CN100437954C - 制造半导体器件的方法 - Google Patents
制造半导体器件的方法 Download PDFInfo
- Publication number
- CN100437954C CN100437954C CNB2004100117280A CN200410011728A CN100437954C CN 100437954 C CN100437954 C CN 100437954C CN B2004100117280 A CNB2004100117280 A CN B2004100117280A CN 200410011728 A CN200410011728 A CN 200410011728A CN 100437954 C CN100437954 C CN 100437954C
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- China
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- wiring substrate
- multilayer wiring
- substrate
- mould
- molding die
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
Description
Claims (23)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP334858/2003 | 2003-09-26 | ||
JP2003334858A JP4094515B2 (ja) | 2003-09-26 | 2003-09-26 | 半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1601711A CN1601711A (zh) | 2005-03-30 |
CN100437954C true CN100437954C (zh) | 2008-11-26 |
Family
ID=34373183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100117280A Active CN100437954C (zh) | 2003-09-26 | 2004-09-24 | 制造半导体器件的方法 |
Country Status (5)
Country | Link |
---|---|
US (2) | US7288440B2 (zh) |
JP (1) | JP4094515B2 (zh) |
KR (1) | KR20050030865A (zh) |
CN (1) | CN100437954C (zh) |
TW (1) | TWI346986B (zh) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003243435A (ja) * | 2002-02-14 | 2003-08-29 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
JP2004134591A (ja) * | 2002-10-10 | 2004-04-30 | Renesas Technology Corp | 半導体集積回路装置の製造方法 |
JP2005150350A (ja) * | 2003-11-14 | 2005-06-09 | Renesas Technology Corp | 半導体装置の製造方法 |
JP4647258B2 (ja) * | 2004-07-29 | 2011-03-09 | 株式会社日立製作所 | 成形材料転写方法、基板構体 |
KR100784390B1 (ko) | 2006-08-08 | 2007-12-11 | 삼성전자주식회사 | 반도체 패키지 제조 장치 및 패키지 제조 방법 |
US7525187B2 (en) * | 2006-10-13 | 2009-04-28 | Infineon Technologies Ag | Apparatus and method for connecting components |
KR101273591B1 (ko) * | 2007-01-22 | 2013-06-11 | 삼성전자주식회사 | 사출성형장치 |
JP2008227131A (ja) * | 2007-03-13 | 2008-09-25 | Renesas Technology Corp | 半導体装置及びその製造方法 |
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- 2004-09-23 US US10/947,261 patent/US7288440B2/en active Active
- 2004-09-24 KR KR1020040076740A patent/KR20050030865A/ko not_active Application Discontinuation
- 2004-09-24 CN CNB2004100117280A patent/CN100437954C/zh active Active
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KR20050030865A (ko) | 2005-03-31 |
US7288440B2 (en) | 2007-10-30 |
CN1601711A (zh) | 2005-03-30 |
TW200512850A (en) | 2005-04-01 |
US20050070047A1 (en) | 2005-03-31 |
JP4094515B2 (ja) | 2008-06-04 |
JP2005101407A (ja) | 2005-04-14 |
US7445969B2 (en) | 2008-11-04 |
US20080057626A1 (en) | 2008-03-06 |
TWI346986B (en) | 2011-08-11 |
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