CN101197232B - Production method for medium layer of plasma display - Google Patents
Production method for medium layer of plasma display Download PDFInfo
- Publication number
- CN101197232B CN101197232B CN2007103024915A CN200710302491A CN101197232B CN 101197232 B CN101197232 B CN 101197232B CN 2007103024915 A CN2007103024915 A CN 2007103024915A CN 200710302491 A CN200710302491 A CN 200710302491A CN 101197232 B CN101197232 B CN 101197232B
- Authority
- CN
- China
- Prior art keywords
- medium
- spacer
- dielectric layer
- medium layer
- basal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Gas-Filled Discharge Tubes (AREA)
Abstract
The invention relates to a producing method for medium layer in plasma displayer, which is characterized in that adhesive belts of certain width is pasted in the binding region outside the edge of an educing line before heat pressing the medium. A glass basal plate after pasted with the adhesive belt passes through a pre-heating stove, a dry cleaner and a die pressing machine respectively. The glass basal plate with moderate temperature passes between an upper roll and a lower roll with certain speed after short-time ironing, then the surface of the basal plate is uniformly pasted with the medium layer. After the medium attaching is completed, the critical position of the surface of the basal plate and the adhesive belt has an obvious imprinting, thus pressing the steel ruler on the imprinting slightly. Starts from one end of the adhesive belt by nipper with care, then the adhesive belt is lifted along the direction of the steel ruler and the medium layer on the adhesive belt is removed simultaneously. The invention has the advantages of fast speed and good quality. Furthermore, the front and back basal plate can be pressed in same batch without changing the medium with different widths.
Description
Technical field
The present invention relates to a kind of Plasma Display Technology, especially a kind of manufacturing technology of plasma scope attaches a kind of method of making dielectric layer of medium stage in specifically a kind of plasma display.
Background technology
Plasma flat-panel display (Plasma Display Panel is called for short PDP) is to utilize the luminous flat display board that shows of gas discharge.Shadow mask plasma display (Shadow Mask Plasma Display Panel is called for short SMPDP) is on existing PDP technical foundation, utilizes the planar mask in the color CRT (cathode ray tube) to replace barrier manufacturing complicated among the PDP.
The shadow mask plasma display panel that adopts mainly comprises prebasal plate, metacoxal plate and shadow mask at present, as shown in Figure 1.Prebasal plate is from glass substrate, is respectively scan electrode, dielectric layer and the protective layer that forms on the dielectric layer surface; Metacoxal plate is respectively addressing electrode, dielectric layer vertical with scan electrode and the protective layer that forms on dielectric layer from glass substrate.The front-back baseboard structure that comprises electrode as shown in Figure 2.And shadow mask is the metal foil web plate that comprises the mesh array that is processed by electric conducting material.
In order to make electrode on the substrate avoid the sputter damage that causes because of discharge, on electrode, must cover one deck dielectric layer.The main effect of transparency dielectric layer is protection scan electrode and addressing electrode, savings electric charge and restriction discharging current.Keep normal discharge condition, require thin and its proof voltage intensity of transparent dielectric layer to want high.
In the preceding working procedure that plasma display panel (PDP) is made,, can adopt methods such as silk-screen, hot pressing in order to form the transparent dielectric layer that to protect scan electrode and addressing electrode.The method that has adopted the hot pressing of press mold machine to attach is at present made dielectric layer, and its advantage is that technology is simple relatively, and lower to the requirement of equipment and technology level, the defective of generation is few, but also has the higher another side of material cost.
Whether the quality that medium attaches directly decision screen can be used, if it is bad to attach effect, compressive resistance is low, easily causes dielectric breakdown.So it is a key link in the plasma panel making, plays a part very important to whole technology.
Can face a problem when attaching medium: when the medium width has surpassed required value, if do not carry out the direct hot pressing of any processing, can make medium cover the binding line outside the lead-in wire edge, cause binding to carry out after the sintering, just can not obtain qualified plasma panel.Here the design of the size of the glass substrate of required value of being mentioned and different size and graph area is closely related.Later on plate is an example, and the ideal medium width is the width (not comprising binding line) between the binding line at two ends, and the medium that exceeds this width just must be handled through corresponding before hot pressing.
Summary of the invention
The objective of the invention is the shortcomings and deficiencies that exist in the dielectric layer manufacture method at existing shadow mask type plasma display, a kind of manufacture method of simple to operate, dielectric layer that efficient is high is provided.
Technical scheme of the present invention is:
A kind of manufacture method of plasma scope medium layer is characterized in that:
At first spacer is sticked in the binding district outside the contact conductor edge of the substrate surface that passes through clean;
Secondly, the substrate that posts adhesive tape is passed through preheating furnace, dry-cleaning machine, press mold machine respectively, form at substrate surface and attach uniform hot pressing dielectric layer;
The 3rd, push down the represented that the spacer place forms with steel ruler, uncover spacer and when the direction of steel ruler is taken spacer off, remove the dielectric layer that overlays on the spacer with hand or instrument, expose the making that contact conductor binding district in addition promptly finishes whole dielectric layer.
Described substrate comprises prebasal plate and metacoxal plate.
Described spacer is anti-adhesive tape more than 100 ℃.
Key of the present invention is that the binding line of avoiding going between outside the edge is covered by medium, presss from both sides layer of substance (abbreviation spacer) between glass substrate and dielectric layer for this reason, after the hot pressing medium, thereby removes dielectric layer by removing spacer.In conjunction with some characteristics of heat pressing process, spacer in selection, must be noted that following some:
1, spacer can not be too thick, otherwise can influence the effect that medium attaches, and dielectric surface is at the local fold and the bubble of easily producing of tape edge after the hot pressing;
2, before the piezodielectric, substrate will be removed the floating ash on surface through the ultrasonic wave dry-cleaning machine.Therefore, spacer must have certain viscosity, is convenient to be fixed on substrate surface.If can not be fixed, when cleaning through dry type easily by the ultrasonic wave substrate surface that blows off.But its viscosity again can not be too strong, otherwise be difficult to make it to peel off from glass baseplate surface after the hot pressing medium;
3, the width to spacer also has certain requirement, and desirable width value is suitable with the width of binding line.The width of binding line is approximately about 6mm;
4, to pass through preheating furnace before the piezodielectric, its objective is the surface temperature of rising glass substrate, more help the attaching of medium.After substrate surface was heated, temperature was at 40 ℃～100 ℃, and under this temperature, spacer can not melt, distortion, releasing organics.
Take all factors into consideration the factor of above three aspects, the adhesive tape that can tolerate more than 100 ℃ relatively meets these conditions.
Before the hot pressing medium, the adhesive tape of certain width is sticked in the binding district outside the lead-in wire edge.Pass through preheating furnace, dry-cleaning machine, press mold machine respectively with attaching adhesive tape glass substrate afterwards.Preheating furnace heats up substrate, and dry-cleaning machine utilizes ultrasonic wave to remove impurity such as floating ash.Glass substrate with suitable temperature passes through between the last lower compression roller with certain speed through after the of short duration flatiron.Because roller temperature is higher, and have certain pressure, dielectric layer will be attached to substrate surface equably, and hot pressing medium principle as shown in Figure 3.
After the attaching medium finishes, check the substrate surface situation.Substrate surface has tangible impression with the critical place of adhesive tape, and steel ruler is pressed on this road impression gently, carefully starts with tweezers at an end of adhesive tape, takes adhesive tape off along the direction of steel ruler, and the dielectric layer above the adhesive tape just together is removed, as shown in Figure 4.
Before the hot pressing medium, remove and keep the cleaning of surrounding environment and equipment also must carry out suitable preliminary treatment: should be when promptly starting shooting according to different types of dielectric material setup parameter, in the preheating of press mold machine, roller and main body are removed, new deielectric-coating is installed, adjust the distance of deielectric-coating edge to D/F unit, make the distance of two back gauge D/F Unit of deielectric-coating identical; Cut the deielectric-coating of 50cm, diaphragm is set, place the bobbin of roller top, the rolling bobbin makes diaphragm quill flatly, again with the deielectric-coating main body via action roller, roller tensioner after, be pulled down to adsorption plate; Deielectric-coating flatly is attached on the adsorption plate, after opening vacuum action, selecting the deielectric-coating size, adjusts the smooth of film, be pulled down to the about 1～2cm of deielectric-coating miter guide so that the mounting medium film; Deielectric-coating on the film miter guide is strained a little, utilized scraper cutting medium film, repetitive operation is up to smooth adsorption plate and the miter guide of placing of deielectric-coating; Confirm above action, main body is pushed back original position; Adjust feed zone charging width, preliminary treatment work is promptly finished in the gap before and after affirmation vacuum and the pad pasting.
Beneficial effect of the present invention:
The invention has the advantages that, when not having the medium of suitable width, just can obtain desirable attaching effect by simple processing.Manufacture craft is simple, and is with low cost.The most important thing is, during same batch of compacting of front-back baseboard, do not need to change the medium of different in width.
Description of drawings
Fig. 1 is the structural representation of common shadow mask type plasma display screen.
Fig. 2 is the structural representation of front-back baseboard.
Fig. 3 is a hot pressing medium schematic diagram of the present invention.
Fig. 4 is a dielectric layer manufacture method schematic diagram of the present invention.
Embodiment
The present invention is further illustrated below in conjunction with drawings and Examples, but the present invention is not limited to this embodiment.
With reference to Fig. 1, prebasal plate 1, metacoxal plate 2, shadow mask 3, with reference to Fig. 2, prebasal plate 1, bus electrode 2, dielectric layer 8, MgO protective layer 3, metacoxal plate 6, addressing electrode 5, dielectric layer 7, MgO protective layer 4.The roughly manufacture process of display panel is: prebasal plate, shadow mask, metacoxal plate are put well by the fixed position, use sealing-in slurry (main component is a glass powder with low melting point) hermetic seal all around, shadow mask can be drawn with external circuit and is connected by drawing pin or being imprinted on conducting film on the substrate.To wherein charging into a certain amount of working gas, carry out sealed-off then, just can access shadow mask plasma display panel.
As can be seen from Figure 2, dielectric layer 8 is attached on the electrode of forward and backward substrate 1,2, shield, so it needs stronger withstand voltage.Pit and raised points can appear in the surface when dielectric layer 8 attachings were bad, and be breakdown easily after the sintering, and then make the electrode broken string.Particularly careful when therefore, before the hot pressing medium, suitably handling.
Be example with the metacoxal plate below, illustrate that the present invention makes the method for dielectric layer, the making of front substrate medium layer can be with reference to carrying out.
Shown in Fig. 3,4.
1, preparation
In the process of hot pressing medium, must keep the cleaning of surrounding environment and equipment, if having dust, fiber can cause some defectives.
Start is according to different types of dielectric material setup parameter.In press mold machine (can adopt commercially available matured product to be realized) preheating, roller and main body are removed, new deielectric-coating is installed, adjust the deielectric-coating edge to the D/F unit distance of (D/F Unit), make the distance of two back gauge D/F Unit of deielectric-coating identical.Cut the deielectric-coating of 50cm, diaphragm is set, place the bobbin of roller top, the rolling bobbin makes diaphragm quill flatly, again with the deielectric-coating main body via action roller, roller tensioner after, be pulled down to adsorption plate (P.B plate).Deielectric-coating flatly is attached on the adsorption plate P.B plate, after opening vacuum action, selecting the deielectric-coating size, adjusts the smooth of film, be pulled down to the about 1～2cm of deielectric-coating miter guide so that the mounting medium film.Deielectric-coating on the film miter guide (film guide) is strained a little, utilized scraper cutting medium film, repetitive operation is up to smooth adsorption plate P.B plate and the film miter guide film guide of placing of deielectric-coating.Confirm above action, main body is pushed back original position.Concrete structure as shown in Figure 3.Adjust feed zone charging width, confirm gap, vacuum and pad pasting front and back.
2, attach adhesive tape
Before the hot pressing medium, the adhesive tape of certain width is sticked at the binding line place outside the lead-in wire edge.When taping, notice that glass substrate just flushes with the workbench edge, one end of adhesive tape is bonded at earlier on the work top of the substrate end, then on the binding line outside the steering handle adhesive tape of substrate edges is bonded at the lead-in wire edge, note pushing slightly after attaching it is fixed, if adhesive tape fails to fix, when the dry-cleaning machine easily by the ultrasonic wave substrate surface that blows off.Exert oneself but must guard against too, severe because the great efforts meeting makes that adhesive tape adheres to, thus be difficult for peeling off from substrate surface.Afterwards, note that pocket knife becomes 45 with substrate to the adhesive tape excision that is exposed at outside the substrate edges.The angle, wrist is inwardly exerted oneself, and can not stay burr at the edge.Must be noted that glass substrate just flushes with the workbench edge when attaching adhesive tape, the reason of doing like this is, if adhesive tape and substrate edges have the space, medium can attach on the substrate, and the removing medium is cumbersome; If adhesive tape exceeds substrate edges, the cutting edge difficulty easily causes breach.
3, hot pressing medium
Pass through preheating furnace, dry-cleaning machine, press mold machine respectively with attaching adhesive tape glass substrate afterwards.The purpose of pre-ripe stove is the surface temperature of rising glass substrate, thereby helps the attaching of dielectric layer, and general substrate surface temperature can not cause the fusing and the distortion of adhesive tape at 40 ℃～100 ℃.During through dry-cleaning machine, can utilize ultrasonic wave to remove the impurity such as floating ash of substrate surface.Preheating has suitable temperature with cleaning substrate afterwards, after the of short duration flatiron, passes through between the last lower compression roller with certain speed.Because roller temperature is higher, and have certain pressure, dielectric layer will be attached to substrate surface equably.The adhesive tape of original substrate surface can't attach medium and cause bad influence because thinner, and dielectric layer can evenly attach.
4, subsequent treatment
After the attaching medium finishes, check the situation of substrate surface, observe whether have pit and protrusion.The place that substrate surface is taped has together significantly impression, and the steel ruler of appropriate length is pressed in the inward flange of this road impression, and the place of taping is exposed at the steel ruler outside, and the attention steel ruler will be handled with care, avoids being pressed onto or running into medium, causes bad influence.Carefully start with tweezers at an end of adhesive tape then, along the direction of steel ruler, slowly take adhesive tape off, the dielectric layer above the adhesive tape just together is removed.As shown in Figure 4.When taking off adhesive tape, it is steady and slow that action is wanted, and should not too exert oneself, otherwise adhesive tape can disconnect, and starts again again, causes unnecessary trouble.
By these operations, the problem that just can solve above to be mentioned, technology is simple, is easy to realize.Technical scheme of the present invention, embodiment can have a lot, repeats no more here.The display screen of the virtually any size of for example common PDP or SMPDP can use the manufacture method of this kind dielectric layer, only need revise stent size and adhesive tape size a little.And also being not limited to adhesive tape choosing of spacer, the material that meets several characteristic in the literary composition all is considered to be covered by among the present invention.
Part that the present invention does not relate to such as film sticking equipment and technological parameter are same as the prior art.
Claims (3)
1. the manufacture method of a plasma scope medium layer is characterized in that:
At first, spacer is sticked in the binding district outside the contact conductor edge of the substrate surface that passes through clean;
Secondly, the substrate that posts spacer is passed through preheating furnace, dry-cleaning machine, press mold machine respectively, form at substrate surface and attach uniform hot pressing dielectric layer;
The 3rd, push down the represented that the spacer place forms with steel ruler, uncover spacer with hand or instrument, and when the direction of steel ruler is taken spacer off, remove the dielectric layer that overlays on the spacer, expose the making that contact conductor binding district in addition promptly finishes whole dielectric layer.
2. the manufacture method of plasma scope medium layer according to claim 1 is characterized in that described substrate comprises prebasal plate and metacoxal plate.
3. the manufacture method of plasma scope medium layer according to claim 1 is characterized in that described spacer is anti-adhesive tape more than 100 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007103024915A CN101197232B (en) | 2007-12-28 | 2007-12-28 | Production method for medium layer of plasma display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007103024915A CN101197232B (en) | 2007-12-28 | 2007-12-28 | Production method for medium layer of plasma display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101197232A CN101197232A (en) | 2008-06-11 |
| CN101197232B true CN101197232B (en) | 2010-10-13 |
Family
ID=39547542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007103024915A Expired - Fee Related CN101197232B (en) | 2007-12-28 | 2007-12-28 | Production method for medium layer of plasma display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101197232B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4959748A (en) * | 1988-03-30 | 1990-09-25 | Matsushita Electric Industrial Co., Ltd. | Film capacitor, method of and apparatus for manufacturing the same |
| CN1146016C (en) * | 1997-05-30 | 2004-04-14 | 琳得科株式会社 | Method and apparatus for applying protecting film to semiconductor wafer |
| CN2899093Y (en) * | 2006-01-10 | 2007-05-09 | 彩虹集团电子股份有限公司 | Film paster for producing plasma display screen |
-
2007
- 2007-12-28 CN CN2007103024915A patent/CN101197232B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4959748A (en) * | 1988-03-30 | 1990-09-25 | Matsushita Electric Industrial Co., Ltd. | Film capacitor, method of and apparatus for manufacturing the same |
| CN1146016C (en) * | 1997-05-30 | 2004-04-14 | 琳得科株式会社 | Method and apparatus for applying protecting film to semiconductor wafer |
| CN2899093Y (en) * | 2006-01-10 | 2007-05-09 | 彩虹集团电子股份有限公司 | Film paster for producing plasma display screen |
Non-Patent Citations (2)
| Title |
|---|
| JP 特开2006-4726 A,全文. |
| JP特开2004-303976A 2004.10.28 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101197232A (en) | 2008-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| GB1566558A (en) | Large liquid crystal cells | |
| CN108623180A (en) | A kind of cutting method of panel display board | |
| CN101197232B (en) | Production method for medium layer of plasma display | |
| KR20060111880A (en) | El sheet of roll type and manufacturing process | |
| JP4068070B2 (en) | Metal back layer forming device | |
| EP3211676B1 (en) | Method for producing solar cell module | |
| CN111399708A (en) | Electrode wiring structure of touch functional sheet and preparation method thereof | |
| WO2006003944A1 (en) | Molding device and molding method | |
| CN101521131B (en) | Method for manufacturing reserved window leaded by shadow mask in production of dielectic layer of plasma display | |
| GB2104270A (en) | Display device manufacture | |
| CN102496600B (en) | Manufacturing method of flexible display panel | |
| CN107678586A (en) | A kind of GFF screens attaching process | |
| CN214983992U (en) | Production facility of cell-phone protection film | |
| KR100550563B1 (en) | Plasma display panel plasticity device and plasticity method for green sheet | |
| CN213458007U (en) | Touch display screen of mobile phone | |
| CN111182740B (en) | Automobile battery collection FPC wire row convenient to weld | |
| EP1548792A1 (en) | Plasma display panel | |
| JP3910075B2 (en) | Method for forming reinforcing film on substrate for solar cell | |
| CN101441963A (en) | Method for preparing shadow mask type plasma display device front substrate medium layer | |
| TWI276881B (en) | Method for making glass structures for flat panel displays | |
| CN100483602C (en) | Method for preparing upper and lower medium substrate of AC gas discharge display screen | |
| JP2006049291A (en) | Forming device and forming method | |
| CN111292897A (en) | Cable copper strip | |
| JPH09252179A (en) | Formation of filling through hole | |
| JPS60193229A (en) | Production of plasma display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101013 Termination date: 20121228 |