CN101212007A - 电致发光模块 - Google Patents
电致发光模块 Download PDFInfo
- Publication number
- CN101212007A CN101212007A CNA2006101717642A CN200610171764A CN101212007A CN 101212007 A CN101212007 A CN 101212007A CN A2006101717642 A CNA2006101717642 A CN A2006101717642A CN 200610171764 A CN200610171764 A CN 200610171764A CN 101212007 A CN101212007 A CN 101212007A
- Authority
- CN
- China
- Prior art keywords
- substrate
- module
- light
- heat conduction
- electroluminescent module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/17—Structure, shape, material or disposition of the bump connectors after the connecting process of a plurality of bump connectors
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (18)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006101717642A CN100568558C (zh) | 2006-12-29 | 2006-12-29 | 电致发光模块 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006101717642A CN100568558C (zh) | 2006-12-29 | 2006-12-29 | 电致发光模块 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101212007A true CN101212007A (zh) | 2008-07-02 |
CN100568558C CN100568558C (zh) | 2009-12-09 |
Family
ID=39611793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006101717642A Expired - Fee Related CN100568558C (zh) | 2006-12-29 | 2006-12-29 | 电致发光模块 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100568558C (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102185090A (zh) * | 2011-03-29 | 2011-09-14 | 晶科电子(广州)有限公司 | 一种采用cob封装的发光器件及其制造方法 |
CN103515508A (zh) * | 2012-06-19 | 2014-01-15 | 茂邦电子有限公司 | 发光二极管封装及其所使用的散热模块 |
CN104362244A (zh) * | 2014-11-17 | 2015-02-18 | 杨文澍 | 一种金属基板 |
CN109817793A (zh) * | 2016-08-31 | 2019-05-28 | 开发晶照明(厦门)有限公司 | Led模块 |
-
2006
- 2006-12-29 CN CNB2006101717642A patent/CN100568558C/zh not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102185090A (zh) * | 2011-03-29 | 2011-09-14 | 晶科电子(广州)有限公司 | 一种采用cob封装的发光器件及其制造方法 |
CN103515508A (zh) * | 2012-06-19 | 2014-01-15 | 茂邦电子有限公司 | 发光二极管封装及其所使用的散热模块 |
CN104362244A (zh) * | 2014-11-17 | 2015-02-18 | 杨文澍 | 一种金属基板 |
CN109817793A (zh) * | 2016-08-31 | 2019-05-28 | 开发晶照明(厦门)有限公司 | Led模块 |
CN109817793B (zh) * | 2016-08-31 | 2022-01-04 | 开发晶照明(厦门)有限公司 | Led模块 |
Also Published As
Publication number | Publication date |
---|---|
CN100568558C (zh) | 2009-12-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: DONGGUAN DELTA ENERGY TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: DELTA ELECTRONICS, INC. Effective date: 20121019 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: TAIWAN, CHINA TO: 523308 DONGGUAN, GUANGDONG PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20121019 Address after: 523308 Binjiang East Road, Shijie Town, Dongguan, Guangdong Patentee after: Dongguan Delta Energy Technology Co., Ltd. Address before: China Taiwan Taoyuan County Patentee before: Delta Optoelectronics Inc. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091209 Termination date: 20151229 |
|
EXPY | Termination of patent right or utility model |