CN100457371C - Mixed powder solder and its production process - Google Patents
Mixed powder solder and its production process Download PDFInfo
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- CN100457371C CN100457371C CNB2007100657066A CN200710065706A CN100457371C CN 100457371 C CN100457371 C CN 100457371C CN B2007100657066 A CNB2007100657066 A CN B2007100657066A CN 200710065706 A CN200710065706 A CN 200710065706A CN 100457371 C CN100457371 C CN 100457371C
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Abstract
The invention provides a solder welded beryllium cobalt copper alloy element which uses BCu45Ag50Pd3Ni2+BAg65Cu20Pd15 and BCu45Ag50Pd3Ni2+BAg65Cu20Pd15 mixed powder. Tests have proved that the product has high solder welding property for resolving the problem between dampening function and solubility.
Description
Technical field
Used solder when the present invention relates to the soldering of copper and copper alloy mother metal, used mixed powder solder when particularly relating to the soldering of copper and copper alloy mother metal.
Technical background
At high temperature (more than 900 ℃) soldering thickness during less than the following copper part of 1.0mm, there be the wetability-erodible contradictory problems of solder to the copper and copper alloy mother metal, when being soldering if solder to the copper base metal wetability when good solder serious to the corrode of copper base metal, hour wetability is relatively poor again if solder is to the mother metal corrode, promptly is difficult to select the more suitable solder in a kind of solid-liquid interval to carry out high temperature brazing.
Mixed-powder is exactly that the solder powder mixing of two kinds of heterogeneities is used.Such solder compare with congruent solder alloy have better wetability, calking and mother metal is had less erodible.
Summary of the invention
The present invention adopts BCu45Ag50Pd3Ni2+BAg65Cu20Pd15, BCu45Ag50Pd3Ni2+BAg65Cu20Pd15 mixed powder solder soldering Be-Co-Cu alloy parts, development test shows when adopting these mixed powder solder soldering Be-Co-Cu alloy parts to have good brazing property, can solve the wetability-erodible contradictory problems of solder to the copper and copper alloy mother metal.
The present invention realizes like this, with alloy designations is BCu45Ag50Pd3Ni2 and alloy designations BAg65Cu20Pd15, be 50: 50 ratio mechanical mixture by weight, promptly get the mixed powder solder that corresponding alloying component is Cu32.5Ag57.5Pd9Ni1, alloy designations is that the percentage by weight of Cu is 45% in the alloy of BCu45Ag50Pd3Ni2, the percentage by weight of Ag is for being 50%, the percentage by weight of Pd is 3%, the percentage by weight of Ni is 2%, the percentage by weight of Cu is 20% in the alloy of alloy designations BAg65Cu20Pd15, the percentage by weight of Ag is 65%, and the percentage by weight of Pd is 15%.
The present invention can also realize like this, with alloy designations is BCu45Ag50Pd3Ni2 and alloy designations BAg65Cu20Pd15, be 60: 40 ratio mechanical mixture by weight, promptly get the mixed powder solder that corresponding alloying component is Cu35Ag56Pd7.8Ni1.2, alloy designations is that the percentage by weight of Cu is 45% in the alloy of BCu45Ag50Pd3Ni2, the percentage by weight of Ag is for being 50%, the percentage by weight of Pd is 3%, the percentage by weight of Ni is 2%, the percentage by weight of Cu is 20% in the alloy of alloy designations BAg65Cu20Pd15, the percentage by weight of Ag is 65%, and the percentage by weight of Pd is 15%.
The pre-arcing characterisitics of table 1 different filler relatively
| Numbering | Solder | The solder type | Solidus (℃) | Liquidus curve (℃) | Fusing is (Δ t) at interval |
| 1 | BCu32.5Ag57.5Pd9Ni1 | Mixed-powder | 783 | 820 | 37 |
| 2 | BCu35Ag56Pd7.8Ni1.2 | Mixed-powder | 785 | 830 | 45 |
| 3 | BCu32.5Ag57.5Pd9Ni1 | Alloy powder | 808 | 828 | 20 |
| 4 | BCu35Ag56Pd7.8Ni1.2 | Alloy powder | 804 | 852 | 48 |
By table 1 as seen, when two kinds of different alloy powder solders mix the back soldering, low-melting brazing filler metal alloy is fusing earlier, the basic solidus basically identical with low-melting solder of the solidus of mixed powder solder, and the solidus of the alloy material of corresponding mixed powder solder has all produced big variation.This shows that the pre-arcing characterisitics of mixed powder solder is inconsistent with the pre-arcing characterisitics of tie element solder alloy.
Two kinds of different mixing proportion mixed powder solders and congruent solder alloy powder have carried out the calking contrast test.Lath sample production with QBe0.6Co2.5 bar cut growth 100mm, wide 20mm, thickness 4mm becomes " ⊥ " type joint sample, one end is the zero clearance, the other end is the 0.5mm gap, and " ⊥ " type joint total length is 100mm, Be-Co-Cu specimen surface copper facing 20um.Solder powder 1.5 grams that will add 15% 102 brazing fluxes are placed on the zero clearance end, and test is carried out in the H2 steam stove, and experimental condition is 920-940 ℃/15-20min, calking, erodiblely the results are shown in Table 2.
Table 2 calking, erodible result of the test
| Numbering | The solder trade mark | The solder type | Wetability | Calking (mm) | Erodible |
| 1 | BCu32.5Ag57.5Pd9Ni1 | Mixed-powder | Good | 90 | Not corrosion |
| 2 | BCu35Ag56Pd7.8Ni1.2 | Mixed-powder | Good | 80 | Not corrosion |
| 3 | BCu32.5Ag57.5Pd9Ni1 | Alloy powder | Generally | 20 | Corrosion |
| 4 | BCu35Ag56Pd7.8Ni1.2 | Alloy powder | Generally | 15 | Corrosion |
Two kinds of powder brazing alloy BCu45Ag50Pd3Ni2: the BAg65Cu20Pd15 mixed proportion be wetability, the calking of 50%: 50% mixed powder solder all to be better than mixed proportion be 60%: 40% mixed powder solder, two kinds of solder powder mixed proportions are that 50%: 50% mixed powder solder fills up " ⊥ " type joint welding substantially after the calking test in 920-940 ℃/15-20min hydrogen.Determine that the powder brazing alloy that Be-Co-Cu blade soldering test is used is BCu45Ag50Pd3Ni2: the BAg65Cu20Pd15 mixed proportion is 50%: 50% a 1# mixed powder solder.
The specific embodiment
Alloy powder is pressed table 3 becomes assignment system promptly to get corresponding alloying component.
Table 3 mixed-powder and corresponding alloying component
| Numbering | The mixed-powder system | Mixed proportion (%) | Corresponding alloying component |
| a | BCu45Ag50Pd3Ni2+BAg65Cu20Pd15 | 50∶50 | BCu32.5Ag57.5Pd9Ni1 |
| b | BCu45Ag50Pd3Ni2+BAg65Cu20Pd15 | 60∶40 | BCu35Ag56Pd7.8Ni1.2 |
Embodiment 1
With alloy designations is BCu45Ag50Pd3Ni2 and alloy designations BAg65Cu20Pd15, be 50: 50 ratio mechanical mixture by weight, promptly get the mixed powder solder that corresponding alloying component is Cu32.5Ag57.5Pd9Ni1, alloy designations is that the percentage by weight of Cu is 45% in the alloy of BCu45Ag50Pd3Ni2, the percentage by weight of Ag is for being 50%, the percentage by weight of Pd is 3%, the percentage by weight of Ni is 2%, the percentage by weight of Cu is 20% in the alloy of alloy designations BAg65Cu20Pd15, the percentage by weight of Ag is 65%, and the percentage by weight of Pd is 15%.
Embodiment 2
With alloy designations is BCu45Ag50Pd3Ni2 and alloy designations BAg65Cu20Pd15, be 60: 40 ratio mechanical mixture by weight, promptly get the mixed powder solder that corresponding alloying component is Cu35Ag56Pd7.8Ni1.2, alloy designations is that the percentage by weight of Cu is 45% in the alloy of BCu45Ag50Pd3Ni2, the percentage by weight of Ag is for being 50%, the percentage by weight of Pd is 3%, the percentage by weight of Ni is 2%, the percentage by weight of Cu is 20% in the alloy of alloy designations BAg65Cu20Pd15, the percentage by weight of Ag is 65%, and the percentage by weight of Pd is 15%.
Claims (4)
1, a kind of mixed powder solder Cu32.5Ag57.5Pd9Ni1 is characterized in that: the percentage by weight of Cu is 32.5% in this powder brazing alloy, and the percentage by weight of Ag is 57.50%, and the percentage by weight of Pd is 9%, and the percentage by weight of Ni is 1%.
2, the preparation method of mixed powder solder according to claim 1, it is characterized in that: with alloy designations is BCu45Ag50Pd3Ni2 and alloy designations BAg65Cu20Pd15, be 50: 50 ratio mechanical mixture by weight, promptly get the mixed powder solder that corresponding alloying component is Cu32.5Ag57.5Pd9Ni1, alloy designations is that the percentage by weight of Cu is 45% in the alloy of BCu45Ag50Pd3Ni2, the percentage by weight of Ag is for being 50%, the percentage by weight of Pd is 3%, the percentage by weight of Ni is 2%, the percentage by weight of Cu is 20% in the alloy of alloy designations BAg65Cu20Pd15, the percentage by weight of Ag is 65%, and the percentage by weight of Pd is 15%.
3, a kind of mixed powder solder Cu35Ag56Pd7.8Ni1.2 is characterized in that: the percentage by weight of Cu is 35% in this powder brazing alloy, and the percentage by weight of Ag is 56%, and the percentage by weight of Pd is 7.8%, and the percentage by weight of Ni is 1.2%.
4, the preparation method of a kind of mixed powder solder according to claim 3, it is characterized in that: with alloy designations is BCu45Ag50Pd3Ni2 and alloy designations BAg65Cu20Pd15, be 60: 40 ratio mechanical mixture by weight, promptly get the mixed powder solder that corresponding alloying component is Cu35Ag56Pd7.8Ni1.2, alloy designations is that the percentage by weight of Cu is 45% in the alloy of BCu45Ag50Pd3Ni2, the percentage by weight of Ag is for being 50%, the percentage by weight of Pd is 3%, the percentage by weight of Ni is 2%, the percentage by weight of Cu is 20% in the alloy of alloy designations BAg65Cu20Pd15, the percentage by weight of Ag is 65%, and the percentage by weight of Pd is 15%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100657066A CN100457371C (en) | 2007-03-12 | 2007-03-12 | Mixed powder solder and its production process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100657066A CN100457371C (en) | 2007-03-12 | 2007-03-12 | Mixed powder solder and its production process |
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| Publication Number | Publication Date |
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| CN101015888A CN101015888A (en) | 2007-08-15 |
| CN100457371C true CN100457371C (en) | 2009-02-04 |
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| CNB2007100657066A Expired - Fee Related CN100457371C (en) | 2007-03-12 | 2007-03-12 | Mixed powder solder and its production process |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06315790A (en) * | 1993-05-06 | 1994-11-15 | Mitsubishi Materials Corp | Preform solder |
| CN1227878A (en) * | 1998-03-04 | 1999-09-08 | 昆明贵金属研究所 | Contact material gold-base alloy |
| JP2000246483A (en) * | 1999-02-23 | 2000-09-12 | Internatl Business Mach Corp <Ibm> | Leadless solder powder, leadless solder paste and their production |
| CN1513812A (en) * | 2003-06-26 | 2004-07-21 | 哈尔滨工业大学 | Ceramic particle reinforced composite brazing alloy used for ceramic soldering |
| US20040217152A1 (en) * | 2000-08-22 | 2004-11-04 | Senju Metal Industry Co., Ltd. | Lead-free solder paste for reflow soldering |
| CN1546275A (en) * | 2003-12-09 | 2004-11-17 | 株洲硬质合金集团有限公司 | Tungsten carbide - cobalt - copper based welding rod alloy and method for making same |
| CN1564726A (en) * | 2002-09-18 | 2005-01-12 | 株式会社荏原制作所 | Joining material and joining method |
| WO2006075459A1 (en) * | 2005-01-11 | 2006-07-20 | Murata Manufacturing Co., Ltd | Solder paste and electronic device |
-
2007
- 2007-03-12 CN CNB2007100657066A patent/CN100457371C/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06315790A (en) * | 1993-05-06 | 1994-11-15 | Mitsubishi Materials Corp | Preform solder |
| CN1227878A (en) * | 1998-03-04 | 1999-09-08 | 昆明贵金属研究所 | Contact material gold-base alloy |
| JP2000246483A (en) * | 1999-02-23 | 2000-09-12 | Internatl Business Mach Corp <Ibm> | Leadless solder powder, leadless solder paste and their production |
| US20040217152A1 (en) * | 2000-08-22 | 2004-11-04 | Senju Metal Industry Co., Ltd. | Lead-free solder paste for reflow soldering |
| CN1564726A (en) * | 2002-09-18 | 2005-01-12 | 株式会社荏原制作所 | Joining material and joining method |
| CN1513812A (en) * | 2003-06-26 | 2004-07-21 | 哈尔滨工业大学 | Ceramic particle reinforced composite brazing alloy used for ceramic soldering |
| CN1546275A (en) * | 2003-12-09 | 2004-11-17 | 株洲硬质合金集团有限公司 | Tungsten carbide - cobalt - copper based welding rod alloy and method for making same |
| WO2006075459A1 (en) * | 2005-01-11 | 2006-07-20 | Murata Manufacturing Co., Ltd | Solder paste and electronic device |
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| CN101015888A (en) | 2007-08-15 |
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