CN100443245C - Nickel soldering paste for automatic brazing - Google Patents
Nickel soldering paste for automatic brazing Download PDFInfo
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- CN100443245C CN100443245C CNB2006100363335A CN200610036333A CN100443245C CN 100443245 C CN100443245 C CN 100443245C CN B2006100363335 A CNB2006100363335 A CN B2006100363335A CN 200610036333 A CN200610036333 A CN 200610036333A CN 100443245 C CN100443245 C CN 100443245C
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- automatic brazing
- nickel soldering
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Abstract
The present invention relates to nickel soldering paste for automatically soldering, which is composed of 91.50 to 96.50% of solder and 3.50 to 8.50% of paste forming body by weight percentage, wherein the solder comprises 5 to 20% of Cr, 0.2 to 5% of Fe, 0.01 to 0.1% of C and 0.1 to 5% of Si, and the other is Ni. The paste forming body is composed of the following components according to weight percentage: polybutene with molecular weight from 200 to 9000, 72 to 92% of polyisobutylene mixture, or polyvinyl acetate with molecular weight from 10000 to 100000, 6.5 to 45% of one or more of polyvinylpyrrolidone, polyisobutylene and polypentene, 50 to 80% of organic solvent, 1.0 to 12.0% of surfactant and 1.0 to 18.0% of lubricant. The nickel soldering paste for automatically soldering is solder paste for stainless steel; the soldering seams soldered by the present invention have the advantages of good high temperature resistance and corrosion resistance performance and consistent color with stainless steel.
Description
Technical field
The present invention relates to a kind of automatic brazing material, particularly a kind of constituent of automatic brazing cream.
Background technology
A kind of paste soldering material---soldering paste is characterized in it being executed quantitatively by the method for pneumatic extrusion and applies in workpiece to be welded part to be welded, has satisfied quick and precisely reinforced requirement in the automatic brazing production process, thereby has realized finishing simultaneously the brazing filler metal of multi-section position.Often needing the position of soldering to reach more than 6 on a workpiece, is manual more than tens times and adopt the production efficiency of automatic brazing, and production efficiency is increased substantially, and constant product quality.In addition, the realization of the soldering production automation has reduced widely that waste gas makes and produces environmentally-friendly sanitary more operator's health affected in the brazing process.
Red copper soldering paste, silver paste are used for stainless steel braze welding and have good soldering processes performance, and are widely used.Yet, its elevated temperature strength of workpiece, the corrosion resistance of red copper soldering paste, silver paste welding are relatively poor, do not satisfy the electric heating appliance instructions for use, in addition, owing to influencing attractive in appearance with completely different of stainless steel on the red copper color, silver paste costs an arm and a leg, and therefore, red copper soldering paste, silver paste are in the application restriction to a certain degree of electric heating appliance industry.
Summary of the invention
The purpose of this invention is to provide and a kind ofly have high temperature resistant, the good corrosion resistance of weld seam, and the weld seam color and luster consistent with stainless steel be used for stainless solder paste.
Solder paste of the present invention is that 91.50～96.50% solder is formed with 3.50～8.50% the lotion that becomes by weight percent, described solder is in weight percent, comprise Cr:5～20%, Fe:0.2～5%, C:0.01～0.1%, Si:0.1～5%, surplus is Ni.
Described solder contains P:5～11%.
Described solder contains Cu:2～8%.
Described solder contains B:0.2～5%.
Become lotion in weight percent, be made up of following ingredients: molecular weight is 200～9000 polybutene, polyisobutene mixture: 72～92% or molecular weight be in 10000～100000 polyvinyl acetate, polyvinylpyrrolidone, polyisobutene, the polypenthylene one or more: 6.5～45% and organic solvent: 50～80%, surfactant: 1.0～12.0%, lubricant: 1.0～18.0%.
Above-mentioned surfactant is one or more in APES, AEO, the aliphatic acid sorbitan ester.
Above-mentioned lubricant is one or more in butter, lard, soybean oil, olive oil or the palm oil.
Above-mentioned organic solvent is C
5-C
18Alkane compound comprises one or more of kerosene, 120# solvent naphtha, 190# solvent naphtha, 200# solvent naphtha, 260# solvent naphtha, 5# technical white oil, 7# technical white oil, 10# technical white oil, 15# technical white oil, 32# technical white oil, 68# technical white oil, 100# technical white oil and saxol.
Above-mentioned surfactant APES is octyl phenol polyoxy ethene (6) ether, C
8-9Alkylphenol-polyethenoxy (4) ether, C
8-9Alkylphenol-polyethenoxy (7) ether, C
8-9One or more of alkylphenol-polyethenoxy (8) ether, Nonyl pheno (10) ether.
AEO is C
12Aliphatic alcohol polyethenoxy (3) ether, C
12Aliphatic alcohol polyethenoxy (4) ether, C
12Aliphatic alcohol polyethenoxy (7) ether, C
12-18Aliphatic alcohol polyethenoxy (10) ether, C
12-18One or more of aliphatic alcohol polyethenoxy (20) ether.
The aliphatic acid sorbitan ester is one or more of mono laurate sorbitan ester, monostearate sorbitan ester, sorbitan tristearate, single oleic acid sorbitan ester, single palmitic acid sorbitan ester.
Solder is the chief component of soldering paste, and soldering processes and weld strength are had critical influence.Solder of the present invention is matrix with Ni, adds Cr, Fe, C, Si, and the solder fusing point is reduced, and improves liquidity, wellability and joint filling.In becoming lotion, add the vegetable and animals oils lubricant, can increase solder and the surperficial adhesion that becomes lotion, help the anti-layering of solder paste and reinforced smoothly, for automation, large-scale production provide technologic assurance.
The specific embodiment
Solder: press the solder ingredient composition; Melting under the vacuum condition; Refining purifies; Inert gas is pulverized molten metal bath stream and is become drop; Drop solidifies cooling under protective atmosphere; The powder size classification; Application of vacuum.
Become lotion: choose polymer and organic solvent, surfactant, the mix lubricant of different molecular weight and be heated to 80～150 ℃, fully stir and make organic lotion.
Synthetic solder paste: by proportioning solder is joined in the lotion, stir.
Embodiment 1
Solder: Cr15%, P 10%, Fe 0.5%, Si 0.1%, C 0.08%, B 0.2%, surplus Ni.Become lotion (account for solder paste gross weight 6.5%): molecular weight be 300 polybutene, molecular weight be 450,2400 polyisobutene each 30%, Nonyl pheno (10) ether 8.2%, butter 1.8%.
Embodiment 2
Solder: Cr13%, P 10.5%, Fe 0.4%, Si 0.2%, C 0.08%, B 1.02%, surplus Ni.Become lotion (account for solder paste gross weight 7.35%): molecular weight is that 250 polybutene accounts for 20%, molecular weight is that 220 polyisobutene accounts for 20%, and molecular weight is that 7000 polyisobutene accounts for 38%, C
8-9Alkylphenol-polyethenoxy (8) ether accounts for 5%, single palmitic acid sorbitan ester accounts for 6%, palm oil accounts for 11%.
Embodiment 3
Solder: Cr 14%, B 3.5%, Si 4.5%, Fe 4.0%, C 0.06%, surplus Ni; Become lotion (account for solder paste gross weight 7.5%): molecular weight is that 20000 polyvinyl acetate 6.63%, molecular weight are that 10000 polyisobutene 2.55%, molecular weight are 80000 polyvinylpyrrolidones 1.02%, kerosene 73.2%, mono laurate sorbitan ester 1.9%, single oleic acid sorbitan ester 2.0%, butter 6.7%, olive oil 6.0%.
Embodiment 4
Solder: Cr 10.5%, P 9.3%, Cu 4.0%, Si 0.8%, C 0.06%, Fe0.8%, surplus Ni; Become lotion (account for solder paste gross weight 4.75%): molecular weight is that 18000 polyvinyl acetate 33%, molecular weight are 30000 polypenthylene 2%, and the 15# white oil is 53%, C
8-9Alkylphenol-polyethenoxy (4) ether 6.4%, C
12Aliphatic alcohol polyethenoxy (3) ether 3.0%, palm oil 2.6%.
Embodiment 5
Solder: Cr 14%, Cu 6.2%, Si 2.5%, Fe2.0%, C 0.1%, surplus Ni; Become lotion (account for solder paste gross weight 6.75%): molecular weight is that 35000 polyisobutene 25%, 190# solvent naphtha are 66%, C
12Aliphatic alcohol polyethenoxy (4) ether 3.5%, monostearate sorbitan ester 2.0%, butter 2.5%, soya-bean oil 1.0%.
Claims (10)
1. nickel soldering paste for automatic brazing, it is characterized in that forming with 3.50～8.50% the lotion that becomes by the solder of weight percent 91.50～96.50%, described solder comprises that in weight percent Cr:9.0～16.0%, Fe:0.2～4.0%, C:0.05～0.1%, Si:0.1～5.0%, surplus are Ni; Described one-tenth lotion is made up of following ingredients in weight percent: molecular weight is 200～9000 polybutene, polyisobutene mixture: 72～92%, surfactant: 1.0～12.0%, lubricant: 1.0～18.0% or molecular weight be in 10000～100000 polyvinyl acetate, polyvinylpyrrolidone, polyisobutene, the polypenthylene one or more: 6.5～45%, organic solvent: 50～80%, surfactant: 1.0～12.0%, lubricant: 1.0～18.0%.
2. nickel soldering paste for automatic brazing according to claim 1 is characterized in that described solder contains P:9.0～11.0%.
3. nickel soldering paste for automatic brazing according to claim 1 is characterized in that described solder contains Cu:3.0～7.0%.
4. nickel soldering paste for automatic brazing according to claim 1 is characterized in that described solder contains B:0.2～4.0%.
5. nickel soldering paste for automatic brazing according to claim 1 is characterized in that surfactant in the described one-tenth lotion is one or more in APES, AEO, the aliphatic acid sorbitan ester.
6. nickel soldering paste for automatic brazing according to claim 1 is characterized in that lubricant in the described one-tenth lotion is one or more in butter, lard, soybean oil, olive oil or the palm oil.
7. nickel soldering paste for automatic brazing according to claim 1 is characterized in that the organic solvent in the described one-tenth lotion is C
5-C
18Alkane compound comprises one or more of kerosene, 120# solvent naphtha, 190# solvent naphtha, 200# solvent naphtha, 260# solvent naphtha, 5# technical white oil, 7# technical white oil, 10# technical white oil, 15# technical white oil, 32# technical white oil, 68# technical white oil, 100# technical white oil and saxol.
8. nickel soldering paste for automatic brazing according to claim 5 is characterized in that the surfactant APES is octyl phenol polyoxy ethene (6) ether, C
8-9Alkylphenol-polyethenoxy (4) ether, C
8-9Alkylphenol-polyethenoxy (7) ether, C
8-9One or more of alkylphenol-polyethenoxy (8) ether, Nonyl pheno (10) ether.
9. nickel soldering paste for automatic brazing according to claim 5 is characterized in that the surfactant AEO is C
12Aliphatic alcohol polyethenoxy (3) ether, C
12Aliphatic alcohol polyethenoxy (4) ether, C
12Aliphatic alcohol polyethenoxy (7) ether, C
12-18Aliphatic alcohol polyethenoxy (10) ether, C
12-18One or more of aliphatic alcohol polyethenoxy (20) ether.
10. nickel soldering paste for automatic brazing according to claim 5 is characterized in that surfactant aliphatic acid sorbitan ester is one or more of mono laurate sorbitan ester, monostearate sorbitan ester, sorbitan tristearate, single oleic acid sorbitan ester, single palmitic acid sorbitan ester.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100363335A CN100443245C (en) | 2006-07-04 | 2006-07-04 | Nickel soldering paste for automatic brazing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100363335A CN100443245C (en) | 2006-07-04 | 2006-07-04 | Nickel soldering paste for automatic brazing |
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| Publication Number | Publication Date |
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| CN1876312A CN1876312A (en) | 2006-12-13 |
| CN100443245C true CN100443245C (en) | 2008-12-17 |
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| CNB2006100363335A Expired - Fee Related CN100443245C (en) | 2006-07-04 | 2006-07-04 | Nickel soldering paste for automatic brazing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102699569A (en) * | 2012-06-18 | 2012-10-03 | 北京有色金属研究总院 | High temperature nickel base brazing solder paste in nuclear industry and preparing method of high temperature nickel base brazing solder paste |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7789288B1 (en) * | 2009-07-31 | 2010-09-07 | General Electric Company | Brazing process and material for repairing a component |
| CN101890593B (en) * | 2010-07-23 | 2013-02-06 | 安泰科技股份有限公司 | Nickel-based brazing material for brazed diamond tool and preparation method thereof |
| CN101966632B (en) * | 2010-09-29 | 2013-07-17 | 广州瀚源电子科技有限公司 | Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof |
| CN105081598A (en) * | 2014-05-06 | 2015-11-25 | 烟台市固光焊接材料有限责任公司 | Solder paste and application thereof |
| CN108080808A (en) * | 2017-11-29 | 2018-05-29 | 温州宏丰电工合金股份有限公司 | It is a kind of to be used for the aqueous into lotion of paste XHBNi-5 nickel-based solders preparation |
| CN107838578A (en) * | 2017-11-29 | 2018-03-27 | 温州宏丰电工合金股份有限公司 | A kind of water-based preparation method into lotion prepared for the nickel-based solders of paste XHBNi 5 |
| CN108098190A (en) * | 2017-11-30 | 2018-06-01 | 温州宏丰电工合金股份有限公司 | A kind of oiliness prepared for paste XHBNi-5 nickel-based solders is into lotion |
| CN108032004A (en) * | 2017-11-30 | 2018-05-15 | 温州宏丰电工合金股份有限公司 | A kind of preparation method for oiliness prepared by paste XHBNi-5 nickel-based solders into lotion |
| CN108436324A (en) * | 2018-06-07 | 2018-08-24 | 浙江大学 | A kind of medium temperature paste aluminium alloy brazing filler metal and preparation method thereof |
| CN110303274A (en) * | 2019-06-26 | 2019-10-08 | 浙江强力控股有限公司 | Remain heat cure solder(ing) paste and preparation method thereof |
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| US6207300B1 (en) * | 1997-03-20 | 2001-03-27 | Federal-Mogul Sealing Systems Gmbh | Soldering paste for producing geometrical metal structures with precise contours |
| CN1451512A (en) * | 2002-04-12 | 2003-10-29 | 吴庆林 | Process for preparing lead-tin alloy solder paster, and product thereof |
| CN1671506A (en) * | 2002-05-30 | 2005-09-21 | 弗莱氏金属公司 | Solder paste flux system |
| US7017793B2 (en) * | 2003-06-26 | 2006-03-28 | United Technologies Corporation | Repair process |
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2006
- 2006-07-04 CN CNB2006100363335A patent/CN100443245C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6207300B1 (en) * | 1997-03-20 | 2001-03-27 | Federal-Mogul Sealing Systems Gmbh | Soldering paste for producing geometrical metal structures with precise contours |
| CN1451512A (en) * | 2002-04-12 | 2003-10-29 | 吴庆林 | Process for preparing lead-tin alloy solder paster, and product thereof |
| CN1671506A (en) * | 2002-05-30 | 2005-09-21 | 弗莱氏金属公司 | Solder paste flux system |
| US7017793B2 (en) * | 2003-06-26 | 2006-03-28 | United Technologies Corporation | Repair process |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102699569A (en) * | 2012-06-18 | 2012-10-03 | 北京有色金属研究总院 | High temperature nickel base brazing solder paste in nuclear industry and preparing method of high temperature nickel base brazing solder paste |
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