CN100562238C

CN100562238C - Heat abstractor

Info

Publication number: CN100562238C
Application number: CNB2006100626063A
Authority: CN
Inventors: 龙俊; 李皓; 李涛
Original assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Current assignee: Hong Jun Precision Industry Co ltd; Fuzhun Precision Industry Shenzhen Co Ltd
Priority date: 2006-09-15
Filing date: 2006-09-15
Publication date: 2009-11-18
Anticipated expiration: 2026-09-15
Also published as: CN101146424A

Abstract

A kind of heat abstractor, comprise a radiator and a cover body, this cover body encloses this radiator in it and forms passage by radiator, this passage comprises an air inlet and air outlet, one fan is installed on the air inlet place of cover body, and forms of linking up above-mentioned passage and cover body outside are installed on cover body in addition, described forms comprise a framework and the some guide vanes that are connected with this framework, this heat abstractor can be taken into account the radiating requirements of electronic device around central processing unit and the central processing unit pointedly, and obtains preferable radiating effect simultaneously.

Description

Heat abstractor

Technical field

The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor that is used on the electronic component especially.

Background technology

Along with developing rapidly of electronic industry, increase substantially as the arithmetic speed of electronic component in the computer, the heat of its generation also increases severely thereupon, and how the heat with electronic component distributes, and to guarantee its normal operation, is the essential problem that solves of dealer always.As everyone knows, the central processing unit that is installed on the motherboard is the core of computer system, and when computer moved, central processing unit produced heat.Too much heat can cause central processing unit normally to move.For effectively distributing the heat that central processing unit produces in running, on circuit board, install a heat abstractor that contacts with central processing unit additional usually so that the heat of its generation is distributed.

Be provided with devices such as some transistors, electric capacity around the central processing unit on the computer motherboard.When computer moved, these devices also can produce a large amount of heats, and these heat transferred can cause motherboard to heat up, and then influence systematic function to motherboard.

One fan is installed on heat abstractor in the prior art usually, the airflow passes radiator that fan produces, thus improve radiating efficiency.For example U.S. Patent application the 6th, disclosed a kind of heat abstractor 304,445 B1 numbers, comprised that a radiator, is installed on the radiator fan and a cover body of radiator one side, this radiator is made up of some radiating fins, forms some air ducts towards fan between the described radiating fin.The forced draft that fan provides is blown over described air duct, and radiator is taken away from the heat that central processing unit absorbs, and reaches the effect of cooling central processing unit.

Because cover body encloses radiator in it, the air-flow that fan produces be subjected to the gathering of cover body and take into account less than around the heat radiation of electronic component.If cover body is removed the air-flow of fan generation is blowed everywhere, then can reduce the heat dispersion of radiator, also can disperse owing to air-flow certainly, the radiating effect of electronic device is all not good around the central processing unit.

Therefore, need a kind of new heat abstractor of design, the heat that this heat abstractor not only can produce central processing unit well distributes, and also can dispel the heat to the electronic component around it targetedly.

Summary of the invention

The present invention aims to provide a kind of heat abstractor that can dispel the heat to a plurality of heat-generating electronic elements simultaneously.

A kind of heat abstractor, comprise a radiator and a cover body, this cover body encloses this radiator in it and forms passage by radiator, this passage comprises an air inlet and air outlet, one fan is installed on the air inlet place of cover body, and forms of linking up above-mentioned passage and cover body outside are installed on cover body in addition, described forms comprise a framework and the some guide vanes that are connected with this framework.

Compared with prior art, this heat abstractor can be taken into account the radiating requirements of electronic device around central processing unit and the central processing unit pointedly, and obtains preferable radiating effect simultaneously.

In addition, this heat abstractor is installed an active window body, and window structure can be selected the different selection scheme of opening or closing according to different demands.

With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.

Description of drawings

Fig. 1 is the three-dimensional exploded view of first embodiment of heat abstractor of the present invention.

Fig. 2 is the three-dimensional exploded view of cover body among Fig. 1.

Fig. 3 be among Fig. 2 after the cover body reversing view.

Fig. 4 is the constitutional diagram of heat abstractor among Fig. 1.

Fig. 5 is the view of another angle of heat abstractor among Fig. 4.

Embodiment

See also Fig. 1, Fig. 1 is first embodiment of heat abstractor of the present invention.This heat abstractor is installed on the circuit board (figure do not show), comprises that cover body 30, that a radiator 10, is covered with this radiator 10 can be installed on the fan 20 that forms 31 and on this cover body 30 are placed in these radiator 10 1 sides.

Described radiator 10 comprise one with circuit board on electronic component (figure do not show) pedestal 12 of fitting and place radiating fin group 14 on this pedestal 12, this radiating fin group 14 and pedestal 12 are by welding or glued joint in one.The roughly rectangular tabular setting of this pedestal 12, the relative both sides of the edge of this pedestal 12 level respectively outwards protrude out two fixed parts 120, and each fixed part 120 two ends is respectively equipped with a through hole 122, for cover body 30 lockings.Described radiating fin group 14 is made up of some radiating fins and is formed some air ducts, passes through for the forced draft that fan 20 provides.The stepped setting of these radiating fin group 14 1 sides prevents that on the one hand radiating fin group 14 and forms 31 from interfering, on the other hand in conjunction with the structure of cover body 30 to guide a part of air flow direction forms 31.

Please consult Fig. 2 and Fig. 3 in conjunction with Fig. 1, described cover body 30 roughly is a housing shape, in order to radiating fin group 14 is covered with in it, comprise altogether a top board that roughly is rectangle 32, respectively with top board 32 vertical two

baffle plates

33,34 that are connected and place top board 32 both sides.These top board 32 front-end edges extend a square panel 35 downward vertically, and these panel 35 both sides are connected with

baffle plate

33,34 respectively.Described panel 35 is provided with a roughly rounded air inlet 350.Be respectively equipped with a screw 3520 on four corners 352 of this panel 35.Be stained with one around on this panel 35 and have certain thickness square packing ring 37, this packing ring 37 is made up of elastomeric material, as rubber, in order to connect the side plate of this heat abstractor and cabinet.Ora terminalis is provided with a ribs 304 under the other side of described

baffle plate

33,34 relative panels 35, and this ribs 304 surrounds an air outlet 302 with the end edge of top board 32, baffle plate 33,34.Described air inlet 350 is beneficial to air-flow with air outlet 302 formation one passage by radiator 10 and flows through at cover body 30.

The lower limb of described

baffle plate

33,34 forms two supports 38 respectively, and this each support 38 comprises a stiffener 381 from the straight outward extending base plate 382 of

baffle plate

33,34 lower end marginal lappets and connection base plate 382 outward flanges and parallel baffle 33,34.Form two fixed legs 36 on this each support 38, for screw 50 wear so that with the circuit board locking, thereby the entire heat dissipation device is fixed on the circuit board.The base plate 382 of this each support 38 is provided with two screws 3820, and this screw 3820 is arranged between two fixed legs 36, and is corresponding with through hole 122.Described baffle plate 34 is provided with a rectangular aperture 340, and an edge of this opening 340 is provided with the recess 342 of open communication 340.

Described forms 31 are blind shaped, comprise a framework 310 and the some guide vanes that are connected with this framework 310.This framework 310 is that its profile and opening 340 are roughly the same by the mounting panel 314 of two levels and the parallelogram framework that surrounds of connection plate 314 2 opposite ends and two connecting plates 313,311 that are parallel to each other respectively.This connecting plate 311 outwards forms a fixture block 3122 towards middle part, the edge of cover body 30, and this fixture block 3122 is corresponding with described recess 342.Described guide vane comprise one from connecting plate 313 between first guide vane 312 that cover body 30 extends and folder are as for two mounting panels 314 and second guide vane 315 parallel with two connecting plates 313,311; Wherein first guide vane, 312 sides form a fixture block 3120, and this second guide vane 315 also extends towards cover body 30, and 302 direction increases progressively the length that all guide vanes 312 extend to cover body 30 along air inlet 350 to air outlet.

See also Fig. 4 and Fig. 5, during installation, at first fan 20 is placed in the cover body 30, make the interior side contacts of an end face and the panel 35 of fan 20, and the locking hole 220 on four corners 22 of this fan 20 is alignd with screw 3520 on the panel 35,, make fan 20 be installed on air inlet 350 places of cover body 30 for screw 40 lockings, and on panel 35, be stained with packing ring 37, to weaken the vibration that produces when fan 20 moves; Secondly, radiator 10 is overlapped to cover body 30, the fixed part 120 of the pedestal 12 of this radiator 10 places between two fixed legs 36, and the through hole 122 on this pedestal 12 aligns with this screw 3820, by screw (figure does not show) radiator 10 and cover body 30 is locked together; Then, described forms 31 are installed on opening 340 places of the baffle plate 34 of cover body 30, the recess 342 on wherein said fixture block 3122 and opening 340 edges fastens, and this fixture block 3120 is interlocked with the inwall at opening 340 another edges.These framework 310 clips are in the outside of described opening 340 at this moment, and this guide vane 312 extends to cover body 30 inside, blows to other electron component with steering current; At last, by screw 50 the entire heat dissipation device is fixed on the circuit board.

During work, the heat that central processing unit produces is passed to radiating fin group 14 by pedestal 12; The forced draft part that fan 20 produces is taken away the heat of radiating fin group 14 through the passage of the inside of radiating fin group 14, and the heat of central processing unit is distributed; Another part air-flow then blows to the other electron component on cover body 30 next doors by forms 31, thereby reaches the cooling central processing unit effect of electronic component on every side simultaneously.

In the present embodiment, forms 31 can be arranged to movablely, promptly guide vane 312 is movably installed on the framework 310, and framework 310 swings relatively.The heat that produces when other electron component is less and when not needing to cool off, can swing guide vane 312 and make whole forms 31 closures, flows out from forms 31 with the air-flow that stops fan 20 to produce, and adds the thermolysis of air blast to radiating fin group 14.

Claims

1. heat abstractor, comprise a radiator and a cover body, this cover body encloses this radiator in it and forms passage by radiator, this passage comprises an air inlet and air outlet, it is characterized in that: a fan is installed on the air inlet place of cover body, and forms that are communicated with above-mentioned passage and cover body outside are installed on cover body in addition, described forms comprise that a framework reaches the some guide vanes that are connected with this framework.

2. heat abstractor as claimed in claim 1 is characterized in that: described forms are blind shaped.

3. heat abstractor as claimed in claim 2 is characterized in that: described cover body is provided with an opening, and described framework is installed on this open outer side, and described guide vane partly passes this opening and extends in this cover body.

4. heat abstractor as claimed in claim 1 is characterized in that: described cover body comprises a top board and two by the straight baffle plates that extend of these top board two relative edge's marginal lappets downwards, and described opening is arranged at wherein on the baffle plate.

5. heat abstractor as claimed in claim 4 is characterized in that: described cover body also comprises a panel that is connected with described top board and two baffle plates, and described fan is installed on the described panel.

6. heat abstractor as claimed in claim 5 is characterized in that: the air inlet of described cover body passage is arranged on the described panel, and described air outlet is arranged at the other end relative with this air inlet on the cover body.

7. heat abstractor as claimed in claim 6 is characterized in that: described each guide vane increases progressively to the inner direction of length along air inlet to air outlet of extending of cover body.

8. heat abstractor as claimed in claim 3 is characterized in that: described radiator comprises a pedestal and places radiating fin group on the pedestal.

9. heat abstractor as claimed in claim 8 is characterized in that: described radiating fin group is the stairstepping setting.

10. heat abstractor as claimed in claim 3, it is characterized in that: an edge of described this opening is provided with the recess of open communication, each outwards forms a fixture block described forms lateral surface, wherein a fixture block and described recess clip, the opposite side edge clip of another fixture block and described opening.

11. heat abstractor as claimed in claim 2 is characterized in that: the framework swing relatively of described guide vane.