CN100578309C - Substrate adherence device and substrate adherence method - Google Patents
Substrate adherence device and substrate adherence method Download PDFInfo
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- CN100578309C CN100578309C CN200710169221A CN200710169221A CN100578309C CN 100578309 C CN100578309 C CN 100578309C CN 200710169221 A CN200710169221 A CN 200710169221A CN 200710169221 A CN200710169221 A CN 200710169221A CN 100578309 C CN100578309 C CN 100578309C
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- Crystallography & Structural Chemistry (AREA)
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- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Manufacturing & Machinery (AREA)
- Engineering & Computer Science (AREA)
- Mathematical Physics (AREA)
- Control Of Presses (AREA)
- Press Drives And Press Lines (AREA)
- Presses And Accessory Devices Thereof (AREA)
Abstract
An apparatus and method for attaching substrates to each other are provided to attach the substrates to each other easily and accurately. An apparatus for attaching two substrates(W1,W2) to each other includes a plurality of load detection units(31,361,36b,36c,36d) and a plurality of pressing units(34a,34b,34c,34d). The load detection units detect loads applied to the two substrates. The pressing units are arranged corresponding to the load detection units and generate pressure for attaching the two substrates to each other. The pressure generated by each pressing units is independently adjusted in response to a variation in the load detected by each load detection unit.
Description
Technical field
The present invention relates to a kind of base plate bonding device and base plate bonding method, in detail, be to be suitable for base plate bonding device and the base plate bonding method when 2 substrates of liquid crystal indicator (Liquid Crystal Dispray:LCD) etc. are made the substrate (plate/パ ネ Le) that is bonding with, used.
In recent years, flat display boards such as LCD, along with maximize, progress aspect (slimming) in light weight, the requirement of cost degradation has further improved.Therefore, require the device of bonding 2 substrates, manufacturing display board can improve yield rate, boost productivity.
Background technology
LCD panel is provided with color filter (CF) substrate of a plurality of TFT (thin film transistor (TFT)) being made the array base palte of matrix (マ ト リ Network ス) shape and being formed with color filter (red, green, orchid) and photomask etc. with extremely narrow and small interval (number μ about m) face-off, and sealing liquid crystal is made between these 2 glass substrates.In order to obtain contrast, and in order to hide (shading) TFT, to prevent to produce light and leak (light リ-Network) electric current and use photomask.With the encapsulant that contains thermosetting resin (bonding agent) adhesion array substrate and CF substrate.
In the manufacturing process of this LCD panel, with the general injection method that drips that adopts of the sealing liquid crystal operation of sealing liquid crystal between the glass substrate of face-off, promptly, on the real estate of liquid crystal drop in the frame of the encapsulant of making the frame shape around the substrate with ormal weight, adhesion array substrate and CF substrate in a vacuum are with encapsulated liquid crystals.
In the past, bonding 2 substrates (CF substrate and array base palte) used pressue device (bonder) to be undertaken bonding by substrate pressurization operation.This bonder possess in process chamber face-off mutually, up and down configuration, keep 2 holding plates of CF substrate and array base palte respectively, flatness by critically keeping two holding plates and up and down between the depth of parallelism, remain under the uniform state at the interval that makes the thickness direction between the substrate simultaneously, make two substrates approaching, carry out bonding thus.For example in patent documentation 1, separated the prior art relevant with such bonder.
Patent documentation 1
Japanese patent gazette spy opens 2002-323694 number
But, the problem that existing bonder as described above exists is, in order to reduce in making process chamber to vacuum because the distortion of the holding plate that produces with the pressure reduction of outside (atmospheric pressure), the position that is subjected to the influence of pressure reduction needs very high rigidity, therefore, the weight of device has increased, or device volume has increased etc.
In recent years, along with maximization, the slimming of substrate, make the flatness of holding plate monomer guarantee to have certain precision in the process segment and be very difficult, be difficult to keep accurately the depth of parallelism of two substrates.Therefore, when bonding large-scale and slim substrate, be easy to generate dislocation when bonding and substrate non-uniform phenomenon at interval especially.
Such substrate dislocation and substrate are inhomogeneous at interval, are light leak and the inhomogeneous reason that shows bad phenomenon that waits of demonstration from light shielding part, are difficult to make stable product, are the main causes that yield rate reduces.
Summary of the invention
The present invention proposes for addressing the above problem, base plate bonding device and base plate bonding method that its purpose is to provide a kind of energy high precision and carries out base plate bonding easily.
In order to achieve the above object, according to of the present invention first and second, nine aspects, the bonding base plate bonding device that remains on 2 substrates on the 1st and the 2nd holding plate that is disposed at the mutual face-off in the process chamber respectively possesses: a plurality of load testing agency of the load of detection effect on above-mentioned 2 substrates; With the corresponding a plurality of pressing mechanisms that be provided with, that make its tonnage that produces bonding above-mentioned 2 substrates of above-mentioned a plurality of load testing agencies, can be according to the load change that detects respectively by above-mentioned a plurality of load testing agency, adjust the tonnage that produces by above-mentioned a plurality of pressing mechanisms respectively.According to this structure, can make the 1st holding plate and the 2nd holding plate, promptly, the depth of parallelism of the 1st substrate and the 2nd substrate is kept evenly, and can carry out bonding accurately.Consequently, can prevent that substrate dislocation and substrate are inhomogeneous at interval, can reduce the demonstration bad phenomenon.
According to a second aspect of the invention, respectively the 1st substrate and the 2nd substrate remained on the 1st holding plate and the 2nd holding plate of the mutual face-off that is disposed in the process chamber, make above-mentioned the 1st holding plate near above-mentioned the 2nd holding plate, the base plate bonding device of bonding above-mentioned the 1st substrate and above-mentioned the 2nd substrate possesses according to the distribution that acts on the load on above-mentioned the 1st holding plate and corrects the bonding the above-mentioned the 1st and a plurality of pressurization straightening mechanisms of the tonnage of the 2nd substrate.According to this structure, can make the 1st holding plate and the 2nd holding plate, promptly, the depth of parallelism of the 1st substrate and the 2nd substrate is kept evenly, and can carry out bonding accurately.Consequently, can prevent that substrate dislocation and substrate are inhomogeneous at interval, can reduce the demonstration bad phenomenon.
According to a third aspect of the invention we, above-mentioned pressurization straightening mechanism possesses load testing agency and pressing mechanism.The load of load testing agency detection effect on above-mentioned the 1st holding plate.And pressing mechanism produces above-mentioned tonnage according to the load change that is detected by above-mentioned load testing agency.
According to a forth aspect of the invention, possesses output according to above-mentioned each load testing agency, calculating acts on the load summation on above-mentioned the 1st holding plate, partly determines the control part of the tonnage that produced by above-mentioned each pressing mechanism according to the minimizing of the load summation of this calculating.
According to a fifth aspect of the invention, above-mentioned control part, calculate the mean value of the minimizing part of above-mentioned load summation, the minimizing part of the load that detects according to this mean value with by above-mentioned each load testing agency poor determined the tonnage that is produced by above-mentioned each pressing mechanism.Therefore, can make load distribution keep carrying out equably bonding.
According to a sixth aspect of the invention, to the tendency of above-mentioned each load testing agency record, correct the tonnage that produces by above-mentioned each pressing mechanism at each load change tendency in advance by the load change of above-mentioned each load testing agency detection.Therefore, can more at a high speed and carry out bonding operation at an easy rate.
According to a seventh aspect of the invention, above-mentioned the 1st holding plate can suspend in midair up or down by a plurality of pillars and be bearing on the support plate, possess relative to above-mentioned process chamber above-mentioned the 1st holding plate and above-mentioned a plurality of pillar are linked into an integrated entity, allow above-mentioned the 1st holding plate to move up and down, limit simultaneously the anti-dislocation mechanism that moves to horizontal direction.Therefore, can prevent the 1st holding plate dislocation when pressurization.
According to the 8th, ten aspects of the present invention, respectively the 1st substrate and the 2nd substrate remained on the 1st holding plate and the 2nd holding plate of the mutual face-off that is disposed in the process chamber, make above-mentioned the 1st holding plate near above-mentioned the 2nd holding plate, the base plate bonding device of bonding above-mentioned the 1st substrate and above-mentioned the 2nd substrate possesses: the load testing agency of the load of detection effect on above-mentioned the 1st holding plate; According to the load distribution that acts on above-mentioned the 1st holding plate, correct a plurality of angle correction mechanism at inclination angle of the relative surface level of above-mentioned the 1st holding plate.According to this structure, can make the 1st holding plate and the 2nd holding plate, promptly, the depth of parallelism of the 1st substrate and the 2nd substrate is kept evenly, and can carry out bonding accurately.Consequently, can prevent that substrate dislocation and substrate are inhomogeneous at interval, can reduce the demonstration bad phenomenon.And, owing to carry out the rectification control of the depth of parallelism of pressurized control and two substrates respectively, so can simplify control.
Description of drawings
Fig. 1 is the front view of the bonder of expression first embodiment.
Fig. 2 is the vertical view of the bonder of Fig. 1.
Fig. 3 is the partial enlarged drawing of the bonder of Fig. 1.
Fig. 4 is the vertical view of expression universal joint.
Fig. 5 is the block scheme of control gear that is used for the bonder of key diagram 1.
Fig. 6 is the side view that is used to illustrate second embodiment.
Fig. 7 is the A-A line side cross sectional view along Fig. 6.
Embodiment
(first embodiment)
Below, according to Fig. 1～Fig. 5 first embodiment that the present invention specialized is described.
Fig. 1 is the front view of brief configuration of the base plate bonding device (hereinafter referred to as bonder) 10 of expression first embodiment, and Fig. 2 is the vertical view of bonder 10, and Fig. 3 is the partial enlarged drawing of bonder 10.2 kind the 1st and the 2nd substrate W1, W2 that these bonder 10 bonding liquid crystal that drip on any one are in advance supplied with make LCD panel.
And, the LCD panel made from this form of implementation is active matrix type LCD panel, the 1st substrate W1 is the color filter substrate (CF substrate) that is formed with color filter or photomask etc., and the 2nd substrate W2 is the array base palte (TFT substrate) that is formed with TFT etc.In this case, for example (adhesive surface one side) coating encapsulant makes it become the frame shape around the 2nd substrate W2, and the liquid crystal of the ormal weight that drips on the real estate in this frame is transported to bonder 10 with two substrates W1, W2.
This bonder 10 possesses base plate 11 and the bracket assembly 12 that is fixed on this base plate 11.And base plate 11 and bracket assembly 12 usefulness have the material of sufficiently high rigidity and make.Have the inner chamber 13 as process chamber in the inboard of bracket assembly 12, inner chamber 13 is cut apart up and down, is made of upper container 13a and lower container 13b.At the peristome of inner chamber 13, promptly in the place that upper container 13a contacts with lower container 13b, as shown in Figure 3, be provided with the round section joint ring 13c that is used to seal between them, keeps the airtight conditions of inner chamber 13.
Lower container 13b is bearing on the bracket assembly 12, and upper container 13a can support with inner chamber switching portion 14 up and downly.Inner chamber switching portion 14 is formed with externally threaded leading screw at one end (being the upper end in Fig. 1), screws formation ball-screw 15 with the internal thread that is installed on the upper container 13a.The other end of this leading screw (being the lower end in Fig. 1) is connected on the speed reduction unit 16, and this leading screw passes through gear case 18 by motor shown in Figure 2 17 driven in rotation.
Therefore, if make the forward and reverse rotation of leading screw by motor 17, its spinning movement is transformed into linearly operating by ball-screw 15, and upper container 13a lower container 13b relatively moves up and down.Therefore, inner chamber 13 is done on-off action.
In inner chamber 13, standing facing each other is provided with as the increased pressure board 19 that adsorbs the 1st holding plate that keeps the 1st substrate W1 (CF substrate) with as the worktable 20 that adsorbs the 2nd holding plate that keeps the 2nd substrate W2 (TFT substrate).Increased pressure board 19 and worktable 20 effects have at least a power that attracts in absorption affinity and the Electrostatic Absorption power, have the mechanism that absorption respectively keeps the 1st substrate W1 and the 2nd substrate W2.
Between this location objective table 21 and lower container 13b, be respectively equipped with as the elastomeric corrugated tube 23 that keeps inner chamber 13 airtight conditions around above-mentioned each pillar 22.Corrugated tube 23 has round section joint ring in the flange portion at two ends, is sealed locating between objective table 21 and the lower container 13b by this round section joint ring.
Increased pressure board 19 can supported by support plate 24 suspentions by above-below direction (Z direction) movably.In detail, a plurality of (is 4 at present embodiment) pillar 25 usefulness nuts 26 are fixed on the support plate 24, and nut 26 revolves (screw thread twist) and is combined on the screw thread that forms in the upper end of pillar 25.And as shown in Figure 3, each pillar 25 is inserted among the inserting hole 27a of the fixed part 27 that is installed on the upper container 13a, is installed in top (outside) of increased pressure board 19.
Fixed part 27 and pillar 25 are by linking into an integrated entity as the anti-universal joint 28 that misplaces mechanism.As shown in Figure 4, universal joint 28 is roughly circle, and side ring 28b and outer ring 28c made in the center of the inserting hole 28a that forms in the central connected relatively.This universal joint 28 be installed in fixed part 27 below, fastening this fixed part 27 and outer ring 28c.In addition, above-mentioned pillar 25 is inserted among each inserting hole 27a, 28a of fixed part 27 and universal joint 28, fastening this pillar 25 and interior side ring 28b.That is, each pillar 25 is separately fixed on increased pressure board 19 and the inner chamber 13 (upper container 13a specifically).
This universal joint 28 can limit each pillar 25 relative inner chamber 13 along continuous straight runs, i.e. moving radially to universal joint 28.On the other hand, allow each pillar 25 relative inner chamber 13 direction, i.e. moving axially to universal joint 28 up and down.Therefore, increased pressure board 19 can move up and down when bonding, on the other hand, can prevent this increased pressure board 19 transversion malpositions.
As shown in Figure 1, between support plate 24 and upper container 13a, be provided with the elastomeric corrugated tube 29 that conduct keeps the airtight conditions of inner chamber 13 around each pillar 25.With above-mentioned same, the flange portion of this corrugated tube 29 at two ends has round section joint ring, by this round section joint ring to sealing between support plate 24 and the upper container 13a.
Again, above-mentioned support plate 24 can move up and down it by a plurality of (is 4 at present embodiment) pressurization straightening mechanism 32a～32d that is arranged on this support plate 24.In detail, upright being provided with respectively and the corresponding guide rod 33 of each pressurization straightening mechanism 32a～32d on upper container 13a, support plate 24 can move up and down along each guide rod 33.Each straightening mechanism 32a～32d that pressurizes is configured on the position that center (i.e. the center of the 1st substrate W1) distance apart from support plate 24 equates respectively, in this case, preferably be configured in supporting support plate 24 each pillar 25 near.
The leading screw 35 that each straightening mechanism 32a～32d that pressurizes possesses motor 34a～34d as the band scrambler of pressing mechanism respectively, drive with each motor 34a～34d and respectively as the load cell 36a～36d of load testing agency.Motor 34a～34d drives its rotation by the gating pulse from motor driver described later, and its driving force is delivered to each ball-screw 35.
Each ball-screw 35 is connected with first linear guides 37, and this first linear guides 37 can move up and down along the guide rod 38 that is installed on each self-corresponding motor 34a～34d.This guide rod 38 is fixed on the support plate 24, and support plate 24 is installed in that be designed to can be along on up and down second linear guides 39 of above-mentioned guide rod 33.
Each load cell 36a～36d is arranged on the upper end of each guide rod 33.Each load cell 36a～36d be against each self-corresponding ball-screw 35 below, the load the when pressure detection of being born according to this ball-screw 35 is bonding.
The pressurization straightening mechanism 32a～32d of Gou Chenging when pros rotate, by bearing the ball-screw 35 that this driving force moves downwards, pushes load cell 36a～36d downwards at CD-ROM drive motor 34a～34d like this, because its counter-force, support plate 24 rises.On the contrary, when CD-ROM drive motor 34a～34d rotates round about,, each ball-screw 35 is moved upward, so support plate 24 descends owing to bearing its driving force.
Fig. 5 is the block scheme of briefing of the control gear on the bonder 10 of expression present embodiment.And, mark same label with the part of Fig. 1 same structure.
At this, close inner chamber 13, when making it be in decompression state (vacuum state), be applied to deadweight on the support plate 24 (general assembly (TW)s of substrate W1, increased pressure board 19, pillar 25, pressurization straightening mechanism 32a～32d etc.) A and with the sectional area of pillar 25 act on pro rata atmospheric pressure on the increased pressure board 19 and inner chamber 13 internal pressures pressure differential B's and (A+B) be the load summation.This load summation (A+B) makes two substrates W1, W2 near carrying out when bonding, and its tonnage becomes counter-force, reduces gradually.Therefore, above-mentioned control part 41 when bonding, will to the tonnage of two substrates W1, W2 as the minimizing part that acts on the load summation on each load cell 31, the 36a～36d.
Though this tonnage is in fact because the amount of the size of display board (substrate W1, W2) and liquid crystal, encapsulant or kind etc. different and different are approximately 100Kg at present embodiment.At this, for example, the pressure differential B that the deadweight A on being applied to support plate 24 is about the pressure in 1000Kg, atmospheric pressure and the inner chamber 13 is approximately under the situation of 1000Kg, and load summation (A+B) is about 2000Kg.In this case, control part 41 is adjusted tonnage, makes the load summation be approximately 1900Kg, that is, the minimizing of load summation partly is 100Kg.
And at present embodiment, load cell 31,36a～36d use respectively can be with the load cell of 1/5 load of the resolution test load summation about about 0.1Kg.That is, as previously discussed, approximately be the occasion of 2000Kg in the load summation, each load cell 31,36a～36d use the load cell that can detect the load of about 400Kg with the resolution of about 0.1Kg.
The minimizing value of control part 41 assumed (specified) load summations makes the tonnage that is applied on two substrates W1, the W2 according to this result of calculation be the signal that certain pressure generates, and outputs to electric air conditioner 42 and motor driver 43a～43d.
42 responses of electricity air conditioner are adjusted the pressure of forced air spring 30 from the signal of this control part 41.In addition, motor driver 43a～43d response is from the signal of control part 41, and output is with the pulse signal of the umber of pulse CD-ROM drive motor 34a～34d of regulation.
At this moment, control part 41 calculates the minimizing part of the load that the load cell 36a～36d by each pressurization straightening mechanism 32a～32d detects and poor (unit interval) of the mean value of the minimizing part of the load summation that detected by load cell 31,36a～36d, generates the drive signal of motor 34a～34d according to this calculated value.
For example, the minimizing part occasion bigger than above-mentioned mean value of the load that detects at the load cell 36a by pressurization straightening mechanism 32a shows that the tonnage that is applied by this pressurization straightening mechanism 32a is bigger than other last tonnage of straightening mechanism 32b～32d that pressurizes.In other words, show that the inclination angle appears in the plane of increased pressure board 19, destroyed the depth of parallelism of increased pressure board 19 and worktable 20 (the 1st substrate W1 and the 2nd substrate W2).In this occasion, control part 41 is corrected, drive the motor 34a of pressurization straightening mechanism 32a to the direction that improves support plate 24, or stop to drive this motor 34a, make driving by this motor 34a be applied to load (tonnage) on the increased pressure board 19 and reduce to and be above-mentioned mean value.
For example, at present embodiment, the minimizing part of the load that detects at the load cell 36a～36d by each pressurization straightening mechanism 32a～32d stops to drive each self-corresponding motor 34a～34d than the occasion more than the big 0.1Kg of above-mentioned mean value, suppresses the increase of tonnage thus.And, after this, partly become 0.1Kg with interior occasion in the minimizing of load, drive the motor that has stopped once more, two substrates W1, W2 are pressurizeed.
So, because according to respectively motor 34a～34d being carried out drive controlling from the load testing result of each self-corresponding load cell 36a～36d, so, when in adhesion process owing to the occasion of the reason load distribution occurs deviation such as an end is stressed, can correct the inclination angle on increased pressure board plane in view of the above on one side, on one side pressure boost to final tonnage (about 100Kg).Consequently, it is bonding to make substrate W1, W2 keep the accurate depth of parallelism to carry out.
And, at present embodiment, though according to the load testing result that detects by each load cell 31,36a～36d, suitably correcting (adjustment) tonnage on one side pressurizes on one side, but, also can be to each straightening mechanism 32a～32d that pressurizes, the load change tendency planar of record increased pressure board 19 is corrected tonnage at this tendency in advance.
In detail, as previously discussed, suitably tonnage is corrected, carried out for example No. 10 substrate pressurization operations.And, to each pressurization straightening mechanism 32a～32d, precompute 10 times the average pulse number of motor 34a～34d.According to this result of calculation, the umber of pulse that keeps respectively pressurizeing on straightening mechanism 32a～32d is poor, the tonnage that is produced at increased pressure board 19 reaches final tonnage (being approximately 100Kg at present embodiment) before, the decline rate that makes the increased pressure board of being controlled by forced air spring 30 and motor 34a～34d 19 is a certain speed separately, pressurizes.This method can be omitted the control that is used to adjust tonnage.Consequently owing to can simplify bonding operation, and can carry out at high speed bonding, so help to shorten the manufacturing time of display board.
Below, the effect of the bonder 10 that constitutes is as described above described.
This is handled, and makes the adhesive surface retention properties that can not break a seal after bonding stable.The the 1st and the 2nd substrate W1, W2 generate films such as oxide film on these surfaces, or adhere to airborne suspension, and the state on surface changes.Because the variation of this state, each substrate is inequality, so, can not make stable display board.Therefore, this processing can suppress the generation of film or adhere to impurity, in addition, by the impurity that processing is adhered to, can suppress the substrate surface state and change, and is convenient to make the steady quality of display board.
Then, bonder 10 utilizes the datum line mark, (the 1st substrate W1 is contacted) with encapsulant on the 2nd substrate W2 non-contactly with optical facilities (CCD shooting first-class) and makes two substrates W1, W2 aligned position.
Then, motor 34a～34d on the pressure of 10 pairs of forced air springs 30 of bonder and each the pressurization straightening mechanism 32a～32d carries out drive controlling,, make support plate 24, just increased pressure board 19 descended with the certain speed of for example 5 μ m/s with before the 2nd substrate W2 (specifically being coated in the encapsulant above the substrate W2) contacts at the 1st substrate W1.At this moment, the load summation that is detected by each load cell 31,36a～36d is approximately 2000Kg.
If the 1st substrate W1 contacts with the 2nd substrate W2, increased pressure board 19 begins to produce tonnage, and then above-mentioned load summation begins to reduce gradually, bonder 10 is before this load summation changes to about 1900Kg from about 2000Kg, that is, final tonnage changes to before about 100Kg, pressurizes always.At this moment, the load that bonder 10 detects for the load cell 36a～36d that makes by each pressurization straightening mechanism 32a～32d reduces the mean value of minimizing part of the above-mentioned relatively load summation of part in 0.1Kg, motor 34a～34d is carried out drive controlling, pressurize while correct tonnage (being the inclination angle on increased pressure board 19 planes).And the distance (dropping distance) before stopping to move to this increased pressure board 19 after beginning to produce tonnage on increased pressure board 19 approximately is about 100 μ m.
By the way, carrying out this when bonding,, because the counter-force of this tonnage, be used on the increased pressure board 19 to horizontal (horizontal direction) mobile masterpiece along with the increase gradually of tonnage.But, should will suspend the universal joint 28 that the upper container 13a of the pillar 25 that supports increased pressure board 19 and inner chamber 13 links into an integrated entity towards reacting force of horizontal direction and be absorbed.Therefore, can prevent the increase along with tonnage, increased pressure board 19 produces dislocation.
Pressurize after becoming final tonnage at bonder 10, open inner chamber 13 inside, it is communicated with atmosphere.Therefore, two substrates W1, W2 were compressed equably by the pressure differential between atmospheric pressure and two substrates W1, the W2 before becoming the substrate interval of the component thickness of regulation (element gap).
As previously discussed, have following effect according to present embodiment:
(1) bonder 10 possesses pressurization straightening mechanism 32a～32d, this presses straightening mechanism 32a～32d when bonding two substrates W1, W2, detect the load change of increased pressure board 19, on one side adjust tonnage, make the load distribution of increased pressure board 19 even, Yi Bian pressurize according to this load change.According to this structure, can make increased pressure board 19 and worktable 20, just make the depth of parallelism of two substrates W1, W2 keep evenly carrying out bonding accurately according to correcting the inclination angle on the plane of increased pressure board 19 with each pressurization straightening mechanism 32a～load change that 32d detects.Consequently, can prevent that substrate dislocation or substrate are inhomogeneous at interval, can reduce the demonstration bad phenomenon.
(2) at present embodiment, according to the load distribution deviation whether in allowed limits (for example whether more than 0.1Kg) adjust tonnage.According to this method, when pressurization, can extremely easily adjust the depth of parallelism of two substrates W1, W2.
(3) because according to the performance of the pressurization of substrate repeatedly operation, each pressurization straightening mechanism 32a～32d is write down the tendency of the load change of increased pressure board 19, at this tendency the motor 34a～34d on pressurization straightening mechanism 32a～32d is carried out drive controlling in advance, adjust tonnage, so, can carry out bonding operation more at high speed.Consequently, be convenient to shorten the display board manufacturing time.In addition, because this method has been omitted the control of the complexity that is used to adjust tonnage, so, can carry out bonding operation more simply.
(4) possess the pillar 25 that is fixed on the support plate 24, will suspends supporting increased pressure board 19 in midair and be connected universal joint 28 on the inner chamber 13 integratedly.Therefore, can prevent increase, move to horizontal direction because of its reacting force makes pillar 25 along with tonnage.That is, can prevent that increased pressure board 19 from moving (dislocation) relative to worktable 20 along continuous straight runs.In addition, use the structure of this universal joint 28, be in decompression (vacuum) state following time, even owing to produce the occasion of distortion with the pressure reduction inner chamber 13 of atmospheric pressure at inner chamber 13, also can allow increased pressure board 19 only above-below direction move, can prevent the dislocation on the horizontal direction reliably.
(5) at present embodiment, owing to can make the load distribution of increased pressure board 19 even, accurately keep the depth of parallelism of two substrates W1, W2 to pressurize simultaneously, so, when bonding, can make the load that is added on the encapsulant roughly even.This means and to carry out bonding with suitable tonnage.Therefore, can prevent the load distribution inequality that causes owing to reasons such as end in contact and then increase tonnage that when bonding, can prevent has shearing force because encapsulant and liquid crystal act between upper and lower base plate W1, W2, produce bonding dislocation.
(6) at present embodiment, owing to the inclination angle of correcting the plane of increased pressure board 19 according to the testing result of load change, so, can make the depth of parallelism of two substrates W1, W2 keep evenly carrying out bonding at an easy rate.Therefore, can suppress to be in and to be subjected to the weight that the position with the influence of outside pressure reduction causes under the decompression state and to increase and the volume increase owing to be formed in inner chamber 13 with high rigid parts.
(second embodiment)
Below, according to Fig. 6 and Fig. 7 second embodiment that the present invention has been specialized is described.
And, at present embodiment, to marking same label with the part of spline structure, and omit its explanation with above-mentioned first embodiment.
Fig. 6 is the side view of brief configuration of the base plate bonding device (hereinafter referred to as bonder) 50 of expression second embodiment, and Fig. 7 is the A-A line side cross sectional view along bonder shown in Figure 6 50.Same with first embodiment, bonder 50 the bonding the 1st and the 2nd substrate W1, W2 make LCD panel.
As shown in Figure 6, bonder 50 possesses inner chamber 51, is provided with the increased pressure board 52 that absorption keeps the 1st substrate W1 in the upper container 51a of this inner chamber 51.And, in Fig. 6, omitted the lower container of inner chamber 51 and the worktable of absorption maintenance the 2nd substrate W2 etc.
Increased pressure board 52 is connected on the universal joint 53, and this universal joint 53 is bearing on the support plate 55 by pillar 54 suspentions.The 2nd support 53b formation that universal joint 53 is connected with inner peripheral surface with the outer peripheral face of increased pressure board 52 and the 1st support 53a by the 1st support 53a of top (outside one side) that cover increased pressure board 52 and outer peripheral face.
On increased pressure board 52 and between the inner face of the 1st support 53a of covering increased pressure board 52, dispose a plurality of (is 4 at present embodiment) load cell 56a～56d, each load cell 56a～56d is according to the pressure of the 1st support 53a that bears, detects the load when bonding.
As shown in Figure 7, the 1st support 53a and the 2nd support 53b are being connected with joint 57a～57d in the central authorities on each limit (4 limit) of inner peripheral surface and outer peripheral face adjacency separately.And, on 2 limits arbitrarily of the face-off that connects the 1st support 53a and the 2nd support 53b 2 limits of the Width of the 1st and the 2nd support 53a, 53b (in the drawings along), be provided with the 58a of angle correction mechanism, 58b.
The 58a of angle correction mechanism, 58b possess motor 59a, 59b and above-mentioned joint 57a, 57b respectively, make it adjust the level angle (inclination angle of surface level relatively) of the length direction of the 2nd support 53b according to the driving of motor 59a, 59b.
The 2nd support 53b and increased pressure board 52 are being connected with joint 60a～60d in the central authorities on each limit (4 limit) of inner peripheral surface and outer peripheral face adjacency separately.And, on 2 limits arbitrarily of the face-off that connects the 2nd support 53b and increased pressure board 52 2 limits of the length direction of the 2nd support 53b and increased pressure board 52 (in the drawings along), be provided with the 58c of angle correction mechanism, 58d.
The 58c of angle correction mechanism, 58d possess motor 59c, 59d and above-mentioned joint 60c, 60d respectively, make it adjust the level angle of the Width of increased pressure board 52 according to the driving of motor 59c, 59d.
The bonder 50 of Gou Chenging like this, when on increased pressure board 52, producing tonnage, the load change that is detected by each load cell 56a～56d is output to the control part (PLC) that figure does not show, according to the signal from this control part, motor 59a～59d that drive controlling is corresponding with each load cell 56a～56d respectively.
For example, when the minimizing of the load that is detected by load cell 56a is partly big than the minimizing part of the load on other load cell 56b～56d (when the mean value of the minimizing part of unit load summation is big), drive the motor 59a of the angle correction 58a of mechanism along the direction that improves increased pressure board 52.Therefore, same with first embodiment, can correct the inclination angle of increased pressure board 52 according to the load testing result of each load cell 56a～56d, make the load distribution of this increased pressure board 52 even.
According to above-described present embodiment, on the basis of the effect that first embodiment has, also have following effect:
(1),, possesses the independently angle correction 58a～58d of mechanism of the depth of parallelism of adjusting this increased pressure board 52 for the mechanism that makes increased pressure board 52 generation tonnages at present embodiment.According to this structure, owing to can make increased pressure board 52 produce the control of tonnage and the control of the 58a～58d of angle correction mechanism respectively, so, can simplify control.
And the various embodiments described above also can be implemented with following form:
At first embodiment, though the load that detects the 1st substrate W1 periphery with 4 load cell 36a～36d also is not limited to 4.That is,, also can be provided with more than 2 or 3 or 5 according to size of the 1st and the 2nd substrate W1, W2 etc.And second embodiment too.
At first embodiment, also can be according to the difference of the display board of making, omit near the load cell 31 of the load the central authorities of detecting increased pressure board 19 (the 1st substrate W1) and as the forced air spring 30 of pressing mechanism.
The configuration of load cell 36a～36d in first embodiment is not limited to position shown in Figure 2.The configuration of each load cell 36a～36d, can do suitable change with the size of the 2nd substrate W1, W2 different according to the 1st, be the position that center (i.e. the center of the 1st substrate W1) distance apart from support plate 24 equates respectively, so long as can detect the 1st substrate W1 periphery load the position just.At this moment, preferably near pillar 25, can detect near being configured to of load 4 bights of the 1st substrate W1.And, even, equally also be not limited to position shown in Figure 7 for the configuration of the load cell 56a～56d among second embodiment.
The feature that gathers the various embodiments described above is as follows:
(note 1) a kind of bonding base plate bonding device that remains on 2 substrates on the 1st and the 2nd holding plate that is disposed at the mutual face-off in the process chamber respectively is characterized in that: possess:
The a plurality of load testing agency of the load of detection effect on above-mentioned 2 substrates;
With the corresponding a plurality of pressing mechanisms that be provided with, that make its tonnage that produces bonding above-mentioned 2 substrates of above-mentioned a plurality of load testing agencies,
Can adjust the tonnage that produces by above-mentioned a plurality of pressing mechanisms respectively according to the load change that detects respectively by above-mentioned a plurality of load testing agency.
(note 2) a kind of to remain on the 1st substrate and the 2nd substrate on the 1st holding plate and the 2nd holding plate of the mutual face-off that is disposed in the process chamber respectively, make above-mentioned the 1st holding plate near above-mentioned the 2nd holding plate, the base plate bonding device of bonding above-mentioned the 1st substrate and above-mentioned the 2nd substrate is characterized in that:
Possess a plurality of pressurization straightening mechanisms according to the tonnage of the distribution that acts on the load on above-mentioned the 1st holding plate, rectification the bonding the above-mentioned the 1st and the 2nd substrate.
The feature of the base plate bonding device that (note 3) note 2 is put down in writing is:
Above-mentioned pressurization straightening mechanism possesses:
The load testing agency of the load of detection effect on above-mentioned the 1st holding plate;
Load change according to being detected by above-mentioned load testing agency makes it produce the pressing mechanism of above-mentioned tonnage.
The base plate bonding device that (note 4) note 3 is put down in writing, it is characterized in that: possess control part, this control part is according to the output of above-mentioned each load testing agency, calculating acts on the load summation on above-mentioned the 1st holding plate, partly determines the tonnage that is produced by above-mentioned each pressing mechanism according to the minimizing of the load summation of this calculating.
(note 5) base plate bonding device that note 4 is put down in writing is characterized in that:
Above-mentioned control part,
Calculate the mean value of the minimizing part of above-mentioned load summation, the minimizing part of the load that detects according to this mean value with by above-mentioned each load testing agency poor determined the tonnage that is produced by above-mentioned each pressing mechanism.
(note 6) base plate bonding device that note 5 is put down in writing is characterized in that:
Above-mentioned control part,
When the minimizing part of the load that is detected by above-mentioned load testing agency was bigger than above-mentioned mean value, the above-mentioned pressing mechanism corresponding with this load testing agency stopped to provide tonnage.
(note 7) base plate bonding device that note 5 is put down in writing is characterized in that:
Above-mentioned control part,
When the minimizing part of the load that is detected by above-mentioned load testing agency was bigger than above-mentioned mean value, the above-mentioned pressing mechanism corresponding with this load testing agency reduced tonnage.
Any base plate bonding device of being put down in writing of (note 8) note 3 to 7, it is characterized in that:, correct the tonnage that produces by above-mentioned each pressing mechanism at each load change tendency in advance the tendency of above-mentioned each load testing agency record by the load change of above-mentioned each load testing agency detection.
Any base plate bonding device of being put down in writing of (note 9) note 3 to 8 is characterized in that:
Above-mentioned each load testing agency is configured on the position of center for the difference equidistance of above-mentioned the 1st substrate, detects near the load of periphery of above-mentioned the 1st substrate,
Above-mentioned each pressing mechanism is configured on corresponding with above-mentioned each the load testing agency respectively position.
(note 10) base plate bonding device that note 9 is put down in writing is characterized in that: near the load in 4 bights of above-mentioned the 1st substrate detects in above-mentioned each load testing agency.
Any base plate bonding device of being put down in writing of (note 11) note 2 to 10 is characterized in that: also be provided with detection effect in the load testing agency of the load of above-mentioned the 1st holding plate with produce the pressing mechanism of above-mentioned tonnage according to the load change that is detected by this load testing agency on the center of above-mentioned the 1st holding plate.
Any base plate bonding device of being put down in writing of (note 12) note 1 to 11 is characterized in that:
Above-mentioned the 1st holding plate can suspend in midair up or down by a plurality of pillars and be bearing on the support plate,
Possess relative to above-mentioned process chamber above-mentioned the 1st holding plate and above-mentioned a plurality of pillar are linked into an integrated entity, allow above-mentioned the 1st holding plate to move up and down, limit simultaneously the anti-dislocation mechanism that moves to horizontal direction.
(note 13) a kind of base plate bonding device remains on the 1st substrate and the 2nd substrate on the 1st holding plate and the 2nd holding plate of the mutual face-off that is disposed in the process chamber respectively, makes above-mentioned the 1st holding plate near above-mentioned the 2nd holding plate, bonding above-mentioned the 1st substrate and the 2nd substrate
It is characterized in that: possess:
The load testing agency of the load of detection effect on above-mentioned the 1st holding plate;
According to the load distribution that acts on above-mentioned the 1st holding plate, correct a plurality of angle correction mechanism at inclination angle of the relative surface level of above-mentioned the 1st holding plate.
(note 14) a kind of bonding base plate bonding method that remains on 2 substrates on the 1st and the 2nd holding plate that is disposed at the mutual face-off in the process chamber respectively is characterized in that:
In the load of many places detection effect on above-mentioned 2 substrates, correct the tonnage of bonding above-mentioned 2 substrates according to the load change situation of this detection.
(note 15) a kind of bonding base plate bonding method that remains on 2 substrates on the 1st and the 2nd holding plate that is disposed at the mutual face-off in the process chamber respectively is characterized in that:
In the load of many places detection effect on above-mentioned 2 substrates, according to the load change situation of this detection correct the above-mentioned the 1st with the 2nd holding plate in the inclination angle of relative surface level of at least one holding plate.
Such as described in detail above, can provide according to the present invention a kind of can high precision and carry out the base plate bonding device and the base plate bonding method of base plate bonding at an easy rate.
Claims (3)
1. bonding base plate bonding method that remains on 2 substrates on the 1st and the 2nd holding plate of mutual face-off that is disposed in the process chamber that is in decompression state respectively is characterized in that:
At a plurality of load cells that are provided with the peripheral corresponding part of the 1st holding plate, the load of detection effect on above-mentioned the 1st holding plate,
A plurality of pressing mechanisms of corresponding setting with above-mentioned a plurality of load cells produce the tonnage of bonding above-mentioned 2 substrates,
According to what produce when bonding, the minimizing part of the load summation that acts on above-mentioned the 1st holding plate that is detected by above-mentioned a plurality of load cells is calculated the tonnage of bonding above-mentioned 2 substrates,
According to the load change that detects, adjust the tonnage that produces by above-mentioned a plurality of pressing mechanisms respectively.
2. base plate bonding method according to claim 1 is characterized in that:
Above-mentioned minimizing part is produced by the counter-force that produces when bonding above-mentioned 2 substrates.
3. base plate bonding method according to claim 1 and 2 is characterized in that:
Above-mentioned load summation be applied to the interior pressure of deadweight on the support plate that makes above-mentioned the 1st holding plate suspention supporting and atmospheric pressure and above-mentioned process chamber pressure differential and.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003064630A JP4245138B2 (en) | 2003-03-11 | 2003-03-11 | Substrate laminating apparatus and substrate laminating method |
| JP064630/2003 | 2003-03-11 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100037727A Division CN100533232C (en) | 2003-03-11 | 2004-01-30 | Substrate binding device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101149507A CN101149507A (en) | 2008-03-26 |
| CN100578309C true CN100578309C (en) | 2010-01-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710169221A Expired - Fee Related CN100578309C (en) | 2003-03-11 | 2004-01-30 | Substrate adherence device and substrate adherence method |
| CNB2004100037727A Expired - Fee Related CN100533232C (en) | 2003-03-11 | 2004-01-30 | Substrate binding device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100037727A Expired - Fee Related CN100533232C (en) | 2003-03-11 | 2004-01-30 | Substrate binding device |
Country Status (4)
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| JP (1) | JP4245138B2 (en) |
| KR (1) | KR100897664B1 (en) |
| CN (2) | CN100578309C (en) |
| TW (1) | TWI287158B (en) |
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| JP5111865B2 (en) * | 2007-01-12 | 2013-01-09 | 株式会社東芝 | Semiconductor device manufacturing method and semiconductor device manufacturing apparatus |
| JP5023627B2 (en) * | 2006-09-12 | 2012-09-12 | 株式会社デンソー | Press machine |
| WO2009084536A1 (en) * | 2007-12-28 | 2009-07-09 | Nikon Corporation | Semiconductor substrate bonding apparatus and semiconductor substrate bonding method |
| JP4978505B2 (en) * | 2008-02-19 | 2012-07-18 | 株式会社ニコン | Joining apparatus and manufacturing method |
| JP4209457B1 (en) * | 2008-02-29 | 2009-01-14 | 三菱重工業株式会社 | Room temperature bonding equipment |
| JP5458520B2 (en) * | 2008-07-16 | 2014-04-02 | 株式会社ニコン | Substrate bonding equipment |
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| JP5434471B2 (en) * | 2009-10-21 | 2014-03-05 | 株式会社ニコン | Pressurizing apparatus, substrate bonding apparatus, pressing method, and substrate bonding method |
| JP5670208B2 (en) * | 2011-01-13 | 2015-02-18 | 株式会社ディスコ | Resin coating device |
| CN102654668B (en) * | 2011-08-01 | 2014-11-19 | 北京京东方光电科技有限公司 | Vacuum box aligning equipment and box aligning system |
| KR101368819B1 (en) * | 2011-12-20 | 2014-03-06 | 삼성디스플레이 주식회사 | Device for transferring supporting substrate |
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- 2003-03-11 JP JP2003064630A patent/JP4245138B2/en not_active Expired - Fee Related
- 2003-12-23 TW TW092136551A patent/TWI287158B/en not_active IP Right Cessation
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2004
- 2004-01-29 KR KR1020040005557A patent/KR100897664B1/en not_active IP Right Cessation
- 2004-01-30 CN CN200710169221A patent/CN100578309C/en not_active Expired - Fee Related
- 2004-01-30 CN CNB2004100037727A patent/CN100533232C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
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| JP4245138B2 (en) | 2009-03-25 |
| CN100533232C (en) | 2009-08-26 |
| KR100897664B1 (en) | 2009-05-14 |
| CN101149507A (en) | 2008-03-26 |
| TW200417796A (en) | 2004-09-16 |
| CN1530714A (en) | 2004-09-22 |
| TWI287158B (en) | 2007-09-21 |
| KR20040080948A (en) | 2004-09-20 |
| JP2004268113A (en) | 2004-09-30 |
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