CN101242723A - Spring slice fixing structure and heat radiation module - Google Patents
Spring slice fixing structure and heat radiation module Download PDFInfo
- Publication number
- CN101242723A CN101242723A CNA2007100732565A CN200710073256A CN101242723A CN 101242723 A CN101242723 A CN 101242723A CN A2007100732565 A CNA2007100732565 A CN A2007100732565A CN 200710073256 A CN200710073256 A CN 200710073256A CN 101242723 A CN101242723 A CN 101242723A
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- China
- Prior art keywords
- fixed
- fixing structure
- fixed mount
- fixed head
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A spring plate fixing structure, including a fixing frame and a fixing plate thereon, wherein the fixing frame is for fixing heating electronic elements, and the fixing plate is for fixing circuit board. At least one spring plate is arranged between fixing frame and fixing plate, when fixing plate is fixed to circuit board, the fixing plate presses the spring plate downwards, makes the spring plate elastically deformed and press fixing frame onto the heating electronic element. The spring plate fixing structure has an advantage of generating appropriate pressure. The invention also relates to a heat dissipation module group of the mentioned spring plate fixing structure.
Description
Technical field
The present invention relates to a kind of spring slice fixing structure, particularly relate to a kind of heat radiation module that is used for the spring slice fixing structure of heat-generating electronic elements and adopts this spring slice fixing structure.
Background technology
Current, along with developing rapidly of computer industry, the heat that heat-generating electronic elements such as little process chip produce is more and more many.For the heat that these are unnecessary effectively distributes, the industry plate body that is sticked on the surface of this heat-generating electronic elements usually utilizes heat dissipation elements such as fin, heat pipe, radiator fan that this plate body is carried out forced heat radiation, so that the heat on the heat-generating electronic elements is forced to leave.For reducing the thermal resistance between this plate body and the heat-generating electronic elements, also be folded with one deck thermal interfacial material between this plate body and the heat-generating electronic elements usually.
For example, Chinese utility model patent promptly discloses a kind of heat radiation module No. 02236915.5.This heat radiation module comprises a pedestal, some heat pipes, a radiating fin group and a fan.This pedestal dual-side is arranged with a shell fragment respectively, and these shell fragment ends are respectively equipped with a lock member.These shell fragments are fixed on the motherboard by these lock members, so that this pedestal is suppressed on the CPU of this motherboard.Be provided with one deck thermal interfacial material between this pedestal and this CPU.These heat pipe one ends are connected with this pedestal, and the other end is connected with the radiating fin group, and this fan is used for this radiating fin group is carried out forced heat radiation.
During assembling, these shell fragments can produce distortion along with the stressed of lock member, fix this pedestal with compacting.Yet for fear of spatial limitation, the length of these shell fragments is shorter, and the variation of its deformation quantity can produce the rapid variation on the elastic force, makes the size of the elastic force that these shell fragments produce be difficult to control.If shell fragment is excessive to the pedestal applied pressure, then easily heat-generating electronic elements is caused damage; If it is too small that shell fragment is exerted pressure to pedestal, then be difficult to the tight pressing of thermal interfacial material that will be located between pedestal and the heat-generating electronic elements, cause thermal interfacial material not play one's part to the full, make the contact heat resistance between pedestal and the heat-generating electronic elements too high.
Summary of the invention
In view of this, be necessary to provide a kind of heat radiation module that produces the spring slice fixing structure of suitable pressure and use this spring slice fixing structure.
A kind of spring slice fixing structure, comprise fixed mount and be located at fixed head on this fixed mount, this fixed mount is used for fixing to heat-generating electronic elements, this fixed head is used for fixing to circuit board, be provided with at least one shell fragment between this fixed mount and the fixed head, when this fixed head was fixed on the circuit board, this fixed head compressed this shell fragment downwards, and this shell fragment generation elastic deformation is also suppressed this fixed mount on this heat-generating electronic elements.
A kind of spring slice fixing structure, comprise fixed mount and fixed head, the bottom surface of this fixed mount is provided with thermal interfacial material, this fixed mount is used for fixing to heat-generating electronic elements, this fixed head is used for fixing to circuit board, be provided with at least one flexible member between this fixed mount and the fixed head, this fixed head is arranged with downwards towards the surface of fixed mount and forms corresponding butt groove of accommodating this at least one flexible member, when this fixed head was fixed on the circuit board, this at least one flexible member was compressed distortion in described butt groove.
A kind of heat radiation module, comprise fan, the radiating fin group, heat pipe and spring slice fixing structure, this heat pipe is with spring slice fixing structure and the hot link of radiating fin group, this fan is to this radiating fin group heat radiation, this spring slice fixing structure comprises fixed mount and is located at fixed head on this fixed mount, this fixed mount is used for fixing to heat-generating electronic elements, this fixed head is used for fixing to circuit board, be provided with at least one shell fragment between this fixed mount and the fixed head, when this fixed head is fixed on the circuit board, this fixed head compresses this shell fragment downwards, and this shell fragment generation elastic deformation is also suppressed this fixed mount on this heat-generating electronic elements.
Compared with prior art, this spring slice fixing structure compresses this shell fragment by this fixed mount and fixed head, makes shell fragment that quantitative elastic deformation take place, thereby this fixed mount is produced the suitably pressure of size.Guarantee that this heat-generating electronic elements can not produce damage because of the pressure that is subjected to is excessive, make the thermal interfacial material that is located between this fixed mount and the heat-generating electronic elements fully fill gap between the two simultaneously, thereby the heat transferred that heat-generating electronic elements is produced is somebody's turn to do the heat radiation module effectively, significantly reduces the temperature of this heat-generating electronic elements.
Description of drawings
Fig. 1 for the present invention dispel the heat module wherein an embodiment and related elements along the three-dimensional exploded view at first visual angle.
Fig. 2 be in the heat radiation module shown in Figure 1 subelement along the three-dimensional exploded view at second visual angle.
Fig. 3 is the three-dimensional assembly diagram of heat radiation module shown in Figure 2.
Fig. 4 is the three-dimensional assembly diagram of heat radiation module shown in Figure 1 and related elements.
Embodiment
With reference to the accompanying drawings, be described further in conjunction with the embodiments.
Figure 1 shows that the present invention's wherein three-dimensional exploded view of an embodiment of module that dispels the heat.This heat radiation module 100 comprises a heat abstractor 10 and a spring slice fixing structure 20.This heat abstractor 10 comprises a radiator fan 12, a radiating fin group 14 and a heat pipe 16, and this radiator fan 12 is used for radiating fin group 14 is carried out forced heat radiation.This spring slice fixing structure 20 comprises a fixed mount 30 and a fixed head 40, this fixed head 40 is fixed on the circuit board 50, this fixed mount 30 between this circuit board 50 and fixed head 40 and with a heat-generating electronic elements 60 (as graphical display chip in the notebook computer etc.) hot link of being located on this circuit board 50.Be folded with one deck thermal interfacial material 70 (as shown in Figure 2) between this fixed mount 30 and the heat-generating electronic elements 60.
Please refer to Fig. 1 to Fig. 3, this heat pipe 16 comprises an evaporation ends 164 and a condensation end 162.This evaporation ends 164 is contained between this fixed mount 30 and this fixed head 40 (as shown in Figure 3), is used to absorb the heat that heat-generating electronic elements 60 produces; This condensation end 162 is sticked on the surface of this radiating fin group 14, makes the heat that is passed to condensation end 162 from this evaporation ends 164 force to leave by this radiating fin group 14 and radiator fan 12.
This fixed mount 30 comprises a rectangular substrate 32 and is located at two shell fragments 34 on this substrate 32.This substrate 32 is made by thermal conductivity good metal part such as copper billet, is respectively equipped with a spacer 322 on two diagonal positions of this substrate 32, and this two spacer 322 is one bending forming from this substrate 32 respectively; Middle position on this substrate 32 is provided with two pairs of spacers 324 to evaporation ends 164 that should heat pipe 16.These spacers 324 are by these substrate 32 integrated punchings and be bent to form, and are symmetrically distributed in the both sides of the evaporation ends 164 of heat pipe 16, so that this heat pipe 16 is gripped.This two shell fragment 34 be symmetrically distributed in this heat pipe 16 both sides and with heat pipe 16 parallel (as shown in Figure 1).These shell fragments 34 are made into integration by metal, and it comprises a strip fixed part 342 and two support arms 344 that extend to form obliquely respectively from the two ends of this fixed part 342, and this fixed part 342 is fixed on the substrate 32 of this fixed mount 30 by elements such as rivets.The end of each support arm 344 is bent to form circular-arc top 345, is used for this fixed head 40 butts and reduces scraping to this fixed head 40.
Please refer to Fig. 1 to Fig. 4, three button pin 46 that this fixed head 40 comprises a plate body 42, is located at the some fins 44 on this plate body 42 and stretches out and form from this plate body 42.These fins 44 are used for this fixed head 40 is dispelled the heat, and these button pin 46 are fixed to this fixed head 40 on this circuit board 50 by screw 462 (as shown in Figure 4).Please refer to Fig. 2, the bottom surface of this plate body 42 to should heat pipe 16 and fixed mount 30 be respectively equipped with an accepting groove 41 and an embeded slot 43, this accepting groove 41 is interconnected with embeded slot 43.This plate body 42 is being contained in this heat pipe 16 in the accepting groove 41 of this plate body 42 in fixing with fixed mount 30 is chimeric, makes heat pipe 16 simultaneously and this fixed mount 30 and fixed head 40 hot links (as shown in Figure 3).The both sides of this accepting groove 41 are respectively equipped with a slot to make way 41a to spacer 324 that should fixed mount 30, to accommodate these spacers 324 when ccontaining this heat pipe 16.In this embeded slot 43 two spacers 322 that should fixed mount 30 are respectively equipped with a location notch 431, in this two spacer 322 is contained in to locate this fixed mount 30.In this embeded slot 43 two shell fragments 34 that should fixed mount 30 are respectively equipped with a butt groove 432.The size setting of the corresponding shell fragment 34 of the size of this butt groove 432 makes shell fragment 34 that elastic deformation can take place in this butt groove 432.
This thermal interfacial material 70 is a phase change thermal interfacial material.Certainly, according to required thermal resistance value, this thermal interfacial material 70 also can be the thermal interfacial material of other kind, as heat-conducting cream (thermal grease) etc.
During assembling, the spacer 324 on this fixed mount 30 grips the evaporation ends 164 of this heat pipe 16, and evaporation ends 164 and this fixed mount 30 of this heat pipe 16 are housed in respectively in the accepting groove 41 and embeded slot 43 of this fixed head 40.Wherein, the spacer 322 of this fixed mount 30 is housed in the location notch 431 of this fixed head 40.The combination of this fixed mount 30, heat pipe 16 and fixed head 40 is fixed on this circuit board 50 by the button pin 46 on this fixed head 40 and these screws 462.Wherein, this fixed mount 30 is by thermal interfacial material 70 and heat-generating electronic elements 60 hot links.The condensation end 162 of this heat pipe 16 is sticked on the radiating fin group 14 in this heat abstractor 10, and the heat that utilizes 12 pairs of these heat pipes 16 of this radiating fin group 14 and this radiator fan to be transmitted carries out forced heat radiation (as shown in Figure 4).
In this fixed head 40 was fixed to process on this circuit board 50, this fixed head 40 compressed these shell fragments 34 downwards by butt groove 432, made these shell fragments 34 elastic deformations take place and suppress this fixed mount 30.When this fixed head 40 contacts with fixed mount 30 and heat pipe 16, strain no longer takes place in these shell fragments 34, this fixed head 40 is fixed on this circuit board 50, and this fixed mount 30 is fixed on this heat-generating electronic elements 60 by these shell fragments 34 and 40 compactings of this fixed head simultaneously.
The heat that this heat-generating electronic elements 60 produces passes to this fixed mount 30 through this thermal interfacial material 70, and the heat part on this fixed mount 30 passes to this fixed head 40, by the fin on this fixed head 40 44 heat is left; Another part passes to the evaporation ends 164 of this heat pipe 16, and is passed to the condensation end 162 of this heat pipe 16 by this evaporation ends 164, utilizes this heat abstractor 10 that the heat on the condensation end 162 is forced to leave.
By above narration as can be known, this spring slice fixing structure 20 compresses these shell fragments 34 by this fixed mount 30 is set with fixed head 40, make these shell fragments 34 that quantitative elastic deformation take place, compress this fixed mount 30 and the thermal interfacial material 70 that is located between this fixed mount 30 and the heat-generating electronic elements 60 is produced the suitably pressure of size, promptly when this fixed head 40 is fixed on the circuit board 50 by screw 462, the sealed power that is applied will be adjusted by the elastic deformation of shell fragment 34, makes this heat-generating electronic elements 60 can not produce damage because of the pressure that is subjected to is excessive; Also this thermal interfacial material 70 is produced the suitable power that compresses simultaneously.
Because this spring slice fixing structure 20 can produce the pressure of suitable size, make to have and to bring into play the effect that the best is filled up the gap than the phase change thermal interfacial material 70 of low-heat resistance, thereby, significantly reduce the temperature of this heat-generating electronic elements 60 effectively with the heat transferred fixed mount 30 of heat-generating electronic elements 60 generations.
In addition, the surface of this fixed head 40 is provided with fin 44, and this heat pipe 16 to heat abstractor 10, utilizes radiating fin group 14 and radiator fan 12 to carry out forced heat radiation the heat transferred of fixed mount 30, and these are provided with the further heat-sinking capability that promotes this heat radiation module 100.
Claims (11)
1. spring slice fixing structure, comprise fixed mount and be located at fixed head on this fixed mount, this fixed mount is used for fixing to heat-generating electronic elements, this fixed head is used for fixing to circuit board, it is characterized in that: be provided with at least one shell fragment between this fixed mount and the fixed head, when this fixed head was fixed on the circuit board, this fixed head compressed this shell fragment downwards, and this shell fragment generation elastic deformation is also suppressed this fixed mount on this heat-generating electronic elements.
2. spring slice fixing structure according to claim 1 is characterized in that: described shell fragment comprises a fixed part and two support arms that extend to form obliquely respectively from these fixed part two ends.
3. spring slice fixing structure according to claim 1 is characterized in that: the end face of this fixed head is provided with some fins.
4. spring slice fixing structure according to claim 1 is characterized in that: the bottom surface of this fixed head is provided with an embeded slot to shape that should fixed mount, in this embeded slot is contained in this shell fragment and fixed mount.
5. spring slice fixing structure according to claim 4 is characterized in that: corresponding described shell fragment is provided with the butt groove that matches in this embeded slot.
6. spring slice fixing structure according to claim 4 is characterized in that: the place, diagonal angle of this fixed mount is provided with a spacer respectively, and the corresponding described spacer of the embeded slot of this fixed head is provided with location notch, and described spacer is housed within the described location notch.
7. spring slice fixing structure according to claim 1 is characterized in that: be provided with one deck thermal interfacial material between this fixed head and the heat-generating electronic elements.
8. spring slice fixing structure according to claim 1 is characterized in that: be folded with heat pipe between this fixed head and the fixed mount, this fixed head is provided with the storage tank of accommodating this heat pipe, and this fixed mount is provided with the spacer of this heat pipe of clamping.
One kind the heat radiation module, comprise fan, radiating fin group, heat pipe and spring slice fixing structure, this heat pipe is with spring slice fixing structure and the hot link of radiating fin group, this fan is to this radiating fin group heat radiation, and it is characterized in that: this spring slice fixing structure is each described spring slice fixing structure in the claim 1 to 7.
10. spring slice fixing structure, comprise fixed mount and fixed head, the bottom surface of this fixed mount is provided with thermal interfacial material, this fixed mount is used for fixing to heat-generating electronic elements, this fixed head is used for fixing to circuit board, it is characterized in that: be provided with at least one flexible member between this fixed mount and the fixed head, this fixed head is arranged with downwards towards the surface of fixed mount and forms corresponding butt groove of accommodating this at least one flexible member, when this fixed head was fixed on the circuit board, this at least one flexible member was compressed distortion in described butt groove.
11. spring slice fixing structure as claimed in claim 10 is characterized in that: this at least one flexible member comprises a pair of shell fragment that is arranged on this fixed mount, and correspondence is provided with a pair of butt groove on this fixed head.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100732565A CN101242723A (en) | 2007-02-09 | 2007-02-09 | Spring slice fixing structure and heat radiation module |
| US11/735,806 US7855889B2 (en) | 2007-02-09 | 2007-04-16 | Resilient fastener and thermal module incorporating the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100732565A CN101242723A (en) | 2007-02-09 | 2007-02-09 | Spring slice fixing structure and heat radiation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101242723A true CN101242723A (en) | 2008-08-13 |
Family
ID=39714568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100732565A Pending CN101242723A (en) | 2007-02-09 | 2007-02-09 | Spring slice fixing structure and heat radiation module |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US7855889B2 (en) |
| CN (1) | CN101242723A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102458081A (en) * | 2010-10-22 | 2012-05-16 | 富瑞精密组件（昆山）有限公司 | Heat radiator and electronic device using same |
| CN103515339A (en) * | 2012-06-29 | 2014-01-15 | 富瑞精密组件（昆山）有限公司 | Electronic device |
| CN107453621A (en) * | 2017-09-25 | 2017-12-08 | 孙景玉 | A kind of Miniature inverter |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008251687A (en) | 2007-03-29 | 2008-10-16 | Toshiba Corp | Printed circuit board, and electronic equipment equipped with this |
| CN101674717B (en) * | 2008-09-11 | 2012-05-16 | 富准精密工业(深圳)有限公司 | Radiation device |
| CN101840257A (en) * | 2009-03-21 | 2010-09-22 | 富瑞精密组件（昆山）有限公司 | Heat dissipation module and fixing device thereof |
| CN101861078A (en) * | 2009-04-10 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Heat sink and manufacturing method thereof |
| CN101861079A (en) * | 2009-04-10 | 2010-10-13 | 富准精密工业(深圳)有限公司 | Heat radiating device |
| CN101909417A (en) * | 2009-06-04 | 2010-12-08 | 富准精密工业(深圳)有限公司 | Radiating device and manufacture method thereof |
| US8405997B2 (en) * | 2009-06-30 | 2013-03-26 | Kabushiki Kaisha Toshiba | Electronic apparatus |
| CN102549742A (en) * | 2009-09-30 | 2012-07-04 | 日本电气株式会社 | Structure for cooling electronic component, and electronic apparatus |
| CN102984915B (en) * | 2011-09-05 | 2016-11-23 | 富瑞精密组件（昆山）有限公司 | Heat abstractor |
| TWI538611B (en) * | 2011-11-29 | 2016-06-11 | 鴻準精密工業股份有限公司 | Heat sink and clip thereof |
| JP7097477B1 (en) * | 2021-05-12 | 2022-07-07 | レノボ・シンガポール・プライベート・リミテッド | Manufacturing methods for electronic devices, cooling devices, and cooling devices |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0864732A (en) * | 1994-08-26 | 1996-03-08 | Mitsubishi Electric Corp | Semiconductor integrated circuit device |
| US6119101A (en) * | 1996-01-17 | 2000-09-12 | Personal Agents, Inc. | Intelligent agents for electronic commerce |
| TW450377U (en) * | 1999-09-30 | 2001-08-11 | Wei Wen Jen | Clip structure for heat sink device |
| JP3280954B2 (en) * | 2000-06-02 | 2002-05-13 | 株式会社東芝 | Circuit module and electronic equipment mounted with circuit module |
| US20030102108A1 (en) * | 2001-11-30 | 2003-06-05 | Sarraf David B. | Cooling system for electronics with improved thermal interface |
| US20040188079A1 (en) | 2003-03-31 | 2004-09-30 | Arima Computer Corporation | Heat-dissipation module for chip |
| US7019976B1 (en) * | 2003-06-04 | 2006-03-28 | Cisco Technology, Inc. | Methods and apparatus for thermally coupling a heat sink to a circuit board component |
| US7342788B2 (en) | 2004-03-12 | 2008-03-11 | Powerwave Technologies, Inc. | RF power amplifier assembly with heat pipe enhanced pallet |
| US7327574B2 (en) * | 2005-02-15 | 2008-02-05 | Inventec Corporation | Heatsink module for electronic device |
| CN1848035A (en) * | 2005-04-14 | 2006-10-18 | 富准精密工业(深圳)有限公司 | Locking module |
| CN2817070Y (en) | 2005-05-27 | 2006-09-13 | 佛山市顺德区汉达精密电子科技有限公司 | Central processor rediating device structure |
| TWI320526B (en) * | 2006-05-24 | 2010-02-11 | Compal Electronics Inc | Cooler module and its fasten structure |
| US7447035B2 (en) * | 2006-12-01 | 2008-11-04 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device assembly |
| JP4783326B2 (en) * | 2007-04-11 | 2011-09-28 | 株式会社東芝 | Electronics |
-
2007
- 2007-02-09 CN CNA2007100732565A patent/CN101242723A/en active Pending
- 2007-04-16 US US11/735,806 patent/US7855889B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102458081A (en) * | 2010-10-22 | 2012-05-16 | 富瑞精密组件（昆山）有限公司 | Heat radiator and electronic device using same |
| CN102458081B (en) * | 2010-10-22 | 2015-10-07 | 富瑞精密组件（昆山）有限公司 | Heat abstractor and use the electronic installation of this heat abstractor |
| CN103515339A (en) * | 2012-06-29 | 2014-01-15 | 富瑞精密组件（昆山）有限公司 | Electronic device |
| CN103515339B (en) * | 2012-06-29 | 2016-06-08 | 富瑞精密组件（昆山）有限公司 | Electronic installation |
| CN107453621A (en) * | 2017-09-25 | 2017-12-08 | 孙景玉 | A kind of Miniature inverter |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080202740A1 (en) | 2008-08-28 |
| US7855889B2 (en) | 2010-12-21 |
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