CN101017067A - Heat dissipation plate and manufacture method therefor - Google Patents
Heat dissipation plate and manufacture method therefor Download PDFInfo
- Publication number
- CN101017067A CN101017067A CN 200610033585 CN200610033585A CN101017067A CN 101017067 A CN101017067 A CN 101017067A CN 200610033585 CN200610033585 CN 200610033585 CN 200610033585 A CN200610033585 A CN 200610033585A CN 101017067 A CN101017067 A CN 101017067A
- Authority
- CN
- China
- Prior art keywords
- heat
- heat sink
- conducting
- fiber
- matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention provides a heat radiation plate, comprising a base with opposite first and second surfaces, a plurality of heat-conductive fibers dispersed in the base, and heat-conductive layers formed on at least one of the first and second surfaces. The heat-conductive fiber is connected with the heat-conductive layer, the heat radiation plate is formed by heat-conductive channels between the heat-conductive fiber and the heat-conductive layer, via which heat can be quickly and on-time transferred outside to obtain better heat-radiation function. The invention also provides a relative production.
Description
[technical field]
The invention relates to a kind of heat abstractor, especially about a kind of heat sink and preparation method thereof.
[background technology]
In the modern electronic industry, intelligent electronic products such as notebook computer, palmtop computer, mobile phone are constantly weeded out the old and bring forth the new, and various electronic products also develop towards light, thin, short, little direction simultaneously.Above-mentioned electronic product all needs central processing unit and other electronic component working at high speed, yet a large amount of heats that produce when central processing unit and the running of other electronic component can influence its operational paradigm and service life, so, how effectively the heat that central processing unit and other electronic component are produced is taken out of in the external environment condition by electronic product inside, and promptly how central processing unit and other electronic component are lowered the temperature is an important topic always.
Take the heat of central processing unit and the generation of other electronic component one of out of solution route in the external environment condition by electronic product inside, be to use heat sink to make the shell of intelligent electronic products such as above-mentioned mobile computer, palmtop computer, mobile phone, thereby its inner heat that produces can be delivered in the external environment condition by this heat sink with heat conductivility.Wherein, this heat-conducting plate comprises resin matrix and a plurality of heat conducting fiber that are filled in this resin matrix.For improving the heat conductivility of this heat-conducting plate, these a plurality of heat conducting fiber are evenly arranged in a certain direction in this described resin matrix.For example, make a plurality of heat conducting fiber evenly being arranged in the described resin matrix perpendicular to the heat sink surface.
When the heat of described electronic product is delivered to described heat sink, because heat conducting fiber itself has better heat transfer property than resin matrix, so heat transmits fast along heat conducting fiber, again because the strip structure of heat conducting fiber, so heat transmits between the surface at two of heat sink with nearly linearity relatively along heat conducting fiber.At this moment, heat sink to outer surface on, the heat conducting fiber that is evenly distributed in the described resin matrix only relies on its very little end face to contact with external environment condition, dispels the heat the heat that at all this heat conducting fiber other end can't be passed over rapidly, be delivered in the external environment condition timely by this end face to outside naturally.Thereby, influence the heat dissipation of this heat sink.
In addition, in the above-mentioned heat sink, the strip structure of described heat conducting fiber causes its integral body to have heat radiation anisotropy, promptly, radiating effect perpendicular to the heat conducting fiber direction is relatively poor, and the radiating effect that is parallel to the heat conducting fiber direction is better, also can cause this heat sink integral heat sink poor-performing.
In view of this, heat sink that a kind of excellent radiation performance is provided and preparation method thereof is real in necessary.
[summary of the invention]
Below, heat sink of a kind of excellent radiation performance and preparation method thereof will be described with embodiment.
A kind of heat sink, it comprises: a matrix has opposite first and second surface; A plurality of heat conducting fiber are dispersed in this matrix; And being formed at least one lip-deep heat-conducting layer in described first surface and the second surface, described heat conducting fiber is connected with this heat-conducting layer.
And, a kind of preparation method of heat sink, it comprises:
A plurality of heat conducting fiber and a kind of matrix material are provided;
Described a plurality of heat conducting fiber are dispersed in the described matrix material, form a mixture;
Make this mixture moulding and cutting;
On at least one surface of the mixture of this excision forming, form a heat-conducting layer.
Compared with prior art, form the thermal conducting path of heat conducting fiber and heat-conducting layer in the described heat sink, heat can be delivered in the external environment condition rapidly, timely by this thermal conducting path, has good heat dispersion, avoid in the prior art heat conducting fiber only to rely on its very little end face to contact, and heat can't be delivered to rapidly, timely the phenomenon in the external environment condition with external environment condition.In addition, described heat sink can be prepared into large-area heat-dissipating casing, when needing heat radiation when its local environment high temperature, heat can be delivered in the heat-conducting layer rapidly, timely by this thermal conducting path, heat when external environment condition is distributed, along the rapid diffusion of this heat-conducting layer self, thereby enlarges the area of dissipation that directly contacts with external environment condition by heat-conducting layer, heat sink amount of localized heat the most at last is dispersed into rapidly in the external environment condition, can avoid the generation of heat radiation anisotropy phenomenon of the prior art.
[description of drawings]
Fig. 1 is the schematic diagram of the heat sink of first embodiment of the invention.
Fig. 2 is the preparation flow figure of the heat sink of first embodiment of the invention.
Fig. 3 is the schematic diagram of the heat sink of second embodiment of the invention.
Fig. 4 (a) be in the second embodiment of the invention in substrate the schematic diagram of carbon nano tube array grows.
Fig. 4 (b) is grown in suprabasil carbon nano pipe array to be coated on schematic diagram in the matrix in the second embodiment of the invention.
Fig. 4 (c) is that carbon nano pipe array is coated on schematic diagram in the matrix in the second embodiment of the invention.
[specific embodiment]
Below, with reference to accompanying drawing the specific embodiment of the present invention is elaborated.
As shown in Figure 1, the heat sink 1 in the first embodiment of the invention comprises: a matrix 12 has opposite first 15 and second surface 16; A plurality of heat conducting fiber 13 are dispersed in this matrix 12; And the heat-conducting layer 11 that is formed on the second surface 16 of this matrix 12.
Above-mentioned a plurality of heat conducting fiber 13 can be interlaced with one another, to form from first surface 15 to second surface 16 thermal conducting path.In addition, heat sink 1 also can comprise a plurality of heat conduction particles 14, evenly disperses in the described matrix 12, and interconnects with a plurality of heat conducting fiber 13, also can form from first surface 15 to second surface 16 thermal conducting path.
Described matrix 12 is made by resin material, makes as the materials such as rubber compound of polymer resin, other serial plastics, silicones or other flexible resin(a) base made by manufacturers such as GEPLASTICS, Pittsfield, MA.
Described heat conducting fiber 13 can be a kind of in carbon fiber, CNT, stainless steel fibre, copper fiber, silver-colored fiber and their arbitrary composition, is preferably nanofiber.
Described heat conduction particle 14 can be a kind of in metal particles such as powdered graphite, unformed carbon dust and copper, iron, silver, aluminium, nickel or their arbitrary composition.
Described heat-conducting layer 11 covers on the second surface 16 of matrix 12, can be formed by conductive metal such as copper, iron, silver, aluminium, nickel.Its thickness is 0.5～5 micron (μ m).
Please see figures.1.and.2 simultaneously, the preparation method of above-mentioned heat sink 1 comprises the steps.
For improving the heat conductivility of above-mentioned heat-conducting layer 11, in the sputter process, can suitably improve matrix 12 sides bias voltage (as-50～-100V), thereby promote the compactness of heat-conducting layer 11, improve the heat conductive efficiency of heat sink 1 integral body.
In above-mentioned heat sink 1, the interconnecting in matrix 12 by heat conducting fiber 13 and heat conduction particle 14, the thermal conducting path of formation from the first surface 15 of matrix 12 to second surface 16, thus heat can be delivered to second surface 16 by first surface 15 rapidly along this thermal conducting path.When heat was delivered to second surface 16, the direct thermal conducting path that forms that contacts by heat conducting fiber 13, heat conduction particle 14 and heat-conducting layer 11 was delivered to rapidly on the heat-conducting layer 11, by heat-conducting layer 11 heat was dispersed in the external environment condition again.
As shown in Figure 3, the heat sink 2 in the second embodiment of the invention comprises: matrix 22 has relative and parallel first surface 25 and second surface 26; A plurality of heat conducting fiber 23 are dispersed in this matrix 22, and perpendicular to first and second surface 25,26 of this matrix 22; And the heat-conducting layer 21 that is formed on the second surface 26 of this matrix 22.
The material of described matrix 12, described heat conducting fiber 13 and described heat-conducting layer 11 and formation can be with reference to first embodiment.
Referring to Fig. 3 and Fig. 4, adopting CNT with heat conducting fiber 23 is example, and the preparation method of above-mentioned heat sink 2 comprises the steps.
Step 201 shown in Fig. 4 (a), adopts chemical vapour deposition technique, growing oriented carbon nano pipe array 23 ' of arranging in substrate 3.
Step 202 shown in Fig. 4 (b), immerses the substrate 3 of carbon nano tube array grows 23 ' in the container (figure does not show) that molten state matrix 22 is housed, and makes matrix 22 fill up the gap in the carbon nano pipe array 23 ' and it is coated fully.
Step 203 is taken out the substrate 3 be formed with carbon nano pipe array 23 ' and matrix 22, make matrix 22 cooling curings after, remove substrate 3 (shown in Fig. 4 (c)).Then, along with carbon nano pipe array 23 ' in the perpendicular direction of CNT, the matrix 22 that is coated with carbon nano pipe array 23 ' is carried out the cutting of definite shape and size.By this cutting processing, make matrix 22 form parallel and opposite first 25 and second surface 26, simultaneously the both ends of the surface of the CNT in the carbon nano pipe array 23 ' and external environment condition are communicated.Thereby can obtain to be coated with the matrix 22 of carbon nano pipe array 23 '.
Step 204 is used methods such as sputter, physical vapour deposition (PVD) or coating, forms a heat-conducting layer 21 on the second surface 26 of this matrix 22.At this moment, above-mentioned carbon nano pipe array 23 ' end face and heat-conducting layer 21 direct conductings.Can obtain heat sink 2.
Equally, for improving the heat conductivility of above-mentioned heat-conducting layer 21, in the sputter process, can suitably improve matrix 22 sides bias voltage (as-50～-100V), thereby promote the compactness of heat-conducting layer 21, improve the heat conductive efficiency of heat sink 2 integral body.
In above-mentioned heat sink 2, heat conducting fiber 23 forms the thermal conducting path from the first surface 25 of matrix 22 to second surface 26, thereby heat can be delivered to second surface 26 by first surface 25 rapidly along this thermal conducting path.When heat was delivered to second surface 26, the direct thermal conducting path that forms that contacts by heat conducting fiber 23 and heat-conducting layer 21 was delivered to rapidly on the heat-conducting layer 21, by heat-conducting layer 21 heat was dispersed in the external environment condition again.
Heat-conducting layer 11,21 in the various embodiments described above also can be formed on the first surface 15,25 and second surface 16,26 of matrix 12,22 simultaneously, can further improve the heat dispersion of heat sink 1,2 integral body.
Heat-conducting plate provided by the present invention can be used for making the device that notebook computer shell, palmtop computer shell, mobile phone shell, radiating fin, tube body of heat pipe etc. need have certain heat dispersion.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion, and all these changes and distortion all should belong to the protection domain of claim of the present invention according to technical scheme of the present invention and technical conceive.
Claims (12)
1. heat sink, comprise a matrix, have opposite first and second surface, a plurality of heat conducting fiber, be dispersed in this matrix, it is characterized in that described heat sink comprises also and be formed at least one lip-deep heat-conducting layer in described first surface and the second surface that described heat conducting fiber is connected with this heat-conducting layer.
2. heat sink as claimed in claim 1 is characterized in that, described heat conducting fiber forms a plurality of thermal conducting path perpendicular to the first surface and the second surface of described matrix between described first surface and second surface.
3. heat sink as claimed in claim 1 is characterized in that described heat conducting fiber is interlaced with one another, and forms a plurality of thermal conducting path between described first surface and second surface.
4. heat sink as claimed in claim 3 is characterized in that described heat sink also comprises a plurality of heat conduction particles, and this heat conduction particle and heat conducting fiber interconnect, and forms the thermal conducting path from the first surface of described matrix to second surface.
5. heat sink as claimed in claim 1 is characterized in that described basic material is selected from polymer resin, plastics, silicones or rubber compound.
6. heat sink as claimed in claim 1 is characterized in that, described heat conducting fiber is selected from a kind of in carbon fiber, CNT, stainless steel fibre, copper fiber, silver-colored fiber and their arbitrary composition.
7. heat sink as claimed in claim 1 is characterized in that, described heat conduction particle is selected from a kind of in powdered graphite, unformed carbon dust, metal particle and their arbitrary composition.
8. heat sink as claimed in claim 1 is characterized in that, described heat-conducting layer thickness is 0.5～5 micron.
9. the preparation method of a heat sink comprises:
A plurality of heat conducting fiber and a kind of matrix material are provided;
Described a plurality of heat conducting fiber are dispersed in the described matrix material, form a mixture;
Make this mixture moulding and cut;
On at least one surface of the mixture of this moulding, form a heat-conducting layer.
10. the preparation method of heat sink as claimed in claim 9 is characterized in that, the forming method of described mixture is selected from injection molding or extrinsion pressing.
11. the preparation method of heat sink as claimed in claim 9 is characterized in that, the formation method of described heat-conducting layer is selected from sputter, physical vapour deposition (PVD) or coating.
12. the preparation method of heat sink as claimed in claim 11 is characterized in that, described sputtering method forms in the process of heat-conducting layer, the bias voltage of matrix side is set at-50～-100V.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610033585 CN101017067A (en) | 2006-02-11 | 2006-02-11 | Heat dissipation plate and manufacture method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610033585 CN101017067A (en) | 2006-02-11 | 2006-02-11 | Heat dissipation plate and manufacture method therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101017067A true CN101017067A (en) | 2007-08-15 |
Family
ID=38726221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610033585 Pending CN101017067A (en) | 2006-02-11 | 2006-02-11 | Heat dissipation plate and manufacture method therefor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101017067A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102544343A (en) * | 2012-03-02 | 2012-07-04 | 杭州电子科技大学 | Method for improving heat-dissipating performance of LED substrate |
| CN102883584A (en) * | 2012-06-28 | 2013-01-16 | 蔡州 | High-efficiency heat dissipation device |
| CN103842445A (en) * | 2011-10-05 | 2014-06-04 | 独立行政法人产业技术综合研究所 | Carbon nanotube composite material and heat conductor |
| CN104868042A (en) * | 2015-03-26 | 2015-08-26 | 汕头大学 | High-heat-conduction composite ceramic substrate and manufacturing method thereof |
| CN104878357A (en) * | 2015-06-11 | 2015-09-02 | 桂林理工大学 | Method for preparing SiC coating layers on surfaces of carbon fibers by radio-frequency (RF) magnetron sputtering |
| CN105241297A (en) * | 2014-07-04 | 2016-01-13 | 英诺晶片科技股份有限公司 | Heat radiation sheet |
| CN105419724A (en) * | 2015-12-16 | 2016-03-23 | 哈尔滨工业大学 | High-thermal-conductivity organic silicon adhesive doped with multiple carbon materials and preparation method of adhesive |
| CN104144597B (en) * | 2012-12-11 | 2017-01-11 | 天诺光电材料股份有限公司 | Heat-conduction-fiber-enhanced high heat conductivity graphite cooling fin and manufacturing method |
| US9688897B2 (en) | 2011-10-05 | 2017-06-27 | National Institute Of Advanced Industrial Science And Technology | Carbon nanotube composite material and thermal conductor |
| CN110791257A (en) * | 2019-10-08 | 2020-02-14 | 鞍钢股份有限公司 | Preparation method and device of directional heat transfer phase change heat storage material |
| CN113563671A (en) * | 2021-07-23 | 2021-10-29 | 威海市润通橡胶有限公司 | Tire curing bladder and preparation method thereof |
-
2006
- 2006-02-11 CN CN 200610033585 patent/CN101017067A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103842445B (en) * | 2011-10-05 | 2017-05-03 | 独立行政法人产业技术综合研究所 | Carbon nanotube composite material and heat conductor |
| US9688897B2 (en) | 2011-10-05 | 2017-06-27 | National Institute Of Advanced Industrial Science And Technology | Carbon nanotube composite material and thermal conductor |
| CN103842445A (en) * | 2011-10-05 | 2014-06-04 | 独立行政法人产业技术综合研究所 | Carbon nanotube composite material and heat conductor |
| CN102544343A (en) * | 2012-03-02 | 2012-07-04 | 杭州电子科技大学 | Method for improving heat-dissipating performance of LED substrate |
| CN102883584B (en) * | 2012-06-28 | 2014-12-31 | 蔡州 | High-efficiency heat dissipation device |
| CN102883584A (en) * | 2012-06-28 | 2013-01-16 | 蔡州 | High-efficiency heat dissipation device |
| CN104144597B (en) * | 2012-12-11 | 2017-01-11 | 天诺光电材料股份有限公司 | Heat-conduction-fiber-enhanced high heat conductivity graphite cooling fin and manufacturing method |
| CN105241297A (en) * | 2014-07-04 | 2016-01-13 | 英诺晶片科技股份有限公司 | Heat radiation sheet |
| CN104868042A (en) * | 2015-03-26 | 2015-08-26 | 汕头大学 | High-heat-conduction composite ceramic substrate and manufacturing method thereof |
| CN104868042B (en) * | 2015-03-26 | 2019-05-24 | 汕头大学 | A kind of high thermal conductivity composite ceramic substrate |
| CN104878357A (en) * | 2015-06-11 | 2015-09-02 | 桂林理工大学 | Method for preparing SiC coating layers on surfaces of carbon fibers by radio-frequency (RF) magnetron sputtering |
| CN105419724A (en) * | 2015-12-16 | 2016-03-23 | 哈尔滨工业大学 | High-thermal-conductivity organic silicon adhesive doped with multiple carbon materials and preparation method of adhesive |
| CN105419724B (en) * | 2015-12-16 | 2018-07-06 | 哈尔滨工业大学 | Various carbon materials doping high heat conduction organosilicon adhesive and preparation method thereof |
| CN110791257A (en) * | 2019-10-08 | 2020-02-14 | 鞍钢股份有限公司 | Preparation method and device of directional heat transfer phase change heat storage material |
| CN113563671A (en) * | 2021-07-23 | 2021-10-29 | 威海市润通橡胶有限公司 | Tire curing bladder and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101017067A (en) | Heat dissipation plate and manufacture method therefor | |
| CN1837147B (en) | Thermal interface material and its production method | |
| Wang et al. | Ultrahigh conductive copper/large flake size graphene heterostructure thin‐film with remarkable electromagnetic interference shielding effectiveness | |
| CN100358132C (en) | Thermal interface material producing method | |
| US7569425B2 (en) | Method for manufacturing thermal interface material with carbon nanotubes | |
| Chung | Performance of thermal interface materials | |
| US7160620B2 (en) | Thermal interface material and method for manufacturing same | |
| TWI253467B (en) | Thermal interface material and method for making same | |
| US8029900B2 (en) | Thermal interface material and method for manufacturing same | |
| CN103367275B (en) | A kind of interface conducting strip and preparation method thereof, cooling system | |
| CN105848882A (en) | Metal packaging material having good heat resistance, method of manufacturing same, and flexible electronic device packaged in said metal packaging material | |
| US20140102687A1 (en) | Thermal interface material | |
| KR20040089590A (en) | Low cost thermal management device or heat sink manufactured from conductive loaded resin-based materials | |
| CN102977540A (en) | Method for preparing organic polymer matrix composite material and LED (Light-Emitting Diode) radiator | |
| CN105623619A (en) | Flexible heat conduction/heat storage double-function composite material, method for manufacturing same and application of flexible heat conduction/heat storage double-function composite material | |
| KR101796206B1 (en) | thermal dissipation pad | |
| US20050230082A1 (en) | Thermal interface material and method for manufacturing same | |
| CN110494014A (en) | A kind of radiator structure and its preparation method and application for display panel | |
| CN104163016A (en) | High-heat-conductivity high-compression wet-viscous-state heat-conducting gasket and preparation thereof | |
| CN1919961A (en) | Heat interfacial material and method for making the same | |
| CN105778134B (en) | A kind of graphene composite polymer film material and preparation method thereof | |
| CN102098886B (en) | Cabinet and manufacturing method thereof | |
| TWI331132B (en) | Method of fabricating thermal interface material | |
| KR101079664B1 (en) | Post treatment method of carbon nanotube film | |
| CN214164264U (en) | Combined type graphite copper foil diaphragm |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |