CN100536634C - Plasma processing device and method - Google Patents
Plasma processing device and method Download PDFInfo
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- CN100536634C CN100536634C CNB2006100721176A CN200610072117A CN100536634C CN 100536634 C CN100536634 C CN 100536634C CN B2006100721176 A CNB2006100721176 A CN B2006100721176A CN 200610072117 A CN200610072117 A CN 200610072117A CN 100536634 C CN100536634 C CN 100536634C
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- supply pipe
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- container handling
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
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Abstract
The provided plasma treatment device (100) with multiple gas feeding pipes (30) comprises: some gas pipes (28) with corresponding supporting bodies (27); in (27), arranging the first path to feed Ar gas from pipe (30) for plasma (P1) by microwave r the second path to feed silicane and H2 gas for plasma (P2) by weak microwave. The plasma from this invention can be used to form well amorphous silicon film.
Description
Technical field
The present invention relates to a kind of gas feed unit that utilizes two systems will handle gas and supply to plasma processing apparatus and method of plasma processing in the container handling.
Background technology
Always, propose that the plasma processing apparatus (for example, with reference to patent documentation 1) of supplying with two kinds of gases of different nature from the gas supply mechanism (for example gas spray head) that is located at container handling two systems is up and down respectively arranged.
On the other hand, in recent years, in order to adapt to the large tracts of landization of substrate, the plasma processing apparatus that this substrate is carried out plasma treatment also maximizes.With this,, be necessary also to make the gas spray head to maximize for uniform plasma takes place in container handling.But, if use above-mentioned prior art, then because of the integrated formation of gas spray head, so if consider the rigidity of gas spray head, it is limitary that the gas spray head is maximized.
[patent documentation 1] Japanese patent laid-open 7-312348 communique
Summary of the invention
The present invention in view of the above problems, its purpose is to provide a kind of and utilizes many gas supply pipe spares will handle gas to supply to plasma processing apparatus and method of plasma processing in the container handling.
In order to solve above-mentioned problem, a viewpoint of the present invention provides a kind of plasma processing apparatus, makes the processing gaseous plasmaization that supplies in the container handling by microwave, and substrate is carried out plasma treatment, it is characterized in that having: import a plurality of gas introduction parts of handling gas; Many gas supply pipe spares; First handle gas and be released to the first gas feed unit in the above-mentioned container handling what import at least one gas introduction part; With utilize above-mentioned many gas supply pipe spares, second handle gas and be released to the second gas feed unit in the above-mentioned container handling what import at least one gas introduction part.
As previously mentioned, existing gas supply mechanism (for example, gas spray head) forms.In contrast, gas supply mechanism of the present invention is formed by a plurality of gas supply pipe spares.As a result, only depend on the radical that increases gas supply pipe spare, just can easily make gas spray head large tracts of landization.
In addition, according to the present invention, supply in the container handling respectively by the first gas feed unit and the second gas feed unit processing gas with two systems.Thus, in a processing procedure, can make two or more processing gaseous plasmaizations respectively.As a result, can moderately dissociate or ionization gas separately, can implement needed plasma treatment to substrate by the plasma that produces thus according to the character of handling gas.
In addition, as gas supply pipe spare because of the situation of the bump deterioration of the ion that produces in the processing procedure etc., when producing unfavorable condition on the gas supply pipe spare, only change produce unfavorable condition pipe fitting just can, it is all to there is no need to change the gas spray head.As a result, the maintenance management of plasma processing apparatus becomes easily, and can reduce plasma processing apparatus and safeguard required expense.
Here, above-mentioned many gas supply pipe spares can be arranged on and supply with above-mentioned first below of handling the supply port of gas.
Thus, first handles gas by plasmaization, and by this plasma, second handles gas by plasmaization.As a result, can not promote second to handle the disassociation of gas, substrate is implemented required plasma treatment.
In addition, though above-mentioned many gas supply pipe spares also can be formed by nonmetal, preferably form by dielectric.Particularly under the situation that gas supply pipe spare is formed by dielectric, when forming by metal as gas supply pipe spare, because sheath layer (sheath) is little to the influence on the surface of gas supply pipe spare, so the electromagnetic field of the near surface of gas supply pipe spare is not disturbed, the distribution that non-warping plasma generates.Therefore, can generate more uniform plasma.In addition, if use these, then can eliminate the problem that is produced when gas supply pipe spare is formed by metal, i.e. gas supply pipe spare thermal deformation is (for example, gas supply pipe spare is crooked because of the heat of plasma, fusing), or the problem that in plasma treatment, is corroded of gas supply pipe spare.
In addition, also can on above-mentioned many gas supply pipe spares, be respectively equipped with a plurality of pores, the above-mentioned second gas feed unit is released in the above-mentioned container handling above-mentioned second from a plurality of pores that are located at respectively on the above-mentioned many gas supply pipe spares with handling gas spray shape.
Utilize these, second handles gas can be released in the container handling from a plurality of pores that are located on the many gas supply pipe spares with spraying shapes.Thus, can handle gas with second is released in the container handling equably.As a result, can handle gas by second plasma takes place more equably.
Also have, it is position between dielectric and the mounting table that relative this dielectric is provided with that for example is arranged in the container handling that what is called is provided with assigned position in the container handling of many gas supply pipe spares, also can be and position that the dielectric of the position of the supply first processing gas leaves mutually.
In addition, above-mentioned plasma processing apparatus also has the supporter that supports above-mentioned many gas supply pipe spares.Utilize these,, can guarantee the rigidity that the gas spray head is all, and, can make gas spray head large tracts of landization by increasing the radical of gas supply pipe spare by many gas supply pipe spares of support body supports.
Specifically, existing spray head is all formed by dielectric, and spray head itself is set to be supported on the wall of container handling.But in the present invention, as mentioned above, spray head is formed by the many gas supply pipe spares that supporter supported.And this supporter also can be formed by metal.Thus, all compare, can dispel the heat expeditiously from the supporter of gas supply pipe spare to metal by the prior art that dielectric forms with spray head.As a result, can prevent that in plasma treatment gas supply pipe spare from becoming gas supply pipe spare that high temperature causes by breakage because of plasma heat etc.
In addition, above-mentioned supporter is to fix with respect to the telescopic mode of above-mentioned container handling.Thus, can make a plurality of gas supply pipe spares move to the position that needs in the container handling by the flexible of supporter.Thus, consider when first handles gas by plasma by the electromagnetic field that weakened or with by first collision of handling the plasma that gas takes place, second handles gas by the aspect of plasmaization, can make gas supply pipe spare move to the position that best plasma takes place based on the character of the various processing gases of supplying with according to processing procedure.As a result, can set the position of a plurality of gas supply pipe spares according to the degree that hope is low by electron temperature (Te) more equably, plasma that electron density (Ne) is high carries out dissociating gas.
In addition, a plurality of above-mentioned supporters and above-mentioned gas introduction part are set respectively,, can be provided with first path that is connected to above-mentioned a plurality of gas introduction parts or at least one of second path in the inside of above-mentioned a plurality of supporters.At this moment, the above-mentioned first gas feed unit can be supplied with above-mentioned first from above-mentioned first path and handle gas via at least one gas introduction part.In addition, the above-mentioned second gas feed unit can be supplied with above-mentioned second from above-mentioned many gas supply pipe spares and handle gas via at least one gas introduction part and above-mentioned second path.
Utilize these, first handles gas supplies with from first path, and second handles gas supplies with from many gas supply pipe spares via second path.Thus, second handles gas, via handling different path, path that gas passes through and supply to position separately in the container handling with first.In a processing procedure, can make the state that two or more processing gaseous plasmas changes into to be needed thus respectively.As a result, generate more equably from handling gas that electron temperature (Te) is low, the high plasma of electron density (Ne), can carry out plasma treatment to substrate accurately by this plasma.
As the kind of institute's gas supplied, for example, the first processing gas can be the gas of molecule binding energy greater than the second processing gas.If use these, can be when making first to handle gaseous plasma consumed energy, second handles gas undertaken plasmaization by the microwave that energy weakens a little.Thus, can from the molecule binding energy big, handle gas as first of inertia strong plasma take place, and can plasmaization to not too promote the molecule binding energy little, as the degree of the disassociation of the second processing gas of reactant gas.As a result, utilize high plasma of electron density (Ne) and the low plasma of electron temperature (Te) accurately substrate to be carried out plasma treatment more equably.
For example, handling gas first is the big argon gas of molecule binding energy (Ar), and the second processing gas is the little silane gas (SiH of molecule binding energy
4) or hydrogen (H
2) time, argon gas is dissociated or ionization fully by the microwave with strong energy.On the other hand, silane gas or hydrogen leave and are suitably dissociated or ionization by the microwave a little less than the electric field from the slot antenna that is made of dielectric.SiH for example
4SiH dissociates
3Base, but disassociation is less than SiH
2The degree of base.As a result, can be because of SiH
2Base makes the film deterioration, uses the plasma that is generated can generate the high amorphous silicon film of precision on substrate.
In addition, if with another kind of viewpoint of the present invention, a kind of method of plasma processing is provided, be used for making the processing gaseous plasmaization that supplies in the container handling by microwave, substrate is carried out plasma treatment, it is characterized in that, comprising:, handle gas from first path with first and supply to operation in the above-mentioned container handling via at least one the gas introduction part in a plurality of gas introduction parts that import gas; With via with supply with the above-mentioned first different gas introduction part and second path of gas introduction part of handling gas, handle gas from many gas supply pipe spares with second and supply to operation in the above-mentioned container handling.
Thus, first handles gas supplies in the container handling from first path, and second handles gas supplies with from a plurality of gas supply pipe spares via second path.Thus, can easily make gas spray head large tracts of landization by the radical that increases gas supply pipe spare.In addition, can supply with two or more processing gas respectively in a processing procedure, can generate plasma according to gas property separately, the result can be to the plasma treatment of substrate enforcement needs.
As described above, according to the present invention, can provide a kind of and utilize many gas supply pipe spares will handle gas to supply to plasma processing apparatus and method of plasma processing in the container handling.
Description of drawings
Fig. 1 is the sectional view of the plasma processing apparatus of expression an embodiment of the invention.
Fig. 2 is the figure that the air valve that looks up from the container handling bottom is described.
Fig. 3 is the sectional view of a part of the microwave plasma processing apparatus of presentation graphs 1.
Symbol description
10 container handlings
11 pedestals
20 lids
22a～22f waveguide pipe
23a～23f slot antenna
24a～24f dielectric
26a～26g beam
27 supporters
28 flues
29 microwave generators
30a～30g gas introduction tube
31a first stream
31b second stream
32 gas supply sources
32a4 argon gas feed source
32b4 silane gas supply source
32b8 hydrogen supply source
100 microwave plasma processing apparatus
Embodiment
With reference to the accompanying drawings preferred implementation of the present invention is elaborated.In addition, in this specification and accompanying drawing, just have the inscape that identical function constitutes in fact, give same numeral and omit repeat specification.
(formation of microwave plasma processing apparatus)
At first, to the microwave plasma processing apparatus of an embodiment of the invention, its formation is described with reference to Fig. 1.Fig. 1 is with being parallel to axial sectional view that cuts off microwave plasma processing apparatus 100 of x direction of principal axis and z.Microwave plasma processing apparatus 100 is examples of plasma processing apparatus.In the present embodiment, enumerating the example that generates amorphous silicon film (a-Si) by microwave plasma processing apparatus 100 describes.
Microwave plasma processing apparatus 100 has the framework that is made of container handling 10 and lid 20.What container handling 10 had a upper opening has an end cube shaped, is grounded.Container handling 10 is formed by for example aluminium metals such as (Al).In the inside of container handling 10,, be provided with as the mounting pedestal 11 of the mounting table of glass substrate W (hereinafter referred to as " substrate W ") for example at the substantial middle place.Pedestal 11 is formed by for example aluminium nitride.
In the inside of pedestal 11, be provided with power supply 11a and heater 11b.On power supply 11a, be connected with high frequency electric source 12b via adaptation 12a (for example capacitor).In addition, on power supply 11a, be connected with high-voltage DC power supply 13b via coil 13a.Adaptation 12a, high frequency electric source 12b, coil 13a and high-voltage DC power supply 13b are located at the outside of container handling 10, and high frequency electric source 12b and high-voltage DC power supply 13b are grounded.
On heater 11b, be connected with the AC power 14 of the outside that is located at container handling 10, substrate W remained under the temperature of regulation by the alternating current of being exported from AC power 14.
The bottom surface of container handling 10 is a tubular by opening, and near the periphery of opening, an end of bellows 15 is towards the outside of container handling 10 and install.On the other end of bellows 15, be fixed with lifter plate 16.So, the opening portion of container handling 10 bottom surfaces is by bellows 15 and lifter plate 16 sealings.
Around pedestal 11, be provided with and be used for the gas flow in the container handling is controlled to the cowling panel 18 of kilter.In addition, on the bottom surface of container handling 10, be provided with the gas outlet pipe 19 that is connected in not shown vacuum pump.The gas of vacuum pump by discharging in the container handling from gas outlet pipe 19 will be vented to the vacuum degree that needs in the container handling.
Be respectively equipped with dielectric 24a～dielectric 24f in the bottom of slot antenna 23a～slot antenna 23f.Each dielectric 24 is by for example quartzy, aluminium oxide (Al
2O
3) wait formation, so that see through microwave.
Dielectric 24a～dielectric 24f supports its two ends respectively by the beam 26a～beam 26g that is formed by metals such as for example aluminium.In addition, bottom at beam 26a～beam 26g, be fixed with the supporter 27a～supporter 27g that forms by metal respectively, at each flue 28 of two end supports of the flue 28a～flue 28f that becomes a unit that constitutes gas supply pipe spare (gas supply mechanism (for example, gas spray head)).Moreover the distance between dielectric 24 and the flue 28 is about 25mm.In addition, the distance between dielectric 24 and the pedestal 11 is for about 70mm～210mm.
Flue 28 is by aluminium oxide (Al
2O
3) wait dielectric to form.Therefore, compared by the prior art that metal forms with flue 28, the influence of the sheath layer of the surface of flue 28 is little, causes the electromagnetic field of near surface of flue 28 not disturbed, the distribution that non-warping plasma generates.As a result, can generate more uniform plasma.In addition, the problem that produces in the time of can eliminating the gas spray head and form by metal, i.e. flue 28 thermal deformations (for example, gas supply pipe spare is because of the crooked or fusing of heat of plasma), or flue 28 corrodes such problem in plasma treatment.
In addition, flue 28 is a tubulose, and its diameter is about 8mm.As the shown in Figure 2 of flue 28 sides that look up from pedestal 11 sides, on each flue 28, be provided with and supply gas to the pore of using in the container handling (pore).The diameter of this pore is about 0.5mm.
So, dielectric flue 28 is by being supported by supporter 27 and can guarantee the rigidity that the gas spray head is all, and can make gas spray head large tracts of landization by the radical that increases flue 28.In addition, as flue 28 because of the situation of the bump deterioration of the ion in the processing procedure etc., when producing unfavorable condition on the flue 28, only change produce unfavorable condition pipe fitting just can, it is all to there is no need to change the gas spray head.As a result, the maintenance management of microwave plasma processing apparatus 100 becomes easily, and can reduce the needed expense of maintenance of microwave plasma processing apparatus 100.
In addition, form by metal by supporter 27, can be from of beam 26 heat radiations of the low dielectric flue 28 of heat conductivity to the supporter 27 and the metal of the high metal of heat conductivity.Its result can prevent that flue 28 from being high temperature because of the plasma heat forms in process is handled.
Constitute by this of above explanation, propagate among waveguide pipe 22a～waveguide pipe 22f from microwave generator 29a～microwave generator 29f microwave that exported, for example 2.45GHz, by being located at the slit on slot antenna 23a～slot antenna 23f, see through dielectric 24a～dielectric 24f and incide in the container handling, propagate into a plurality of flues 28.
(the first gas feed unit and the second gas feed unit)
Next, describe with regard to the gas supply mechanism of the microwave plasma processing apparatus 100 of present embodiment, the action with regard to the first gas feed unit and the second gas feed unit describes then.
The inside of gas introduction tube 30a～gas introduction tube 30g through beam 26a～beam 26g.In each gas introduction tube 30, as shown in Figure 1, at the end of gas introduction tube 30a, gas introduction tube 30c, gas introduction tube 30e and gas introduction tube 30g via the argon gas feed source 32a4 in the first stream 31a connection processing gas supply source 32.In addition, on gas introduction tube 30b, gas introduction tube 30d and gas introduction tube 30f, via silane gas supply source 32b4 and the hydrogen supply source 32b8 in the second stream 31b connection processing gas supply source 32.
Handling gas supply source 32 is made of valve 32a1, mass flow controller 32a2, valve 32a3, argon gas feed source 32a4, valve 32b1, mass flow controller 32b2, valve 32b3 and silane gas supply source 32b4, valve 32b5, mass flow controller 32b6, valve 32b7 and hydrogen supply source 32b8.
Handle the switching of gas supply source 32, respectively with argon (Ar) gas (be equivalent to first and handle gas), silane (SiH by control valve 32a1, valve 32a3, valve 32b1 and valve 32b3, valve 32b5 and valve 32b7
4) gas and hydrogen (H
2) gas (be equivalent to second handle gas) supplies in the container handling.In addition, mass flow controller 32a2, mass flow controller 32b2 and mass flow controller 32b6 supply to the gas of needed concentration in the container handling by the flow of controlling the processing gas of supplying with respectively.
In addition, represent its part as Fig. 3, on the other end of gas introduction tube 30a, the gas introduction tube 30c, gas introduction tube 30e and the gas introduction tube 30g that supply with argon gas, be connected with an end of the path A (being equivalent to first path) of supporter 27a, supporter 27c, supporter 27e and the supporter 27g inside of below each beam 26, extending.The other end of path A is at the upper opening of flue 28.
In addition, on the other end of the gas introduction tube 30b, the gas introduction tube 30d that supply with silane gas and hydrogen and gas introduction tube 30f, be connected with the end of the path B (being equivalent to second path) of the supporter 27b, the supporter 27d that extend from each beam 26 and supporter 27f inside.And then the other end of path B is connected an end of the flue 28 that is supported by supporter 27.
Utilize this gas supply mechanism, the first gas feed unit is from gas introduction tube 30a, gas introduction tube 30c, gas introduction tube 30e and gas introduction tube 30g and each path A of being connected to these gas introduction tubes 30, and argon gas is released to space between each dielectric 24 and each flue 28.
Microwave plasma processing apparatus 100 incides the microwave in the container handling by seeing through each dielectric 24, by the argon gas that is released to the space between each dielectric 24 and each flue 28, plasma P 1 takes place.
On the other hand, the second gas feed unit is via gas introduction tube 30b, gas introduction tube 30d, gas introduction tube 30f and be connected to each path B of these gas introduction tubes 30, silane gas and hydrogen is released to the bottom of flue 28 from being located at pore on the flue 28.
Microwave plasma processing apparatus 100 is consumed energy when generating plasma P 1, utilizes the microwave that weakens, by the silane gas and the hydrogen generation plasma P 2 that are released to flue 28 bottoms with spraying shape.
Thus, by inert argon strong plasma can take place, and can make suitably plasmaization of active silane gas and hydrogen.Here, so-called " suitably plasmaization " for example is meant that silane gas is by the microwave that weakens a little SiH that dissociates
3Base is the SiH that excessively do not dissociate
2The disassociation of the degree of base.
As above, the processing gas of two systems is supplied in the container handling by the first gas feed unit and the second gas feed unit respectively.Thus, can make two or more processing gas plasmaization respectively.In addition, many flues 28 are arranged on and supply with the first supply port below of handling gas.In a processing procedure, in the processing gas of plasmaization, at first, first handles gas by plasmaization, makes second to handle gaseous plasmaization by this plasma respectively thus.As a result, do not promote second to handle the disassociation of gas, can implement needed plasma treatment substrate.
In contrast, for example, suppress lowly and during situation suitably dissociating gas at the power of considering the microwave by with incident the time because the plasma that is generated becomes unstable, the disassociation of gas also not necessarily, so can't generate the amorphous silicon film of high-quality.But if with the microwave plasma processing apparatus 100 of present embodiment, the power of the microwave when then not suppressing incident can generate the very amorphous silicon film of high-quality by the plasma P 1 and the plasma P 2 that produce on substrate W.
As described above, utilize the microwave plasma processing apparatus 100 of present embodiment, first handles gas (argon gas) supplies with from first path (path A), and second handles gas (silane gas and hydrogen) supplies with from many gas supply pipe spares (flue 28) via second path (path B).Thus, can implement needed plasma treatment by the plasma that produces to substrate respectively.In addition, form by many gas supply pipe spares, can not only guarantee the rigidity that the gas spray head is all but also make gas spray head large tracts of landization easily by the gas spray head.
More than first of explanation handle gas, the preferred big inert gas of molecule binding energy.In addition, second handle the little reactant gas of the preferred molecule binding energy of gas.The ionization energy of argon gas is 15.759 (eV).In addition, the molecule binding energy of H and H is 4.48 (eV), and the molecule binding energy of Si and H is 3.2 (eV).Therefore, in amorphous silicon CVD handled, the molecule binding energy was handled gas greater than the argon gas of silane or hydrogen as first and is supplied with from the top of container handling, and silane or hydrogen are handled the underfeed of gas from container handling as second.
In the respective embodiments described above, the action of each several part is interrelated, on one side can consider mutual association, Yi Bian replace as a series of action.Thereby, by as the displacement, more than the invention of Shuo Ming plasma processing apparatus can be used as the invention execution mode of method of plasma processing.
More than, describe with regard to preferred implementation of the present invention with reference to accompanying drawing, but the present invention is not limited to these examples certainly.So long as the professional and technical personnel in the category described in claims, can expect it being conspicuous in various variation or correction example, should be noted that relevant these also belong to technical scope of the present invention certainly.
For example, plasma processing apparatus, be not limited to microwave plasma processing apparatus, so long as inductance coupling high type plasma processing apparatus or ECR (electron-cyclotron-resonance) plasma processing apparatus etc., make the plasma processing apparatus of type of plasma diffusion just passable.
In addition, as the processing gas of being supplied with, for example, first handle gas can be the big gas of molecule binding energy (for example, easy Ionized inert gas (argon gas, xenon (Xe) etc.)), the second processing gas can be the little gas of molecule binding energy (for example, silane gas (SiH
4), hydrogen (H
2) isoreactivity gas).
In addition, handling gas as the first processing gas and second and be not limited to film forming gas, also can be etching gas, sputter gas etc.
In addition, gas introduction part among the present invention also can not only be made of gas introduction tube 30a～gas introduction tube 30g, also can only constitute by the first stream 31a and the second stream 31b, perhaps, also can constitute by gas introduction tube 30a～gas introduction tube 30g, the first stream 31a and the second stream 31b.
In addition, supporter 27 of the present invention also can be fixed in the mode that can move (scalable) with respect to container handling 10 up and down.According to these, moving up and down by the flexible position of a plurality of flues 28 that makes of supporter 27, can emit second position of handling gas by appropriate change.Thus, consider when first handles gaseous plasma by the electromagnetic field that weakens or with handle the collision of the plasma that gas takes place and second handle gas by first by plasmaization, can gas supply pipe spare be moved to the position that best plasma takes place based on the character of the processing gas of being supplied with.As a result, can handle gas by second and generate more equably that electron temperature (Te) is low, the high plasma of electron density (Ne).
In addition, in supporter 27a～supporter 27g inside, be provided with any of first path or second path.But, the invention is not restricted to this, supporter 27a～supporter 27g also within it portion first path and second path, two sides are set, and any the mechanism that can select first path or second path is set, supply gas to the path of selection.
In addition, many gas supply pipe spares are preferably formed by dielectrics such as pottery, quartz, glass tubes, but also can be by nonmetal formation such as resins.
Utilizability on the industry
The present invention can be applicable to that utilizing many gas supply pipe spares will process gas supplies to processing Plasma processing apparatus in the container.
Claims (10)
1. a plasma processing apparatus makes the processing gaseous plasmaization that supplies in the container handling by microwave, and substrate is carried out plasma treatment, it is characterized in that having:
Import and handle a plurality of gas introduction parts gas, that be divided into the first gas introduction part and the second gas introduction part;
Many gas supply pipe spares;
First handle gas and be released to the first gas feed unit in the described container handling what import to the described first gas introduction part; With
The second processing gas that utilizes described many gas supply pipe spares will import to the described second gas introduction part is released to the second gas feed unit in the described container handling.
2. plasma processing apparatus as claimed in claim 1 is characterized in that:
Described many gas supply pipe spares are arranged on the below of the supply port of the described first gas feed unit of supplying with the described first processing gas.
3. as claim 1 or 2 each described plasma processing apparatus, it is characterized in that: described many gas supply pipe spares are formed by nonmetal.
4. plasma processing apparatus as claimed in claim 3 is characterized in that:
Forming the nonmetal of described many gas supply pipe spares is dielectric.
5. plasma processing apparatus as claimed in claim 1 or 2 is characterized in that: be respectively equipped with a plurality of pores on the described many gas supply pipe spares,
The described second gas feed unit is released in the described container handling described second from being located at a plurality of pores on the described many gas supply pipe spares respectively with handling gas spray shape.
6. plasma processing apparatus as claimed in claim 1 or 2 is characterized in that: also have the supporter that supports described many gas supply pipe spares.
7. plasma processing apparatus as claimed in claim 6 is characterized in that:
Described supporter is formed by metal.
8. plasma processing apparatus as claimed in claim 6 is characterized in that: described supporter is to fix with respect to the telescopic mode of described container handling.
9. plasma processing apparatus as claimed in claim 6 is characterized in that: a plurality of described supporters are set,
Be provided with first path that is connected to described a plurality of gas introduction parts or at least one of second path in the inside of described a plurality of supporters,
The described first gas feed unit is supplied with described first via the described first gas introduction part and is handled gas from described first path,
The described second gas feed unit is supplied with described second with described second path that is connected with this second gas introduction part from described many gas supply pipe spares via the described second gas introduction part and is handled gas.
10. a method of plasma processing is used for making the processing gaseous plasmaization that supplies in the container handling by microwave, and substrate is carried out plasma treatment, it is characterized in that, comprising:
Via the first gas introduction part in a plurality of gas introduction parts of import handling gas, from being connected in first path of the described first gas introduction part, handling gas with first and supply to operation in the described container handling; With
Via the second gas introduction part in described a plurality of gas introduction parts be connected in second path of the described second gas introduction part,, handle gas with second and supply to operation in the described container handling from many gas supply pipe spares.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005140137 | 2005-05-12 | ||
| JP2005140137A JP4781711B2 (en) | 2005-05-12 | 2005-05-12 | Plasma processing apparatus and plasma processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1863427A CN1863427A (en) | 2006-11-15 |
| CN100536634C true CN100536634C (en) | 2009-09-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100721176A Expired - Fee Related CN100536634C (en) | 2005-05-12 | 2006-04-12 | Plasma processing device and method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4781711B2 (en) |
| KR (1) | KR100827032B1 (en) |
| CN (1) | CN100536634C (en) |
| TW (1) | TW200710953A (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100757470B1 (en) | 2006-11-22 | 2007-09-11 | (주)퓨전에이드 | Gas supplying apparatus of rotary type |
| US7767028B2 (en) * | 2007-03-14 | 2010-08-03 | Lam Research Corporation | Cleaning hardware kit for composite showerhead electrode assemblies for plasma processing apparatuses |
| JP5103223B2 (en) * | 2008-02-27 | 2012-12-19 | 東京エレクトロン株式会社 | Microwave plasma processing apparatus and method of using microwave plasma processing apparatus |
| US8501624B2 (en) * | 2008-12-04 | 2013-08-06 | Varian Semiconductor Equipment Associates, Inc. | Excited gas injection for ion implant control |
| CN102157327B (en) * | 2009-12-31 | 2014-12-03 | 丽佳达普株式会社 | Gas supply structure of substrate processing apparatus |
| CN102634775A (en) * | 2011-02-09 | 2012-08-15 | 理想能源设备有限公司 | Plasma enhanced chemical vapor deposition method |
| EP3189915B1 (en) * | 2014-08-13 | 2020-12-23 | National Institute of Advanced Industrial Science and Technology | Sintering device for metal material |
| CN114127902A (en) * | 2019-07-15 | 2022-03-01 | 应用材料公司 | Large area high density plasma processing chamber for flat panel display |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02114530A (en) * | 1988-10-25 | 1990-04-26 | Mitsubishi Electric Corp | Thin film formation device |
| TW293983B (en) * | 1993-12-17 | 1996-12-21 | Tokyo Electron Co Ltd | |
| JP3422583B2 (en) * | 1994-03-23 | 2003-06-30 | 東京エレクトロン株式会社 | Processing equipment |
| JP2001329368A (en) * | 2000-05-18 | 2001-11-27 | Mitsubishi Heavy Ind Ltd | Method for depositing silicon film |
| JP4338355B2 (en) * | 2002-05-10 | 2009-10-07 | 東京エレクトロン株式会社 | Plasma processing equipment |
-
2005
- 2005-05-12 JP JP2005140137A patent/JP4781711B2/en not_active Expired - Fee Related
-
2006
- 2006-04-12 CN CNB2006100721176A patent/CN100536634C/en not_active Expired - Fee Related
- 2006-05-11 KR KR1020060042569A patent/KR100827032B1/en not_active IP Right Cessation
- 2006-05-11 TW TW095116745A patent/TW200710953A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| CN1863427A (en) | 2006-11-15 |
| KR20060117237A (en) | 2006-11-16 |
| KR100827032B1 (en) | 2008-05-02 |
| TW200710953A (en) | 2007-03-16 |
| JP4781711B2 (en) | 2011-09-28 |
| JP2006319127A (en) | 2006-11-24 |
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