CN100474551C - Locating calibration device and locating calibration system - Google Patents
Locating calibration device and locating calibration system Download PDFInfo
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- CN100474551C CN100474551C CNB2006101125692A CN200610112569A CN100474551C CN 100474551 C CN100474551 C CN 100474551C CN B2006101125692 A CNB2006101125692 A CN B2006101125692A CN 200610112569 A CN200610112569 A CN 200610112569A CN 100474551 C CN100474551 C CN 100474551C
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Abstract
The present invention discloses a location-and-calibration device and a location-and-calibration system for this device. The location-and-calibration device includes a base, an outer location device and an inner location device, which can simultaneously locate and calibrate a wafer. The outer location device includes an outer rotating frame on which several fasten arms are fixed; the each fasten arm has fasten blocks which can locate and fasten wafer. The inner location device includes an inner rotating frame on which several vacuum holes are set; a wafer can be adsorbed onto surface of the inner rotating frame by vacuum. The location-and-calibration system includes manipulators matched to the location-and-calibration device, which can simultaneously locate two wafers to corresponding positions on the outer and inner location devices, and also simultaneously carry two wafers from the outer and inner location devices. The present invention has compact structure, simple operation and high efficiency, and is applied to locate and calibrate sheet objects, especially for wafers.
Description
Technical field
The present invention relates to a kind of chip etching equipment, relate in particular to a kind of locating calibration device and use this locating calibration device locating calibration system.
Background technology
In the transmission system of 300mm chip etching equipment, the transmission path of wafer is to be taken out from Pod (wafer storehouse) by the atmosphere manipulator, be placed on the Aligner (location calibrator) among the EFEM (the preposition module of atmosphere) and position calibration, and then will calibrate good wafer and be transferred among the Load Lock (vacuum load lock) with the atmosphere manipulator, and then the vacuum mechanical-arm in the transmission chamber again from Load Lock the taking-up wafer be placed into and carry out manufacturing process in each processing chamber.
Generally, realize Notch (breach) location and the centralized positioning of wafer with Aligner, its implementation has two kinds, a kind of is the vacuum adsorption type calibration, the wafer that soon obtains from the atmosphere manipulator is placed on the Aligner, and by applying low vacuum that wafer absorption is fixing, Aligner carries wafer and does high speed rotating then, and with sensor in the rotary course to side-play amount be notified to the atmosphere manipulator, the atmosphere manipulator is then taken wafer away with revised side-play amount once more.Another kind of mode is the edge method of clamping, the wafer that soon obtains from the atmosphere manipulator is placed on the fixture of Aligner, because the Clamping Center of three grip blocks is the center of wafer, thereby be easy to realize the centralized positioning of wafer, and then carry wafer by fixture and do the Notch location that high speed rotating is realized wafer.
The characteristics of above-mentioned two kinds of structures are, all are that single-wafer is carried out centralized positioning and Notch location.All be only single wafer to be calibrated the location in sometime, so this has reduced the location efficiency of Aligner beyond doubt, thereby also brought influence to overall system efficiency.
Summary of the invention
The purpose of this invention is to provide a kind of easy to use, locating calibration device and locating calibration system that efficient is high.
The objective of the invention is to be achieved through the following technical solutions:
Locating calibration device of the present invention, comprise pedestal, pedestal is provided with positioner and transducer, it is characterized in that, described positioner comprises external position device and interior locating device, and described external position device and interior locating device can position a wafer respectively simultaneously; Described transducer can detect calibration to each piece wafer respectively.
Described external position device and interior locating device are coaxial, divide two-layer layout up and down, can distinguish wafer of clamping and rotate around axis, realize the location to wafer; Described transducer comprises upper sensor and lower sensor, and upper sensor can detect calibration separately to the upper chip of external position device clamping, and lower sensor can detect calibration separately to the lower chip of interior locating device clamping.
Described external position device comprises outer rotary disk, is fixed with a plurality of clamping limbs on the outer rotary disk, is respectively equipped with grip block on each clamping limb, and wafer can be located and clamp to the grip block acting in conjunction on a plurality of clamping limbs.
Described clamping limb has three, and equal angles is arranged.
The bottom of described grip block is provided with slide rail, radially is provided with sliding-rail groove on the corresponding clamping limb, and slide rail places sliding-rail groove, and grip block can move forward and backward along slide rail.
Be respectively equipped with groove on the corresponding clamping face of described a plurality of grip blocks, described groove positions and clamps wafer; Also be provided with liner in the groove, be used to protect the edge of wafer not to be damaged.
Described interior locating device comprises interior rotary disk, and described interior rotary disk is provided with vacuum hole, the surface of rotary disk in can chip sucking being attached to by vacuum.
Also be provided with a plurality of thimbles on the rotary disk in described, be used for supporting wafers.
Described locating calibration system also comprises manipulator, described manipulator comprises two mechanical arms, every mechanical arm is connected with driver by independent driving shaft, and two mechanical arms can got under the driving of driver on the external position device and the corresponding position of interior locating device that two wafers are put in above-mentioned locating calibration device simultaneously; And the wafer on external position device and the interior locating device can be taken out simultaneously.
The end of described every mechanical arm is connected with a sucker or holder fork respectively, is used to grasp wafer.
As seen from the above technical solution provided by the invention, locating calibration device of the present invention and locating calibration system, owing to comprise external position device and interior locating device, described external position device and interior locating device can position a wafer respectively simultaneously; Like this, just can position calibration to two wafers simultaneously, improve operating efficiency.External position device and interior locating device coaxial arrangement, upper sensor and lower sensor can detect calibration separately, compact conformation, easy to use to the upper chip of external position device clamping and the lower chip of interior locating device clamping respectively.
Again because locating calibration system of the present invention, also comprise the manipulator that is used with locating calibration device, described manipulator comprises two mechanical arms, every mechanical arm is connected with driver by independent driving shaft, and two mechanical arms can got under the driving of driver on the external position device and the corresponding position of interior locating device that two wafers are put in above-mentioned locating calibration device simultaneously; And the wafer on external position device and the interior locating device can be taken out simultaneously, further improved operating efficiency.
Description of drawings
Fig. 1 is the facade structures schematic diagram of locating calibration device of the present invention;
Fig. 2 is the planar structure schematic diagram of locating calibration device of the present invention;
Fig. 3 is the facade structures schematic diagram of manipulator of the present invention;
Fig. 4 is the planar structure schematic diagram of manipulator of the present invention;
Fig. 5 picks and places the facade state reference map of wafer from locating calibration device for manipulator of the present invention;
Fig. 6 picks and places the flat state reference diagram of wafer from locating calibration device for manipulator of the present invention;
The state reference map of Fig. 7 during for locating calibration device calibration chip of the present invention.
Embodiment
The preferable embodiment of the present invention as shown in Figure 1 and Figure 2, comprise pedestal 1, pedestal 1 is provided with positioner and transducer, positioner comprises external position device and interior locating device, described external position device and interior locating device can position a wafer respectively simultaneously, and transducer can detect calibration to each piece wafer respectively.
External position device and interior locating device are coaxial, can adopt same servomotor to control, also can adopt servomotor to control separately, divide two-layer layout up and down, external position device and interior locating device are independent of each other, can distinguish wafer of clamping and rotate, realize location wafer around axis; Transducer comprises upper sensor 2 and lower sensor 3, in the bottom of pedestal 1 direct light type lower sensor 2 is installed, because the direct light type transducer can set irradiation distance, thereby can be separately the lower chip 3 of interior locating device clamping be detected calibration.Simultaneously, direct light type upper sensor 3 is installed on upper sensor support bar 17, can be separately the upper chip 4 of external position device clamping be detected calibration at an end of pedestal 1.
External position device comprises outer rotary disk 6, is fixed with a plurality of clamping limbs 7 on the outer rotary disk 6, and equal angles arranges that clamping limb 7 preferably has three, becomes 120 degree angles each other.Be respectively equipped with grip block 8 on each clamping limb 7, wafer can be located and clamp to grip block 8 actings in conjunction on a plurality of clamping limbs 7.The bottom of grip block 8 is provided with slide rail, radially is provided with sliding-rail groove on the corresponding clamping limb 7, and slide rail places sliding-rail groove, and grip block 7 can move forward and backward along slide rail, realizes clamping action.
Be respectively equipped with groove 9 on the corresponding clamping face of each grip block 7,9 pairs of wafers of described groove position and clamp; Also be provided with liner in the groove 9, be used to protect the edge of wafer not to be damaged, liner adopts PEEK (polyether-ether-ketone) material.
Interior locating device comprises interior rotary disk 10, is arranged on the middle cavities of outer rotary disk 6, and interior rotary disk 10 is provided with vacuum hole 11, the surface of rotary disk 10 in can chip sucking being attached to by vacuum.Also be provided with a plurality of thimbles 12 on the interior rotary disk 10, preferably three, be used for supporting wafers, thimble can be flexible up and down on the surface of interior rotary disk 10.
The locating calibration system of using above-mentioned locating calibration device also comprises manipulator, as shown in Figure 3, Figure 4, manipulator comprises two mechanical arms 13, every mechanical arm 13 is connected with driver 14 by independent driving shaft, and two mechanical arms 13 can got under the driving of driver 14 on the external position device and the corresponding position of interior locating device that two wafers are put in above-mentioned locating calibration device simultaneously; And the wafer on external position device and the interior locating device can be taken out simultaneously.The end of every mechanical arm 13 is connected with a holder fork 16 respectively, be used to grasp wafer, around the holder fork 16 vacuum hole can be set, be used for adsorbing fixing to holder fork 16 wafers of holding, also can not establish vacuum hole, and the bigger material of one deck coefficient of friction being set on the surface of holder fork 16, the end of mechanical arm 13 also can not connect holder fork 16, and uses sucker or other form instead.
The operation principle of above-mentioned locating calibration device and locating calibration system is such:
When placing wafer in locating calibration device, the holder of two mechanical arm 13 ends of manipulator fork 16 takes out wafer respectively fast from Pod, get wafer after, holder fork 16 is asking wafer to extend into the inside of locating calibration device simultaneously.
When locating calibration device when manipulator is accepted wafer, as Fig. 5, shown in Figure 6, upper and lower holder fork 16 holders of manipulator carry two wafer and stretch near the center of locating calibration device, allow the driving shaft of two manipulators segment distance that descends simultaneously then, at this moment for lower chip 5, three thimbles 12 on the interior rotary disk 10 support the lower surface of lower chip 5, and the subiculum fork 16 of manipulator breaks away from the lower surface of lower chip 5.
For upper chip 4, the plane of upper chip 4 is in same plane with the groove of seizing on both sides by the arms of seizing piece 8 on both sides by the arms, and pop-up fork 16 holders of manipulator carry the lower surface of upper chip 4.At this moment, seize piece 8 on both sides by the arms for three and be in the distal-most end of seizing arm 7 on both sides by the arms, then, seizing piece 8 outside rotary disks 6 centers on both sides by the arms with three shrinks, then the edge of upper chip 4 is seized on both sides by the arms, and when the driving shaft of manipulator descended, the lower surface of upper chip 4 broke away from machinery pop-up fork 16 on hand.
This moment, the wafer of upper and lower layer all broke away from holder fork 16, then the manipulator upper and lower holder fork 16 of withdrawing simultaneously.
When locating calibration device is calibrated the location to wafer, as shown in Figure 7, under the driving of servomotor, seizing piece 8 on both sides by the arms for three is seizing upper chip 4 on both sides by the arms and is doing high speed rotating around the locating calibration device axle center, because the center that three centers of seizing on both sides by the arms after piece 8 shrinks are outer rotary disk 6 is the center of wafer just, has realized the centralized positioning of upper chip 4 thus.By the irradiation distance of direct light type upper sensor 2 is set, upper sensor 2 is only worked to upper chip 4 then, detect the position of the Notch (breach) of upper chip 4, and the information of upper chip 4 is notified to manipulator by upper sensor 2.
When upper chip 4 is done high speed rotating, three thimbles 12 that support lower chip 5 fall to being withdrawn in the interior rotary disk 10 simultaneously, the lower surface of lower chip 5 is contacted with the surface of interior rotary disk 10, apply certain vacuum by technology vacuum hole 11 then, chip sucking is attached on the surface of interior rotary disk 10.After the upper chip high-speed motion finishes, servomotor begins to drive interior rotary disk 10, make lower chip 5 with interior rotary disk 10 rotations, by the irradiation distance of the direct light type lower sensor 3 on the pedestal 1 is set, lower sensor 3 is only worked to lower chip 5, detect the center and Notch (breach) position of lower chip 5 by lower sensor 3, and the information of lower chip 5 is notified to manipulator.
More than can carry out synchronously upper chip and lower chip location process, also can carry out in proper order successively.
Locating calibration device is to last, after finish the lower chip location, technology vacuum hole 11 in the interior rotary disk 10 of locating calibration device will no longer apply low vacuum, three thimbles 12 in the interior then rotary disk 10 are with lower chip 5 jack-up, at this moment two of manipulator mechanical arms extend in the locating calibration device with revised wafer side-play amount simultaneously, the manipulator a bit of distance that vertically rises then, the pop-up fork 16 of manipulator is just in time contacted with the lower surface of upper chip 4, subiculum fork 16 holds up lower chip 5 just, the piece 8 of seizing on both sides by the arms of seizing upper chip 4 then on both sides by the arms moves outside locating calibration device along slide rail, and upper chip 4 lower surfaces are placed on the pop-up fork 16 of atmosphere manipulator.This moment, two wafer all were placed on the holder fork 16 of atmosphere manipulator.
Finish the location calibration of locating calibration device thus to wafer.Then, two mechanical arms 13 of manipulator are withdrawn simultaneously, and wafer transfer is arrived next manufacturing process.
Locating calibration device among the present invention and locating calibration system are a kind of function composite structures, compare with other two kinds of structures in the past, can position calibration to two wafer simultaneously, thereby with carry out the calibration of a slice wafer orientation for twice separately and compare, obviously shortened the time of location calibration, thereby shortened the transmission time of whole transmit stage, improved efficiency of transmission.
The riding position of the transducer in the locating calibration device among the present invention can be selected not to be installed on the locating calibration device, but select to be installed on other the external support members according to operating position.The contour structures of seizing piece simultaneously on both sides by the arms also can be difformity.
The above; only for the preferable embodiment of the present invention, but protection scope of the present invention is not limited thereto, and anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; the variation that can expect easily or replacement all should be encompassed within protection scope of the present invention.
Claims (9)
1, a kind of locating calibration device, comprise pedestal, pedestal is provided with positioner and transducer, it is characterized in that, described positioner comprises external position device and interior locating device, and described external position device and interior locating device can position a wafer respectively simultaneously; Described transducer can detect calibration to each piece wafer respectively;
Described external position device and interior locating device are coaxial, divide two-layer layout up and down, can distinguish wafer of clamping and rotate around axis, realize the location to wafer; Described transducer comprises upper sensor and lower sensor, and upper sensor can detect calibration separately to the upper chip of external position device clamping, and lower sensor can detect calibration separately to the lower chip of interior locating device clamping.
2, locating calibration device according to claim 1, it is characterized in that described external position device comprises outer rotary disk, be fixed with a plurality of clamping limbs on the outer rotary disk, be respectively equipped with grip block on each clamping limb, wafer can be located and clamp to the grip block acting in conjunction on a plurality of clamping limbs.
3, locating calibration device according to claim 2 is characterized in that, described clamping limb has three, and equal angles is arranged.
4, according to claim 2 or 3 described locating calibration devices, it is characterized in that the bottom of described grip block is provided with slide rail, radially be provided with sliding-rail groove on the corresponding clamping limb, slide rail places sliding-rail groove, and grip block can move forward and backward along slide rail.
5, locating calibration device according to claim 2 is characterized in that, is respectively equipped with groove on the corresponding clamping face of described a plurality of grip blocks, and described groove positions and clamps wafer; Also be provided with liner in the groove, be used to protect the edge of wafer not to be damaged.
6, locating calibration device according to claim 1 is characterized in that, described interior locating device comprises interior rotary disk, and described interior rotary disk is provided with vacuum hole, the surface of rotary disk in can chip sucking being attached to by vacuum.
7, locating calibration device according to claim 6 is characterized in that, also is provided with a plurality of thimbles on the described interior rotary disk, is used for supporting wafers.
8, a kind of application rights requires the locating calibration system of 1 to 7 each described locating calibration device, it is characterized in that, described locating calibration system also comprises manipulator, described manipulator comprises two mechanical arms, every mechanical arm is connected with driver by independent driving shaft, and two mechanical arms can got under the driving of driver on the external position device and the corresponding position of interior locating device that two wafers are put in above-mentioned locating calibration device simultaneously; And the wafer on external position device and the interior locating device can be taken out simultaneously.
9, locating calibration system according to claim 8 is characterized in that, the end of described every mechanical arm is connected with a sucker or holder fork respectively, is used to grasp wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101125692A CN100474551C (en) | 2006-08-23 | 2006-08-23 | Locating calibration device and locating calibration system |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2006101125692A CN100474551C (en) | 2006-08-23 | 2006-08-23 | Locating calibration device and locating calibration system |
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| CN101131953A CN101131953A (en) | 2008-02-27 |
| CN100474551C true CN100474551C (en) | 2009-04-01 |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101738500B (en) * | 2008-11-20 | 2013-01-16 | 未来产业株式会社 | Equipment for correcting user tray position and test processor |
| CN102534551B (en) * | 2010-12-17 | 2014-08-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Semiconductor equipment |
| CN103811292B (en) * | 2012-11-07 | 2016-08-10 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Silicon chip process and treat system and processing method |
| CN103972135B (en) * | 2013-01-25 | 2017-02-22 | 上海微电子装备有限公司 | Silicon wafer accurate positioning and conveying device and positioning method |
| CN107818932B (en) * | 2013-09-09 | 2020-02-14 | 北京北方华创微电子装备有限公司 | Turntable positioning device, loading and conveying system and plasma processing equipment |
| FR3052869B1 (en) * | 2016-06-17 | 2018-06-22 | Unity Semiconductor | DEVICE FOR POSITIONING AN INTEGRATED CIRCUIT PLATE, AND APPARATUS FOR INSPECTING AN INTEGRATED CIRCUIT PLATE COMPRISING SUCH A POSITIONING DEVICE |
| JP6948873B2 (en) * | 2017-07-31 | 2021-10-13 | 東京エレクトロン株式会社 | How to calibrate the measuring instrument and the case |
| CN107887318A (en) * | 2017-12-15 | 2018-04-06 | 广东工业大学 | A kind of wafer disks positioner |
| CN112530850A (en) * | 2020-12-04 | 2021-03-19 | 北京北方华创微电子装备有限公司 | Calibration method for station position in process chamber and semiconductor process equipment |
| CN114311346B (en) * | 2022-03-16 | 2022-06-07 | 江苏京创先进电子科技有限公司 | Wafer and workbench alignment identification method |
| CN116141259B (en) * | 2023-04-24 | 2023-06-20 | 南京仁厚科技有限公司 | Graphite boat assembly calibrating device and graphite boat |
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No. Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100016, building 2, block M5, No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |