CN100456458C - Radiating apparatus - Google Patents
Radiating apparatus Download PDFInfo
- Publication number
- CN100456458C CN100456458C CNB2005101022884A CN200510102288A CN100456458C CN 100456458 C CN100456458 C CN 100456458C CN B2005101022884 A CNB2005101022884 A CN B2005101022884A CN 200510102288 A CN200510102288 A CN 200510102288A CN 100456458 C CN100456458 C CN 100456458C
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- China
- Prior art keywords
- heat
- mentioned
- radiator
- conducting wall
- heat abstractor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The heat sink includes radiator and heat conductor integrated inside the radiator. The radiator includes heat-conducting wall and heat elimination fins extended from the heat-conducting wall. Phase change medium is filled between the heat conductor and the heat-conducting wall. Thus, through Phase change medium, quantity of heat generated by working electronic components can be transferred from the heat conductor to the radiator quickly to be emitted. The invention raises heat dispersion.
Description
[technical field]
The present invention relates to a kind of heat abstractor, be meant a kind of heat abstractor of auxiliary electron element radiating especially.
[background technology]
As everyone knows, electronic component such as central processing unit produces a large amount of heat in running.For preventing that thereby this heat-generating electronic elements from causing its temperature rising to cause its fluctuation of service, this electronic component need install a heat abstractor usually additional with auxiliary its heat radiation because of the accumulation of heat.
Usually, a heat abstractor comprises that one is used for the entity newel of heat conduction and is placed on the radiator of this newel periphery, some radiating fins that this radiator comprises a hollow heat conducting wall and radially extends to external radiation from this heat conducting wall periphery.This newel is bonded in the hollow heat conducting wall of radiator by modes such as interference fit.One end of this newel is provided with the endothermic section that can conform to heat-generating electronic elements.During use, the endothermic section of newel conforms on the electronic component, and absorbs the heat that electronic component produces, thereby this heat passes through this newel to the radiator transmission, and then is distributed to surrounding space by radiating fin.Yet, because the outer peripheral face of newel and the inner peripheral surface of heat conducting wall have certain roughness, and make newel and heat conducting wall can not realize combining closely, thereby there is bigger thermal resistance between newel and the heat conducting wall, the heat that electronic component produces can not be passed to heat conducting wall by newel faster and distribute, and make heat accumulation in electronic component and newel, influence the runnability of electronic component.So this heat abstractor needs further to improve.
[summary of the invention]
In view of this, be necessary to provide a kind of heat transfer heat abstractor rapidly.
A kind of heat abstractor, be used for the heat-generating electronic elements heat radiation, it comprises radiator and is combined in the interior heat carrier of this radiator, this radiator comprises heat conducting wall and the some radiating fins that extend from this heat conducting wall, this heat carrier comprises a centerbody, the outer peripheral face of this centerbody digs and is provided with some grooves, forms a cave between each groove and this heat conducting wall, is filled with the phase change medium in this cave.
Compared with prior art, fill the phase change medium between the heat carrier of this heat abstractor and the radiator, distribute thereby the heat that electronic component work produces promptly is passed to radiator by heat carrier by the phase change medium, the heat dispersion of this heat abstractor promotes.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of heat abstractor of the present invention.
Fig. 2 is the three-dimensional assembly diagram of heat abstractor of the present invention.
Fig. 3 is the cross-sectional view of heat abstractor of the present invention.
Fig. 4 is a heat abstractor phantom of the present invention.
[embodiment]
See also Fig. 1, this heat abstractor comprises a radiator and this radiator is fixed to the fixture 50 of the heat-generating electronic elements (figure does not show) that is installed in (figure does not show) on the circuit board.This radiator comprises a heat carrier 10 and a radiator 30 that combines with this heat carrier 10.
This heat carrier 10 has high-termal conductivity, and it comprises bigger disc endothermic section of a diameter 11 and the less cylindrical core 13 of diameter of extending from these endothermic section 11 1 Surface Vertical.This centerbody 13 digs and is provided with four grooves 135 that are evenly distributed to its outer peripheral face, thereby this centerbody 13 has the partition wall 133 that reaches between two adjacent grooves 135 at the nucleome 131 that the connecting portion 137 between groove 135 and the endothermic section 11, groove 135 are centered on.
This radiator 30 comprises a column hollow heat conducting wall 31 and the some radiating fins 32 that extend to external radiation from these heat conducting wall 31 outer peripheral faces.This heat conducting wall 31 is provided with a cylindricality through hole 311 that runs through these heat conducting wall 31 centers, and the diameter of this through hole 311 is slightly less than or the diameter of roughly quite above-mentioned heat carrier 10 centerbodies 13.Each fin extends axially along heat conducting wall 31, and it comprises that a main part 321 that extends radially outward out from heat conducting wall 31 outer peripheral faces reaches from this main part 321 terminal extended three wooden fork portions 323 of outside branches that continue.
See also Fig. 2-4, the centerbody 13 of heat carrier 10 is bonded in the through hole 311 of radiator 30 heat conducting wall 31 by existing means, one end of bottom 137 sealing heat conducting wall, 31 through holes 311 of centerbody 13, the inner peripheral surface of the outside wall surface of partition wall 133 and heat conducting wall 31 fits tightly, thereby, each groove 135 of centerbody 13 forms a cave 35 with heat conducting wall 31, is filled with the phase change medium in this cave 35.The other end of one end cap, 33 these heat conducting wall 31 through holes 311 of sealing.The endothermic section 11 of radiator 10 is positioned at an end of this radiator 30.
Please consult Fig. 1 again, fixture 50 comprises that a square fixed head 51 reaches from 51 4 jiaos of outward extending four fixing feet 53 of this fixed head.The middle part of this fixed head 51 is provided with a perforate 511, and the slightly larger in diameter of perforate 511 is in the diameter of the newel 13 of heat carrier 10 but less than the diameter of endothermic section 11.The floating prominent holding section 513 that forms of the upper surface of this fixed head 51, further extend to each fixing feet 53 this holding section 513.The close end of each fixing feet 53 is provided with a fixing hole (indicate), and a fixture 54 is placed through in this fixing hole, and each fixture 54 comprises a screw and is placed on spring on this screw.
See also Fig. 4, the bottom 137 of heat carrier 10 centerbodies 13 is placed in the perforate 511 of fixture 50 fixed heads 51, the holding section 513 of fixed head 51 is folded between endothermic section 11 and the radiator 30, and four fixing feet 53 of fixture 50 stretch out wooden fork portion 323 ends of radiator 30 fins 32.
During use, radiator places on the electronic component, four fixing feet 53 of fixture 50 are fixed on the circuit board by fixture 54,, the endothermic section 11 of radiator heat carrier 10 absorbs the heat that electronic component produces thereby conforming on the electronic component, the part heat is absorbed by the phase change medium in the cave 35 by centerbody 13, thereby be passed to the heat conducting wall 31 of radiator 30, the part heat is passed to heat conducting wall 31 by the partition wall 133 of centerbody 13, and then is distributed to surrounding space by the fin of radiator 30.
For further improving the radiating effect of this heat abstractor, the top of radiator can install a fan (figure does not show) additional and provide the strong convection air-flow to this radiator.
Compared with prior art, between the heat carrier 10 of heat abstractor radiator and the radiator 30 cave 35 is set, fill the phase change medium in the cave 35, after thereby the heat that electronic component work produces is absorbed by heat carrier 10, by phase change medium heat absorption undergo phase transition turn to heat-conducting fluid and with heat transferred to radiator 30, and then, overcome the high thermal resistance defective between the heat carrier and radiator in the prior art, in addition, this phase change medium by phase change rapidly with heat transferred to radiator 30, thereby the heat that electronic component is produced passes rapidly, and the heat dispersion of this heat abstractor promotes.
In addition, the fin 32 of heat abstractor radiator forms apparatus derivatorius, thereby increases the area of dissipation of this heat abstractor.
Be appreciated that ground, end cap 33 can be one-body molded with heat carrier 10, in the case, the centerbody 13 of heat carrier 10 is filled after phase change medium such as the solid paraffin etc. in groove 135, be bonded to again in the through hole 311 of radiator 30 heat conducting wall 31, thus with the phase change medium-tight between heat carrier 10 and radiator 30.
Claims (11)
1. heat abstractor, comprise radiator and be combined in the interior heat carrier of this radiator, this radiator comprises heat conducting wall and the some radiating fins that extend from this heat conducting wall, it is characterized in that: above-mentioned heat carrier comprises a centerbody, the outer peripheral face of this centerbody digs and is provided with some grooves, form a cave between each groove and the above-mentioned heat conducting wall, be filled with the phase change medium in this cave.
2. heat abstractor as claimed in claim 1 is characterized in that: be provided with a through hole in the above-mentioned radiator heat conducting wall, above-mentioned centerbody is combined in this through hole.
3. heat abstractor as claimed in claim 2 is characterized in that: above-mentioned centerbody comprises the bottom of the above-mentioned through hole of a sealing.
4. heat abstractor as claimed in claim 2 is characterized in that: above-mentioned centerbody comprises a nucleome, and above-mentioned groove evenly distributes around this nucleome.
5. heat abstractor as claimed in claim 4 is characterized in that: have a partition wall between above-mentioned centerbody and the adjacent grooves, this partition wall and above-mentioned heat conducting wall are fitted.
6. heat abstractor as claimed in claim 5 is characterized in that: an endothermic section that enlarges further stretches out bottom the above-mentioned centerbody.
7. heat abstractor as claimed in claim 3 is characterized in that: the end cap that also comprises the above-mentioned through hole other end of a sealing.
8. as each described heat abstractor in the claim 1 to 7, it is characterized in that: above-mentioned heat conducting wall is cylindrical, and above-mentioned fin extends from the peripheral radiation of this heat conducting wall.
9. heat abstractor as claimed in claim 8 is characterized in that: above-mentioned each fin comprises a main part that is extended radially outward out by heat conducting wall and from the terminal extended some wooden fork portion that continues of this main part.
10. heat abstractor as claimed in claim 9 is characterized in that: the end of above-mentioned each fin portion extends three wooden fork portions.
11. heat abstractor as claimed in claim 8 is characterized in that: also comprise a fixture, this fixture comprises that a fixed head that is placed between above-mentioned heat carrier and the radiator reaches from the outward extending plurality of fixed pin of this fixed head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101022884A CN100456458C (en) | 2005-12-09 | 2005-12-09 | Radiating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101022884A CN100456458C (en) | 2005-12-09 | 2005-12-09 | Radiating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1979824A CN1979824A (en) | 2007-06-13 |
| CN100456458C true CN100456458C (en) | 2009-01-28 |
Family
ID=38130924
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101022884A Expired - Fee Related CN100456458C (en) | 2005-12-09 | 2005-12-09 | Radiating apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100456458C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102231369B (en) * | 2010-12-18 | 2013-11-27 | 中山伟强科技有限公司 | High-power heat-dissipation module |
| CN101986775B (en) * | 2010-09-30 | 2012-07-25 | 中山伟强科技有限公司 | High-power heat dissipation module |
| CN110012646A (en) * | 2019-04-19 | 2019-07-12 | 湖北赛格瑞新能源科技有限公司 | A kind of radiating module |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4633371A (en) * | 1984-09-17 | 1986-12-30 | Amdahl Corporation | Heat pipe heat exchanger for large scale integrated circuits |
| CN1359045A (en) * | 2000-12-19 | 2002-07-17 | 庄嘉琛 | Heat sink of CPU |
| CN2650335Y (en) * | 2003-07-04 | 2004-10-20 | 鸿富锦精密工业（深圳）有限公司 | Water-cooled radiating device |
| US20050036289A1 (en) * | 2003-08-13 | 2005-02-17 | Lee Hsieh Kun | Heat dissipation device |
-
2005
- 2005-12-09 CN CNB2005101022884A patent/CN100456458C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4633371A (en) * | 1984-09-17 | 1986-12-30 | Amdahl Corporation | Heat pipe heat exchanger for large scale integrated circuits |
| CN1359045A (en) * | 2000-12-19 | 2002-07-17 | 庄嘉琛 | Heat sink of CPU |
| CN2650335Y (en) * | 2003-07-04 | 2004-10-20 | 鸿富锦精密工业（深圳）有限公司 | Water-cooled radiating device |
| US20050036289A1 (en) * | 2003-08-13 | 2005-02-17 | Lee Hsieh Kun | Heat dissipation device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1979824A (en) | 2007-06-13 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090128 Termination date: 20131209 |