purpose part or all as internal ramp 50.That is, for example can adopt the dust suction filter that to catch and to remove the particle of the desired diameter in the gas.In addition, in above-mentioned example, the different a plurality of filters of function have been made up in employing be illustrated as the situation of internal ramp 50, but be not limited to this, for example can constitute, in addition, also can constitute by a filter by other a plurality of filters that are combined to form.
And, concerning the combination of inlet filter 40 and internal ramp 50, also be not limited to above-mentioned example, can be the combination of mutually different other filter of function, also can be the combination of the filter of same kind.
In addition, can adopt the filter of arbitrary shape as inlet filter 40 and internal ramp 50 according to purpose.That is, for example can adopt honeycomb structured body, folded structure body, spherical, extruded body, foaming body etc.For example at loss of pressure little and pollutant substance remove the life-span long aspect, also preferably adopt honeycomb structured body.
In addition, in above-mentioned example, the situation of resettlement section 10 and chest portion 20 for rectangular shape with bending and four madial walls 11 that link to each other and lateral wall 21 is illustrated, but is not limited to this, can make other shape.
In addition, in above-mentioned example, blowing engine 60 for the situation of axial flow fan is illustrated, but is not limited thereto, for example also can adopts sucking on the S. A. direction on gas and the tangential direction and discharge the supply ventilating fan of gas and other turbofan etc. at the hand of rotation of blade part.In addition, even when adopting blowing engine 60 beyond the axial flow fan, for example also its discharge orifice is provided with towards door 24, or, this blowing engine 60 can be configured to 24 air-supplies from reception room 13 towards door by adopting suitable design-calculated pipeline etc.That is, when for example adopting supply ventilating fan, this supply ventilating fan can be configured in the upstream end portion of resettlement section 10, make its exhausr port towards the downstream (direction of arrow B indication illustrated in figures 1 and 2) as blowing engine 60.In addition, when adopting turbofan, this turbofan and axial flow fan similarly can be configured in the upstream end portion of resettlement section 10, make of the direction extension of its S. A. along arrow B indication illustrated in figures 1 and 2 as blowing engine 60.In addition, blowing engine 60 also can be positioned at the upstream side of resettlement section 10 and be configured in preceding stream 32.
In addition, for example in storage appts 1,, and blowing engine 60 is stopped if inlet baffle 41 and chest portion baffle plate 25 are closed fully, thereby the inside of this storage appts 1 is in air-tight state, then also can take care of semiconductor wafer W under the situation of not blowing in this storage appts 1.
Claims (5)
1. a storage appts is characterized in that it comprises: the reception room of accommodating article; Be arranged on the chemical filter of the upstream side of described reception room; To be blown into the blowing engine in the described reception room by the gas that described chemical filter has purified; And the circulation stream that is used to make the Purge gas circulation that is blown in the described reception room and is provided with along the sidewall of described reception room.
2. storage appts as claimed in claim 1 is characterized in that described circulation stream is arranged on the downstream of described chemical filter, and at least a portion that is blown into the Purge gas in the described reception room is in the circulation of the downstream of described chemical filter.
3. storage appts as claimed in claim 1 or 2, it is characterized in that, have the let-in door of taking-up that is used to be housed in the described article in the described reception room in the downstream of described reception room, described blowing engine is according to disposing from the mode of described reception room to described door air-supply.
4. as each described storage appts of claim 1～3, it is characterized in that, have the let-in door of taking-up that is used to be housed in the described article in the described reception room and described chemical filter, described blowing engine, described reception room and the in series configuration of described door in the downstream of described reception room.
5. as each described storage appts of claim 1～4, it is characterized in that described circulation stream comprises: the primary flow path that extends to the secondary flow road of upstream side and extend to upstream side and form less than the mode on described secondary flow road along another part of described sidewall along the part of described sidewall from the downstream of described reception room according to the ventilation resistance of Purge gas from the downstream of described reception room.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007092685A JP5145541B2 (en) | 2007-03-30 | 2007-03-30 | Storage device |
| JP092685/2007 | 2007-03-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101274701A true CN101274701A (en) | 2008-10-01 |
| CN101274701B CN101274701B (en) | 2013-01-16 |
Family
ID=39976505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100902024A Expired - Fee Related CN101274701B (en) | 2007-03-30 | 2008-03-28 | Custody apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5145541B2 (en) |
| KR (1) | KR20080089225A (en) |
| CN (1) | CN101274701B (en) |
| TW (1) | TW200848334A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103768905A (en) * | 2012-10-19 | 2014-05-07 | 和舰科技(苏州)有限公司 | Moveable air chemical filtration apparatus |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6332950A (en) * | 1986-07-25 | 1988-02-12 | Hitachi Electronics Eng Co Ltd | Wafer cassette housing box |
| US5607647A (en) * | 1993-12-02 | 1997-03-04 | Extraction Systems, Inc. | Air filtering within clean environments |
| WO1999028968A1 (en) * | 1997-12-02 | 1999-06-10 | Kabushiki Kaisha Toshiba | Method of maintaining cleanliness of substrates and box for accommodating substrates |
| WO2000037160A1 (en) * | 1998-12-22 | 2000-06-29 | Taisei Corporation | Filter medium for air filter and process for producing the same |
| JP3595791B2 (en) * | 2001-11-19 | 2004-12-02 | キヤノン株式会社 | Semiconductor manufacturing equipment |
| JP2006156712A (en) * | 2004-11-30 | 2006-06-15 | Sony Corp | Substrate carrying container |
-
2007
- 2007-03-30 JP JP2007092685A patent/JP5145541B2/en not_active Expired - Fee Related
-
2008
- 2008-03-26 TW TW097110682A patent/TW200848334A/en unknown
- 2008-03-27 KR KR1020080028533A patent/KR20080089225A/en not_active Application Discontinuation
- 2008-03-28 CN CN2008100902024A patent/CN101274701B/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103768905A (en) * | 2012-10-19 | 2014-05-07 | 和舰科技(苏州)有限公司 | Moveable air chemical filtration apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101274701B (en) | 2013-01-16 |
| JP2008251926A (en) | 2008-10-16 |
| JP5145541B2 (en) | 2013-02-20 |
| TW200848334A (en) | 2008-12-16 |
| KR20080089225A (en) | 2008-10-06 |
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| PB01 | Publication | ||
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