CN101192473B - Surface-mount type electrolytic capacitor and method of producing the same - Google Patents
Surface-mount type electrolytic capacitor and method of producing the same Download PDFInfo
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- CN101192473B CN101192473B CN2007101970611A CN200710197061A CN101192473B CN 101192473 B CN101192473 B CN 101192473B CN 2007101970611 A CN2007101970611 A CN 2007101970611A CN 200710197061 A CN200710197061 A CN 200710197061A CN 101192473 B CN101192473 B CN 101192473B
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Abstract
An exterior case for a surface-mount type electrolytic capacitor has a box type resin case and an exterior case cover. The resin case incorporates anode terminals and a cathode terminal at the bottom portion and is open upward. The exterior cover covers the top and an outer surface of a side wall of the resin case. A convex portion is formed on an inner surface of a ceiling of the exterior case cover and, thereby, a concave portion is formed between an inner surface of the side wall of the exterior case cover and the convex portion. The concave portion and an upper end portion of the side wall of the resin case are fitted together with an adhesive therebetween. An upper surface of the capacitor element is pressed by the convex portion of the inner surface of the ceiling of the exterior case cover and, thereby, a positional deviation thereof is prevented.
Description
The application based on and to require to enjoy the applying date be Japanese patent application 2006-321853 number and applying date on November 29th, 2006 to be the priority of Japanese patent application 2007-208070 number on August 9th, 2007, their disclosure is by reference and whole incorporated herein.
Technical field
The present invention relates to a kind of surface-mount type electrolytic capacitor and manufacturing approach thereof.Especially, the present invention relates to a kind of surface-mount type electrolytic capacitor and manufacturing approach thereof of having showed the reliability of improving.
Background technology
Conventional surface-mounted type electrolytic capacitor is disclosed in such as unexamined Japanese patent application and discloses among the 2006-128247 (after this being called patent documentation 1).The surface-mount type electrolytic capacitor that is disclosed in the patent documentation 1 is called as three terminal transmission line (transmission-line) elements.As patent documentation 1 was disclosed, surface-mount type electrolytic capacitor used the functional polymer film of conduction as solid electrolyte.Surface-mount type electrolytic capacitor comprises a plurality of capacitor elements.In order to make each capacitor element, the anodized layer that is coated with at first is formed on valve action (valve-action) metallic surface, thus the metal anode of preparation valve action.Then, formed the functional polymer film of conduction, so that cover the anodized central part that is coated with laminar surface of anode.Graphite linings forms around the functional polymer film that conducts electricity.In addition, silver paste (silver paste) layer forms as cathode layer.After above-mentioned these layers form with this in proper order, be positioned at the positive wire portion of capacitor element end, through using electrically conducting adhesive, and be connected on the anode terminal that is formed in the resin-case via conductive spacer.Be positioned at the negative pole part of the central part of capacitor element, directly be connected on the cathode terminal that is formed in the resin-case through using electrically conducting adhesive.After this, the shell body covering is fixed by bonding agent.
In conventional surface-mounted type electrolytic capacitor, capacitor element is placed in the resin-case, and connects and be fixed on anode terminal and the cathode terminal.After this, the shell body covering is fixed on the resin-case, and carries out sealing.In each operation in fixing operation, use electrically conducting adhesive or bonding agent, and the dry and curing (curing) of its experience.Therefore, the operation of each in the fixing operation all needs stationary fixture and drying oven.Each step in drying steps and the curing schedule all needs the lead time (leadtime) in equipment and the production process.In addition, when resin-case and shell body covering were combined, nonuniformity or variation may take place in the distribution of bonding agent, thereby cause the nonuniformity or the variation of bonding or overstrain.As a result, characteristic trends towards changing, and does not obtain consistent quality.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of surface-mount type electrolytic capacitor, it can realize the reduction of lead time and simplifying of equipment, and its cause owing to the sealing of improving has prevented the variation of characteristic.
Another object of the present invention provides a kind of method of making above-mentioned surface-mount type electrolytic capacitor.
According to an aspect of the present invention, the present invention provides a kind of surface-mount type electrolytic capacitor, and it comprises having positive wire portion that is positioned at the end and the capacitor main body that is positioned at the negative pole part of central part; Be connected to the anode terminal in the positive wire portion; Be connected to the cathode terminal on the negative pole part; With the shell body that is used for capacitor for voltage protection main body, anode terminal and cathode terminal.In electrolytic capacitor, shell body comprises box resin-case and shell body covering.Resin-case is combined with anode terminal and the cathode terminal that is positioned at the bottom, and upward opening.The shell body covering covers at least a portion of the sidewall outer surface of top and resin-case.The shell body covering has the protuberance on the inner surface that is arranged on top board, and is arranged on the inner surface of shell body cover sidewalls and the recess between the protuberance, and the upper end of the sidewall of resin-case is assembled in this recess.
According to another aspect of the present invention, the present invention provides a kind of shell body covering of shell body, and this shell body covering is used for the capacitor main body of covering surfaces mount type electrolytic capacitor.The shell body covering comprises the protuberance on the inner surface that is arranged on top board, and is arranged on the inner surface of shell body cover sidewalls and the recess between the protuberance.
According to a further aspect of the invention, the present invention provides a kind of method of making surface-mount type electrolytic capacitor.Of the present invention aspect this in, the method comprising the steps of: make and have positive wire portion that is positioned at the end and the chip capacitor element that is positioned at the negative pole part of central part; Conductive spacer is connected in the positive wire portion of capacitor element; Capacitor element is placed on the anode terminal and cathode terminal of box resin-case; And be provided with electrically conducting adhesive between capacitor element and these terminals; And resin-case comprises the anode terminal that is positioned at the bottom and the cathode terminal and the upward opening that are positioned at portion of bottom centre; Bonding agent is coated onto on the upper end face of resin-case; And the shell body covering is assembled on the resin-case, and the shell body covering has the protuberance that is positioned at the upper surface inboard, and capacitor element is pushed by protuberance; And while curing conductive bonding agent and bonding agent.
According to a further aspect of the invention, the present invention provides a kind of method of making surface-mount type electrolytic capacitor.Of the present invention aspect this in, the method comprising the steps of: make and have positive wire portion that is positioned at the end and the chip capacitor element that is positioned at the negative pole part of central part; Conductive spacer is connected in the positive wire portion of capacitor element; The overlapped capacitor element is so that form the capacitor element lamination; The capacitor element lamination is placed on the anode terminal and cathode terminal of box resin-case; And be provided with electrically conducting adhesive between capacitor element and these terminals, and resin-case comprises the anode terminal that is positioned at the bottom and the cathode terminal and the upward opening that are positioned at portion of bottom centre; Bonding agent is coated onto on the upper end face of resin-case, and the shell body covering is assembled on the resin-case, and the shell body covering has the protuberance that is positioned at the upper surface inboard, and capacitor element is pushed by protuberance; And while curing conductive bonding agent and bonding agent.
Description of drawings
Figure 1A is the elevational sectional view of the shell body covering of conventional surface-mounted type electrolytic capacitor;
Figure 1B is the upward view of the shell body covering shown in Figure 1A;
Fig. 1 C is the elevational sectional view of conventional surface-mounted type electrolytic capacitor;
Fig. 2 A is the elevational sectional view according to the shell body covering of the surface-mount type electrolytic capacitor of example 1 of the present invention;
Fig. 2 B is the upward view of the shell body covering shown in Fig. 2 A;
Fig. 2 C is the elevational sectional view according to the complete surface-mount type electrolytic capacitor of example 1 of the present invention;
Fig. 3 A is the elevational sectional view according to the shell body covering of the surface-mount type electrolytic capacitor of example 2 of the present invention;
Fig. 3 B is the upward view of the shell body covering shown in Fig. 3 A;
Fig. 3 C is the elevational sectional view according to the complete surface-mount type electrolytic capacitor of example 2 of the present invention;
Fig. 4 A is the elevational sectional view according to the shell body covering of the surface-mount type electrolytic capacitor of example 3 of the present invention;
Fig. 4 B is the upward view of the shell body covering shown in Fig. 4 A; And
Fig. 4 C is the elevational sectional view according to the surface-mount type electrolytic capacitor of example 3 of the present invention.
Embodiment
Before explaining specific embodiment of the present invention, with combining Figure 1A to Fig. 1 C traditional electrolytic capacitor is described, to help to understanding of the present invention.
The traditional capacitance that is showed among Figure 1A, Figure 1B and Fig. 1 C is called as three terminal transmission line element.With reference to Figure 1A, Figure 1B and Fig. 1 C, the conventional surface mount type electrolytic capacitor 10 that is disclosed in the patent documentation 1 uses the functional polymer film that conducts electricity as solid electrolyte.Surface-mount type electrolytic capacitor comprises a plurality of capacitor elements 8.In order to make each capacitor element 8, the anodized layer that is coated with at first is formed on the surface of valve metals, thus the metal anode of preparation valve action.Then, formed the functional polymer film of conduction, so that cover the anodized central part that is coated with laminar surface of anode.Graphite linings forms around the functional polymer film that conducts electricity.In addition, silver paste layer forms as cathode layer.After above-mentioned these layers formed with this in proper order, the positive wire portion 11 that is positioned at the end of capacitor element 8 passed through to use electrically conducting adhesive 5, and is connected on the anode terminal 6 that is arranged in the resin-case 2 via conductive spacer 4.On the other hand, the negative pole part 12 that is positioned at the central part of capacitor element 8 directly is connected on the cathode terminal 7 that is arranged at resin-case 2 through using electrically conducting adhesive 5.At this, capacitor element lamination 13 forms through stacked a plurality of capacitor elements 8, and can be called as capacitor main body 13.After this, shell body covering 1 is fixed by using bonding agent 3.
Next, will describe surface-mount type electrolytic capacitor below in detail according to one aspect of the invention.
Surface-mount type electrolytic capacitor comprises capacitor main body, anode terminal, cathode terminal and is used for protecting the shell body of (armoring) capacitor main body, anode terminal and cathode terminal.
Capacitor main body is made up of the chip capacitor element, and the chip capacitor element has positive wire portion that is positioned at the protection end and the negative pole part that is positioned at central part.Alternatively, capacitor main body can be made up of the capacitor element lamination, and the capacitor element lamination is processed through stacked above-mentioned capacitor element.
Anode terminal is connected to above-mentioned positive wire portion.Cathode terminal is connected to above-mentioned negative pole part.
Shell body has box resin-case and shell body covering.Resin-case is combined with above-mentioned anode terminal and the cathode terminal that is positioned at the bottom, and upward opening.The shell body covering covers at least a portion of the sidewall outer surface of top and resin-case.
Shell body covering according to aspects of the present invention comprises the protuberance on the inner surface that is arranged on top board.Because the existence of protuberance, recess is formed between the inner surface and protuberance of shell body cover sidewalls.Recess is assembled on the upper end of sidewall of above-mentioned resin-case.
Above-mentioned capacitor main body is pushed by the lower surface of protuberance, and protuberance is formed on the inner surface of top board of above-mentioned shell body covering.
Above-mentioned resin-case and above-mentioned shell body covering assemble up mutually, and through using bonding agent to combine.Through the use electrically conducting adhesive above-mentioned positive wire portion and above-mentioned anode terminal are combined, and above-mentioned negative pole part and above-mentioned cathode terminal are combined.
The protuberance of above-mentioned shell body covering can be by forming with the material identical materials that forms above-mentioned shell body covering, and can integrally form with the shell body covering.Alternatively, the protuberance of shell body covering can be formed by elastomeric element, and is connected on the above-mentioned shell body covering.
Next, with the method for describing according to aspects of the present invention, it is used to make the surface-mount type electrolytic capacitor with said structure.
Have at capacitor main body under the situation of single chip capacitor element; The method comprising the steps of: make the chip capacitor element that has the positive wire portion that is positioned at the end and be positioned at the negative pole part of central part; Conductive spacer is connected in the positive wire portion of above-mentioned capacitor element; Above-mentioned capacitor element is placed on the anode terminal and cathode terminal of box resin-case; And be provided with electrically conducting adhesive between capacitor element and these terminals; And resin-case comprises and bonding agent is coated onto the above-mentioned anode terminal that is positioned at the bottom and the cathode terminal and the upward opening that are positioned at portion of bottom centre on the upper end face of above-mentioned resin-case, and above-mentioned shell body covering is assembled on the above-mentioned resin-case; And the shell body covering has and is positioned at the inboard protuberance of upper surface, and the positive wire portion of above-mentioned capacitor element and negative pole part are pushed by protuberance; And solidify above-mentioned electrically conducting adhesive and above-mentioned bonding agent simultaneously.
In addition, capacitor main body by a plurality of situation about forming as the chip capacitor element of capacitor element lamination under, the method comprising the steps of: make and to have positive wire portion that is positioned at the end and the chip capacitor element that is positioned at the negative pole part of central part; Conductive spacer is connected in the positive wire portion of above-mentioned capacitor element, and stacked above-mentioned capacitor element, so that form the capacitor element lamination; The capacitor element lamination is placed on the anode terminal and cathode terminal of box resin-case; And be provided with electrically conducting adhesive between them; And resin-case comprises above-mentioned anode terminal that is positioned at the bottom simultaneously and above-mentioned cathode terminal and the upward opening that is positioned at portion of bottom centre; Bonding agent is coated onto on the upper end face of above-mentioned resin-case, and above-mentioned shell body covering is assembled on the above-mentioned resin-case, and the shell body covering has the protuberance that is positioned at the upper surface inboard; And the positive wire portion and the negative pole part of above-mentioned capacitor element lamination are pushed by above-mentioned protuberance, and solidify above-mentioned electrically conducting adhesive and above-mentioned bonding agent simultaneously.
Above-mentioned according to surface-mount type electrolytic capacitor of the present invention in, resin-case and shell body covering assemble up mutually, and combine by bonding agent.Therefore, shell body bonding is able to strengthen, and reliability improves, and this is because the cause of the sealing of improving.
Positive wire portion and negative pole part at capacitor element are pushed by the protuberance of shell body covering; And through using electrically conducting adhesive to be attached under the situation of anode terminal and cathode terminal; Can obtain to connect more reliably, and prevent because the characteristic variations of the cause of incomplete and insufficient connection.
In the method for manufacturing surface-mount type electrolytic capacitor according to the present invention, resin-case and shell body covering are fixed on the state that capacitor element is pressed.Before this, the junction between capacitor element and resin-case, the curing operation of execution electrically conducting adhesive, and the junction between resin-case and shell body covering, the curing operation of execution bonding agent.Therefore, these curing operations were before carried out individually and discretely.According to said method of the present invention, these operations can be carried out simultaneously.Therefore, improve operability, and simplified equipment.
To combine Fig. 2 A to Fig. 4 C to describe now according to embodiments of the invention.Can be understood that easily that the present invention is not limited to these embodiment.
Example 1
Shown in Fig. 2 A, Fig. 2 B and Fig. 2 C, has following structure according to the surface-mount type electrolytic capacitor 20 of example 1 of the present invention.
Shell body covering 1 is as another element of shell body and prepare.This shell body covering 1 is made by this way, makes rectangle protuberance 1a be formed on the inner surface of top board (ceiling), and recess 1b forms around protuberance 1a.
Therefore, shown in Fig. 2 C, resin-case 2 can combine with shell body covering 1, and is fixed into the state that capacitor element 8 is pushed by protuberance 1a.According to the present invention, it is possible carrying out two curing operations simultaneously, and promptly (1) is used for capacitor element 8 is connected to anode terminal 6 and cathode terminal 7 on the bottom that is positioned at resin-case 2 to the curing operation of electrically conducting adhesive 5; (2), be used for resin-case 2 and shell body covering 1 are combined and be fixed up to the curing operation of bonding agent 3.In the past, two curing operations were to carry out discretely and individually.
The upper end of the sidewall of resin-case 2 is seated in the recess 1b of shell body covering 1 inside, and has bonding agent 3 between the two.Therefore, bonding being able to strengthens, and reliability improves, and this is because the cause of the sealing of improving.
Example 2
Shown in Fig. 3 A, Fig. 3 B and Fig. 3 C, similar according to the surface-mount type electrolytic capacitor 21 of example 2 of the present invention with the surface-mount type electrolytic capacitor in the example 1, except the inner wall shape difference of shell body covering 1.
That is, in example 2 of the present invention, the protuberance that is used for pushing from the top capacitor element 8 is not formed on the central part of inner surface of the top board of shell body covering 1.The substitute is, dike shape (bank-shaped) protuberance 1c forms by this way, makes recess 1b form along the surperficial edge of top board.The upper end of the sidewall of resin-case 2 is assembled in the recess 1b, and has bonding agent 3 between the two, and carries out combination with fixing.
In the process of making according to the surface-mount type electrolytic capacitor 21 of example 2 of the present invention, be used with resin-case 2 similar shell body coverings 1 and resin-case 2 with shell body covering 1 in the example 1.Capacitor main body 13 is made up of a plurality of capacitor elements 8, as stacked capacitor element 13.Capacitor main body 13 is connected on the anode terminal 6 and cathode terminal 7 of the inboard that is positioned at resin-case 2 through using electrically conducting adhesive 5.The upper end of the sidewall of resin-case 2 is assembled in the recess 1b of shell body covering 1, and has bonding agent 3 between the two, thereby makes combination and fixedly be performed.In this way, produce surface-mount type electrolytic capacitor 21.
According to example 2, the bonding of shell body is improved simultaneously, and do not require the strictness control to the amount of being coated with of bonding agent 3.Therefore, the surface-mount type electrolytic capacitor that has prevented characteristic variations is able to create.In addition, the external dimensions error of product can be reduced.
Example 3
Shown in Fig. 4 A, Fig. 4 B and Fig. 4 C, similar according to surface-mount type electrolytic capacitor of example 3 of the present invention 22 and example 1 with the surface-mount type electrolytic capacitor in the example 2, except the structure difference of the inner wall surface of shell body covering 1.
That is, the shell body covering in example 3 has protuberance 1a and the protuberance 1c that is positioned at the upper surface inboard, and has the recess 1b around them.
Surface-mount type electrolytic capacitor 22 that kind as described below according to example 3 of the present invention are created.
In the explanation of example 1, example 2 and example 3, the overlapped capacitor element 13 that will comprise capacitor element 8 uses as capacitor main body 13.Yet, as will easily understanding, in the present invention, even when using single chip capacitor element 8, still can obtain surface-mount type electrolytic capacitor.
In example of the present invention 1, example 2 and example 3, positive wire portion 11 is arranged on the both sides of capacitor element 8.Yet, can have negative pole part 12 that is positioned at a side and the positive wire portion 11 that is positioned at opposite side according to capacitor element of the present invention.To be understood that easily that a plurality of negative pole parts and positive wire portion can be alongst or Width and alternately being provided with.
Surface-mount type electrolytic capacitor according to the present invention may be used on certain type the electronic component, and the electronic component of this type will be installed on the printed circuit board (PCB) with the form of mounted on surface, and is used for forming electrode in the bottom of product.
Though having combined its exemplary embodiment, the present invention showed especially and described that the present invention is not and be limited to these embodiment.Those those of ordinary skill in the art will be understood that under the situation that does not break away from the spirit of the present invention that defined by claim and scope, can make the change of various ways and structure.
Claims (8)
1. surface-mount type electrolytic capacitor, it comprises:
Capacitor main body, it comprises chip capacitor element or a plurality of chip capacitor elements stacked on top of each other, and said chip capacitor element has the positive wire portion that is positioned at the end and the negative pole part that is positioned at central part, and said positive wire portion is connected to conductive spacer;
Be connected to the anode terminal in the said positive wire portion through electrically conducting adhesive;
Be connected to the cathode terminal on the said negative pole part through another electrically conducting adhesive; With
Be used to protect the shell body of said capacitor main body, said anode terminal and said cathode terminal,
Wherein, said shell body comprises box resin-case and shell body covering,
Said resin-case comprises said anode terminal and said cathode terminal and the upward opening that is positioned at its bottom,
Said shell body covering covers at least a portion of the sidewall outer surface of top and said resin-case,
Said shell body covering has the protuberance on the inner surface that is arranged on top board and is arranged at the said side wall inner surfaces of said shell body covering and the recess between the said protuberance; The length of said protuberance is not shorter than the length of the said capacitor main body on the length direction of said capacitor main body
The upper end of the said sidewall of said resin-case is assembled in the said side wall inner surfaces and the female portion between the said protuberance of said shell body covering, between said upper end and the female portion, is provided with bonding agent,
The negative pole part of said capacitor main body is set at the lower surface of the said protuberance on the said inner surface of said top board of said shell body covering and pushes, and
The said protuberance of said shell body covering is formed by elastomeric element, and is connected on the said shell body covering.
2. electrolytic capacitor as claimed in claim 1 is characterized in that, said capacitor main body comprises chip capacitor element or the capacitor element lamination of processing through stacked said capacitor element.
3. electrolytic capacitor as claimed in claim 1 is characterized in that:
Said resin-case and said shell body covering assemble up mutually, and combine through bonding agent;
Through the use electrically conducting adhesive said positive wire portion and said anode terminal are combined, and said negative pole part and said cathode terminal are combined.
4. shell body, it is used for the capacitor main body of covering surfaces mount type electrolytic capacitor, and comprises that box resin-case and shell body covering, said capacitor main body comprise chip capacitor element or a plurality of chip capacitor elements stacked on top of each other,
Said shell body covering comprises:
Be arranged on the protuberance on the inner surface of top board and be arranged at the said side wall inner surfaces of said shell body covering and the recess between the said protuberance; The length of said protuberance is not shorter than the length of the said capacitor main body on the length direction of said capacitor main body
Said resin-case comprises:
Be connected to the anode terminal in the positive wire portion through electrically conducting adhesive; With
Be connected to the cathode terminal on the negative pole part through another electrically conducting adhesive;
The upper end of the said sidewall of said resin-case is assembled in the said side wall inner surfaces and the female portion between the said protuberance of said shell body covering, between said upper end and the female portion, is provided with bonding agent,
Said shell body covering covers at least a portion of the sidewall outer surface of top and said resin-case,
Wherein, the negative pole part of said capacitor main body is set at the lower surface of the said protuberance on the said inner surface of said top board of said shell body covering and pushes, and
The said protuberance of said shell body covering is formed by elastomeric element, and is connected on the said shell body covering.
5. shell body covering as claimed in claim 4; It is characterized in that; Said capacitor main body comprises the positive wire portion that is positioned at the end and the negative pole part that is positioned at central part, and said shell body protection is connected to anode terminal in the said positive wire portion, is connected to cathode terminal and said capacitor main body on the said negative pole part.
6. shell body covering as claimed in claim 4 is characterized in that, said shell body covering assembles and is attached on the resin-case by bonding agent.
7. method of making surface-mount type electrolytic capacitor, said method comprises step:
Manufacturing has positive wire portion that is positioned at the end and the chip capacitor element that is positioned at the negative pole part of central part;
Conductive spacer is connected in the said positive wire portion of said capacitor element;
Said capacitor element is placed on the anode terminal and cathode terminal of box resin-case; And be provided with electrically conducting adhesive between said capacitor element and the said terminal; And said resin-case comprises said anode terminal that is positioned at the bottom and said cathode terminal and the upward opening that is positioned at portion of bottom centre; Bonding agent is coated onto on the upper end face of said resin-case; And the shell body covering is assembled on the said resin-case; And said shell body covering has the protuberance of the inboard that is positioned at upper surface, and the length of said protuberance is not shorter than the length of the said capacitor element on the length direction of said capacitor element, and the negative pole part of said capacitor element is pushed by said protuberance; And
Solidify said electrically conducting adhesive and said bonding agent simultaneously.
8. method of making surface-mount type electrolytic capacitor, said method comprises step:
Make and respectively have positive wire portion that is positioned at the end and the chip capacitor element that is positioned at the negative pole part of central part;
Conductive spacer is connected in the said positive wire portion of said capacitor element, and stacked said capacitor element, so that form the capacitor element lamination;
Said capacitor element lamination is placed on the anode terminal and cathode terminal of box resin-case; And be provided with electrically conducting adhesive between said capacitor element and the said terminal; And said resin-case comprises said anode terminal that is positioned at the bottom and said cathode terminal and the upward opening that is positioned at portion of bottom centre; Bonding agent is coated onto on the upper end face of said resin-case; And the shell body covering is assembled on the said resin-case; And said shell body covering has the protuberance of the inboard that is positioned at upper surface, and the length of said protuberance is not shorter than the length of the said capacitor element lamination on the length direction of said capacitor element lamination, and the negative pole part of said capacitor element lamination is pushed by said protuberance; And
Solidify said electrically conducting adhesive and said bonding agent simultaneously.
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006321853 | 2006-11-29 | ||
| JP2006321853 | 2006-11-29 | ||
| JP2006-321853 | 2006-11-29 | ||
| JP2007-208070 | 2007-08-09 | ||
| JP2007208070 | 2007-08-09 | ||
| JP2007208070A JP4889037B2 (en) | 2006-11-29 | 2007-08-09 | Surface mount electrolytic capacitor and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101192473A CN101192473A (en) | 2008-06-04 |
| CN101192473B true CN101192473B (en) | 2012-11-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101970611A Expired - Fee Related CN101192473B (en) | 2006-11-29 | 2007-11-29 | Surface-mount type electrolytic capacitor and method of producing the same |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4889037B2 (en) |
| CN (1) | CN101192473B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4963676B2 (en) * | 2008-02-26 | 2012-06-27 | Ｎｅｃトーキン株式会社 | Surface mount thin electrolytic capacitors |
| KR101067168B1 (en) * | 2009-10-13 | 2011-09-22 | 삼성전기주식회사 | Chip-type electric double layer capacitor and method for manufacturing the same |
| US20110102972A1 (en) | 2009-11-05 | 2011-05-05 | Samsung Elctro-Mechanics Co., Ltd. | Chip-type electric double layer capacitor cell and method of manufacturing the same |
| KR101141447B1 (en) * | 2009-12-01 | 2012-05-15 | 삼성전기주식회사 | Chip-type electric double layer capacitor and method for manufacturing the same |
| JP5721172B2 (en) * | 2011-04-13 | 2015-05-20 | Ｎｅｃトーキン株式会社 | Chip-type solid electrolytic capacitor and manufacturing method thereof |
| JP5360445B2 (en) | 2012-03-30 | 2013-12-04 | 戸田工業株式会社 | Ferrite particle powder for bonded magnet, resin composition for bonded magnet, and molded body using them |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4769745A (en) * | 1986-05-29 | 1988-09-06 | Licentia Patent Verwaltungs-Gmbh | Sealed capacitor winding container and process for hermetically sealing electrical component container with a lid |
| CN1093196A (en) * | 1993-03-31 | 1994-10-05 | 三星电机株式会社 | Sureace mounting type chip capacitor |
| US6141205A (en) * | 1998-04-03 | 2000-10-31 | Medtronic, Inc. | Implantable medical device having flat electrolytic capacitor with consolidated electrode tabs and corresponding feedthroughs |
| US6310762B1 (en) * | 1998-03-03 | 2001-10-30 | Jeol Ltd. | Carbon material for electric double layer capacitor, method of producing same, electric double layer capacitor and method of fabricating same |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6144421A (en) * | 1984-08-09 | 1986-03-04 | 松下電器産業株式会社 | Aluminum electrolytic condenser |
| DE3813435A1 (en) * | 1988-04-21 | 1989-11-02 | Siemens Ag | COMPONENT IN CHIP DESIGN FOR FASTENING ON A SWITCHBOARD, WITH AN ELECTRICAL OR ELECTRONIC FUNCTIONAL BODY |
| JPH11191520A (en) * | 1997-12-26 | 1999-07-13 | Tdk Corp | Chip-type electric double-layered capacitor |
| JP2002328449A (en) * | 2001-04-27 | 2002-11-15 | Konica Corp | Photographic sensitive material wrapping body, manufacturing method of photographic sensitive material wrapping body |
| JP4060657B2 (en) * | 2002-07-18 | 2008-03-12 | Ｎｅｃトーキン株式会社 | Solid electrolytic capacitor and manufacturing method thereof |
| JP3897294B2 (en) * | 2002-08-12 | 2007-03-22 | ナカバヤシ株式会社 | Storage box |
| JP4450378B2 (en) * | 2004-10-27 | 2010-04-14 | Ｎｅｃトーキン株式会社 | Surface mount capacitor and method of manufacturing the same |
| JP2006294734A (en) * | 2005-04-07 | 2006-10-26 | Nec Tokin Corp | Surface-mounting thin capacitor |
-
2007
- 2007-08-09 JP JP2007208070A patent/JP4889037B2/en not_active Expired - Fee Related
- 2007-11-29 CN CN2007101970611A patent/CN101192473B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4769745A (en) * | 1986-05-29 | 1988-09-06 | Licentia Patent Verwaltungs-Gmbh | Sealed capacitor winding container and process for hermetically sealing electrical component container with a lid |
| CN1093196A (en) * | 1993-03-31 | 1994-10-05 | 三星电机株式会社 | Sureace mounting type chip capacitor |
| US6310762B1 (en) * | 1998-03-03 | 2001-10-30 | Jeol Ltd. | Carbon material for electric double layer capacitor, method of producing same, electric double layer capacitor and method of fabricating same |
| US6141205A (en) * | 1998-04-03 | 2000-10-31 | Medtronic, Inc. | Implantable medical device having flat electrolytic capacitor with consolidated electrode tabs and corresponding feedthroughs |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4889037B2 (en) | 2012-02-29 |
| CN101192473A (en) | 2008-06-04 |
| JP2008160062A (en) | 2008-07-10 |
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