CN100420019C - 集群发光二极管芯片的封装方法及器件 - Google Patents
集群发光二极管芯片的封装方法及器件 Download PDFInfo
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- CN100420019C CN100420019C CNB2005100343322A CN200510034332A CN100420019C CN 100420019 C CN100420019 C CN 100420019C CN B2005100343322 A CNB2005100343322 A CN B2005100343322A CN 200510034332 A CN200510034332 A CN 200510034332A CN 100420019 C CN100420019 C CN 100420019C
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004806 packaging method and process Methods 0.000 title abstract description 6
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- 238000002161 passivation Methods 0.000 claims abstract description 15
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- 239000000758 substrate Substances 0.000 claims description 37
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000741 silica gel Substances 0.000 claims description 13
- 229910002027 silica gel Inorganic materials 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- 238000012856 packing Methods 0.000 claims description 9
- 239000000919 ceramic Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000005253 cladding Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000012780 transparent material Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
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- 239000004033 plastic Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2005100343322A CN100420019C (zh) | 2005-04-20 | 2005-04-20 | 集群发光二极管芯片的封装方法及器件 |
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CNB2005100343322A CN100420019C (zh) | 2005-04-20 | 2005-04-20 | 集群发光二极管芯片的封装方法及器件 |
Publications (2)
Publication Number | Publication Date |
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CN1702862A CN1702862A (zh) | 2005-11-30 |
CN100420019C true CN100420019C (zh) | 2008-09-17 |
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CNB2005100343322A Active CN100420019C (zh) | 2005-04-20 | 2005-04-20 | 集群发光二极管芯片的封装方法及器件 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101118035B (zh) * | 2006-07-12 | 2012-03-07 | 香港应用科技研究院有限公司 | 发光组件及其使用 |
CN101409320B (zh) * | 2007-10-09 | 2010-06-23 | 富士迈半导体精密工业(上海)有限公司 | 基板制作方法 |
CN101996983B (zh) * | 2009-08-21 | 2013-01-23 | 深圳华映显示科技有限公司 | 一种发光二极管封装结构和支架结构 |
CN102543987A (zh) * | 2012-02-07 | 2012-07-04 | 达亮电子(苏州)有限公司 | 固态发光组件 |
CN107068666A (zh) * | 2017-04-21 | 2017-08-18 | 蒋雪娇 | 可提高散热性的发光二极管封装结构以及灯具 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
CN1417868A (zh) * | 2001-10-29 | 2003-05-14 | 银河光电股份有限公司 | 发光二极管芯片的多芯片封装结构 |
WO2004023522A2 (en) * | 2002-09-04 | 2004-03-18 | Cree, Inc. | Power surface mount light emitting die package |
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2005
- 2005-04-20 CN CNB2005100343322A patent/CN100420019C/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6498355B1 (en) * | 2001-10-09 | 2002-12-24 | Lumileds Lighting, U.S., Llc | High flux LED array |
CN1417868A (zh) * | 2001-10-29 | 2003-05-14 | 银河光电股份有限公司 | 发光二极管芯片的多芯片封装结构 |
WO2004023522A2 (en) * | 2002-09-04 | 2004-03-18 | Cree, Inc. | Power surface mount light emitting die package |
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CN1702862A (zh) | 2005-11-30 |
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Owner name: SHENZHEN WEINA SCIENCE AND TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WANG RUIXUN Effective date: 20150615 |
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Effective date of registration: 20150615 Address after: Baoan District Songgang Yanchuan Street Chaoyang Road Shenzhen city in Guangdong province 518105 Industrial Park B District No. 4 North Yongfa Technology Park Building Patentee after: Shenzhen nano science and Technology Co., Ltd. Address before: 518021, Guangdong Province, Shenzhen, Luohu District No. 3007 Spring Road, GUI Du building, room 1510 Patentee before: Wang Ruixun |
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Effective date of registration: 20200819 Address after: Room 303, 3rd floor, No.7 Guhe street, Sanjiao Town, Zhongshan City, Guangdong Province Patentee after: Zhongshan Basic Technology Co., Ltd Address before: Baoan District Songgang Yanchuan Street Chaoyang Road Shenzhen city in Guangdong province 518105 Industrial Park B District No. 4 North Yongfa Technology Park Building Patentee before: SHENZHEN VACNANO SCIENCE AND TECHNOLOGY Co.,Ltd. |