CN101109094A - Method of horizontally plating, electrodepositing or electrodeless plating processing on substrate - Google Patents
Method of horizontally plating, electrodepositing or electrodeless plating processing on substrate Download PDFInfo
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- CN101109094A CN101109094A CNA2006100989974A CN200610098997A CN101109094A CN 101109094 A CN101109094 A CN 101109094A CN A2006100989974 A CNA2006100989974 A CN A2006100989974A CN 200610098997 A CN200610098997 A CN 200610098997A CN 101109094 A CN101109094 A CN 101109094A
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Abstract
A level electroplating equipment comprises essentially a group of plating-solution baffles, a group of first electrodes, a group of reticulated, surface-like or needle-like second electrodes, and an electrode regeneration and plating-solution recycling system. When the baseplate is sent horizontally for positioning, the plating-solution slowly flowing plate and the contact cathode will clamp and conduct electricity for the baseplate; then by filling plating solution and contacting with the anode at upper, an electro plating environment is formed so as to carry out one-side plating for the baseplate at the side of cathode; or by filling electro-deposition solution and contacting with the anode at upper, an electro-deposition environment is formed, so as to carry out one-side electro deposition at the side of the anode for color optic filter pigment, dyestuff, or electro conductive photoresistor. The invention provides a level electroplating/ electro-deposition/ electrode-free electroplating equipment, can be used for electroplating an one-side even and horizontal film on the upper surface of a baseplate, for electro deposition of color optic filter pigment, dyestuff, or electro conductive photoresistor, or for depositing metallic film on a single side by chemical oxidation-reduction method.
Description
Technical field
The present invention relates to a kind of on substrate the technology of plated film, specifically, be involved in the working method of carrying out horizontal plating, galvanic deposit or electrodeless plating etc. on the substrate.
Background technology
Following plating/the electrodeless plating carried of this specification sheets is meant general inorganic metal film sedimentation; Galvanic deposit only is meant organic conductive material membrane sedimentation, for example the deposition of colored filter colorant, dye film or electroconductibility photovaristor.
In generally in flat-panel screens or semiconductor technology, as shown in Figures 1 and 2, for go up to form conductive film (metal such as aluminium, molybdenum, chromium, copper or be the alloy film of principal constituent with it) in substrate (Silicon Wafer, glass, plastics etc.), utilize vacuum coating technology to finish more.And on all the other industrial application, then often will be plated on the Industrial products rete (as circuit card) that makes it form ornament layer, protective layer or have desired characteristic as metals such as copper, nickel, gold and silver with plating/electrodeless plating technology.
With regard to the vacuum coating technology of prior art, be that substrate is sent in the cavity, see through again vacuumize, the control of cavity voltage and gas flow, generation ion bombardment target makes the target material surface atom be got and is deposited on substrate through diffusion.With regard to this technology, because of the need vacuum environment, add equipment complex and expensive, power consumption factor such as big, thereby increase the cost of manufacture that large-size substrate is used.
And aspect the electroplating technology of prior art, except the vertical plating that industry is known, the horizontal electroplating technology that is applied to circuit card is arranged still.The vertical part of electroplating is subject to fixing, hanging of substrate and electrode configuration, and have the operating time long, the plated film homogeneity is relatively poor, the large size operation is difficult for and front and back technology in level turn to the difficulty of problem etc. when changeing vertical; With regard to level is electroplated, when being applied to semi-conductor or planar display substrates, because the difference of the difference of substrate size external form, thickness demand and substrate tolerance levels etc. is different, originally be applied to plating or colored filter colorant, dyestuff or the electroconductibility photovaristor galvanic deposit that the design of the galvanized conductive roller of circuit board level and coating bath will be unfavorable for aforesaid base plate, cause the plated film damage, film uniformity is not good and the possibility of substrate breakage.
Therefore, for realizing electroplating in a horizontal manner required metallic film or galvanic deposit colored filter colorant, dyestuff, to reduce the suitability problem of the expensive and existing electroplating technology that uses vacuum system, the invention provides a kind of new working method of on substrate, carrying out horizontal plating, galvanic deposit or electrodeless plating etc.
Summary of the invention
The method that the purpose of this invention is to provide horizontal plating, galvanic deposit or electrodeless plating on a kind of substrate.
For solving the problem of above-mentioned explanation, the present invention proposes a kind of horizontal plating/galvanic deposit on substrate/electrodeless plating method, the main horizontal electroplating system that proposes to have one group of movable plating bath plate washer, a set of contact first electrode, an electroplate liquid injection and retrieving arrangement, a networking shape, planar or acicular second electrode and have catholyte reduction or etching mechanism.Keep the plating liquid measure of suitable foot on the substrate and good Flow Field Distribution, plated film homogeneity when improving large-area electroplating by plate washer.And, eliminate the injury of roller contact to plated film and substrate by contact first electrode, do not need electrode in the electrodeless plating method.
The method of horizontal plating, galvanic deposit or electrodeless plating comprises following step on the substrate of the present invention:
With a substrate that makes electroplated face conduction through electro-conductive material coating, electrodeless plating or sputter conducting metal, when entering the substrate support system location with live roller or mechanical arm, four piece baffles (independent separately, be one group or be one group with four in twos) move respectively and are contacted with the non-wiring region on the substrate plating face or are attached at substrate edges, move the first electrode contact substrate, the non-wiring region that itself and substrate surface are contacted with the left and right sides or four limits makes substrate conducting; Inject electroplate liquid simultaneously, slow down plating bath loss speed on the substrate plating face and keep certain plating bath height by plate washer.Afterwards, when the plating bath height rises and after or needle-like insoluble second electrode netted with the substrate top contact, carry out thin film electroplating, colored filter colorant, dyestuff or electroconductibility photovaristor galvanic deposit program (opposite when the first/the second electrode definition is with plating when colored filter or electroconductibility photovaristor electro-deposition applications), by plating bath lasting injection and loss, reach the purpose of plating bath stirring and good Flow Field Distribution, and then obtain good plated film uniformly.
Compare with roller type the first/the second electrode commonly used, because the first/the second electrode here is the column or the sheet of tool contact, and the zone of action is non-wiring region, can avoid the scratch of line areas plated film and cooperate the suitable configuration of the first/the second electrode to improve the plated film homogeneity.After the substrate plating is finished,, can see through additional electrolysis or the removal of Wet-type etching mechanism at the plated film that cathode surface may form.Electroplating or galvanic deposit program when carrying out, substrate support system also can have lifting and inclined mechanism to present the little degree of tilt perpendicular or parallel with substrate approach axis axle, to reach better Flow Field Distribution except that the level configuration.
In addition, the electroplate liquid that runs off in plate washer and substrate slit sees through the below accumulator tank and reclaims, through filtration, additive replenishes with the concentration adjustment after reuse, reduce cost.
For making the above-mentioned purpose of the present invention, feature and advantage be easier to understand, below especially exemplified by going out preferred embodiment, and conjunction with figs. illustrates it.
Description of drawings
Fig. 1 is the vacuum coating technology of prior art;
Fig. 2 is the horizontal electroplating technology of prior art;
Fig. 3 A to Fig. 3 C is the side-view of preferred embodiment different step of the present invention;
Fig. 4 A and Fig. 4 B are second electrodes of different types among the present invention;
Fig. 5 is the electroplate liquid plate washer of preferred embodiment of the present invention and the different distributing styles of first electrode;
Fig. 6 is the little degree of tilt synoptic diagram of preferred embodiment substrate support system of the present invention, and wherein this substrate support system is several rollers;
Fig. 7 is the little degree of tilt synoptic diagram of preferred embodiment substrate support system of the present invention, and wherein this substrate support system is a platform;
Fig. 8 is activation of single face substrate and the metal film deposition that the present invention is applied to electrodeless plating;
Fig. 9 is a schema of the present invention.
Drawing reference numeral is as follows: 301 substrates; 302 substrate support system; 303 recovery systems; 304 second electrodes; 305 electroplate liquids; 306 plating baths unhurried current frid; 307 first electrodes; 308 second electrodes; 401 plating bath plate washers; 402 electrodes; 501 substrates; 502 rollers.
Embodiment
Now sincerely form, and the effect and the advantage that can produce, cooperate graphicly, lift preferred embodiments more of the present invention and be described in detail as follows with regard to structure of the present invention.
Substrate horizontal metal film of the present invention, electro-conductive material sedimentary structure such as Fig. 3 A to Fig. 3 C paint, and please refer to the schema of Fig. 9, this program is with live roller or mechanical arm (not shown) substrate 301 (being glass substrate in this example) to be sent on the substrate support system 302 earlier to position.In the present embodiment, this substrate support system 302 is several roller (step 10).
After finish the location several plating baths Huan Liu File plate 306 is moved and be pasted to substrate 301 edges, these plating baths Huan Liu File plate 306 surrounds the periphery of substrate 301, formation surrounding edge (step 11).The plating bath plate washer is that firm, the elastic material of tool is formed among the present invention.
Moving first electrode 307 makes to contact with this substrate 301 non-wiring region and makes conduction (step 12).This first electrode 307 is a kind of of male or female among the present invention.Substrate can be silicon wafer substrate, glass substrate, metal substrate, plastic base or colored filter substrate in the present invention.
Injecting electroplate liquid 305 makes it to contact laggard electroplating program (step 14) with substrate 301 tops second electrode 304 in these plating bath plate washer 306 formed surrounding edges.Electroplate liquid 305 among the present invention injects the formed surrounding edge of this plating bath plate washer 306 in the mode of unhurried current, be that electroplate liquid 305 slowly injects on one side, also slowly flow out this surrounding edge on one side, its effect makes electroplate liquid 305 form the effect of stirring, so this electrolytic ion can be plated on this substrate 301 equably.Therefore the overflow effect makes electroplate liquid 305 form a good stirring, and flooding velocity control is reached preferable Flow Field Distribution according in fact using required adjusting, and obtains required uniform film.And the loss of electroplate liquid 305 can see through below plating bath recovery system 303 to reclaim, and utilizes again after adjusting through filtration, concentration, reduces cost.
Fig. 3 C shows the second embodiment of the present invention, wherein this second electrode also can be packaged type second electrode 308 of tool mobile mechanism, make with lower substrate 301 and form parcel plating, galvanic deposit zone, see through again and progressively move full substrate 301 plating, the galvanic deposit program finished.In the electroplating process,, slow down 301 losses of going up electroplate liquid 305 of substrate by the attaching of plating bath plate washer 306.
Fig. 4 A and Fig. 4 B show the third embodiment of the present invention, show another embodiment of the present invention among this embodiment, and wherein identical with a last embodiment assembly and function thereof represent that with identical figure number its details also repeats no more, and only illustrate that hereinafter both do not exist together.This first electrode 3071 is a mesh electrode (Fig. 4 A) in the present embodiment, or several columnar electrodes (Fig. 4 B) form.This all within the scope of the invention.
Fig. 5 shows the fourth embodiment of the present invention, shows another embodiment of the present invention among this embodiment, and wherein identical with a last embodiment assembly and function thereof represent that with identical figure number its details also repeats no more, and only illustrates that hereinafter both do not exist together.This first electrode 402 is configured in the below of plating bath paper plate 401 in a horizontal manner and contacts with this substrate 301 in the present embodiment.Same this first electrode in the present embodiment can be a mesh electrode or several columnar electrodes.
Fig. 6 shows the fifth embodiment of the present invention, shows another embodiment of the present invention among this embodiment, and wherein identical with a last embodiment assembly and function thereof represent that with identical figure number its details also repeats no more, and only illustrate that hereinafter both do not exist together.Show in the present embodiment that this roller has inclined mechanism for 502 groups, this substrate 501 that can therefore tilt is so the density of adjustable economize on electricity coating reaches more uniform electrolytic coating.
Fig. 7 shows the sixth embodiment of the present invention, shows another embodiment of the present invention among this embodiment, and wherein identical with a last embodiment assembly and function thereof represent that with identical figure number its details also repeats no more, and only illustrate that hereinafter both do not exist together.Show in the present embodiment that this substrate support system is a platform 502, similarly this platform 502 also has an inclined mechanism, and this substrate 501 that can therefore tilt is so the density of adjustable economize on electricity coating reaches more uniform electrolytic coating.
Fig. 8 shows the seventh embodiment of the present invention, shows another embodiment of the present invention among this embodiment, and wherein identical with a last embodiment assembly and function thereof represent that with identical figure number its details also repeats no more, and only illustrate that hereinafter both do not exist together.Show in the present embodiment first and second electrode is removed, in electrodeless plating technology, carry out, carry out substrate activation or electrodeless plating metal film deposition, so as to reaching single face activation substrate and single face electrodeless plating metal deposition.Wherein inject earlier activation processing substrate liquid in the formed surrounding edge of this plate washer, make it and carry out substrate activation treatment program after the substrate top contacts.The electrodeless plating liquid that reinjects makes it and carries out the electrodeless plating program after substrate top contacts in the formed surrounding edge of this plate washer.And activation treatment liquid and electrodeless plating liquid all can recycle the saving cost by the recovery system of first embodiment.Above used " activation processing substrate liquid ", be this area this treatment solution commonly used, be that this area professional knows, need not give unnecessary details.
Each assembly in the various embodiments of the present invention is a moving assembly synchronously.
The present invention is meant that the single face of upper surface of base plate electroplates, and comprises substrate and electroplate (panel plating) comprehensively.And also can re-plating (patternplating) after covering layer of conductive film on the substrate 301 earlier to define a pattern among the present invention.
Electrode among the present invention (comprising first electrode and second electrode) can be by the formed electrode of semipermeable membrane material parcel electroplate liquid.
Still can comprise among the present invention by plating/galvanic deposit/electrodeless plating liquid parameter control system and carry out pH, temperature and the analysis of circulation volt, size distribution analysis, charge distribution, conductance, the monitoring of real time reaction plating situation etc.
In sum, the design of consideration of human natureization of the present invention, quite realistic demand.Obviously have breakthrough progressive advantage, the enhancement that has effect really compared to existent technique.
Above-listed detailed description is specifying at possible embodiments of the present invention, these embodiment are not the claim scope in order to restriction patent of the present invention, allly do not break away from the equivalence that the technology of the present invention spirit does and implement or change, all should be contained in the claim of the present invention.
Claims (25)
1. the method for horizontal plating, galvanic deposit on a substrate is characterized in that, comprises the following step:
Substrate sent on the substrate support system position, wherein this substrate is with the direction configuration of approximate horizontal;
Several plating bath plate washers are moved be pasted to substrate edges, these plating bath plate washers surround the periphery of substrates, form surrounding edge;
Moving first electrode makes contact with the non-wiring region of this substrate and makes it to conduct electricity;
Second electrode is placed the top of this substrate, and do not contact with this substrate, the polarity of this second electrode is opposite with this first polarity of electrode; And
Inject electroplate liquid in the formed surrounding edge of this plating bath plate washer, make it to contact laggard electroplating or galvanic deposit program with substrate top second electrode.
2. the method for horizontal plating, galvanic deposit is characterized in that on the substrate as claimed in claim 1, comprises following step:
Electroplate liquid injects the formed surrounding edge of this plating bath plate washer in the mode of unhurried current, and promptly electroplate liquid slowly injects on one side, Yi Bian also slowly flow out this surrounding edge, its effect makes electroplate liquid form the effect of stirring, so this electrolytic ion can be plated on this substrate equably.
3. on the substrate as claimed in claim 2 horizontal electroplate, the method for galvanic deposit, it is characterized in that the loss of electroplate liquid can see through below plating bath recovery system and reclaim, utilize again after concentration is adjusted through filtering, carrying out.
4. the method for horizontal plating, galvanic deposit is characterized in that this substrate support system is several rollers or a platform on the substrate as claimed in claim 1.
5. the method for horizontal plating, galvanic deposit is characterized in that this second electrode is a sheet electrode on the substrate as claimed in claim 1, and it places the top of this substrate in the mode that roughly is level.
6. the method for horizontal plating, galvanic deposit is characterized in that substrate is in silicon wafer substrate, glass substrate, metal substrate, plastic base or colored filter or the electroconductibility photovaristor substrate on the substrate as claimed in claim 1.
7. the method for horizontal plating, galvanic deposit is characterized in that on the substrate as claimed in claim 1, deposits conductive film in modes such as coating, electrodeless plating, sputters on the substrate.
8. the method for horizontal plating, galvanic deposit is characterized in that this second electrode is tabular, netted or needle electrode on the substrate as claimed in claim 1.
9. the method for horizontal plating, galvanic deposit is characterized in that on the substrate as claimed in claim 1, and this second electrode places the substrate top, and relative spacing can be adjusted as required.
10. the method for horizontal plating, galvanic deposit is characterized in that on the substrate as claimed in claim 1, and when colored filter or electroconductibility photovaristor galvanic deposit, second electrode of substrate top can be insoluble negative electrode.
11. on the substrate as claimed in claim 1 horizontal electroplate, the method for galvanic deposit, it is characterized in that when Metal plating, second electrode is not for to participate in the insoluble electrode of electroplating reaction, or is the formed soluble anode of a plan metallization.
12. the method for horizontal plating, galvanic deposit is characterized in that this second electrode is a travelling electrode on the substrate as claimed in claim 1.
13. the method for horizontal plating, galvanic deposit is characterized in that on the substrate as claimed in claim 1, first electrode and second electrode are by the formed electrode of semipermeable membrane material parcel electroplate liquid.
14. on the substrate as claimed in claim 1 horizontal electroplate, the method for galvanic deposit, it is characterized in that, be covered with earlier on the substrate layer of conductive film define a pattern after re-plating.
15. the method for horizontal plating, galvanic deposit is characterized in that on the substrate as claimed in claim 1, plating, galvanic deposit material comprise copper, silver, aluminium, metal, conduction colorant, dyestuff, conductive rubber.
16. the method for horizontal plating, galvanic deposit is characterized in that on the substrate as claimed in claim 1, the plating bath plate washer comprises rectangular parallelepiped or is right cylinder.
17. the method for horizontal plating, galvanic deposit is characterized in that substrate support system has inclined mechanism on the substrate as claimed in claim 1, to regulate plating bath Flow Field Distribution homogeneity.
18. the method for horizontal plating, galvanic deposit on the substrate as claimed in claim 1, it is characterized in that, comprise by plating, electrodeposit liquid parameter control system and carry out pH, temperature and cycle analysis, size distribution analysis, charge distribution, conductance, the monitoring of situation is electroplated in real time reaction.
19. the method for horizontal plating, galvanic deposit is characterized in that this first electrode is configured in the below of plating bath paper plate in a horizontal manner and contacts with this substrate on the substrate as claimed in claim 1.
20. the method for horizontal plating, galvanic deposit is characterized in that on the substrate as claimed in claim 1, with live roller or mechanical arm substrate is sent on the substrate support system to position.
21. on the substrate as claimed in claim 1 horizontal electroplate, the method for galvanic deposit, it is characterized in that each assembly is a moving assembly synchronously.
22. the method for horizontal plating, galvanic deposit on a substrate is characterized in that, comprises the following step:
With live roller or mechanical arm substrate is sent on the substrate support system and to be positioned; It is characterized in that this substrate is with the direction configuration of approximate horizontal;
Several plate washers are moved and be pasted to substrate edges, and these plate washers surround the periphery of substrate, the formation surrounding edge;
Inject activation processing substrate liquid in the formed surrounding edge of this plate washer, make it and carry out substrate activation treatment program after the substrate top contacts; And
Inject electrodeless plating liquid in the formed surrounding edge of this plate washer, make it and carry out the electrodeless plating program after the substrate top contacts.
23. the method for horizontal plating, galvanic deposit is characterized in that on the substrate as claimed in claim 22, comprises following step:
Activation processing substrate liquid and electrodeless plating liquid inject the formed surrounding edge of this plate washer in the mode of unhurried current, promptly activating processing substrate liquid and electrodeless plating liquid slowly injects on one side, also slowly flow out this surrounding edge on one side, it act as the formation stirring action, to activate substrate or uniform deposition plated film equably.
24. the method for horizontal plating, galvanic deposit on the substrate as claimed in claim 22, it is characterized in that, the loss of activation processing substrate liquid and electrodeless plating liquid can see through the below recovery system and reclaim, through utilizing again after filtration, concentration adjustment, temperature control and the pH control.
25. on the substrate as claimed in claim 22 horizontal electroplate, the method for galvanic deposit, it is characterized in that each assembly is a moving assembly synchronously.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100989974A CN101109094B (en) | 2006-07-18 | 2006-07-18 | Method of horizontally plating, electrodepositing or electrodeless plating processing on substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2006100989974A CN101109094B (en) | 2006-07-18 | 2006-07-18 | Method of horizontally plating, electrodepositing or electrodeless plating processing on substrate |
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| CN101109094A true CN101109094A (en) | 2008-01-23 |
| CN101109094B CN101109094B (en) | 2011-07-06 |
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| CN2006100989974A Expired - Fee Related CN101109094B (en) | 2006-07-18 | 2006-07-18 | Method of horizontally plating, electrodepositing or electrodeless plating processing on substrate |
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| CN101109094B (en) | 2011-07-06 |
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