CN100393906C - Tin immersion plating technique - Google Patents
Tin immersion plating technique Download PDFInfo
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- CN100393906C CN100393906C CNB2004100383950A CN200410038395A CN100393906C CN 100393906 C CN100393906 C CN 100393906C CN B2004100383950 A CNB2004100383950 A CN B2004100383950A CN 200410038395 A CN200410038395 A CN 200410038395A CN 100393906 C CN100393906 C CN 100393906C
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Abstract
The present invention relates to improved dip tinning technology which adds a preplating step before dip tinning, deposits a uniform tin thin layer on the surface to be plated at slow speed rate and implements dip tinning in a main groove. Because the deposition speed rate of preplating step is slower, crystal grain deposited on the surface are smaller, and the tin thin layer is compactly and smoothly deposited so that when the preplated surface is in dip tinning, a uniform tin metal surface is formed on the deposited surface after dip tinning, the quantity of organic additives, such as interfacial active agents or tin surface levelling agents, etc., added into dip tinning liquid is correspondingly reduced and the organic additives even do not need to be added.
Description
Technical field
The present invention relates to a kind of immersion tin technology of improvement, be meant a kind of tin metal layer skewness phenomenon that is produced when improving immersion tin especially and reduce the immersion tin technology of the consumption of organic additive.
Background technology
Immersion tin is widely used for forming the tin metal layer on the surface of article, for example is used in the electroplating surfaces with tin of printed circuit board (PCB) (PCB) or junctor, and other electronics or nonelectronic product.Traditional immersion tin technical development nearly all is absorbed in the improvement of soup or prescription, pollutes or other side effect but tend to bring.
Fig. 1 is traditional immersion tin artwork that is applied to PCB, and wherein the main purpose of leading portion surface treatment program 10 is the surface of clean PCB, comprises that step 12 is degreasing, grease with flush away PCB surface, its service temperature is 30-80 ℃, and step 14 is washing, is the surface of cleaning PCB with clear water, step 16 is a microetch, to remove the lip-deep oxide compound of copper of PCB, make copper face more clean, its service temperature is 20-50 ℃, step 18 is washing, cleans the surface of PCB again with clear water.Then, step 20 is preimpregnation, and purpose is the copper face of activation PCB, prevents from simultaneously to be brought in the immersion tin major trough and to pollute tin immersion plating liquid at leading portion surface treatment program 10 employed soups, preimpregnation 20 employed solution are stanniferous not, and its service temperature is between 20-70 ℃.Step 22 is an immersion tin, and the PCB after the preimpregnation is put into the immersion tin major trough, so as on PCB the immersion tin metal, its service temperature is preferably 50-70 ℃ between 40-80 ℃.At last, in step 24,, promptly finish immersion tin technology to clean once with pure water again behind the warm water cleaning PCB.Wherein, the tin immersion plating liquid formula of step 22 comprises the about 1-150g/L of tin methane sulfonate (Stannous methanesulfonate), the about 1-150g/L of thiocarbamide (Thiourea), methylsulphonic acid (Methanesulfonic acid) about 1-300ml/L and antioxidant (Antioxidant) 0.1-110g/L, preferably, tin methane sulfonate is that 20-120g/L, thiocarbamide are that 20-120g/L, the about 50-200ml/L of methylsulphonic acid and antioxidant are 1-100g/L.
In traditional immersion tin technology, usually in tin immersion plating liquid, add organism as tin face leveling agent or interfacial agent to suppress tin metal growth speed, and then obtain smooth tin face, if be not added with organic additive, then because the sedimentation rate of tin is too fierce, to make that the crystal grain of sedimentary tin layer is big and pile up loose unfairness, thereby the tin face is more gloomy and have water wave (promptly, the uneven phenomenon of immersion plating) occurs, and, organic additive can remain in and cause assembly solderability variation on the PCB and produce tin palpus (whisker), moreover, organic additive consumes in the immersion plating process gradually, so be difficult to control its concentration, makes that the management of immersion plating liquid is difficult more.
Therefore, be badly in need of at present developing a kind of tin metal layer skewness phenomenon that is produced when improving immersion tin and the immersion tin technology that reduces the consumption of organic additive.
Summary of the invention
Main purpose of the present invention is to propose a kind of minimizing or need not adds organic additives such as leveling agent or interfacial agent can be eliminated the tin metal layer skewness phenomenon that is produced when immersion plating immersion tin technology.
For reaching above-mentioned purpose, the invention provides a kind of immersion tin technology of improvement, it comprises leading portion surface treatment program, status adjustment program (conditioning) and immersion tin program.Compared with prior art, its gordian technique was before described immersion tin program, earlier on surface to be plated with relatively mild speed preplating one uniform tin thin layer.
Specifically, provided by the present invention on thing to be plated, to form the immersion tin technology of tin metal layer, comprise the following steps: leading portion surface treatment program is bestowed on the surface to be plated of thing to be plated; The status adjustment program is bestowed on described surface to be plated, this status adjustment program comprises once or once above preplating, make and on this surface to be plated, be pre-formed uniform tin thin layer, once described or once above preplating comprises at least once uses the solution that contains tin, and the solution that this preplating is used comprises tin methane sulfonate 0.1-120g/L, thiocarbamide 10-120g/L, methylsulphonic acid 40-200ml/L and antioxidant 0.5-100g/L; And immersion tin program;
Wherein, the service temperature of described preplating is not more than the service temperature of described immersion tin program, and the tin concentration of the solution that uses is not higher than the tin concentration that the immersion tin program is used solution, and described uniform tin thin layer is to form with the deposited at rates that is lower than deposit tin in the described immersion tin program.
In immersion tin technology of the present invention, because described pre-tinned sedimentation rate is slower, so it is less to be deposited on the crystal grain (grain) of described lip-deep tin, and this tin thin layer is piled up fine and close and smooth, therefore, through the surface after the preplating during again through immersion tin, not only can obtain a uniform tin metal surface on the post-depositional surface of immersion tin, and for organic additives such as interfacial agent that makes an addition to tin immersion plating liquid or tin face leveling agent can thereby decrement, even to need not adding, thereby make quality product higher.
Description of drawings
Fig. 1 is traditional immersion tin process schematic representation;
Fig. 2 is the immersion tin process schematic representation of improvement of the present invention;
Fig. 3 shows that the traditional immersion tin technology of use is in the formed tin layer in PCB surface;
Fig. 4 is the microstate synoptic diagram that utilizes the tin layer among electron microscope observation Fig. 3;
Fig. 5 shows that use immersion tin technology of the present invention is in the formed tin layer in PCB surface;
Fig. 6 is the microstate synoptic diagram that utilizes the tin layer among electron microscope observation Fig. 5.
The number in the figure explanation:
10 leading portion surface treatment programs, 12 degreasings, 14 washings, 16 microetches
18 washings, 20 preimpregnation, 22 immersion tin, 24 Warm Wash
26 status adjustment programs, 28 preimpregnation, 30 preplating, 32 immersion tin
Embodiment
For making objects and advantages of the present invention more obvious, make the easier understanding of technical characterictic of the present invention, existing conjunction with figs. is also enumerated a specific embodiment and is described in detail as follows:
Fig. 2 is the immersion tin process schematic representation according to a specific embodiment of the present invention, as conventional art, the immersion tin technology of improvement of the present invention also comprises leading portion surface treatment program 10, it contains degreasing 12, washing 14, microetch 16 and washes steps such as 18, no longer repeats to describe in detail at this.Behind cleaning thing to be plated (for example PCB), then treat surfacing and carry out status adjustment program 26, in a preferred embodiment, it contains preimpregnation 28 and 30 two steps of preplating, and these two steps can be finished in same solution, or finish in solution separately respectively.Similarly, the purpose of preimpregnation 28 is the copper faces for activation PCB, prevent from simultaneously to bring in the immersion tin major trough and pollute the immersion tin plating bath at leading portion surface treatment program 10 employed soups, its service temperature is also between 20-70 ℃, but, employed solution can stanniferous in this preimpregnation 28, also stanniferous not.Then, preplating 30 employed solution can use and follow-up immersion tin program 32 employed solution prescription identical or inequality, but the concentration of tin is lower than the concentration of tin in the immersion tin program 32 employed solution in the employed solution when status adjustment program 26, for example, immersion tin program 32 employed prescriptions comprise the about 1-150g/L of tin methane sulfonate, the about 1-150g/L of thiocarbamide, the about 1-300ml/L of methylsulphonic acid, and antioxidant 0.1-110g/L, preferably, tin methane sulfonate is 20-120g/L, thiocarbamide is 20-120g/L, methylsulphonic acid is 50-200ml/L, and antioxidant is 1-100g/L, and preplating 30 employed prescriptions comprise that tin methane sulfonate is 0.1-120g/L, thiocarbamide is 10-120g/L, methylsulphonic acid is 40-200ml/L, and antioxidant is 0.5-100g/L.And the service temperature of preplating 30 also is lower than the service temperature of immersion tin program 32, and for example, the service temperature of immersion tin program 32 is preferably 50-70 ℃ between room temperature to 80 ℃, and the service temperature of preplating 30 is about room temperature to 55 ℃.Similarly, after immersion tin program 32, also comprise Warm Wash step 24.
The purpose of preplating 30 is to deposit a uniform tin metal thin layer with relatively mild speed on the surface of PCB.Because its sedimentation rate is slower, so it is less to be deposited on the lip-deep tin crystal grain of PCB, and pile up fine and close and smooth, therefore, through the PCB after the preplating 30 during in immersion tin 32, not only can on the surface of PCB, deposit a uniform tin metal surface, make zinc-plated not have water wave to occur, and, because tin immersion plating liquid can reduce organic additives such as even need not adding interfacial agent or tin face leveling agent, improve tin layer purity and suppress the advantage that tin must be grown up so have, in addition, owing to reducing or need not adding organic additives such as interfacial agent or tin face leveling agent, make that the composition of tin immersion plating liquid is simpler, therefore, the management of tin immersion plating is also easier.
Those of ordinary skill in the art can understand easily, the prescription of immersion tin or technology have many selections and variation, and principal feature of the present invention is before carrying out immersion tin, preplating one uniform tin thin layer in advance, make follow-up immersion tin obtain good quality, therefore, though the mode that the foregoing description is designed to understand easily is to provide illustration, yet, no matter adopt identical or other immersion tin technology and prescription, as long as before carrying out immersion tin, preplating one uniform tin thin layer does not break away from spirit of the present invention yet in advance.
For showing effect of the present invention, the microcosmic picture of the immersion tin achievement of PCB test piece also is provided, the soup of use and service temperature are identical with aforesaid content.Fig. 3 is to use traditional immersion tin technology, and uneven water wave phenomenon appears in its surface; Fig. 4 utilizes the microstate of the tin layer of electron microscope observation Fig. 3 to show that its crystal grain is more coarse; Fig. 5 is to use result of the present invention, and its surface is even and smooth; Fig. 6 is a microstate of utilizing the tin layer of electron microscope observation Fig. 5, can know discovery with Fig. 4 comparison, uses the formed crystal grain of immersion tin technology of the present invention more careful.From the actual tests result of Fig. 3 to Fig. 6, prove the present invention's conventional art that surpasses far away on effect.
More than the narration done for the preferred embodiments of the present invention purpose only for illustrating; accurately be disclosed form and be not intended to limit the present invention; based on above instruction or to make an amendment or change from embodiments of the invention study be possible; embodiment is for explaining orally principle of the present invention and allow those of ordinary skill in the art utilize the present invention to select in practical application with various embodiment and narrate, and protection scope of the present invention is as the criterion with claims.
Claims (16)
1. an immersion tin technology forms the tin metal layer on thing to be plated, and this technology comprises the following steps:
Leading portion surface treatment program is bestowed on the surface to be plated of thing to be plated;
The status adjustment program is bestowed on described surface to be plated, this status adjustment program comprises once or once above preplating, make and on this surface to be plated, be pre-formed uniform tin thin layer, once described or once above preplating comprises at least once uses the solution that contains tin, and the solution that this preplating is used comprises tin methane sulfonate 0.1-120g/L, thiocarbamide 10-120g/L, methylsulphonic acid 40-200ml/L and antioxidant 0.5-100g/L; And
The immersion tin program;
Wherein, the service temperature of described preplating is not higher than the service temperature of described immersion tin program, and the tin concentration of the solution that uses is not higher than the tin concentration that the immersion tin program is used solution, and described uniform tin thin layer is to form with the deposited at rates that is lower than deposit tin in the described immersion tin program.
2. immersion tin technology as claimed in claim 1, wherein said leading portion surface treatment program comprises the following steps:
Degreasing is bestowed on described surface to be plated;
Wash described surface to be plated;
The described surface to be plated of microetch; And
Wash described surface to be plated.
3. immersion tin technology as claimed in claim 2, wherein said degreasing are to implement down at 30-80 ℃.
4. immersion tin technology as claimed in claim 2, wherein said microetch are to implement down at 20-50 ℃.
5. immersion tin technology as claimed in claim 2, wherein said microetch comprises the oxide compound of removing described surface to be plated.
6. immersion tin technology as claimed in claim 1, wherein said status adjustment program more comprise once or the described surface to be plated of once above preimpregnation.
7. immersion tin technology as claimed in claim 6, same solution is used in wherein said preimpregnation and preplating.
8. immersion tin technology as claimed in claim 6, wherein said preimpregnation are to implement down at 20-70 ℃.
9. immersion tin technology as claimed in claim 6, the solution that contains tin is used in wherein said preimpregnation.
10. immersion tin technology as claimed in claim 6, not stanniferous solution is used in wherein said preimpregnation.
11. immersion tin technology as claimed in claim 1, the solution that wherein said immersion tin program is used comprises tin methane sulfonate 1-150g/L, thiocarbamide 1-150g/L, methylsulphonic acid 1-300ml/L and antioxidant 0.1-110g/L.
12. immersion tin technology as claimed in claim 11, the solution that wherein said immersion tin program is used comprises tin methane sulfonate 20-120g/L, thiocarbamide 20-120g/L, methylsulphonic acid 50-200ml/L and antioxidant 1-100g/L.
13. immersion tin technology as claimed in claim 1, the service temperature of wherein said preplating are room temperature to 55 ℃.
14. immersion tin technology as claimed in claim 13, the service temperature of wherein said immersion tin program are room temperature to 80 ℃.
15. immersion tin technology as claimed in claim 14, the service temperature of wherein said immersion tin program are 50-70 ℃.
16. immersion tin technology as claimed in claim 1 more comprises the following steps: after described immersion tin program
Clean described thing to be plated with warm water; And
Clean described thing to be plated with pure water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100383950A CN100393906C (en) | 2004-05-27 | 2004-05-27 | Tin immersion plating technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100383950A CN100393906C (en) | 2004-05-27 | 2004-05-27 | Tin immersion plating technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1704499A CN1704499A (en) | 2005-12-07 |
| CN100393906C true CN100393906C (en) | 2008-06-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100383950A Expired - Fee Related CN100393906C (en) | 2004-05-27 | 2004-05-27 | Tin immersion plating technique |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105755512A (en) * | 2016-03-04 | 2016-07-13 | 昆山艾森半导体材料有限公司 | Antioxidant for tin methane-sulfonate, preparation method and use method thereof |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101403112B (en) * | 2008-10-28 | 2012-08-08 | 昆山成利焊锡制造有限公司 | Chemical tin plating liquor for copper and copper alloy |
| CN102719776A (en) * | 2012-07-05 | 2012-10-10 | 苏州赛历新材料科技有限公司 | Single-furnace dual-plating mechanism |
| CN105695968A (en) * | 2015-09-30 | 2016-06-22 | 安徽中盛罐业有限公司 | Tinplate tin-plating process |
| CN112680725B (en) * | 2020-12-16 | 2022-12-06 | 大连崇达电路有限公司 | Control method and control structure for tin-immersion wire prepreg liquid medicine |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1418259A (en) * | 2000-03-17 | 2003-05-14 | 新日本制铁株式会社 | Plated metal wire and production method and production device therefor |
| JP2004027281A (en) * | 2002-06-25 | 2004-01-29 | Nippon Steel Corp | Sn-Zn PLATING STEEL SHEET EXCELLENT IN SOLDER WETTABILITY |
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2004
- 2004-05-27 CN CNB2004100383950A patent/CN100393906C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1418259A (en) * | 2000-03-17 | 2003-05-14 | 新日本制铁株式会社 | Plated metal wire and production method and production device therefor |
| JP2004027281A (en) * | 2002-06-25 | 2004-01-29 | Nippon Steel Corp | Sn-Zn PLATING STEEL SHEET EXCELLENT IN SOLDER WETTABILITY |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105755512A (en) * | 2016-03-04 | 2016-07-13 | 昆山艾森半导体材料有限公司 | Antioxidant for tin methane-sulfonate, preparation method and use method thereof |
| CN105755512B (en) * | 2016-03-04 | 2018-01-05 | 昆山艾森半导体材料有限公司 | A kind of tin methane sulfonate antioxidant and preparation method thereof and application method |
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| Publication number | Publication date |
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| CN1704499A (en) | 2005-12-07 |
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Granted publication date: 20080611 Termination date: 20100527 |