CN100529812C - 具有光电器件对准的光学组件 - Google Patents
具有光电器件对准的光学组件 Download PDFInfo
- Publication number
- CN100529812C CN100529812C CNB2005800293410A CN200580029341A CN100529812C CN 100529812 C CN100529812 C CN 100529812C CN B2005800293410 A CNB2005800293410 A CN B2005800293410A CN 200580029341 A CN200580029341 A CN 200580029341A CN 100529812 C CN100529812 C CN 100529812C
- Authority
- CN
- China
- Prior art keywords
- photoelectric device
- optical waveguide
- substrate
- optical
- optical module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
Claims (19)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/931,713 | 2004-09-01 | ||
US10/931,713 US7308167B2 (en) | 2004-09-01 | 2004-09-01 | Optical assembly with optoelectronic device alignment |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101014889A CN101014889A (zh) | 2007-08-08 |
CN100529812C true CN100529812C (zh) | 2009-08-19 |
Family
ID=35943177
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005800293410A Expired - Fee Related CN100529812C (zh) | 2004-09-01 | 2005-06-29 | 具有光电器件对准的光学组件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7308167B2 (zh) |
EP (1) | EP1784669B1 (zh) |
JP (1) | JP5270917B2 (zh) |
CN (1) | CN100529812C (zh) |
WO (1) | WO2006028564A1 (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011033876A (ja) * | 2009-08-03 | 2011-02-17 | Nitto Denko Corp | 光センサモジュールの製造方法およびそれによって得られた光センサモジュール |
JP2011085647A (ja) | 2009-10-13 | 2011-04-28 | Hitachi Chem Co Ltd | 光導波路基板及びその製造方法 |
KR101199302B1 (ko) * | 2009-10-13 | 2012-11-09 | 한국전자통신연구원 | 광 소자 및 그 제조 방법 |
US9065236B2 (en) | 2010-04-30 | 2015-06-23 | Seagate Technology | Method and apparatus for aligning a laser diode on a slider |
JP5308408B2 (ja) * | 2010-07-27 | 2013-10-09 | 日東電工株式会社 | 光センサモジュール |
US8977088B2 (en) | 2010-07-30 | 2015-03-10 | Tyco-Electronics Corporation | Interposer with alignment features |
US8262297B2 (en) * | 2010-07-30 | 2012-09-11 | Tyco Electronics Corporation | Body having a dedicated lens for imaging an alignment feature |
JP5325184B2 (ja) | 2010-08-31 | 2013-10-23 | 日東電工株式会社 | 光センサモジュール |
JP5693986B2 (ja) | 2011-02-03 | 2015-04-01 | 日東電工株式会社 | 光センサモジュール |
MY161466A (en) * | 2011-04-29 | 2017-04-14 | Seagate Technology Llc | Method and apparatus for aligning a laser diode on a slider |
US9151916B2 (en) | 2011-05-16 | 2015-10-06 | Ultra Communications, Inc. | Compact optical package made with planar structures |
US8830466B2 (en) | 2011-11-10 | 2014-09-09 | Cisco Technology, Inc. | Arrangement for placement and alignment of opto-electronic components |
KR102380064B1 (ko) | 2014-02-18 | 2022-03-28 | 에이엠에스 센서스 싱가포르 피티이. 리미티드. | 초점 길이 조정 및/또는 기울기의 축소를 위한 고객 맞춤화 가능한 스페이서를 포함하는 광학 모듈, 및 광학 모듈의 제조 |
KR102282827B1 (ko) | 2014-07-23 | 2021-07-28 | 에이엠에스 센서스 싱가포르 피티이. 리미티드. | 수직 정렬 피처들을 포함하는 광 방출기 및 광 검출기 모듈들 |
US10475830B2 (en) | 2015-08-06 | 2019-11-12 | Ams Sensors Singapore Pte. Ltd. | Optical modules including customizable spacers for focal length adjustment and/or reduction of tilt, and fabrication of the optical modules |
US10571637B2 (en) * | 2016-04-29 | 2020-02-25 | Finisar Corporation | Thermally interfacing chip on glass assembly |
US10670656B2 (en) * | 2016-05-09 | 2020-06-02 | International Business Machines Corporation | Integrated electro-optical module assembly |
US10466501B2 (en) * | 2016-05-26 | 2019-11-05 | Ams Sensors Singapore Pte. Ltd. | Optoelectronic modules including an optical system tilted with respect to a focal plane |
US10859868B2 (en) | 2017-08-11 | 2020-12-08 | Coopervision International Limited | Flexible liquid crystal cells and lenses |
US11003016B2 (en) | 2018-09-21 | 2021-05-11 | Coopervision International Limited | Flexible, adjustable lens power liquid crystal cells and lenses |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3716772A1 (de) | 1987-05-19 | 1988-12-08 | Siemens Ag | Optoelektronische sende- und empfangsvorrichtung |
FR2670909B1 (fr) | 1990-12-21 | 1994-02-11 | Thomson Csf | Dispositif de connexion optique et appareil de traitement de donnees muni de moyens de transmission optique. |
DE59204710D1 (de) * | 1991-02-08 | 1996-02-01 | Siemens Ag | Optoelektronisches Bauelement zum Aus- und Einkoppeln von Strahlung |
JP3117107B2 (ja) | 1993-08-03 | 2000-12-11 | シャープ株式会社 | 光集積回路素子の組立構造 |
US5418870A (en) * | 1994-04-28 | 1995-05-23 | Corning Incorporated | Coaxial coupler with integrated source/ring detector |
EP0950204B1 (en) * | 1996-12-31 | 2002-01-23 | Honeywell Inc. | Flexible optic connector assembly |
JP3239933B2 (ja) | 1997-07-23 | 2001-12-17 | 日本電気株式会社 | 半導体光デバイス、該半導体光デバイスの製造方法、および該半導体光デバイスの実装構造 |
US6095697A (en) * | 1998-03-31 | 2000-08-01 | Honeywell International Inc. | Chip-to-interface alignment |
DE19838519A1 (de) * | 1998-08-25 | 2000-03-02 | Bosch Gmbh Robert | Leiterplatte und Verfahren zur Herstellung |
DE19845227A1 (de) * | 1998-10-01 | 2000-04-06 | Daimler Chrysler Ag | Anordnung zur Justage optischer Komponenten |
TWI239798B (en) | 1999-05-28 | 2005-09-11 | Toppan Printing Co Ltd | Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate |
US6243508B1 (en) * | 1999-06-01 | 2001-06-05 | Picolight Incorporated | Electro-opto-mechanical assembly for coupling a light source or receiver to an optical waveguide |
FR2809826B1 (fr) | 2000-05-31 | 2002-08-30 | Cit Alcatel | Procede d'alignement d'un composant optique a guide incline monte sur une embase et dispositif optique associe |
US6547454B2 (en) * | 2000-09-21 | 2003-04-15 | Corona Optical Systems, Inc. | Method to align optical components to a substrate and other optical components |
WO2002057821A1 (en) * | 2001-01-19 | 2002-07-25 | Primarion, Inc. | Optical interconnect with integral reflective surface and lens, system including the interconnect and method of forming the same |
US6512861B2 (en) | 2001-06-26 | 2003-01-28 | Intel Corporation | Packaging and assembly method for optical coupling |
US6754407B2 (en) * | 2001-06-26 | 2004-06-22 | Intel Corporation | Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board |
JP3883901B2 (ja) * | 2002-04-23 | 2007-02-21 | 三菱電機株式会社 | 光路変換デバイスおよびその製造方法 |
JP4012785B2 (ja) * | 2002-08-27 | 2007-11-21 | 日本板硝子株式会社 | 光接続装置 |
JP2005107409A (ja) * | 2003-10-01 | 2005-04-21 | Nikon Corp | 光合分波装置の製造方法 |
JP4697698B2 (ja) * | 2003-11-07 | 2011-06-08 | セイコーインスツル株式会社 | 光デバイスおよびその製造方法 |
-
2004
- 2004-09-01 US US10/931,713 patent/US7308167B2/en active Active
-
2005
- 2005-06-29 WO PCT/US2005/023300 patent/WO2006028564A1/en active Application Filing
- 2005-06-29 CN CNB2005800293410A patent/CN100529812C/zh not_active Expired - Fee Related
- 2005-06-29 JP JP2007529844A patent/JP5270917B2/ja not_active Expired - Fee Related
- 2005-06-29 EP EP05803979.3A patent/EP1784669B1/en not_active Not-in-force
Also Published As
Publication number | Publication date |
---|---|
WO2006028564A1 (en) | 2006-03-16 |
JP5270917B2 (ja) | 2013-08-21 |
EP1784669B1 (en) | 2013-07-24 |
US7308167B2 (en) | 2007-12-11 |
CN101014889A (zh) | 2007-08-08 |
JP2008511860A (ja) | 2008-04-17 |
EP1784669A1 (en) | 2007-05-16 |
EP1784669A4 (en) | 2010-01-20 |
US20060045410A1 (en) | 2006-03-02 |
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Legal Events
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PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: AVAGO TECHNOLOGIES IP PRIVATE CO. Free format text: FORMER OWNER: ANJELEN SCI. + TECH. INC. Effective date: 20100809 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: CALIFORNIA STATE, USA TO: SINGAPORE SINGAPORE CITY |
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TR01 | Transfer of patent right |
Effective date of registration: 20100809 Address after: Singapore Singapore Co-patentee after: International Business Machines Corp. Patentee after: Avago Technologies General IP (Singapore) Pte. Ltd. Address before: California, USA Co-patentee before: International Business Machines Corp. Patentee before: AGILENT TECHNOLOGIES, Inc. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090819 |
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CF01 | Termination of patent right due to non-payment of annual fee |