CN100500333C - 微粒银粉及其微粒银粉的制造方法 - Google Patents

微粒银粉及其微粒银粉的制造方法 Download PDF

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Publication number
CN100500333C
CN100500333C CNB2004800209882A CN200480020988A CN100500333C CN 100500333 C CN100500333 C CN 100500333C CN B2004800209882 A CNB2004800209882 A CN B2004800209882A CN 200480020988 A CN200480020988 A CN 200480020988A CN 100500333 C CN100500333 C CN 100500333C
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CN
China
Prior art keywords
silver powder
silver
powder
particulate
aqueous solution
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Expired - Fee Related
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CNB2004800209882A
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English (en)
Chinese (zh)
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CN1826198A (zh
Inventor
佐佐木卓也
加藤政志
吉丸克彦
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Mitsui Mining and Smelting Co Ltd
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Mitsui Mining and Smelting Co Ltd
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Publication of CN1826198A publication Critical patent/CN1826198A/zh
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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/24—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from liquid metal compounds, e.g. solutions

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Powder Metallurgy (AREA)
CNB2004800209882A 2003-07-29 2004-07-15 微粒银粉及其微粒银粉的制造方法 Expired - Fee Related CN100500333C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP281660/2003 2003-07-29
JP2003281660A JP4489389B2 (ja) 2003-07-29 2003-07-29 微粒銀粉の製造方法

Publications (2)

Publication Number Publication Date
CN1826198A CN1826198A (zh) 2006-08-30
CN100500333C true CN100500333C (zh) 2009-06-17

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ID=34100960

Family Applications (1)

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CNB2004800209882A Expired - Fee Related CN100500333C (zh) 2003-07-29 2004-07-15 微粒银粉及其微粒银粉的制造方法

Country Status (8)

Country Link
US (1) US20070079665A1 (ja)
JP (1) JP4489389B2 (ja)
KR (1) KR101132283B1 (ja)
CN (1) CN100500333C (ja)
CA (1) CA2534108A1 (ja)
DE (1) DE112004001403T5 (ja)
TW (1) TW200503961A (ja)
WO (1) WO2005009652A1 (ja)

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CN102528070A (zh) * 2012-01-09 2012-07-04 上海龙翔新材料科技有限公司 利用高速射流生产纳米银粉的方法和装置

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JP4660780B2 (ja) * 2005-03-01 2011-03-30 Ｄｏｗａエレクトロニクス株式会社 銀粒子粉末の製造方法
JP4347381B2 (ja) * 2005-05-25 2009-10-21 ニホンハンダ株式会社 金属系被着体接着用ペースト状銀組成物、その製造方法および金属系被着体の接着方法
JP5148821B2 (ja) * 2005-09-20 2013-02-20 三井金属鉱業株式会社 フレーク銀粉の製造方法及び、その製造方法で製造されたフレーク銀粉
US20100167051A1 (en) * 2006-03-31 2010-07-01 Goia Dan V Process for Manufacture of Silver-Based Particles and Electrical Contact Materials
US7842274B2 (en) * 2006-03-31 2010-11-30 Umicore, S.A. Process for manufacture of silver-based particles and electrical contact materials
US20100009191A1 (en) * 2006-07-28 2010-01-14 Mitsubishi Materials Corporation Fine silver particles, production method thereof, and production apparatus therefor
EP3678198A1 (en) * 2008-01-17 2020-07-08 Nichia Corporation A method for producing an electronic device
US8836130B2 (en) 2009-01-23 2014-09-16 Nichia Corporation Light emitting semiconductor element bonded to a base by a silver coating
CN102292835B (zh) 2009-01-23 2015-03-25 日亚化学工业株式会社 半导体装置及其制造方法
EP3151268B1 (en) 2009-01-23 2020-04-01 Nichia Corporation Method of producing a semiconductor device by directly bonding silver oxide on a surface of a semiconductor element with silver or silver oxide on a surface of a base
US8231704B2 (en) * 2009-05-01 2012-07-31 E I Du Pont De Nemours And Company Silver particles and processes for making them
TW201043359A (en) * 2009-05-01 2010-12-16 Du Pont Silver particles and a process for making them
WO2011010659A1 (ja) 2009-07-21 2011-01-27 日亜化学工業株式会社 導電性材料の製造方法、その方法により得られた導電性材料、その導電性材料を含む電子機器、および発光装置
US20110048527A1 (en) * 2009-08-25 2011-03-03 E.I. Du Pont De Nemours And Company Silver thick film paste compositions and their use in conductors for photovoltaic cells
JP5617210B2 (ja) * 2009-09-14 2014-11-05 デクセリアルズ株式会社 光反射性異方性導電接着剤及び発光装置
JP2011080094A (ja) * 2009-10-02 2011-04-21 Toda Kogyo Corp 銀微粒子及びその製造方法、並びに該銀微粒子を含有する導電性ペースト、導電性膜及び電子デバイス
US8366799B2 (en) 2010-08-30 2013-02-05 E I Du Pont De Nemours And Company Silver particles and a process for making them
US8574338B2 (en) * 2010-11-17 2013-11-05 E I Du Pont De Nemours And Company Reactor and continuous process for producing silver powders
CN102528069B (zh) * 2010-12-10 2014-09-17 比亚迪股份有限公司 一种银粉的制备方法
KR101883709B1 (ko) * 2011-06-21 2018-08-01 스미토모 긴조쿠 고잔 가부시키가이샤 은분 및 그 제조 방법
CN102335751B (zh) * 2011-09-22 2013-07-10 上海交通大学 一种高分散超细球形银粉的制备方法
CN102513543A (zh) * 2011-12-06 2012-06-27 上海工程技术大学 一种制备超细银粉的微波加热还原工艺
JP6135405B2 (ja) * 2013-08-28 2017-05-31 住友金属鉱山株式会社 銀粉及びその製造方法
JP6115405B2 (ja) * 2013-08-28 2017-04-19 住友金属鉱山株式会社 銀粉の製造方法
CN103624267A (zh) * 2013-12-03 2014-03-12 浙江光达电子科技有限公司 一种连续法制备银粉的方法
KR101733165B1 (ko) * 2015-08-12 2017-05-08 엘에스니꼬동제련 주식회사 고온 소결형 도전성 페이스트용 은 분말의 제조방법
JP6900357B2 (ja) * 2017-12-15 2021-07-07 Ｄｏｗａエレクトロニクス株式会社 球状銀粉
JP6859305B2 (ja) * 2018-09-28 2021-04-14 Ｄｏｗａエレクトロニクス株式会社 銀粉およびその製造方法ならびに導電性ペースト
KR102302205B1 (ko) * 2018-10-04 2021-09-16 대주전자재료 주식회사 은 분말 및 이의 제조 방법
KR102263618B1 (ko) 2019-03-29 2021-06-10 대주전자재료 주식회사 혼합 은 분말 및 이를 포함하는 도전성 페이스트
KR102304950B1 (ko) * 2020-02-11 2021-09-24 원형일 저온 소결용 은 입자 제조 방법 및 이로부터 제조된 저온 소결용 은입자

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US4979985A (en) * 1990-02-06 1990-12-25 E. I. Du Pont De Nemours And Company Process for making finely divided particles of silver metal
JP3102454B2 (ja) * 1993-07-05 2000-10-23 株式会社村田製作所 導電性ペーストおよびそれを用いた多層セラミック電子部品の製造方法
JP4263799B2 (ja) * 1999-02-09 2009-05-13 Ｄｏｗａエレクトロニクス株式会社 鱗片状銀粉の製造方法
JP2001107101A (ja) * 1999-10-12 2001-04-17 Mitsui Mining & Smelting Co Ltd 高分散性球状銀粉末及びその製造方法
JP4185267B2 (ja) * 2001-07-25 2008-11-26 三井金属鉱業株式会社 銅粉、その銅粉の製造方法、その銅粉を用いた銅ペースト、及びその銅ペーストを用いたプリント配線板
JP2003129106A (ja) * 2001-10-25 2003-05-08 Murata Mfg Co Ltd ニッケル粉末の製造方法、ニッケル粉末、ニッケルペースト、積層セラミック電子部品
JP4109520B2 (ja) * 2002-09-12 2008-07-02 三井金属鉱業株式会社 低凝集性銀粉並びにその低凝集性銀粉の製造方法及びその低凝集性銀粉を用いた導電性ペースト

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银纳米粒子的制备及其表面特性研究. 李亚栋，贺蕴普，钱逸泰.化学物理学报，第12卷第4期. 1999 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102528070A (zh) * 2012-01-09 2012-07-04 上海龙翔新材料科技有限公司 利用高速射流生产纳米银粉的方法和装置
CN102528070B (zh) * 2012-01-09 2014-01-01 苏州银瑞光电材料科技有限公司 利用高速射流生产纳米银粉的方法和装置

Also Published As

Publication number Publication date
JP2005048237A (ja) 2005-02-24
TW200503961A (en) 2005-02-01
US20070079665A1 (en) 2007-04-12
KR101132283B1 (ko) 2012-04-02
TWI295666B (ja) 2008-04-11
CN1826198A (zh) 2006-08-30
KR20060040712A (ko) 2006-05-10
DE112004001403T5 (de) 2006-06-29
WO2005009652A1 (ja) 2005-02-03
JP4489389B2 (ja) 2010-06-23
CA2534108A1 (en) 2005-02-03

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