CN100565812C - 在金属和多晶硅化学机械研磨中减少大图案凹陷的方法 - Google Patents
在金属和多晶硅化学机械研磨中减少大图案凹陷的方法 Download PDFInfo
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- CN100565812C CN100565812C CNB2006100273714A CN200610027371A CN100565812C CN 100565812 C CN100565812 C CN 100565812C CN B2006100273714 A CNB2006100273714 A CN B2006100273714A CN 200610027371 A CN200610027371 A CN 200610027371A CN 100565812 C CN100565812 C CN 100565812C
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CNB2006100273714A CN100565812C (zh) | 2006-06-07 | 2006-06-07 | 在金属和多晶硅化学机械研磨中减少大图案凹陷的方法 |
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CNB2006100273714A CN100565812C (zh) | 2006-06-07 | 2006-06-07 | 在金属和多晶硅化学机械研磨中减少大图案凹陷的方法 |
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CN101086965A CN101086965A (zh) | 2007-12-12 |
CN100565812C true CN100565812C (zh) | 2009-12-02 |
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CNB2006100273714A Expired - Fee Related CN100565812C (zh) | 2006-06-07 | 2006-06-07 | 在金属和多晶硅化学机械研磨中减少大图案凹陷的方法 |
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Families Citing this family (3)
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CN102768944A (zh) * | 2012-07-03 | 2012-11-07 | 上海华力微电子有限公司 | 一种修补去层次样品的方法 |
CN105984833B (zh) * | 2015-02-04 | 2017-12-05 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制作方法 |
CN112198416A (zh) * | 2020-09-28 | 2021-01-08 | 上海华力集成电路制造有限公司 | 一种提高芯片平整度的去层方法 |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111201 |
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Effective date of registration: 20111201 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation Effective date of registration: 20111201 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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Granted publication date: 20091202 Termination date: 20190607 |
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CF01 | Termination of patent right due to non-payment of annual fee |