CN100414691C - 散热器扣合装置 - Google Patents

散热器扣合装置 Download PDF

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Publication number
CN100414691C
CN100414691C CNB2004100279868A CN200410027986A CN100414691C CN 100414691 C CN100414691 C CN 100414691C CN B2004100279868 A CNB2004100279868 A CN B2004100279868A CN 200410027986 A CN200410027986 A CN 200410027986A CN 100414691 C CN100414691 C CN 100414691C
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Prior art keywords
radiator
buckling
elastomer
buckling device
buckling body
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Expired - Fee Related
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CNB2004100279868A
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CN1716582A (zh
Inventor
陈俊吉
吴宜强
冯成斌
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNB2004100279868A priority Critical patent/CN100414691C/zh
Priority to US11/018,349 priority patent/US7180744B2/en
Publication of CN1716582A publication Critical patent/CN1716582A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44291—Clasp, clip, support-clamp, or required component thereof including pivoted gripping member
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T24/00—Buckles, buttons, clasps, etc.
    • Y10T24/44—Clasp, clip, support-clamp, or required component thereof
    • Y10T24/44291—Clasp, clip, support-clamp, or required component thereof including pivoted gripping member
    • Y10T24/44547—Clasp, clip, support-clamp, or required component thereof including pivoted gripping member having inserted and receiving interlocking engaging faces
    • Y10T24/44556—Resilient gripping member

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

一种散热器扣合装置，包括一对扣合体及可旋转的连接于该对扣合体之间的弹性体，该弹性体包括一用于弹性抵压于散热器的抵压部，该扣合体包括一用于钩扣于发热电子元件下缘的扣钩，该扣合装置进一步包括一当扣合体旋转时，可提供与扣合体旋转方向相反的回复力的弹性回复装置。本发明散热器扣合装置扣合时只需将上述扣合体向外旋转，同时下压扣合体，弹性回复装置产生的弹性回复力即可使扣合体的扣钩钩扣在电子元件上，操作方便快捷。

Description

散热器扣合装置
【技术领域】
本发明涉及一种扣合装置，尤其指一种用于将散热器固定于发热电子元件上的扣合装置。
【背景技术】
随着电子信息产业的快速发展，中央处理器等电子元件处理能力不断的提升，致使其产生的热量随之增多，为了将其热量散发出去，业者通常采用一种具备集热、传热和散热功能的金属散热器。为了快速充分散发其热量，上述散热器需要固定在发热电子元件上并与其保持密切的接触，为此需要有固定装置。
目前，市面上已涌现出多种固定装置与散热器匹配使用，将散热器扣合在电子元件上，这些固定装置各有结构特点和用处。如业者较多采用的一种是片状固定装置，是由金属片状体制成，其扣片跨设在散热器沟槽内，扣片两端形成扣合机构，通过扣片变形与固定模组配合，由于扣片的变形而产生弹性回复力，使散热器被挤压在电子元件上；还有一种是将旋转力转化为挤压力的凸轮式固定装置，其一端为凸轮状体与一可跨设在散热器上的扣合体配置而成，该凸轮状体扣在该扣合体上，通过旋转凸轮，使扣合体与散热器之间距离变大，而扣合体与固定模组扣紧，使散热器被压靠在电子元件上。
【发明内容】
本发明的目的在于提供一种使用时方便快捷的散热器扣合装置。
本发明的目的是通过下列技术方案实现的：一种散热器扣合装置，包括一对扣合体及可旋转的连接于该对扣合体之间的弹性体，该弹性体包括一用于弹性抵压于散热器的抵压部，该扣合体包括一用于钩扣于发热电子元件下缘的扣钩，该扣合装置进一步包括一当扣合体旋转时，可提供与扣合体旋转方向相反的回复力的弹性回复装置。
本发明散热器扣合装置扣合时只需将上述扣合体向外旋转，同时下压扣合体，弹性回复装置产生的弹性回复力即可使扣合体的扣钩钩扣在电子元件上，操作方便快捷。
下面参照附图结合实施例对本发明作进一步的说明。
【附图说明】
图1是本发明散热器扣合装置与相关元件的立体分解图。
图2是本发明散热器扣合装置与相关元件的立体组合图。
【具体实施方式】
请参考图1，本发明散热器扣合装置100用于将散热器200固定在发热电子元件300上。该散热器200包括一基座201和设置在该基座201上的若干散热鳍片202，该基座201底面与电子元件300接触，散热鳍片202之间形成有与散热器扣合装置100配合的两沟槽203，其中散热器200中央的一片散热鳍片202上具有一对相向的大致呈耳状的卡槽204，该对卡槽204分别位于两沟槽203外侧。
散热器扣合装置100包括一对扣合体10，一对连接于该对扣合体10之间的两弹性体30，两对设于扣合体10与弹性体30之间的扭力弹簧20及一将该扣合装置100保持于散热器200上的压片400。
每一弹性体30由金属丝弯折而成，具有一用于与散热器200基座201抵靠的抵压部310及自该抵压部310两端略向上倾斜延伸的两倾斜部320，该两倾斜部320两端同向垂直延伸出两连接部330。
该扣合体10下边缘具有扣合于电子元件300的长形扣钩11，其上端形成一板状操作部12，该操作部12具有横向贯穿的连接孔121及两垂直该操作部12的卡孔122，该卡孔122的位置低于该连接孔121。该连接孔121用于收容该弹性体30的连接部330从而将扣合体10可旋转的连接于两弹性体30上，可以理解的，连接孔121也可不贯穿，分设在操作部12两端部各自收容其中一弹性体30的连接部330。
该扭力弹簧20具有一抵压于弹性体30的抵压端21及一与扣合体10的卡孔122对应的卡止端22。
该压片400具有一水平本体41，该水平本体41具有可供散热鳍片202穿过的狭槽410，该水平本体41两端先倾斜向上延伸再反向弯折延伸，形成用于弹性卡止于散热器200的卡槽204的两定位端42。
如图2所示，组装该扣合装置100时，将其中一对扭力弹簧20分别穿套于其中一个弹性体30的两连接部330上，然后将该弹性体30的两连接部330分别插接于两扣合体10同侧的连接孔121内，并将弹簧20的固定端22***扣合体10的卡孔122内，抵压端21抵压于该弹性体30倾斜段320上，同样的方法将另一弹性体30及另一对扭力弹簧20安装于两扣合体10的另一侧，从而该扣合体10、弹簧20及弹性体30组合成一整体。
将上述组合后的扣合装置100置于散热器200上，使弹性体30的抵压部310对应的置于散热器200的沟槽203内，压片40穿过散热器200中央的散热鳍片202，其定位端42弹性卡固于散热器200的卡槽204内，从而将该扣合装置100预先定位于散热器200上。
将上述组装后的散热器200及其扣合装置100安装于电子元件300上时，通过对扣合体10的操作部12施加作用力从而将扣合体10的扣钩11向外旋转，保持该张开状态，将散热器200及其扣合装置100置于电子元件300上，使散热器100的底面与电子元件300接触，向下按压该操作部12并慢慢松开该操作部12，此时扣合体10由于扭力弹簧20的弹性回复力，其扣钩11向内旋转，扣压在电子元件300两相对下边缘，弹性体30产生弹性变形从而将散热器200紧密扣压于电子元件300上，完成散热器200与电子元件300的固定。
可以理解的，该弹性体30不限于上述所介绍的形状，其也可由金属片弯折而成，该两分开的弹性体30也可合二为一，形成一弹性框体，该对扣合体结合于该框体的两相对边上。另外，上述扭力弹簧20的作用是提供一与扣合体10的旋转方向相反的弹性回复力，其形状以及与扣合体10及弹性体30的结合并不限于上述形状，可由任何可提供上述回复力的弹性回复装置代替。

Claims (9)

1. 一种散热器扣合装置，包括一对扣合体及可旋转的连接于该对扣合体之间的弹性体，该弹性体包括一用于弹性抵压于散热器的抵压部，该扣合体包括一用于钩扣于发热电子元件下缘的扣钩，其特征在于：该扣合装置进一步包括一当扣合体旋转时，可提供与扣合体旋转方向相反的回复力的弹性回复装置。
2. 如权利要求1所述的散热器扣合装置，其特征在于：该弹性体进一步包括自其抵压部两端略向上倾斜延伸的倾斜部及自该倾斜部两端垂直于该倾斜部延伸的两连接部，该扣合体设有***述连接部的连接孔。
3. 如权利要求2所述的散热器扣合装置，其特征在于：该弹性体为两个，分别设置于该扣合体两侧。
4. 如权利要求1所述的散热器扣合装置，其特征在于：该弹性体由弹性金属丝弯折而成。
5. 如权利要求1所述的散热器扣合装置，其特征在于：该弹性体由弹性金属片弯折而成。
6. 如权利要求1所述的散热器扣合装置，其特征在于：该弹性回复装置包括一扭力弹簧，其包括一弹性抵压于弹性体的抵压端及一卡设于扣合体的卡止端。
7. 如权利要求6所述的散热器扣合装置，其特征在于：该扣合体进一步包括收容该扭力弹簧卡止端的卡孔。
8. 如权利要求1所述的散热器扣合装置，其特征在于：该散热器扣合装置进一步包括一压片，该压片包括一将弹性体定位于散热器上的本体及两定位端，散热器的至少一散热鳍片上设有两个与该两定位端配合的卡槽。
9. 如权利要求8所述的散热器扣合装置，其特征在于：该压片的本体设有供散热鳍片穿过的狭槽。
CNB2004100279868A 2004-07-02 2004-07-02 散热器扣合装置 Expired - Fee Related CN100414691C (zh)

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CNB2004100279868A CN100414691C (zh) 2004-07-02 2004-07-02 散热器扣合装置
US11/018,349 US7180744B2 (en) 2004-07-02 2004-12-20 Heat sink mounting device

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Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2713634Y (zh) * 2004-05-28 2005-07-27 鸿富锦精密工业（深圳）有限公司 散热器固定装置
US7137440B2 (en) * 2004-09-02 2006-11-21 Inventec Corporation Heat sink for electronic device
US7102889B1 (en) * 2004-09-27 2006-09-05 Hewlett-Packard Development Company, L.P. Method and apparatus for attaching heat sink to a component with a flexible leaf spring mount
US7385825B2 (en) * 2006-10-09 2008-06-10 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device
US7471517B1 (en) * 2007-08-22 2008-12-30 International Business Machines Corporation Heat sink retention module having force-adjustable wire modules
US7746647B2 (en) * 2007-12-18 2010-06-29 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Clip and heat dissipation assembly using the same
US8063485B1 (en) 2008-06-27 2011-11-22 Advanced Thermal Solutions, Inc. Electronics package with integrated lugs for cooling attachment
CN101848618A (zh) * 2009-03-24 2010-09-29 鸿富锦精密工业（深圳）有限公司 散热器及其卡扣装置
CN101861080A (zh) * 2009-04-10 2010-10-13 富准精密工业(深圳)有限公司 散热装置
US8305761B2 (en) * 2009-11-17 2012-11-06 Apple Inc. Heat removal in compact computing systems
CN102105036A (zh) * 2009-12-21 2011-06-22 富准精密工业(深圳)有限公司 散热装置
CN102479764A (zh) * 2010-11-23 2012-05-30 鸿富锦精密工业（深圳）有限公司 散热器固定装置
US20130105112A1 (en) * 2011-10-31 2013-05-02 Cooler Master Co., Ltd. Heat sink
JP5408285B2 (ja) * 2012-04-27 2014-02-05 ダイキン工業株式会社 冷却器、電装品ユニット及び冷凍装置
US9942999B2 (en) * 2014-07-01 2018-04-10 Foxconn Interconnect Technology Limited Electrical connector assembly with holding member
CN105573451A (zh) * 2015-12-10 2016-05-11 浪潮电子信息产业股份有限公司 一种基于模块化设计的免螺丝的散热器安装方法
US10310198B1 (en) * 2018-03-27 2019-06-04 Juniper Networks, Inc Apparatus, system, and method for improving heat transfer between heatsinks and optical transducers within telecommunications devices

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5448449A (en) * 1993-12-20 1995-09-05 The Whitaker Corporation Retainer for securing a heat sink to a socket
US6542367B2 (en) * 2001-05-31 2003-04-01 Intel Corporation Securing heat sinks
CN2559188Y (zh) * 2002-05-28 2003-07-02 台达电子工业股份有限公司 电子构件散热器的组装扣具

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5323845A (en) * 1993-05-17 1994-06-28 Kin Shon Lu Heat sink clip assembly
US5475564A (en) * 1994-12-20 1995-12-12 Chiou; Ming D. CPU heat sink holding-down device
US5638258A (en) * 1995-10-24 1997-06-10 Lin; Jen-Cheng CPU heat sink fastener
US6785136B2 (en) * 2002-06-05 2004-08-31 Inventec Corporation Coupling mechanism for radiator
US6574109B1 (en) * 2002-07-03 2003-06-03 Hon Hai Precision Ind. Co., Ltd. Retainer device for heat sink assembly
US6731506B1 (en) * 2003-02-15 2004-05-04 Hon Hai Precision Ind. Co., Ltd. Retaining device for heat sink

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5448449A (en) * 1993-12-20 1995-09-05 The Whitaker Corporation Retainer for securing a heat sink to a socket
US6542367B2 (en) * 2001-05-31 2003-04-01 Intel Corporation Securing heat sinks
CN2559188Y (zh) * 2002-05-28 2003-07-02 台达电子工业股份有限公司 电子构件散热器的组装扣具

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