CN100453233C - Furnace braze welding process of 6063 aluminum alloy micro-channel cooling plate - Google Patents
Furnace braze welding process of 6063 aluminum alloy micro-channel cooling plate Download PDFInfo
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- CN100453233C CN100453233C CNB2006101612975A CN200610161297A CN100453233C CN 100453233 C CN100453233 C CN 100453233C CN B2006101612975 A CNB2006101612975 A CN B2006101612975A CN 200610161297 A CN200610161297 A CN 200610161297A CN 100453233 C CN100453233 C CN 100453233C
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Abstract
The braze welding of 6063 aluminum alloy uses traditional Nooclock non-corrosive braze agent protecting the channel cold plate, adding a layer of pure aluminum or 3A21 aluminum alloy into the welding seam. It is low in cost, high in efficiency, simple in process with low operation requirement.
Description
Technical field
The present invention relates to a kind of slice welding process method of 6063 aluminium alloy microchannel cold plates.
Background technology
Microchannel cold plates is that the minim channel by 0.1~0.6mm constitutes, but material is that intensity is higher, 6063 aluminium alloys of the high soldering of thermal conductivity, needs to adopt method for welding to be welded into the cavity of a sealing, is a kind of high efficiency heat radiation cool plate.
According to the brazing characteristics of 6063 aluminium alloys, be suitable for adopting the vacuum aluminium soldering.But adopt the vacuum aluminium soldering to have such problem,, in brazing process, be easy to flow into the microchannel, thereby stop up the microchannel, influence the heat dispersion of cold drawing near the solder in the weld seam of microchannel because the vacuum brazing of 6063 aluminium alloys is good.
Summary of the invention
The slice welding process method that the purpose of this invention is to provide a kind of 6063 aluminium alloy microchannel cold plates, it can prevent effectively that solder from flowing into the microchannel.
The object of the present invention is achieved like this: adopt traditional Noclock brazing flux without corrosion slice welder skill, it is characterized in that: in the weld seam of microchannel cold plates, add one deck fine aluminium or 3A21 aluminium alloy.During soldering, because the effect of fine aluminium or 3A21 aluminium alloy, can form solder joint comparatively fine and close, that satisfy the air-tightness requirement, and, can prevent effectively that the solder in the weld seam from flowing into the microchannel because the spreadability and the wetability of the weldering of 6063 aluminium alloy Noclock brazing flux without corrosion slices are relatively poor.
The present invention is owing to adopt the weldering of Noclock brazing flux without corrosion slice, and production cost is low, the production efficiency height, and technology is comparatively simple; Because the solder wetting of 6063 aluminium alloy Noclock brazing flux without corrosion slices weldering is relatively poor, be easy in brazing process prevent that solder from flowing into the microchannel simultaneously, process structure requires lower, strong operability.
Description of drawings
Fig. 1, be typical microchannel water-cooled cold drawing structural representation;
Fig. 2, be the vertical view (not adding the cold drawing cover plate) of Fig. 1.
Among the figure: the 1st, the cold drawing cover plate; The 2nd, the cold drawing base plate; The 3rd, minim channel; The 4th, the interchannel dividing plate plays booster action simultaneously, must weld with cover plate 1.
The specific embodiment
Below in conjunction with drawings and Examples, describe process for soldering in detail according to the weldering of the cold employing in 6063 aluminium alloy microchannels of the present invention Noclock brazing flux without corrosion slice.
A) the 3A21 aluminum alloy materials that adopts 0.3mm is as the soldering transition material in the solder joint, the Al-Si eutectic solder of 0.1mm.
B) clean part to be welded and transition material, solder, and on face of weld and transition material, solder surface brush the Noclock brazing flux without corrosion.
C) on weld seam step around the base plate 2, reach the dividing plate end, state ready solder, transition material, solder by putting successively, cover cover plate 1 again, the weld jig of packing into.
D) furnace temperature is risen to 640~650 ℃, open bell, workpiece in the anchor clamps of packing into is hung in the stove, build bell, vacuumize, vacuum feeds high pure nitrogen during less than 0.1Pa to malleation, open fan, continue heating, evenly heat up, be incubated 2~3 minutes until 605~615 ℃, open bell, hang out the workpiece air cooling.
Claims (1)
1, a kind of slice welding process method of 6063 aluminium alloy microchannel cold plates; adopt traditional Noclock brazing flux without corrosion gas shiled slice welder soldering 6063 aluminium alloy microchannel cold plates of planting; it is characterized in that: during soldering in the weld seam of 6063 aluminium alloy microchannel cold plates; add one deck fine aluminium or 3A21 aluminium alloy, as the soldering transition material in the solder joint.
Priority Applications (1)
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CNB2006101612975A CN100453233C (en) | 2006-12-20 | 2006-12-20 | Furnace braze welding process of 6063 aluminum alloy micro-channel cooling plate |
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CNB2006101612975A CN100453233C (en) | 2006-12-20 | 2006-12-20 | Furnace braze welding process of 6063 aluminum alloy micro-channel cooling plate |
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CN101011768A CN101011768A (en) | 2007-08-08 |
CN100453233C true CN100453233C (en) | 2009-01-21 |
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CNB2006101612975A Active CN100453233C (en) | 2006-12-20 | 2006-12-20 | Furnace braze welding process of 6063 aluminum alloy micro-channel cooling plate |
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Families Citing this family (10)
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CN101979204B (en) * | 2010-11-01 | 2012-05-09 | 哈尔滨工业大学 | Indirect-heating braze-welding method for packaging shell with thermal sensitive element |
US9126279B2 (en) * | 2013-09-30 | 2015-09-08 | General Electric Company | Brazing method |
CN104128687B (en) * | 2014-08-07 | 2016-08-17 | 托伦斯精密机械(上海)有限公司 | Aluminum part internal channel soldering processing method |
CN106238934B (en) * | 2016-08-08 | 2018-08-03 | 成都四威高科技产业园有限公司 | Strong molten aluminum cooled case welding method in one kind |
CN107322251B (en) * | 2017-07-17 | 2019-10-22 | 中国电子科技集团公司第五十四研究所 | A kind of production technology of aluminium alloy microchannel heat sink |
CN109622945A (en) * | 2019-01-29 | 2019-04-16 | 皖西学院 | A kind of multistage disturbed flow type microchannel aluminium alloy compound cold plate and preparation method thereof |
CN110026633B (en) * | 2019-04-04 | 2021-07-16 | 河北躬责科技有限公司 | Micro-channel radiator and welding method |
CN112207509A (en) * | 2020-09-02 | 2021-01-12 | 上海坤勇节能科技有限公司 | Manufacturing method of micro-channel heat exchange plate |
CN113941752A (en) * | 2021-10-14 | 2022-01-18 | 安徽新富新能源科技有限公司 | Method for improving surface roughness of micro-channel cold plate |
CN114905182B (en) * | 2022-06-28 | 2024-04-19 | 新乡市特美特热控技术股份有限公司 | Solder preparation method and method for welding cold plate through solder |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1125412A (en) * | 1993-06-15 | 1996-06-26 | 莱克泽技术有限公司 | A method of brazing |
JP2005207728A (en) * | 2003-12-24 | 2005-08-04 | Showa Denko Kk | Heat exchanger and manufacturing method therefor |
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2006
- 2006-12-20 CN CNB2006101612975A patent/CN100453233C/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1125412A (en) * | 1993-06-15 | 1996-06-26 | 莱克泽技术有限公司 | A method of brazing |
JP2005207728A (en) * | 2003-12-24 | 2005-08-04 | Showa Denko Kk | Heat exchanger and manufacturing method therefor |
Non-Patent Citations (2)
Title |
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6063铝合金及其波导制件气保护钎焊工艺研究. 赵仁祥,冯展鹰.电子机械工程,第22卷第6期. 2006 |
6063铝合金及其波导制件气保护钎焊工艺研究. 赵仁祥,冯展鹰.电子机械工程,第22卷第6期. 2006 * |
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CN101011768A (en) | 2007-08-08 |
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Address after: No.8 Guorui Road, Yuhuatai District, Nanjing, Jiangsu Province, 210014 Patentee after: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 14 Research Institute Address before: 1313 box 03, box 210014, Nanjing City, Jiangsu Province Patentee before: CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION NO. 14 Research Institute |
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