CN100507429C - 平板式传热装置 - Google Patents
平板式传热装置 Download PDFInfo
- Publication number
- CN100507429C CN100507429C CNB2004800287167A CN200480028716A CN100507429C CN 100507429 C CN100507429 C CN 100507429C CN B2004800287167 A CNB2004800287167 A CN B2004800287167A CN 200480028716 A CN200480028716 A CN 200480028716A CN 100507429 C CN100507429 C CN 100507429C
- Authority
- CN
- China
- Prior art keywords
- heat transfer
- transfer device
- flat plate
- net
- plate heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
Description
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030068874 | 2003-10-02 | ||
KR1020030068874A KR20050032888A (ko) | 2003-10-02 | 2003-10-02 | 판형 열전달 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1864043A CN1864043A (zh) | 2006-11-15 |
CN100507429C true CN100507429C (zh) | 2009-07-01 |
Family
ID=36499752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004800287167A Expired - Fee Related CN100507429C (zh) | 2003-10-02 | 2004-09-23 | 平板式传热装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070068656A1 (zh) |
EP (1) | EP1676086A4 (zh) |
JP (1) | JP2007507685A (zh) |
KR (1) | KR20050032888A (zh) |
CN (1) | CN100507429C (zh) |
TW (1) | TWI260388B (zh) |
WO (1) | WO2005031238A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI458932B (zh) * | 2011-09-02 | 2014-11-01 | Giga Byte Tech Co Ltd | 散熱器 |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100698460B1 (ko) * | 2004-11-10 | 2007-03-23 | (주)셀시아테크놀러지스한국 | 판형 냉각 장치 및 이를 사용하는 칩셋 |
GB2427582A (en) * | 2005-06-28 | 2007-01-03 | Asia Vital Components Co Ltd | Manufacture of a heat pipe using ultrasonic welding |
KR100809587B1 (ko) * | 2007-02-02 | 2008-03-04 | 이용덕 | 판형 열전달장치 |
US20080310115A1 (en) * | 2007-06-15 | 2008-12-18 | Brandenburg Scott D | Metal screen and adhesive composite thermal interface |
KR100890019B1 (ko) * | 2007-08-10 | 2009-03-25 | 플루미나 주식회사 | 판형 열전달 장치 |
CN101634532B (zh) * | 2008-12-22 | 2011-06-15 | 富瑞精密组件(昆山)有限公司 | 热导管制造方法 |
JP4737285B2 (ja) * | 2008-12-24 | 2011-07-27 | ソニー株式会社 | 熱輸送デバイス及び電子機器 |
EP2374150A4 (en) * | 2009-01-06 | 2014-04-09 | Massachusetts Inst Technology | HEAT EXCHANGERS AND RELATED METHODS |
US8921702B1 (en) * | 2010-01-21 | 2014-12-30 | Hrl Laboratories, Llc | Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments |
US9546826B1 (en) | 2010-01-21 | 2017-01-17 | Hrl Laboratories, Llc | Microtruss based thermal heat spreading structures |
JP4801797B1 (ja) | 2010-03-10 | 2011-10-26 | パナソニック株式会社 | 半導体装置及びその製造方法 |
CN102374808A (zh) * | 2010-08-26 | 2012-03-14 | 富准精密工业(深圳)有限公司 | 平板式均热板 |
EP2713132A1 (en) * | 2012-09-26 | 2014-04-02 | Alcatel Lucent | A vapor-based heat transfer apparatus |
US9405067B2 (en) | 2013-03-13 | 2016-08-02 | Hrl Laboratories, Llc | Micro-truss materials having in-plane material property variations |
US20150122460A1 (en) * | 2013-11-06 | 2015-05-07 | Asia Vital Components Co., Ltd. | Heat pipe structure |
CN103617969B (zh) * | 2013-12-04 | 2016-06-29 | 广州先艺电子科技有限公司 | 一种焊接金锡合金薄膜的热沉及其制备方法 |
JP5740036B1 (ja) * | 2014-08-01 | 2015-06-24 | 古河電気工業株式会社 | 平面型ヒートパイプ |
JP5788069B1 (ja) | 2014-08-29 | 2015-09-30 | 古河電気工業株式会社 | 平面型ヒートパイプ |
WO2017015814A1 (zh) * | 2015-07-27 | 2017-02-02 | 金积德 | 板状均温装置 |
CN107345771A (zh) * | 2016-05-05 | 2017-11-14 | 讯凯国际股份有限公司 | 抗重力式的热管装置 |
CN108907460A (zh) * | 2018-07-09 | 2018-11-30 | 奇鋐科技股份有限公司 | 热单元制造方法 |
US20200166293A1 (en) * | 2018-11-27 | 2020-05-28 | Hamilton Sundstrand Corporation | Weaved cross-flow heat exchanger and method of forming a heat exchanger |
US10833241B1 (en) | 2019-06-20 | 2020-11-10 | International Business Machines Corporation | Thermalization structure for cryogenic temperature devices |
US11435144B2 (en) * | 2019-08-05 | 2022-09-06 | Asia Vital Components (China) Co., Ltd. | Heat dissipation device |
CN110442214B (zh) * | 2019-08-05 | 2020-09-29 | 浙江广厦建设职业技术大学 | 一种电脑主板超声纳米降温装置 |
CN110678042A (zh) * | 2019-09-30 | 2020-01-10 | 华南理工大学 | 基于聚合物膜的热压式柔性相变均热带/板及其制作方法 |
CN112996339B (zh) * | 2019-12-12 | 2023-09-26 | 王训忠 | 均温板装置 |
CN216079719U (zh) * | 2021-06-25 | 2022-03-18 | 广东英维克技术有限公司 | 一种电视led灯带的散热器 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3680189A (en) * | 1970-12-09 | 1972-08-01 | Noren Products Inc | Method of forming a heat pipe |
US3834457A (en) * | 1971-01-18 | 1974-09-10 | Bendix Corp | Laminated heat pipe and method of manufacture |
US4394344A (en) * | 1981-04-29 | 1983-07-19 | Werner Richard W | Heat pipes for use in a magnetic field |
JPS6166086A (ja) * | 1984-09-07 | 1986-04-04 | Mitsubishi Heavy Ind Ltd | ヒ−トパイプ |
US5560423A (en) * | 1994-07-28 | 1996-10-01 | Aavid Laboratories, Inc. | Flexible heat pipe for integrated circuit cooling apparatus |
KR100290461B1 (ko) * | 1998-05-25 | 2001-06-01 | 정선종 | 편조형윅구조를갖는히트파이프 |
JP2000161878A (ja) * | 1998-11-30 | 2000-06-16 | Furukawa Electric Co Ltd:The | 平面型ヒートパイプ |
TW452642B (en) * | 1999-09-07 | 2001-09-01 | Furukawa Electric Co Ltd | Wick, plate type heat pipe and container |
US6446706B1 (en) * | 2000-07-25 | 2002-09-10 | Thermal Corp. | Flexible heat pipe |
JP2003179189A (ja) * | 2001-12-12 | 2003-06-27 | Furukawa Electric Co Ltd:The | 薄型ヒートシンクおよびその実装構造 |
US6679318B2 (en) * | 2002-01-19 | 2004-01-20 | Allan P Bakke | Light weight rigid flat heat pipe utilizing copper foil container laminated to heat treated aluminum plates for structural stability |
JP4057455B2 (ja) * | 2002-05-08 | 2008-03-05 | 古河電気工業株式会社 | 薄型シート状ヒートパイプ |
-
2003
- 2003-10-02 KR KR1020030068874A patent/KR20050032888A/ko active Search and Examination
-
2004
- 2004-09-23 WO PCT/KR2004/002450 patent/WO2005031238A1/en active Application Filing
- 2004-09-23 US US10/574,356 patent/US20070068656A1/en not_active Abandoned
- 2004-09-23 JP JP2006532074A patent/JP2007507685A/ja not_active Ceased
- 2004-09-23 EP EP04774703A patent/EP1676086A4/en not_active Withdrawn
- 2004-09-23 CN CNB2004800287167A patent/CN100507429C/zh not_active Expired - Fee Related
- 2004-10-01 TW TW093129762A patent/TWI260388B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI458932B (zh) * | 2011-09-02 | 2014-11-01 | Giga Byte Tech Co Ltd | 散熱器 |
Also Published As
Publication number | Publication date |
---|---|
CN1864043A (zh) | 2006-11-15 |
US20070068656A1 (en) | 2007-03-29 |
TWI260388B (en) | 2006-08-21 |
WO2005031238A1 (en) | 2005-04-07 |
KR20050032888A (ko) | 2005-04-08 |
EP1676086A4 (en) | 2008-01-02 |
EP1676086A1 (en) | 2006-07-05 |
JP2007507685A (ja) | 2007-03-29 |
TW200513627A (en) | 2005-04-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CI01 | Publication of corrected invention patent application |
Correction item: Inventor Correct: Jin Xuandui False: Jin Xuandui Number: 46 Volume: 22 |
|
CI02 | Correction of invention patent application |
Correction item: Inventor Correct: Jin Xuandui False: Jin Xuandui Number: 46 Page: The title page Volume: 22 |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090701 Termination date: 20120923 |