CN100454524C - Radiating module - Google Patents
Radiating module Download PDFInfo
- Publication number
- CN100454524C CN100454524C CNB2005101021078A CN200510102107A CN100454524C CN 100454524 C CN100454524 C CN 100454524C CN B2005101021078 A CNB2005101021078 A CN B2005101021078A CN 200510102107 A CN200510102107 A CN 200510102107A CN 100454524 C CN100454524 C CN 100454524C
- Authority
- CN
- China
- Prior art keywords
- heat
- plate body
- radiation module
- heat radiation
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
- One kind the heat radiation module, buckling piece that comprise heat pipe, combines and the radiating fin that combines with the condensation end of heat pipe with the evaporation ends of heat pipe, it is characterized in that: this buckling piece comprises a heat transfer part and the fixed part that extends from heat transfer part, a surface of this heat transfer part engages with the evaporation ends of this heat pipe, its another apparent surface is used for contacting with a heater element, this fixed part is welded on this heat transfer part, this fixed part is made by elastomeric material, and the thermal conductivity of this heat transfer part is higher than the thermal conductivity of fixed part.
- 2. heat radiation module as claimed in claim 1 is characterized in that: the material of this heat transfer part and fixed part is respectively copper and steel.
- 3. heat radiation module as claimed in claim 1 is characterized in that: this fixed part is provided with some through holes, and described through hole is used to wear retaining element so that this heater element is fixed to a circuit board.
- 4. heat radiation module as claimed in claim 3 is characterized in that: this fixed part comprises first plate body of the two lengthwise sheets of being located at the heat transfer part both sides.
- 5. heat radiation module as claimed in claim 4 is characterized in that: on described first plate body through hole is set respectively.
- 6. heat radiation module as claimed in claim 4 is characterized in that: this fixed part comprises that also described second plate body all is the lengthwise sheet by vertically extending second plate body of the free end of each first plate body, and each second plate body two ends is provided with a through hole respectively.
- 7. heat radiation module as claimed in claim 6 is characterized in that: this buckling piece is one " worker " shape structure.
- 8. heat radiation module as claimed in claim 4, it is characterized in that: this fixed part also comprises by vertically extending 2 second plate bodys of the free end of described first plate body and vertical the 3rd plate body that connects described second plate body, described second and third plate body all is the lengthwise sheet, on described second and third plate body a through hole is set respectively.
- 9. heat radiation module as claimed in claim 8 is characterized in that: described through hole is that the center is symmetrically distributed with this heater element.
- 10. heat radiation module as claimed in claim 8 is characterized in that: the through hole on described the 3rd plate body is positioned on the extended line of evaporation ends of this heat pipe.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101021078A CN100454524C (en) | 2005-12-01 | 2005-12-01 | Radiating module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005101021078A CN100454524C (en) | 2005-12-01 | 2005-12-01 | Radiating module |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1979821A CN1979821A (en) | 2007-06-13 |
CN100454524C true CN100454524C (en) | 2009-01-21 |
Family
ID=38130921
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101021078A Expired - Fee Related CN100454524C (en) | 2005-12-01 | 2005-12-01 | Radiating module |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100454524C (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103025119A (en) * | 2011-09-22 | 2013-04-03 | 富瑞精密组件(昆山)有限公司 | Heat dissipation device |
CN107529319A (en) * | 2017-09-01 | 2017-12-29 | 联想(北京)有限公司 | Heat abstractor and electronic equipment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6373700B1 (en) * | 2001-06-18 | 2002-04-16 | Inventec Corporation | Heat sink modular structure inside an electronic product |
US6650540B2 (en) * | 2001-11-29 | 2003-11-18 | Kabushiki Kaisha Toshiba | Cooling unit having a heat-receiving section and a cooling fan, and electronic apparatus incorporating the cooling unit |
US20040184238A1 (en) * | 2003-03-19 | 2004-09-23 | Kuo-Chang Yang | Fixing structure for dissipation device |
-
2005
- 2005-12-01 CN CNB2005101021078A patent/CN100454524C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6373700B1 (en) * | 2001-06-18 | 2002-04-16 | Inventec Corporation | Heat sink modular structure inside an electronic product |
US6650540B2 (en) * | 2001-11-29 | 2003-11-18 | Kabushiki Kaisha Toshiba | Cooling unit having a heat-receiving section and a cooling fan, and electronic apparatus incorporating the cooling unit |
US20040184238A1 (en) * | 2003-03-19 | 2004-09-23 | Kuo-Chang Yang | Fixing structure for dissipation device |
Also Published As
Publication number | Publication date |
---|---|
CN1979821A (en) | 2007-06-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: FU RUI PRECISION COMPONENT (KUNSHAN) CO., LTD. Free format text: FORMER OWNER: QUASI-FU PRECISION INDUSTRY ( SHENZHEN ) CO., LTD. Effective date: 20090612 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090612 Address after: 635, Foxconn Road, hi tech Industrial Development Zone, Kunshan Development Zone, Kunshan, Jiangsu. Zip code: 215316 Co-patentee after: Foxconn Precision Industry Co., Ltd. Patentee after: Furui precision component (Kunshan) Co., Ltd. Address before: 7, 8, 98 industrial town, Wanfeng village, Baoan District, Sha town, Shenzhen, Guangdong Province: zip code: 518104 Co-patentee before: Foxconn Precision Industry Co., Ltd. Patentee before: Rich quasi Precision Industry (Shenzhen) Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090121 Termination date: 20141201 |
|
EXPY | Termination of patent right or utility model |