CN100465787C - Formation of graphic diaphragm layer and barrier - Google Patents
Formation of graphic diaphragm layer and barrier Download PDFInfo
- Publication number
- CN100465787C CN100465787C CNB2004100913891A CN200410091389A CN100465787C CN 100465787 C CN100465787 C CN 100465787C CN B2004100913891 A CNB2004100913891 A CN B2004100913891A CN 200410091389 A CN200410091389 A CN 200410091389A CN 100465787 C CN100465787 C CN 100465787C
- Authority
- CN
- China
- Prior art keywords
- layer
- photoresist layer
- graphical photoresist
- material layer
- barrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Gas-Filled Discharge Tubes (AREA)
Abstract
A method for preparing patternized film layer includes forming patternized light-blocking layer on material layer and exposing partial material layer, removing exposed material layer off to form patternized film layer on substrate, sticking glue tape on light-blocking layer and taking light-blocking layer off from patternized film layer because adhesion force between glue tape and patternized light-blocking layer is greater than adhesion force between patternized light-blocking layer and patternized film layer.
Description
Technical field
The invention relates to a kind of graphical manufacturing process, and particularly about the invention of the formation method of a kind of graphic diaphragm layer and barrier.
Background technology
Comparatively general graphical manufacturing process comprises screen painting manufacturing process and cinephotomicrography/etching manufacturing process at present.With cinephotomicrography/etching manufacturing process, be well known that and utilize the cinephotomicrography manufacturing process on rete, to make graphical photoresist layer earlier.Then, be mask with this graphical photoresist layer again, this rete is carried out the etching manufacturing process, with the design transfer of graphical photoresist layer so far on the rete.Afterwards, again with wet type or dry type removing photoresistance methods such as chemical solution or plasmas, graphical photoresist layer is removed on the rete thus.
Yet, in the removing photoresistance manufacturing process of above-mentioned wet type or dry type, in order to the chemical solvent that removes photoresistance or plasma except with graphical photoresist layer to be removed contacts, still can contact with other rete of graphical photoresist layer below, thereby these retes are caused damage, and then cause the manufacturing process qualification rate to descend.
Summary of the invention
In view of this, purpose of the present invention is just providing the formation method of a kind of graphic diaphragm layer and barrier, can improve the qualification rate of manufacturing process.
The present invention proposes a kind of graphic diaphragm layer formation method, at first form graphical photoresist layer on material layer, and this graphical photoresist layer exposes the material layer of part.Then, remove the part material layer that exposes, to form graphic diaphragm layer.Afterwards, make adhesive tape stick on the graphical photoresist layer, then remove adhesive tape again, separate with graphic diaphragm layer so that graphical photoresist layer attaches on the adhesive tape.Wherein, the adhesion between adhesive tape and the graphical photoresist layer is greater than the adhesion between graphical photoresist layer and the graphic diaphragm layer.
The present invention reintroduces a kind of formation method of graphic diaphragm layer, and this method is prior to the graphical photoresist layer of formation on the material layer, and this graphical photoresist layer exposes the material layer of part.Then, remove the part material layer that exposes, to form graphic diaphragm layer.The viscose cylinder of order with stickiness surface rolls on graphical photoresist layer more afterwards, separates with graphic diaphragm layer so that graphical photoresist layer attaches on the stickiness surface of viscose cylinder.Wherein, the adhesion between the stickiness of viscose cylinder surface and the graphical photoresist layer is greater than the adhesion between graphical photoresist layer and the graphic diaphragm layer.
The present invention proposes a kind of formation method of barrier, is suitable for forming the barrier of plasma display, and the formation method of this barrier is that substrate is provided earlier, has been formed with a plurality of addressing electrodes and a dielectric layer on this substrate.Wherein, dielectric layer covers these addressing electrodes.Continue it, form spacer material layer on dielectric layer, and form graphical photoresist layer on spacer material layer, this graphical photoresist layer exposes the part spacer material layer corresponding to these addressing electrodes.Then, remove the part spacer material layer of exposure, to form barrier.Next, adhesive tape is attached on the graphical photoresist layer, wherein the adhesion between adhesive tape and the graphical photoresist layer is greater than the adhesion between graphical photoresist layer and the barrier.Afterwards, remove adhesive tape, separate with barrier so that graphical photoresist layer attaches on the adhesive tape.
The present invention reintroduces a kind of formation method of barrier, is suitable for forming in plasma display barrier, the formation method of this barrier, and it at first provides substrate, and has been formed with a plurality of addressing electrodes and a dielectric layer on this substrate.Wherein, dielectric layer covers these addressing electrodes.Continue it, form spacer material layer on dielectric layer, and form graphical photoresist layer on spacer material layer, this graphical photoresist layer exposes the part spacer material layer corresponding to these addressing electrodes.Then, remove the part spacer material layer of exposure to form barrier.Next, provide the viscose cylinder, this viscose cylinder has the stickiness surface.Afterwards, rolling viscose cylinder on graphical photoresist layer, because the adhesion between the stickiness of viscose cylinder surface and the graphical photoresist layer is greater than the adhesion between graphical photoresist layer and the barrier, so graphically photoresist layer can attach on the stickiness surface of viscose cylinder and separates with barrier.
In the formation method of the present invention's graphic diaphragm layer and barrier, use adhesive means (adhesive tape or viscose cylinder) to remove the photoresist layer in the graphical manufacturing process, so can't cause damage to other retes, so the present invention can put forward the qualification rate of accusing the element manufacturing.
State with other purpose, feature and advantage and can become apparent on the present invention for allowing, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Figure 1A is to the flow process diagrammatic cross-section of Fig. 1 D for formation graphic diaphragm layer in one of the present invention preferred embodiment.
Fig. 2 is for forming the part flow process diagrammatic cross-section of graphical photoresist layer in one of the present invention preferred embodiment.
Fig. 3 is for forming the part flow process diagrammatic cross-section of graphic diaphragm layer in another preferred embodiment of the present invention.
Fig. 4 A is the flow process diagrammatic cross-section that forms the method for barrier in a preferred embodiment of the present invention to Fig. 4 F.
Fig. 5 is the synoptic diagram of the another kind of barrier method for making in the preferred embodiment of the present invention.
The main element description of symbols
100: substrate
110: material layer
120: photoresist layer
130: graphical photoresist layer
140: graphic diaphragm layer
150: adhesive tape
160: the viscose cylinder
162: the stickiness surface
310: substrate
320: addressing electrode
330: dielectric layer
340: spacer material layer
350: graphical photoresist layer
360: barrier
370: adhesive tape
380: the viscose cylinder
382: the stickiness surface
Embodiment
Figure 1A is to the flow process diagrammatic cross-section of Fig. 1 D for formation graphic diaphragm layer in one of the present invention preferred embodiment.Shown in Figure 1A, at first on substrate 100, form material layer 110, then on material layer 110, form graphical photoresist layer 130, and graphical photoresist layer 130 exposes the material layer 110 of part.Fig. 2 is for forming the part flow process diagrammatic cross-section of graphical photoresist layer in one of the present invention preferred embodiment.Wherein, the formation method of graphical photoresist layer 130 for example is prior to forming 120 (as shown in Figure 2) of one deck photoresist layer on the material layer 110, again photoresist layer 120 being carried out the cinephotomicrography manufacturing process afterwards, to form graphical photoresist layer 130.
Shown in Figure 1B, remove the part material layer 110 that graphical photoresist layer 130 is exposed, with the design transfer of graphical photoresist layer 130 to material layer 110, and then form graphic diaphragm layer 140.In one embodiment, the method that removes the part material layer 110 that exposes for example is to be mask and material layer 110 is carried out dry type or Wet-type etching with graphical photoresist layer 130.
Shown in Fig. 1 C, adhesive tape 150 is attached on the graphical photoresist layer 130.Wherein, adhesive tape 150 for example is general common adhesive tape.Specifically, the adhesion between adhesive tape 150 and the graphical photoresist layer 130 is greater than the adhesion between graphical photoresist layer 130 and the graphic diaphragm layer 140.In a preferred embodiment, before adhesive tape 150 being attached on the graphical photoresist layer 130, first heating adhesive tape 150 increasing the tackness of adhesive tape 150, and then improves the adhesion between graphical photoresist layer 130 and the adhesive tape 150.
Shown in Fig. 1 D, adhesive tape 150 is removed from substrate 100.At this moment, because the adhesion between adhesive tape 150 and the graphical photoresist layer 130 is greater than the adhesion between graphical photoresist layer 130 and the graphic diaphragm layer 140, so when removing adhesive tape 150, can in the lump graphical photoresist layer 130 be removed from graphic diaphragm layer 140.This promptly finishes the making of graphic diaphragm layer 140.
In addition, in another embodiment of the present invention, can also replace the adhesive tape 150 in the foregoing description with viscose cylinder 160 with stickiness surface 162.Fig. 3 is the part flow process diagrammatic cross-section of the formation graphic diaphragm layer in another preferred embodiment of the present invention.After finishing the illustrated etching manufacturing process of Figure 1B, then utilize the viscose cylinder 160 among Fig. 3 on graphical photoresist layer 130, to roll, so that graphical photoresist layer 130 is removed on graphic diaphragm layer 140.Wherein, this viscose cylinder 160 has stickiness surface 162, and because the adhesion between the stickiness of viscose cylinder 160 surface 162 and the graphical photoresist layer 130 is greater than the adhesion between graphical photoresist layer 130 and the graphic diaphragm layer 140, so on graphical photoresist layer 130 in the rolling viscose cylinder 160, graphical photoresist layer 130 is attached on the stickiness surface 162 of viscose cylinder 160, and then graphical photoresist layer 130 is separated with graphic diaphragm layer 140, to finish the graphic diaphragm layer 140 shown in Fig. 1 D.Similarly, before rolling viscose cylinder 160 on the graphical photoresist layer 130, can also carry out heat treated to the stickiness surface 162 of viscose cylinder 160,, and then in the step that removes graphical photoresist layer 130, reach preferable effect with the tackness on the stickiness surface 162 that increases viscose cylinder 160.
To be example with the manufacturing process of the barrier of plasma display below, with explanation the present invention's application, but it be not in order to limit the present invention's application surface.The ordinary skill of technical field that the present invention belongs to should be understood that the present invention can be applicable to any desire and forms in the manufacturing process of graphic diaphragm layer.
Fig. 4 A is the flow process diagrammatic cross-section that forms the method for barrier in a preferred embodiment of the present invention to Fig. 4 F.Shown in Fig. 4 A, at first, provide substrate 310, be formed with a plurality of addressing electrodes 320 and a dielectric layer 330 on this substrate 310.Wherein, dielectric layer 330 covers these addressing electrodes 320.Continue it, shown in Fig. 4 B, on dielectric layer 330, form spacer material layer 340.Come, shown in Fig. 4 C, form graphical photoresist layer 350 on spacer material layer 340, this graphical photoresist layer 350 exposes the part spacer material layer 340 corresponding to addressing electrode 320.At this, the formation method of graphical photoresist layer 350 for example is the formation method of the graphical photoresist layer 130 (as shown in Figure 2) in the previous embodiment, therefore will repeat no more herein.
Afterwards, shown in Fig. 4 D, remove the part spacer material layer 340 that graphical photoresist layer 350 is exposed, with the design transfer of graphical photoresist layer 350 on spacer material layer 340.In a preferred embodiment, the method that removes the part spacer material layer 340 that exposes for example is to be mask and spacer material layer 340 is carried out the action of sandblast (sandblasting) with graphical photoresist layer 350.
Shown in Fig. 4 E, adhesive tape 370 is attached on the graphical photoresist layer 350.Wherein, adhesive tape 370 for example is general common adhesive tape.Particularly, the adhesion between adhesive tape 370 and the graphical photoresist layer 350 is greater than the adhesion between graphical photoresist layer 350 and the spacer material layer 340.In a preferred embodiment, before adhesive tape 370 being attached on the graphical photoresist layer 350, first heating adhesive tape 370, increasing the tackness of adhesive tape 370, and then improve graphical photoresist layer 350 and and adhesive tape 370 between adhesion.
Afterwards, shown in Fig. 4 F, remove adhesive tape 370 and the graphical photoresist layer 350 that attaches on the adhesive tape 370, to form barrier 360.Particularly, in the manufacturing process of present plasma display, can after removing graphical photoresist layer 350, carry out screen printing manufacturing process repeatedly again, usually so that barrier 360 reaches required thickness (shown in Fig. 4 F).
In addition, in another embodiment of the present invention, can also replace the adhesive tape 370 in the foregoing description with viscose cylinder 380 with stickiness surface 382.Fig. 5 is the part flow process diagrammatic cross-section of the barrier formation method in another preferred embodiment of the present invention.After the step of finishing 360 making of the illustrated barrier of Fig. 4 D, then utilize the viscose cylinder 380 among Fig. 5 on graphical photoresist layer 350, to roll, so that graphical photoresist layer 350 is removed on spacer material layer 340.Wherein, this viscose cylinder 380 has stickiness surface 382, and because the adhesion between the stickiness of viscose cylinder 380 surface 382 and the graphical photoresist layer 350 is greater than the adhesion between graphical photoresist layer 350 and the spacer material layer 340, so on graphical photoresist layer 350 in the rolling viscose cylinder 380, graphical photoresist layer 350 is attached on the stickiness surface 382 of viscose cylinder 380, and then graphical photoresist layer 350 is separated with spacer material layer 340.Similarly, before rolling viscose cylinder 380 on the graphical photoresist layer 350, can also carry out heat treated to the stickiness surface 382 of viscose cylinder 380,, and then in the step that removes graphical photoresist layer 350, reach preferable effect with the tackness on the stickiness surface 382 that increases viscose cylinder 380.
The formation method of the present invention's graphic diaphragm layer and barrier uses adhesive means (adhesive tape or viscose cylinder) to remove the photoresist layer in the graphical manufacturing process, so can't cause damage to other retes.For instance, when the present invention is applied in the making of barrier in the plasma display, can avoid hurting the addressing electrode that is positioned at the barrier below, and then improve the manufacturing process qualification rate.
In sum, the formation method of the present invention's graphic diaphragm layer and barrier has following advantage:
(1) because the present invention needn't use chemical solvent or plasma to remove graphical photoresist layer, therefore can avoid chemical solvent or plasma to cause damage, and then improve the qualification rate on the manufacturing process for the rete outside the graphical photoresistance.
(2) the present invention removes graphical photoresist layer by the stickiness of adhesive tape or viscose cylinder, therefore can simplify the step that removes graphical photoresist layer, and reduces the manufacturing process cost.
Though the present invention with preferred embodiment openly as above; right its is not in order to limit the present invention; the ordinary skill of any technical field that the present invention belongs to; in thought that does not break away from the present invention and scope; when can doing a little change and improvement, so the present invention's protection domain is as the criterion when looking claims person of defining.
Claims (12)
1. the formation method of a graphic diaphragm layer is characterized in that comprising at least:
Form graphical photoresist layer on material layer, this graphical photoresist layer exposes this material layer of part;
Remove this material layer of part that exposes, to form this graphic diaphragm layer;
Adhesive tape is attached on this graphical photoresist layer, and the adhesion between this adhesive tape and this graphical photoresist layer is greater than the adhesion between this graphical photoresist layer and this graphic diaphragm layer; And
Remove this adhesive tape, and this graphical photoresist layer attaches on this adhesive tape and separates with this graphic diaphragm layer.
2. according to the formation method of the described graphic diaphragm layer of claim 1, the method that it is characterized in that removing this material layer of part that exposes comprises that with this graphical photoresist layer be mask and this material layer is carried out dry-etching or Wet-type etching.
3. according to the formation method of the described graphic diaphragm layer of claim 1, it is characterized in that after removing this material layer of part that exposes, and before being attached at this adhesive tape on this graphical photoresist layer, also comprise this adhesive tape of heating.
4. the formation method of a graphic diaphragm layer is characterized in that comprising at least:
Form graphical photoresist layer on material layer, this graphical photoresist layer exposes this material layer of part;
Remove this material layer of part that exposes, to form this graphic diaphragm layer; And
The viscose cylinder is provided, and this viscose cylinder has the stickiness surface;
This viscose cylinder rolls on this graphical photoresist layer, so that this graphical photoresist layer attaches on this stickiness surface of this viscose cylinder, and separate with this graphic diaphragm layer, and the adhesion between this stickiness of this viscose cylinder surface and this graphical photoresist layer is greater than the adhesion between this graphical photoresist layer and this graphic diaphragm layer.
5. according to the formation method of the described graphic diaphragm layer of claim 4, the method that it is characterized in that removing this material layer of part that exposes comprises that with this graphical photoresist layer be mask and this material layer carries out dry-etching or Wet-type etching.
6. according to the formation method of the described graphic diaphragm layer of claim 4, it is characterized in that after this viscose cylinder is provided, and before this viscose cylinder that rolls on this graphical photoresist layer, also comprise this stickiness surface of this viscose cylinder is heated.
7. the formation method of a barrier is suitable for forming barrier in plasma display, it is characterized in that the formation method of this barrier comprises at least:
Substrate is provided, has been formed with a plurality of addressing electrodes and a dielectric layer on this substrate, and this dielectric layer covers above-mentioned these addressing electrodes;
On this dielectric layer, form spacer material layer;
Form graphical photoresist layer on this spacer material layer, this graphical photoresist layer exposes this spacer material layer of part corresponding to above-mentioned these addressing electrodes;
Remove this spacer material layer of part of exposure, to form this barrier;
Adhesive tape is attached on this graphical photoresist layer, and the adhesion between this adhesive tape and this graphical photoresist layer is greater than the adhesion between this graphical photoresist layer and this barrier; And
Remove this adhesive tape, and this graphical photoresist layer attaches on this adhesive tape and separates with this barrier.
8. according to the formation method of the described barrier of claim 7, the method that it is characterized in that removing this spacer material layer of part that exposes comprises that with this graphical photoresist layer be mask and this spacer material layer is carried out sandblast.
9. according to the formation method of the described graphic diaphragm layer of claim 7, it is characterized in that after removing this spacer material layer of part that exposes, and before being attached at this adhesive tape on this graphical photoresist layer, also comprise this adhesive tape of heating.
10. the formation method of a barrier is suitable for forming barrier in plasma display, it is characterized in that the formation method of this barrier comprises at least:
Substrate is provided, has been formed with a plurality of addressing electrodes and a dielectric layer on this substrate, and this dielectric layer covers above-mentioned these addressing electrodes;
On this dielectric layer, form spacer material layer;
Form graphical photoresist layer on this spacer material layer, this graphical photoresist layer exposes this spacer material layer of part corresponding to above-mentioned these addressing electrodes;
Remove this spacer material layer of part of exposure, to form this barrier;
The viscose cylinder is provided, and this viscose cylinder has the stickiness surface;
This viscose cylinder rolls on this graphical photoresist layer, so that this graphical photoresist layer attaches on this stickiness surface of this viscose cylinder, and separate with this barrier, and the adhesion between this stickiness of this viscose cylinder surface and this graphical photoresist layer is greater than the adhesion between this graphical photoresist layer and this barrier.
11. according to the formation method of the described barrier of claim 10, the method that it is characterized in that removing this spacer material layer of part that exposes comprises that with this graphical photoresist layer be mask and this spacer material layer is carried out sandblast.
12. according to the formation method of the described graphic diaphragm layer of claim 10, it is characterized in that after this viscose cylinder is provided, and before this viscose cylinder that rolls on this graphical photoresist layer, also comprise this stickiness surface of this viscose cylinder is heated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100913891A CN100465787C (en) | 2004-11-25 | 2004-11-25 | Formation of graphic diaphragm layer and barrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100913891A CN100465787C (en) | 2004-11-25 | 2004-11-25 | Formation of graphic diaphragm layer and barrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1779571A CN1779571A (en) | 2006-05-31 |
| CN100465787C true CN100465787C (en) | 2009-03-04 |
Family
ID=36769930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100913891A Expired - Fee Related CN100465787C (en) | 2004-11-25 | 2004-11-25 | Formation of graphic diaphragm layer and barrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100465787C (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11120905A (en) * | 1997-10-13 | 1999-04-30 | Okuno Chem Ind Co Ltd | Barrier rib forming method for plasma display panel and its material |
| JP2001183848A (en) * | 1999-12-22 | 2001-07-06 | Mitsui Chemicals Inc | Method for manufacturing electronic parts and method for removing mask material |
| JP2001307623A (en) * | 2000-04-24 | 2001-11-02 | Mitsubishi Electric Corp | Manufacturing method of substrate for ac type plasma display panel, sunstrate for ac type plasma display panel, ac type plasma display panel and ac type plasma display device |
| US20030027060A1 (en) * | 2001-08-03 | 2003-02-06 | Kay Lederer | Photoresist and process for structuring such a photoresist |
| US20030099907A1 (en) * | 2001-11-29 | 2003-05-29 | Ming-Ta Tei | Process of rectifying a wafer thickness |
| JP2004317850A (en) * | 2003-04-17 | 2004-11-11 | Hitachi Chem Co Ltd | Photosensitive resin composition, and photosensitive element, method for manufacturing resist pattern and method for manufacturing printed wiring board using the same |
-
2004
- 2004-11-25 CN CNB2004100913891A patent/CN100465787C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11120905A (en) * | 1997-10-13 | 1999-04-30 | Okuno Chem Ind Co Ltd | Barrier rib forming method for plasma display panel and its material |
| JP2001183848A (en) * | 1999-12-22 | 2001-07-06 | Mitsui Chemicals Inc | Method for manufacturing electronic parts and method for removing mask material |
| JP2001307623A (en) * | 2000-04-24 | 2001-11-02 | Mitsubishi Electric Corp | Manufacturing method of substrate for ac type plasma display panel, sunstrate for ac type plasma display panel, ac type plasma display panel and ac type plasma display device |
| US20030027060A1 (en) * | 2001-08-03 | 2003-02-06 | Kay Lederer | Photoresist and process for structuring such a photoresist |
| US20030099907A1 (en) * | 2001-11-29 | 2003-05-29 | Ming-Ta Tei | Process of rectifying a wafer thickness |
| JP2004317850A (en) * | 2003-04-17 | 2004-11-11 | Hitachi Chem Co Ltd | Photosensitive resin composition, and photosensitive element, method for manufacturing resist pattern and method for manufacturing printed wiring board using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1779571A (en) | 2006-05-31 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102150269B (en) | Method for manufacturing solid-state imaging device | |
| JP2010511533A5 (en) | ||
| TWI474377B (en) | A method of patterning a substrate and a method of manufacturing a capacitive touch panel | |
| JP2007183547A (en) | Printing device for liquid crystal display element and pattern forming method using this | |
| CN101739160B (en) | Manufacturing method of ITO film for touch screen | |
| KR20070023897A (en) | Method for manufacturing of printing plate | |
| JP2010005597A (en) | Method of recycling release film and apparatus for cleaning release film | |
| CN100465787C (en) | Formation of graphic diaphragm layer and barrier | |
| JPS63286588A (en) | Production of shadow mask | |
| JP6095315B2 (en) | Method for manufacturing liquid discharge head | |
| CN106444293A (en) | Preparation method of metal pattern | |
| KR101174775B1 (en) | method for manufacturing of printing plate | |
| WO2015000272A1 (en) | Signal substrate of naked eye 3d function panel, manufacturing method therefor and display device | |
| JP3092950B2 (en) | Method of manufacturing gas discharge type display panel | |
| JP6384102B2 (en) | Functional element manufacturing method and printing apparatus | |
| JP3655026B2 (en) | Method for forming thick film pattern | |
| CN111010811A (en) | Manufacturing method of single-side hollowed-out board | |
| JP2006245446A (en) | Resist peeling and removing device | |
| TWI596014B (en) | Method for forming a pattern film having a uniform film thickness and a rectangular cross section, and forming device thereof | |
| JP3279754B2 (en) | Method for forming barrier of plasma display panel | |
| KR102264788B1 (en) | Peeling device of protective film for processing fine metal mask | |
| KR100205949B1 (en) | Manufacturing apparatus of film-type functional film of flat panel display | |
| KR102095101B1 (en) | Patch for Recovery of Valuable Metal | |
| JP2011002549A (en) | Method for manufacturing color filter substrate with spacer | |
| JP4146879B2 (en) | Thick film pattern film peeling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090304 Termination date: 20121125 |