CN101165866A - 一种集成电路封装体及其制造方法 - Google Patents
一种集成电路封装体及其制造方法 Download PDFInfo
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- CN101165866A CN101165866A CNA2007101678568A CN200710167856A CN101165866A CN 101165866 A CN101165866 A CN 101165866A CN A2007101678568 A CNA2007101678568 A CN A2007101678568A CN 200710167856 A CN200710167856 A CN 200710167856A CN 101165866 A CN101165866 A CN 101165866A
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- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/583,719 | 2006-10-20 | ||
US11/583,719 US8169067B2 (en) | 2006-10-20 | 2006-10-20 | Low profile ball grid array (BGA) package with exposed die and method of making same |
Publications (2)
Publication Number | Publication Date |
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CN101165866A true CN101165866A (zh) | 2008-04-23 |
CN101165866B CN101165866B (zh) | 2010-09-01 |
Family
ID=39032133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101678568A Active CN101165866B (zh) | 2006-10-20 | 2007-10-19 | 一种集成电路封装体及其制造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8169067B2 (zh) |
EP (1) | EP1914803A1 (zh) |
KR (1) | KR100903063B1 (zh) |
CN (1) | CN101165866B (zh) |
HK (1) | HK1118952A1 (zh) |
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- 2007-10-19 TW TW096139249A patent/TWI419243B/zh not_active IP Right Cessation
- 2007-10-19 CN CN2007101678568A patent/CN101165866B/zh active Active
- 2007-10-19 KR KR1020070105836A patent/KR100903063B1/ko not_active IP Right Cessation
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CN102867814A (zh) * | 2011-07-06 | 2013-01-09 | 鸿富锦精密工业(深圳)有限公司 | 芯片封装体 |
CN102881605A (zh) * | 2011-07-12 | 2013-01-16 | 英飞凌科技股份有限公司 | 用于制造半导体封装的方法 |
CN102881605B (zh) * | 2011-07-12 | 2015-09-16 | 英飞凌科技股份有限公司 | 用于制造半导体封装的方法 |
CN103548028A (zh) * | 2011-07-26 | 2014-01-29 | 富士通株式会社 | 混合互连技术 |
CN103548028B (zh) * | 2011-07-26 | 2016-08-31 | 富士通株式会社 | 互连结构以及用于构建互连结构的方法 |
WO2016179753A1 (zh) * | 2015-05-08 | 2016-11-17 | 方丽文 | 一种嵌入式电路板贴片结构及其生产方法 |
CN108987352A (zh) * | 2017-05-30 | 2018-12-11 | 英飞凌科技股份有限公司 | 具有连接在载体层级处的部件的封装 |
CN108987352B (zh) * | 2017-05-30 | 2023-10-20 | 英飞凌科技股份有限公司 | 具有连接在载体层级处的部件的封装 |
CN117148119A (zh) * | 2023-10-31 | 2023-12-01 | 合肥晶合集成电路股份有限公司 | 一种芯片电性失效分析的方法 |
Also Published As
Publication number | Publication date |
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KR100903063B1 (ko) | 2009-06-18 |
HK1118952A1 (en) | 2009-02-20 |
US8169067B2 (en) | 2012-05-01 |
US20080096312A1 (en) | 2008-04-24 |
EP1914803A1 (en) | 2008-04-23 |
TWI419243B (zh) | 2013-12-11 |
TW200834768A (en) | 2008-08-16 |
CN101165866B (zh) | 2010-09-01 |
KR20080035996A (ko) | 2008-04-24 |
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