CN101179009B - 喷射清洗方法以及装置 - Google Patents
喷射清洗方法以及装置 Download PDFInfo
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- CN101179009B CN101179009B CN2007101707522A CN200710170752A CN101179009B CN 101179009 B CN101179009 B CN 101179009B CN 2007101707522 A CN2007101707522 A CN 2007101707522A CN 200710170752 A CN200710170752 A CN 200710170752A CN 101179009 B CN101179009 B CN 101179009B
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- silicon chip
- jet
- cleaning method
- jet cleaning
- cleaning
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- 238000004140 cleaning Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 44
- 239000010703 silicon Substances 0.000 claims abstract description 44
- 239000007788 liquid Substances 0.000 claims abstract description 33
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 238000001035 drying Methods 0.000 claims abstract description 18
- 239000002245 particle Substances 0.000 claims abstract description 12
- 230000000694 effects Effects 0.000 claims description 5
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract 3
- 238000002347 injection Methods 0.000 abstract 2
- 239000007924 injection Substances 0.000 abstract 2
- 239000012530 fluid Substances 0.000 description 18
- 239000007789 gas Substances 0.000 description 14
- 238000000889 atomisation Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000006378 damage Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
Images
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007101707522A CN101179009B (zh) | 2007-11-21 | 2007-11-21 | 喷射清洗方法以及装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007101707522A CN101179009B (zh) | 2007-11-21 | 2007-11-21 | 喷射清洗方法以及装置 |
Publications (2)
Publication Number | Publication Date |
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CN101179009A CN101179009A (zh) | 2008-05-14 |
CN101179009B true CN101179009B (zh) | 2011-09-21 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2007101707522A Active CN101179009B (zh) | 2007-11-21 | 2007-11-21 | 喷射清洗方法以及装置 |
Country Status (1)
Country | Link |
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CN (1) | CN101179009B (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101393852B (zh) * | 2008-11-11 | 2010-04-14 | 武汉工程大学 | 一种半导体硅片的清洗方法 |
US20130118536A1 (en) * | 2010-05-31 | 2013-05-16 | Korea Institute Of Machinery & Materials | Ultrasonic precision cleaning apparatus |
CN102354662A (zh) * | 2011-08-10 | 2012-02-15 | 长春理工大学 | 半导体激光器芯片p面清洗和n面抛光方法 |
CN104624542B (zh) * | 2014-12-31 | 2016-09-14 | 广州兴森快捷电路科技有限公司 | 清洗装置 |
CN109304318A (zh) * | 2018-11-30 | 2019-02-05 | 上海华力微电子有限公司 | 一种晶圆清洗装置及清洗方法 |
CN111451190A (zh) * | 2019-01-21 | 2020-07-28 | 宁波江丰电子材料股份有限公司 | 靶材的清洗方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1596461A (zh) * | 2002-09-24 | 2005-03-16 | 株式会社富士金 | 旋转式硅晶片清洗装置 |
CN1833314A (zh) * | 2003-08-07 | 2006-09-13 | 株式会社荏原制作所 | 基片处理装置、基片处理方法和基片固定装置 |
CN2889529Y (zh) * | 2005-12-31 | 2007-04-18 | 吴永清 | 半导体元件清洗机 |
-
2007
- 2007-11-21 CN CN2007101707522A patent/CN101179009B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1596461A (zh) * | 2002-09-24 | 2005-03-16 | 株式会社富士金 | 旋转式硅晶片清洗装置 |
CN1833314A (zh) * | 2003-08-07 | 2006-09-13 | 株式会社荏原制作所 | 基片处理装置、基片处理方法和基片固定装置 |
CN2889529Y (zh) * | 2005-12-31 | 2007-04-18 | 吴永清 | 半导体元件清洗机 |
Non-Patent Citations (1)
Title |
---|
JP平7-283107A 1995.10.27 |
Also Published As
Publication number | Publication date |
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CN101179009A (zh) | 2008-05-14 |
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Legal Events
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C06 | Publication | ||
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: STATE GRID CORPORATION OF CHINA Free format text: FORMER OWNER: HONGLI SEMICONDUCTOR MANUFACTURE CO LTD, SHANGHAI Effective date: 20121221 Owner name: SHANGHAI MUNICIPAL ELECTRIC POWER COMPANY SHANGHAI Effective date: 20121221 |
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C41 | Transfer of patent application or patent right or utility model | ||
C53 | Correction of patent for invention or patent application | ||
CB03 | Change of inventor or designer information |
Inventor after: Hua Yueshen Inventor after: Sun Yangsheng Inventor after: Du Wenwei Inventor after: Zhang Hua Inventor after: Nie Pengchen Inventor after: Zhang Hezhao Inventor after: Zhang Haojie Inventor after: Sun Zhenhai Inventor after: Han Ruijin Inventor before: Sun Zhenhai Inventor before: Han Ruijin |
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COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100031 XICHENG, BEIJING Free format text: CORRECT: INVENTOR; FROM: SUN ZHENHAI HAN RUIJIN TO: HUA YUESHEN SUN YANGSHENG DOU WENWEI ZHANG HUA NIE PENGCHEN ZHANG HEZHAO ZHANG HAOJIE SUN ZHENHAI HAN RUIJIN |
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TR01 | Transfer of patent right |
Effective date of registration: 20121221 Address after: 100031 Xicheng District West Chang'an Avenue, No. 86, Beijing Patentee after: State Grid Corporation of China Patentee after: Shanghai Electric Power Corporation Patentee after: Shanghai Shenjie Environmental Protection Technology Development Co., Ltd. Address before: 201203 Shanghai Zhangjiang hi tech park GuoShouJing Road No. 818 Patentee before: Hongli Semiconductor Manufacture Co., Ltd., Shanghai |