CN100402699C - 一种镁合金表面化学镀镍硼合金的方法 - Google Patents
一种镁合金表面化学镀镍硼合金的方法 Download PDFInfo
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- CN100402699C CN100402699C CNB2006100708580A CN200610070858A CN100402699C CN 100402699 C CN100402699 C CN 100402699C CN B2006100708580 A CNB2006100708580 A CN B2006100708580A CN 200610070858 A CN200610070858 A CN 200610070858A CN 100402699 C CN100402699 C CN 100402699C
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- magnesium alloy
- alloy
- nickel
- plating
- solution
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CNB2006100708580A CN100402699C (zh) | 2006-03-15 | 2006-03-15 | 一种镁合金表面化学镀镍硼合金的方法 |
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CNB2006100708580A CN100402699C (zh) | 2006-03-15 | 2006-03-15 | 一种镁合金表面化学镀镍硼合金的方法 |
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CN1827851A CN1827851A (zh) | 2006-09-06 |
CN100402699C true CN100402699C (zh) | 2008-07-16 |
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CNB2006100708580A Expired - Fee Related CN100402699C (zh) | 2006-03-15 | 2006-03-15 | 一种镁合金表面化学镀镍硼合金的方法 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105441911A (zh) * | 2015-11-19 | 2016-03-30 | 上海应用技术学院 | 一种用于SiCp/Al材料表面化学镀Ni-B/GO复合镀层的化学镀液及其应用 |
CN108505024B (zh) * | 2018-06-29 | 2019-12-17 | 林忠华 | 化学镀镍-锡-铝-磷非晶态多功能合金镀液及其镀层 |
CN109537006B (zh) * | 2018-11-09 | 2021-05-14 | 厦门理工学院 | 一种高效的Ni-S-B析氢电极及其制备方法和应用 |
CN109989050A (zh) * | 2019-04-11 | 2019-07-09 | 上海应用技术大学 | 一种镁合金的防腐处理方法 |
CN109898074A (zh) * | 2019-04-11 | 2019-06-18 | 上海应用技术大学 | 一种镁合金化学镀镍-硼层的方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1039450A (zh) * | 1988-06-09 | 1990-02-07 | 联合工艺公司 | 含亚乙基硫脲、可镀得具耐磨性镀层的无电镀镍-硼溶液组合物 |
JPH06192846A (ja) * | 1992-12-25 | 1994-07-12 | Taiho Kogyo Co Ltd | Ni−B系無電解めっき液、めっき建浴もしくは補充液及びめっき方法 |
US20040144285A1 (en) * | 2002-10-04 | 2004-07-29 | Enthone Inc. | Process and electrolytes for deposition of metal layers |
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- 2006-03-15 CN CNB2006100708580A patent/CN100402699C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1039450A (zh) * | 1988-06-09 | 1990-02-07 | 联合工艺公司 | 含亚乙基硫脲、可镀得具耐磨性镀层的无电镀镍-硼溶液组合物 |
JPH06192846A (ja) * | 1992-12-25 | 1994-07-12 | Taiho Kogyo Co Ltd | Ni−B系無電解めっき液、めっき建浴もしくは補充液及びめっき方法 |
US20040144285A1 (en) * | 2002-10-04 | 2004-07-29 | Enthone Inc. | Process and electrolytes for deposition of metal layers |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Taikoo(Xiamen) Aircraft Engineering Co., Ltd. Assignor: Xiamen University Contract fulfillment period: 2008.8.1 to 2013.7.31 contract change Contract record no.: 2008351000066 Denomination of invention: Method for chemical plating of nickel-boron alloy on magnesium alloy surface Granted publication date: 20080716 License type: Exclusive license Record date: 2008.12.9 |
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Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.8.1 TO 2013.7.31; CHANGE OF CONTRACT Name of requester: XIAMEN TAIGU AEROPLANE ENGINEERING CO., LTD. Effective date: 20081209 |
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Granted publication date: 20080716 Termination date: 20130315 |