CN101056754B - 树脂密封模具及树脂密封装置 - Google Patents
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Abstract
一种用树脂密封半导体元件的树脂密封模具,具有上模(12)、与上模(12)相对配置的下模(14)和夹在上模(12)与下模(14)之间的多个中模(13a、13b),这些中模(13a、13b)在顶端形成有成型面,密封时成型面彼此相对地配置,上述成型面的至少一个设置有在成型后的上述树脂的侧面形成凹部的凸起部(20)。由此,中模(13a、13b)能够从分割面I左右分开,即使是侧面形成有凹部的半导体器件的树脂封装也能够成型。
Description
技术领域
本发明涉及用于半导体器件成型的树脂密封模具和树脂密封装置,尤其涉及对在侧面形成有凹部的树脂封装进行成型的技术。
背景技术
以往,作为用树脂密封半导体元件来制作半导体器件的成型方法之一,使用的是传递成型法。传递成型法利用使用了由上模和下模构成的树脂密封模具的树脂密封装置。如果使用该成型法,通过使上模与下模合模夹持半导体元件的引线框,使树脂在熔锅里熔化后压送到模具的模腔中使其固化。然后使上模和下模在上下方向移动进行开模,取出作为成型品的半导体器件。
作为半导体器件的一例,有用密封半导体发光元件的树脂封装形成了透镜的表面安装型发光装置。图7表示表面安装型发光二极管的一例。图7(a)为俯视图,图7(b)为侧视图。
发光二极管61是用透光性的树脂封装65覆盖了安放在引线框62、63上的半导体发光元件64的器件。树脂封装65形成有汇聚从半导体发光元件64射出的光的透镜单元68、以及将引线框62、63和半导体发光元件64连成一体并覆盖的脚部69。透镜单元68的外周形成有曲面66。通过形成曲面66,透镜单元68与底座部69的连接部分形成缩径部67。
如此地,通过在发光二极管61的侧面设置成为凹部的缩径部67,从半导体发光元件64射向侧方的光不会浪费地在曲面66进行全反射,向主光输出方向F汇聚,因此能够提高亮度。
但是,在对图7所示的树脂封装65进行成型的情况下,由于存在缩径部67,因此由上模和下模构成的树脂密封模具不能进行开模,不能成型制品。
这里,专利文献1中提出了除上模和下模之外还设置了中模的树脂密封装置作为树脂密封模具的方案。该树脂密封装置在上模与下模之间设置中模,将树脂从熔锅经过中模填充到模腔中,在树脂密封之后,首先使下模下降,接着使中模从上模上分离进行开模,从而取出成型品。
但是,专利文献1记载的树脂密封装置虽然具有中模,但中模只起到将树脂填充到模腔中的浇口的作用。因此,即使要成型图7所示的具有缩径部67的树脂封装65,也不能进行开模。
专利文献1:日本特开2003-11187号公报
发明内容
本发明就是为了解决上述现有技术的问题,其目的在于要提供一种树脂密封模具和树脂密封装置,能够对侧面形成有凹部的半导体器件的树脂封装进行成型。
为了达到上述目的,本发明的树脂密封模具,用树脂密封半导体元件,其具有上模、与上述上模相对配置的下模以及被夹持在上述上模与上述下模之间的多个中模;上述多个中模在顶端形成有成型面,配置成上述密封时使上述成型面彼此相对置,
上述成型面的至少一个设置有在成型后的上述树脂的侧面形成凹部的凸起部。
本发明的树脂密封模具,上述多个中模具备能够使上述成型面按圆弧状旋转移动的旋转轴。
本发明的树脂密封模具,上述旋转轴被安装于基座部,上述基座部能够移动,使得上述中模在保持水平状态的状态下从下模浮起。
附图说明
图1是表示本发明的第一实施方式涉及的树脂密封模具结构的剖视图。
图2是中模的凸起部的局部放大图,其中(a)是剖视图,(b)是立体图。
图3是内置有树脂密封模具的上下基座的立体图,其中,(a)是将上模基座上下颠倒时的立体图,(b)是下模基座的立体图。
图4是半导体发光元件框体的放大图。
图5是表示成型后取出的半导体发光装置的俯视图。
图6是表示本发明的第二实施方式涉及的树脂密封模具在封入树脂时的结构的剖视图,其中,(a)是表示合模时的状态的剖视图,(b)是表示开模时的状态的剖视图。
图7是表示表面安装型发光二极管的图,其中,(a)是俯视图,(b)是侧视图。
具体实施方式
根据本发明的树脂密封模具,由于具备多个中模,它们配置成使成型面彼此相对置,因此即使是在侧面形成有凹部的半导体器件的树脂封装,也能够成型。
根据本发明的树脂密封装置,由于具备多个中模,它们配置成使成型面彼此相对置,因此能够成型在侧面形成有凹部的半导体器件的树脂封装。而且,由于多个中模旋转移动,以便打开相对置的成型面,因此能够容易地取出成型品。
在本发明的树脂密封模具中,优选上述成型面的至少一个设置有在成型后的上述树脂的侧面形成凹部的凸起部。
而且,上述多个中模优选具备能够使上述成型面按圆弧状旋转移动的旋转轴。根据这种结构,由于能够使多个中模旋转移动,以打开相对置的成型面,因此能够容易地取出成型品。
下面参照附图说明本发明的一实施方式。
(第一实施方式)
图1是第一实施方式的树脂密封模具的剖视图。图2是中模的顶端部的局部放大图,图2(a)为剖视图,图2(b)为立体图。图3是内置有树脂密封模具的上下基座的立体图,图3(a)是将上模基座上下颠倒时的立体图,图3(b)是下模基座的立体图。
本实施方式是成型与图7所示的发光二极管61的树脂封装65相同的树脂封装的例子,上述各图的模具采用与之相对应的结构。
如图1所示,树脂密封模具11具有上模12、中模13和下模14。中模13由一对中模13a和中模13b构成。并且,在下模14上设有凸透镜形成销15和引导销16。
另外,上模也可以称为上模腔块,中模也可以称为中模腔块,下模也可以称为下模腔块,但在以下的说明中只称为上模、中模和下模。
树脂密封模具11在被上模12、中模13和下模14夹着的部分形成作为空隙的模腔18。通过将树脂填充到该模腔18中,能够成型图7所示的密封半导体发光元件64的树脂封装65。
另外,在图1的例中,树脂密封模具11配置成,在使发光二极管61的主光输出方向F(图7)朝向下模14一侧的状态下成型树脂封装65。
上模12能够通过升降机构(图中未表示)沿上下方向移动。中模13的中模13a与中模13b能够以分割面I为边界彼此分离地沿水平方向(箭头a)移动。中模13a、13b在顶端形成有成型面,在该成型面上设有凸起部20。通过该凸起部20,能够形成图7所示的从透镜单元68向脚部69延伸的缩径部67,这一点在后面详细叙述。
下面参照图2(a)和图2(b)详细说明在中模13的顶端部设置的凸起部20。如图2(b)所示,在中模13a、13b的顶端部形成有紧贴面20a。当使中模13a和中模13b的成型面彼此相对置地将中模13a与中模13b对接时,紧贴面20a彼此紧密接合。图2(a)表示该紧密接合状态,分割面I是紧密接合面。
而且,在中模13a、13b上形成有凹曲面20d。由此,如图2(a)所示形成向下逐渐张开的开口。该开口与图7所示的曲面66相对应。
此外,在中模13a、13b上形成有L字形状面20b和弯曲部20c。L字形状面20b在图2(a)的剖面状态下与中模13a、13b的上表面一起形成L字形,在中模13a、13b的上表面与弯曲部20c之间形成台阶。L字形状面20b对应于图7所示的脚部69,弯曲部20c对应于形成缩径部67的倾斜部。
如此地,通过设置L字形状面20b、弯曲部20c和凹曲面20d,中模13a、13b的顶端部形成与树脂封装65的凹部相对应的凸起部20。
在图1中,在下模14上形成有与模腔18连通的通孔17,凸透镜形成销15穿插到该通孔17中。凸透镜形成销15在顶端形成有凹部19。图中简化表示了凹部19,通过凹部19形成图7所示的透镜单元68的3个凸透镜68a。
引导销16是进行后述的半导体发光元件框体与树脂密封模具11的定位的销。通过使该引导销16与设在半导体发光元件框体上的孔结合,能够在覆盖半导体发光元件64的位置上准确地成型树脂封装65。
上模12配置在图3所示的上模基座31的中央部位,通过嵌合到组装在上模基座31内的冲模组件(未图示)中的定位框中,进行定位。而且,中模13和下模14配置在下模基座35的中央部位,通过嵌合到设置在下模基座35内的模腔块框体(未图示)上的槽中,进行定位。
再者,上模12、中模13和下模14利用在组装到上模基座31内的冲模组件中的定位框内设置的引导销(未图示),进行定位。
在上模基座31的角部设有4根圆筒形的支柱32a。此外,在下模基座35的角部设有4根当下模基座35与上模基座31对接时同支柱32a嵌合的圆柱形的支柱32b。
上模基座31和下模基座35分别设置在树脂密封装置上。树脂密封装置具备使上模基座31升降的升降机构,通过使上模基座31下降将支柱32a与支柱32b嵌合,能够将上模基座31高精度地放置到下模基座35上。
上模基座31内的小孔(cull)部33和树脂浇道34是为了使射出的熔融树脂流入模腔18而设置的树脂通道。另一方面,树脂片料能够投入下模基座35内的小孔部36。
下面参照图1~图5具体说明成型过程。图4是半导体发光元件框体(以下称为“框体”)的放大图。图5是表示成型后取出的半导体发光装置的俯视图。
首先,将中模13嵌入到下模14上。将它们称为中下模37。在将该中下模37设置到下模基座35上之前,利用模具用热熔锅(未图示)预热。在充分预热后,使底盘41朝向下模14一侧地将框体40朝下设置在中模13上。
接着,如图3(a)所示地将上模12设置到上模基座31上,如图3(b)所示地将中下模37设置到下模基座35上。然后分别将上模基座31和下模基座35设置到树脂密封装置上。在将树脂片料投入到小孔部36后,将上模基座31放置到下模基座35上使支柱32a与支柱32b嵌合,将两基座合模。
合模结束后,使投入到下模基座35的小孔部36中的树脂片料熔化。利用小孔部36内的压射活塞(未图示)使熔融树脂从涡流部36射出。然后,射出的熔融树脂从上模基座31的小孔部33通过树脂浇道34流到框体40。
如图4所示,通过了树脂浇道34的熔融树脂从浇口42流入底盘41。流入的熔融树脂填充到模腔18中。在树脂固化后,利用树脂密封装置使上模基座31上升,上模12与中下模37开模。然后,通过冲压机构的顶出操作抬起中下模37,从下模基座35上取下中下模37。
在取下中下模37之后,首先分离浇道。然后将下模14与中模13分离。由此,成为从中模13上取下下模14和中模13的状态。当在该状态下使中模13a和中模13b彼此分离地沿水平方向移动时,分割面I左右分开,能够取出图5所示的树脂封装部成型后的半导体发光元件的框体40。
通过这样的分模,即使在发光二极管61的侧面形成有作为凹部的缩径部67,也能够使中模13a、13b容易地开模。
树脂封装65成型后的框体40如图5所示在附着有固化了剩余树脂的小孔部残留树脂43和树脂浇道残留树脂44的状态下被取出。由于它们能够简单地从框体40上除去,因此能分别分离除去。而且,通过一个个地分离框体40,能够获得半导体发光装置。
在上述工序结束后,用气流清除附着在下模14、中模13上的毛刺,用于下一个制造工序。
(第二实施方式)
图6是表示第二实施方式涉及的树脂密封模具的剖视图。图6(a)是表示合模时的状态的剖视图,图6(b)是表示开模时的状态的剖视图。对于与第一实施方式相同的结构部分,赋予相同的附图标记,并省略详细的说明。
第二实施方式的中模的顶端成型面(凸起部)的基本结构与第一实施方式相同,但与第一实施方式的结构不同点在于,在基端部设置了成为支点的旋转轴,使成型面按圆弧状移动。
如图6(a)所示,树脂密封模具51具有上模12、中模53和下模14。中模53由一对的中模53a和中模53b构成。在下模14上设有凸透镜形成销15和引导销16。
树脂密封模具51在被上模12、中模53和下模14夹着的部分设有作为空隙的模腔18。通过将树脂填充到该模腔18中,能够成型图7所示的树脂封装65。
另外,在图6的例子中,与图1的例子相同地配置树脂密封模具51,以便在使发光二极管61的主光输出方向F(图7)朝向下模14一侧的状态下成型树脂封装65。
在中模53的顶端设置的凸起部20的形状与第一实施方式中的图2所示的结构相同。在中模53的基端部设有使顶端部按圆弧状移动的旋转轴21。当中模53a、53b顶端部的成型面按圆弧状旋转并开模时,旋转轴21成为支点。
如图6(b)所示,在树脂密封模具51上设有用于顶起中模53a、53b使顶端部按圆弧状旋转的顶杆23。顶杆23配置在比旋转轴21靠近中模53a、53b的顶端一侧,***下模14的通孔中。
通过采用这种结构,在树脂密封模具51上设置的升降机构(图中没有表示)使2根顶杆23推压着中模53a、53b移动,由此,能够使中模53a、53b的顶端部以旋转轴21为中心按圆弧状旋转,同时进行开模。
下面参照图3~图6说明成型品的脱模。另外,对于树脂固化之前的工序,由于与上述第一实施方式相同,因此省略其说明。并且,将中模53嵌合到下模14中的组件称为中下模57。
在树脂固化后,通过树脂密封装置使上模基座31上升,在上模12与中下模57之间进行开模。通过开模,上模12从中下模57分离,因此具有中模53a、53b能够向上侧移动的空间。在该状态下,使中模53a、53b以保持了水平的状态向上侧移动,并且浮在上侧。由于中模53a、53b的旋转轴21被安装在设于下模14外侧的基座58上,因此利用升降机构(未图示)向上抬起基座58,使上述浮起成为可能。
然后用树脂密封装置的升降机构如图6(b)所示地使顶杆23推压着中模53a、53b移动。通过该移动,中模53a、53b以旋转轴21为支点打开成八字形,紧密接合的分割面J(图6(a))彼此分离。随着该中模53a、53b的旋转动作,框体40逐渐被抬起,树脂封装65脱离凸起部20。图6(b)表示的是该脱模结束后的状态,在该状态下能够容易地取出框体40。
树脂封装65的框体40如图5所示地在附着有固化了剩余树脂的小孔部残留树脂43和树脂浇道残留树脂44的状态下被取出。由于它们能够简单地从框体40上除去,因此能分别分离除去。并且,通过一个个地分离框体40,能够获得半导体发光装置。
在上述工序结束后,将中模53a、53b翻转,用气流清除与下模14接触的分型面。然后使中模53a、53b回到原来的状态,用气流清除表面侧,用于下一个制造工序。
另外,虽然第一实施方式、第二实施方式中就用2个中模形成树脂密封模具进行了说明,但并不局限于此,也可以采用用3个以上的中模成型半导体器件的树脂封装的结构。
并且,虽然第一实施方式、第二实施方式的树脂密封模具和树脂密封装置以成型图7所示的发光二极管61用的树脂封装65为例,但树脂封装也可以是侧面没有凹部的结构,本发明可以用于成型各种半导体器件的树脂封装。
并且,虽然以侧面具有凹部的树脂封装为例进行说明,但并不局限于此,例如也可以用于成型侧面具有凸起部的树脂封装。此时,中模的成型面上设置与凸起部相对应的凹部。
并且,虽然第一实施方式、第二实施方式就树脂密封模具和树脂密封装置用于用传递成型法成型半导体器件的树脂封装进行了说明,但并不局限于此,也可以用于注射成型法等其他的成型方法。
如上所述,本发明作为用于成型半导体器件的树脂封装——尤其是用于成型侧面形成了凹部的树脂封装的树脂密封模具和树脂密封装置有用。
Claims (3)
1.一种树脂密封模具,用树脂密封半导体元件,其特征在于,
具有上模、与上述上模相对配置的下模以及被夹持在上述上模与上述下模之间的多个中模;上述多个中模在顶端形成有成型面,配置成上述密封时使上述成型面彼此相对置,
上述成型面的至少一个设置有在成型后的上述树脂的侧面形成凹部的凸起部。
2.如权利要求1所述的树脂密封模具,其特征在于,
上述多个中模具备能够使上述成型面按圆弧状旋转移动的旋转轴。
3.如权利要求2所述的树脂密封模具,其特征在于,
上述旋转轴被安装于基座部,上述基座部能够移动,使得上述中模在保持水平状态的状态下从下模浮起。
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JP329276/2004 | 2004-11-12 | ||
PCT/JP2005/020592 WO2006051844A1 (ja) | 2004-11-12 | 2005-11-10 | 樹脂封止金型および樹脂封止装置 |
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EP (1) | EP1834752A4 (zh) |
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- 2005-11-10 KR KR1020077011259A patent/KR100851708B1/ko not_active IP Right Cessation
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EP1834752A4 (en) | 2010-08-25 |
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CN101056754A (zh) | 2007-10-17 |
US7753667B2 (en) | 2010-07-13 |
KR20080067682A (ko) | 2008-07-21 |
JP2006137105A (ja) | 2006-06-01 |
KR20070084331A (ko) | 2007-08-24 |
TW200618993A (en) | 2006-06-16 |
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