CN100426486C - 一种改进器件浅沟道隔离边缘漏电的方法 - Google Patents
一种改进器件浅沟道隔离边缘漏电的方法 Download PDFInfo
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- CN100426486C CN100426486C CNB2005101106057A CN200510110605A CN100426486C CN 100426486 C CN100426486 C CN 100426486C CN B2005101106057 A CNB2005101106057 A CN B2005101106057A CN 200510110605 A CN200510110605 A CN 200510110605A CN 100426486 C CN100426486 C CN 100426486C
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CNB2005101106057A CN100426486C (zh) | 2005-11-22 | 2005-11-22 | 一种改进器件浅沟道隔离边缘漏电的方法 |
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CNB2005101106057A CN100426486C (zh) | 2005-11-22 | 2005-11-22 | 一种改进器件浅沟道隔离边缘漏电的方法 |
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CN1971871A CN1971871A (zh) | 2007-05-30 |
CN100426486C true CN100426486C (zh) | 2008-10-15 |
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CNB2005101106057A Expired - Fee Related CN100426486C (zh) | 2005-11-22 | 2005-11-22 | 一种改进器件浅沟道隔离边缘漏电的方法 |
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CN102403190B (zh) * | 2010-09-08 | 2014-04-23 | 无锡华润上华半导体有限公司 | 圆片清洗方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6004843A (en) * | 1998-05-07 | 1999-12-21 | Taiwan Semiconductor Manufacturing Company | Process for integrating a MOS logic device and a MOS memory device on a single semiconductor chip |
JP2000327311A (ja) * | 1999-05-26 | 2000-11-28 | Ngk Spark Plug Co Ltd | 金属酸化物薄膜を有する基板の製造方法 |
US6642124B1 (en) * | 1999-11-08 | 2003-11-04 | Oki Electric Industry Co., Ltd. | Semiconductor device and manufacturing method thereof |
CN1665016A (zh) * | 2004-03-04 | 2005-09-07 | 富士通株式会社 | 具有浅沟槽隔离的半导体器件及其制造方法 |
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- 2005-11-22 CN CNB2005101106057A patent/CN100426486C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6004843A (en) * | 1998-05-07 | 1999-12-21 | Taiwan Semiconductor Manufacturing Company | Process for integrating a MOS logic device and a MOS memory device on a single semiconductor chip |
JP2000327311A (ja) * | 1999-05-26 | 2000-11-28 | Ngk Spark Plug Co Ltd | 金属酸化物薄膜を有する基板の製造方法 |
US6642124B1 (en) * | 1999-11-08 | 2003-11-04 | Oki Electric Industry Co., Ltd. | Semiconductor device and manufacturing method thereof |
CN1665016A (zh) * | 2004-03-04 | 2005-09-07 | 富士通株式会社 | 具有浅沟槽隔离的半导体器件及其制造方法 |
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CN1971871A (zh) | 2007-05-30 |
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Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20131216 |
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Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
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Effective date of registration: 20131216 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corp. Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Hua Hong NEC Electronics Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081015 Termination date: 20211122 |
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CF01 | Termination of patent right due to non-payment of annual fee |