EP2551375A1 - Electroless nickel plating bath composition - Google Patents
Electroless nickel plating bath composition Download PDFInfo
- Publication number
- EP2551375A1 EP2551375A1 EP11175295A EP11175295A EP2551375A1 EP 2551375 A1 EP2551375 A1 EP 2551375A1 EP 11175295 A EP11175295 A EP 11175295A EP 11175295 A EP11175295 A EP 11175295A EP 2551375 A1 EP2551375 A1 EP 2551375A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- plating bath
- ranges
- nickel
- concentration
- aqueous plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
Definitions
- the present invention is related to an aqueous plating bath composition for the electroless deposition of nickel phosphorous alloys.
- Electroless plating of nickel-phosphorous alloys is used in various industries.
- the deposits derived are used e.g. as wear resistant coatings and barrier layers.
- Such plating bath compositions generally comprise a source of nickel ions, a hypophosphite compound as the reducing agent, at least one complexing agent and at least one stabilising agent.
- the at least one stabilising agent present is required in order to provide a sufficient bath lifetime, a reasonable deposition rate and to control the phosphorous content in the as deposited nickel phosphorous alloy.
- plating baths for deposition of nickel-phosphorous alloys known in the art comprise more than one stabilising agent.
- Common stabilising agents are selected from heavy metal ions such as cadmium, thallium, bismuth, lead and antimony ions, inorganic ions such as SCN - and various organic compounds such as thiourea.
- the patent document US 2,830,014 discloses plating bath compositions for electroplating of nickel which comprise thioalkane sulfonic acids or salts thereof such as mercaptopropane-1-sodium sulfonate as brightening and ductility-improving agents.
- the patent application US 2005/0013928 A1 discloses an electroless plating pre-treatment solution which comprises 3-mercaptopropanesulfonic acid.
- the pre-treatment solution reduces the incubation time (time from the start of the supply of an electroless plating solution to the start of the plating reaction) of nickel plating from an electroless plating bath on a copper surface.
- an aqueous plating bath composition for electroless plating of a nickel phosphorous alloy comprising
- a nickel phosphorous alloy having a phosphorous content in the range of 5 to 12 wt.-% of phosphorous is derived by electroless plating.
- the aqueous plating bath composition according to the present invention comprises a water soluble source of nickel ions such as nickel sulfate, a reducing agent such as sodium-hypophosphite, at least one complexing agent and a stabilising agent selected from compounds according to formulae (1) and (2).
- the concentration of nickel ions ranges from 1 to 18 g/l, more preferably from 3 to 9 g/l.
- the reducing agent is selected from hypophosphite compounds such as hypophosphorous acid or a bath soluble salt thereof such as sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite.
- the amount of the reducing agent employed in the plating bath ranges from 2 to 60 g/l, more preferably from 12 to 50 g/l and most preferably from 20 to 45 g/l. As a conventional practice the reducing agent is replenished during the reaction.
- the complexing agents are employed in amounts of 1 to 200 g/l, more preferably from 15 to 75 g/l.
- carboxylic acids, polyamines or sulfonic acids or mixtures thereof are selected as complexing agents.
- Useful carboxylic acids include mono-, di-, tri- and tetra-carboxylic acids.
- the carboxylic acids may be substituted with various substituent moieties such as hydroxy or amino groups and the acids may be introduced into the plating solutions as their sodium, potassium or ammonium salts.
- Some complexing agents such as acetic acid, for example, may also act as a buffering agent, and the appropriate concentration of such additive components can be optimised for any plating solution in consideration of their dual functionality.
- carboxylic acids which are useful as the complexing agents include: monocarboxylic acids such as acetic acid, hydroxyacetic acid, aminoacetic acid, 2-amino propanoic acid, 2-hydroxy propanoic acid, lactic acid; dicarboxylic acids such as succinic acid, amino succinic acid, hydroxy succinic acid, propanedioic acid, tartaric acid, malic acid; tricarboxylic acids such as 2-hydroxy-1,2,3 propane tricarboxylic acid; and tetracarboxylic acids such as ethylene diamine tetra acetic acid (EDTA).
- monocarboxylic acids such as acetic acid, hydroxyacetic acid, aminoacetic acid, 2-amino propanoic acid, 2-hydroxy propanoic acid, lactic acid
- dicarboxylic acids such as succinic acid, amino succinic acid, hydroxy succinic acid, propanedioic acid, tartaric acid, malic acid
- tricarboxylic acids such
- the most preferred complexing agents are selected from the group consisting of mono-carboxylic acids, and di-carboxylic acids.
- mixtures of two or more of the above complexing agents are utilised.
- the stabilising agent is selected from compounds according to formulae (1) and (2): R 1 S-(CH 2 ) n -SO 3 R 2 (1) R 3 SO 3 -(CH 2 ) m -S-S-(CH 2 ) m -SO 3 R 3 (2) wherein
- R 1 is selected from the group consisting of hydrogen, sodium and potassium.
- n ranges from 2 to 4.
- R 2 is selected from the group consisting of hydrogen, sodium and potassium.
- R 3 is selected from the group consisting of hydrogen, sodium and potassium.
- m ranges from 2 to 4.
- the concentration of the stabilising agent according to formulae (1) and (2) in the plating bath composition ranges from 1 to 100 ppm, more preferably from 2 to 50 ppm and most preferably from 3 to 30 ppm.
- the pH may be periodically or continuously adjusted by adding bath-soluble and bath-compatible alkaline substances such as sodium, potassium or ammonium hydroxides, carbonates and bicarbonates.
- bath-soluble and bath-compatible alkaline substances such as sodium, potassium or ammonium hydroxides, carbonates and bicarbonates.
- the stability of the operating pH of the plating solutions can be improved by the addition of various buffer compounds such as acetic acid, propionic acid, boric acid, or the like, in amounts of up to 30 g/l, more preferably from 2 to 10 g/l.
- nickel plating solutions such as buffers and wetting agents. These materials are known in the art.
- the nickel plating solutions optionally may employ one or more wetting agents of any of the various types heretofore known which are soluble and compatible with the other bath constituents.
- wetting agents prevents or hinders pitting of the nickel phosphorous alloy deposit, and the wetting agents can be employed in amounts up to about 1 g/l.
- the substrate to be plated is contacted with the plating bath at a temperature of at least 40°C up to 95 °C.
- the electroless nickel plating baths according to the present invention are employed, in one embodiment, at a temperature of from 70°C to 95°C, and more often, at a temperature of from 80°C to 90°C.
- the duration of contact of the electroless nickel plating bath with the substrate being plated is a function which is dependent on the desired thickness of the nickel phosphorus alloy.
- a contact time can range from 1 to 30 min.
- the substrate to be coated with a nickel phosphorous alloy can be contacted with the plating bath according to the present invention by dipping the substrate into the plating bath or by spraying the plating bath onto the substrate.
- mild agitation may be employed. Agitation may be a mild air agitation, mechanical agitation, bath circulation by pumping, rotation of a barrel plating, etc.
- the plating solution may also be subjected to a periodic or continuous filtration treatment to reduce the level of contaminants therein. Replenishment of the constituents of the bath may also be performed, in some embodiments, on a periodic or continuous basis to maintain the concentration of constituents, and in particular, the concentration of nickel ions and hypophosphite ions, as well as the pH level within the desired limits.
- a electroless nickel plating bath comprising 6 g/l nickel ions as nickel sulphate, hypophosphite as reducing agent, a mixture of lactic acid and malic acid as complexing agents and lead ions as stabilising additive was tested.
- the plating results are summarised in Table 1.
- MTO metal turn over.
- the phosphorous concentration in the deposited nickel phosphorous alloys increases from 7.0 wt.-% at 1 MTO to 8.3 wt.-% at 3 MTO.
- the stabilising agent according to the present invention shows the desired properties in respect to the stable phosphorous concentration in the deposited nickel phosphorous alloy layers when using the plating bath. Furthermore, the plating rate is sufficient for industrial application.
Abstract
Description
- The present invention is related to an aqueous plating bath composition for the electroless deposition of nickel phosphorous alloys.
- Electroless plating of nickel-phosphorous alloys is used in various industries. The deposits derived are used e.g. as wear resistant coatings and barrier layers.
- Such plating bath compositions generally comprise a source of nickel ions, a hypophosphite compound as the reducing agent, at least one complexing agent and at least one stabilising agent.
- The at least one stabilising agent present is required in order to provide a sufficient bath lifetime, a reasonable deposition rate and to control the phosphorous content in the as deposited nickel phosphorous alloy. Often, plating baths for deposition of nickel-phosphorous alloys known in the art comprise more than one stabilising agent.
- Common stabilising agents are selected from heavy metal ions such as cadmium, thallium, bismuth, lead and antimony ions, inorganic ions such as SCN- and various organic compounds such as thiourea.
- The patent document
US 2,830,014 discloses plating bath compositions for electroplating of nickel which comprise thioalkane sulfonic acids or salts thereof such as mercaptopropane-1-sodium sulfonate as brightening and ductility-improving agents. - The patent application
US 2005/0013928 A1 discloses an electroless plating pre-treatment solution which comprises 3-mercaptopropanesulfonic acid. The pre-treatment solution reduces the incubation time (time from the start of the supply of an electroless plating solution to the start of the plating reaction) of nickel plating from an electroless plating bath on a copper surface. - The main disadvantages of known stabilising agents are
- a) the toxic behaviour of heavy metal ions such as cadmium, thallium, lead and antimony ions and
- b) in case more than one stabilising agent is present in an electroless nickel plating bath, the control of the mixture of stabilising agents during use of such a plating bath is complex.
- Therefore it is the objective of the present invention to provide a bath composition for electroless deposition of nickel phosphorous alloys which is free of toxic heavy metal ion based stabilisers.
- It is a second objective of the present invention to provide a bath composition for electroless deposition of nickel phosphorous alloys which only comprises one kind of stabilising agent and thus is more easy to control during use.
- It is a third objective of the present invention to provide a bath composition for electroless deposition of nickel phosphorous alloys which allows deposition of a nickel phosphorous alloy having a phosphorous concentration in the range of 5 to 12 wt.-%.
- These objectives are solved by an aqueous plating bath composition for electroless plating of a nickel phosphorous alloy, the plating bath comprising
- (i) a water soluble source of nickel ions
- (ii) a hypophosphite compound
- (iii) at least one complexing agent and
- (iv) a stabilising agent selected from the group consisting of compounds according to formulae (1) and (2):
R1S-(CH2)n-SO3R2 (1)
R3SO3-(CH2)m-S-S-(CH2)m-SO3R3 (2)
wherein- R1 is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium,
- n ranges from 1 to 6,
- R2 is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium,
- R3 is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium and
- m ranges from 1 to 6.
- From such a plating bath deposition a nickel phosphorous alloy having a phosphorous content in the range of 5 to 12 wt.-% of phosphorous is derived by electroless plating.
- The aqueous plating bath composition according to the present invention comprises a water soluble source of nickel ions such as nickel sulfate, a reducing agent such as sodium-hypophosphite, at least one complexing agent and a stabilising agent selected from compounds according to formulae (1) and (2).
- The concentration of nickel ions ranges from 1 to 18 g/l, more preferably from 3 to 9 g/l.
- The reducing agent is selected from hypophosphite compounds such as hypophosphorous acid or a bath soluble salt thereof such as sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite. The amount of the reducing agent employed in the plating bath ranges from 2 to 60 g/l, more preferably from 12 to 50 g/l and most preferably from 20 to 45 g/l. As a conventional practice the reducing agent is replenished during the reaction.
- The complexing agents are employed in amounts of 1 to 200 g/l, more preferably from 15 to 75 g/l.
- In one embodiment of the present invention, carboxylic acids, polyamines or sulfonic acids or mixtures thereof are selected as complexing agents. Useful carboxylic acids include mono-, di-, tri- and tetra-carboxylic acids. The carboxylic acids may be substituted with various substituent moieties such as hydroxy or amino groups and the acids may be introduced into the plating solutions as their sodium, potassium or ammonium salts. Some complexing agents such as acetic acid, for example, may also act as a buffering agent, and the appropriate concentration of such additive components can be optimised for any plating solution in consideration of their dual functionality.
- Examples of such carboxylic acids which are useful as the complexing agents include: monocarboxylic acids such as acetic acid, hydroxyacetic acid, aminoacetic acid, 2-amino propanoic acid, 2-hydroxy propanoic acid, lactic acid; dicarboxylic acids such as succinic acid, amino succinic acid, hydroxy succinic acid, propanedioic acid, tartaric acid, malic acid; tricarboxylic acids such as 2-hydroxy-1,2,3 propane tricarboxylic acid; and tetracarboxylic acids such as ethylene diamine tetra acetic acid (EDTA).
- The most preferred complexing agents are selected from the group consisting of mono-carboxylic acids, and di-carboxylic acids.
- In one embodiment, mixtures of two or more of the above complexing agents are utilised.
- The stabilising agent is selected from compounds according to formulae (1) and (2):
R1S-(CH2)n-SO3R2 (1)
R3SO3-(CH2)m-S-S-(CH2)m-SO3R3 (2)
wherein - R1 is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium,
- n ranges from 1 to 6,
- R2 is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium,
- R3 is selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium and
- m ranges from 1 to 6.
- More preferably, R1 is selected from the group consisting of hydrogen, sodium and potassium.
- More preferably, n ranges from 2 to 4.
- More preferably, R2 is selected from the group consisting of hydrogen, sodium and potassium.
- More preferably, R3 is selected from the group consisting of hydrogen, sodium and potassium.
- More preferably, m ranges from 2 to 4.
- The concentration of the stabilising agent according to formulae (1) and (2) in the plating bath composition ranges from 1 to 100 ppm, more preferably from 2 to 50 ppm and most preferably from 3 to 30 ppm.
- Since the plating solution has a tendency to become more acidic during its operation due to the formation of H3O+ ions, the pH may be periodically or continuously adjusted by adding bath-soluble and bath-compatible alkaline substances such as sodium, potassium or ammonium hydroxides, carbonates and bicarbonates. The stability of the operating pH of the plating solutions can be improved by the addition of various buffer compounds such as acetic acid, propionic acid, boric acid, or the like, in amounts of up to 30 g/l, more preferably from 2 to 10 g/l.
- Other materials may be included in the nickel plating solutions such as buffers and wetting agents. These materials are known in the art.
- The nickel plating solutions optionally may employ one or more wetting agents of any of the various types heretofore known which are soluble and compatible with the other bath constituents. In one embodiment, the use of such wetting agents prevents or hinders pitting of the nickel phosphorous alloy deposit, and the wetting agents can be employed in amounts up to about 1 g/l.
- The substrate to be plated is contacted with the plating bath at a temperature of at least 40°C up to 95 °C. The electroless nickel plating baths according to the present invention are employed, in one embodiment, at a temperature of from 70°C to 95°C, and more often, at a temperature of from 80°C to 90°C.
- The duration of contact of the electroless nickel plating bath with the substrate being plated is a function which is dependent on the desired thickness of the nickel phosphorus alloy. Typically, a contact time can range from 1 to 30 min.
- The substrate to be coated with a nickel phosphorous alloy can be contacted with the plating bath according to the present invention by dipping the substrate into the plating bath or by spraying the plating bath onto the substrate.
- During the deposition of the nickel phosphorous alloy, mild agitation may be employed. Agitation may be a mild air agitation, mechanical agitation, bath circulation by pumping, rotation of a barrel plating, etc. The plating solution may also be subjected to a periodic or continuous filtration treatment to reduce the level of contaminants therein. Replenishment of the constituents of the bath may also be performed, in some embodiments, on a periodic or continuous basis to maintain the concentration of constituents, and in particular, the concentration of nickel ions and hypophosphite ions, as well as the pH level within the desired limits.
- The invention will now be illustrated by reference to the following non-limiting examples.
- A electroless nickel plating bath comprising 6 g/l nickel ions as nickel sulphate, hypophosphite as reducing agent, a mixture of lactic acid and malic acid as complexing agents and lead ions as stabilising additive was tested. The plating results are summarised in Table 1.
Table 1: plating results obtained for a electroless nickel plating bath known from prior art (MTO = metal turn over). Sample No. MTO Lead concentration / ppm P concentration in deposited layer / wt.-% Plating rate / µm/h 1 1 0.93 7.0 11.8 2 2 1.2 7.7 11.9 3 3 1.3 8.3 11.0 - The phosphorous concentration in the deposited nickel phosphorous alloys increases from 7.0 wt.-% at 1 MTO to 8.3 wt.-% at 3 MTO.
- The same plating bath as described for example 1 was used. Instead of lead ions, a stabilizing agent according to Formula (1) with R1 = hydrogen, R2 = sodium and n = 3 was added to said plating bath. The plating results are summarised in Table 2.
Table 2: plating results obtained for a electroless nickel plating bath known from prior art (MTO = metal turn over). Sample No. MTO Stabilising agent concentration / ppm P concentration in deposited layer / wt.-% Plating rate / µm/h 1 1 5 8.2 12.3 2 2 5 7.9 12.3 3 3 5 8.2 11.2 - The stabilising agent according to the present invention shows the desired properties in respect to the stable phosphorous concentration in the deposited nickel phosphorous alloy layers when using the plating bath. Furthermore, the plating rate is sufficient for industrial application.
Claims (9)
- An aqueous plating bath composition for electroless plating of a nickel phosphorous alloy, the plating bath comprising(i) a water soluble source of nickel ions(ii) a hypophosphite compound(iii) at least one complexing agent and(iv) a stabilising agent selected from the group consisting of compounds according to formulae (1) and (2):
R1S-(CH2)n-SO3R2 (1)
R3SO3-(CH2)m-S-S-(CH2)m-SO3R3 (2)
whereinR1, R2 and R3 are independently selected from the group consisting of hydrogen, methyl, ethyl, propyl, butyl, lithium, sodium, potassium and ammonium,n ranges from 1 to 6andm ranges from 1 to 6. - The aqueous plating bath according to claim 1 wherein the concentration of nickel ions ranges from 1 to 18 g/l.
- The aqueous plating bath composition according to any of the foregoing claims wherein the hypophosphite compound is selected from the group comprising phosphorous acid, sodium hypophosphite, potassium hypophosphite and ammonium hypophosphite.
- The aqueous plating bath according to any of the foregoing claims wherein the concentration of the hypophosphite compound ranges from 2 to 60 g/l.
- The aqueous plating bath according to any of the foregoing claims wherein the at least one complexing agent is selected from the group comprising carboxylic acids, polyamines or sulfonic acids or mixtures thereof are selected as complexing agents.
- The aqueous plating bath according to any of the foregoing claims wherein the concentration of the at least one complexing agent ranges from 1 to 200 g/l.
- The aqueous plating bath according to any of the foregoing claims wherein the concentration of the stabilising agent according to formulae (1) and (2) ranges from 1 to 100 ppm.
- The aqueous plating bath according to any of the foregoing claims wherein the plating bath composition is essentially free of heavy metal ions selected from cadmium, thallium, lead and antimony.
- Method for depositing a nickel phosphorous alloy having a phosphorous concentration in the range of 5 to 12 wt.-%, the method comprising the steps of(i) providing a substrate(ii) contacting said substrate with an aqueous plating bath according to claims 1 to 8.
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11175295A EP2551375A1 (en) | 2011-07-26 | 2011-07-26 | Electroless nickel plating bath composition |
CN201280036718.5A CN103946420B (en) | 2011-07-26 | 2012-07-04 | Electroless nickel plating bath compositions |
PCT/EP2012/062967 WO2013013941A1 (en) | 2011-07-26 | 2012-07-04 | Electroless nickel plating bath composition |
US14/131,949 US20140150689A1 (en) | 2011-07-26 | 2012-07-04 | Electroless nickel plating bath composition |
KR1020147001368A KR101936977B1 (en) | 2011-07-26 | 2012-07-04 | Electroless nickel plating bath composition |
JP2014522015A JP6053785B2 (en) | 2011-07-26 | 2012-07-04 | Electroless nickel plating bath composition |
EP12743909.9A EP2737107B1 (en) | 2011-07-26 | 2012-07-04 | Electroless nickel plating bath composition |
TW101127003A TWI555878B (en) | 2011-07-26 | 2012-07-26 | Electroless nickel plating bath composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP11175295A EP2551375A1 (en) | 2011-07-26 | 2011-07-26 | Electroless nickel plating bath composition |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2551375A1 true EP2551375A1 (en) | 2013-01-30 |
Family
ID=44736123
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP11175295A Withdrawn EP2551375A1 (en) | 2011-07-26 | 2011-07-26 | Electroless nickel plating bath composition |
EP12743909.9A Active EP2737107B1 (en) | 2011-07-26 | 2012-07-04 | Electroless nickel plating bath composition |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12743909.9A Active EP2737107B1 (en) | 2011-07-26 | 2012-07-04 | Electroless nickel plating bath composition |
Country Status (7)
Country | Link |
---|---|
US (1) | US20140150689A1 (en) |
EP (2) | EP2551375A1 (en) |
JP (1) | JP6053785B2 (en) |
KR (1) | KR101936977B1 (en) |
CN (1) | CN103946420B (en) |
TW (1) | TWI555878B (en) |
WO (1) | WO2013013941A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2737107B1 (en) | 2011-07-26 | 2015-09-09 | Atotech Deutschland GmbH | Electroless nickel plating bath composition |
EP3190208A1 (en) * | 2016-01-06 | 2017-07-12 | ATOTECH Deutschland GmbH | Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys |
US11685999B2 (en) | 2014-06-02 | 2023-06-27 | Macdermid Acumen, Inc. | Aqueous electroless nickel plating bath and method of using the same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104152877B (en) * | 2014-07-17 | 2017-02-15 | 广东致卓精密金属科技有限公司 | Chemical nickel-plating liquor |
EP3034650B1 (en) | 2014-12-16 | 2017-06-21 | ATOTECH Deutschland GmbH | Plating bath compositions for electroless plating of metals and metal alloys |
MY187868A (en) | 2015-03-20 | 2021-10-26 | Atotech Deutschland Gmbh | Activation method for silicon substrates |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2830014A (en) | 1954-03-22 | 1958-04-08 | Dehydag Gmbh | Electroplating process |
JPS502861B1 (en) * | 1970-05-09 | 1975-01-29 | ||
CH620710A5 (en) * | 1975-10-06 | 1980-12-15 | Fedor Petrovich Potapov | Process for chemical nickel-plating of workpieces having a catalytic surface, and installation for carrying out the process |
GB2155041A (en) * | 1984-03-05 | 1985-09-18 | Omi Int Corp | Aqueous electroless nickel plating |
US20050013928A1 (en) | 2003-07-15 | 2005-01-20 | Tokyo Electron Limited | Electroless plating pre-treatment solution and electroles plating method |
US20060264043A1 (en) * | 2005-03-18 | 2006-11-23 | Stewart Michael P | Electroless deposition process on a silicon contact |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4150180A (en) * | 1975-12-08 | 1979-04-17 | Potapov Fedor P | Method for chemical nickel-plating of parts having a catalytic surface employing a vessel having an upper heated zone and a lower cooled zone |
US4483711A (en) * | 1983-06-17 | 1984-11-20 | Omi International Corporation | Aqueous electroless nickel plating bath and process |
TW390915B (en) * | 1995-10-23 | 2000-05-21 | Uyemura C & Co Ltd | Electroless nickel plating solution and method |
JP3594894B2 (en) * | 2000-02-01 | 2004-12-02 | 新光電気工業株式会社 | Via filling plating method |
DE10327374B4 (en) | 2003-06-18 | 2006-07-06 | Raschig Gmbh | Use of propanesulfonated and 2-hydroxy-propanesulfonated Alkylaminaloxylaten as an aid for the electrolytic deposition of metallic layers and plating baths containing them |
JP4731851B2 (en) | 2004-07-28 | 2011-07-27 | キヤノン株式会社 | Image transfer system |
US20060026043A1 (en) * | 2004-07-30 | 2006-02-02 | Schneider John K | Medical records system and method |
EP1932943A4 (en) * | 2005-10-07 | 2013-06-26 | Nippon Mining Co | Electroless nickel plating solution |
TWI348499B (en) * | 2006-07-07 | 2011-09-11 | Rohm & Haas Elect Mat | Electroless copper and redox couples |
ES2339614T3 (en) * | 2008-07-15 | 2010-05-21 | Atotech Deutschland Gmbh | SOLUTION AND METHOD TO ELECTROCHEMICALLY DEPOSIT A METAL ON A SUBSTRATE. |
EP2177646B1 (en) * | 2008-10-17 | 2011-03-23 | ATOTECH Deutschland GmbH | Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces |
EP2199315B1 (en) | 2008-12-19 | 2013-12-11 | Basf Se | Composition for metal electroplating comprising leveling agent |
EP2551375A1 (en) | 2011-07-26 | 2013-01-30 | Atotech Deutschland GmbH | Electroless nickel plating bath composition |
-
2011
- 2011-07-26 EP EP11175295A patent/EP2551375A1/en not_active Withdrawn
-
2012
- 2012-07-04 CN CN201280036718.5A patent/CN103946420B/en active Active
- 2012-07-04 KR KR1020147001368A patent/KR101936977B1/en active IP Right Grant
- 2012-07-04 JP JP2014522015A patent/JP6053785B2/en active Active
- 2012-07-04 WO PCT/EP2012/062967 patent/WO2013013941A1/en active Application Filing
- 2012-07-04 US US14/131,949 patent/US20140150689A1/en not_active Abandoned
- 2012-07-04 EP EP12743909.9A patent/EP2737107B1/en active Active
- 2012-07-26 TW TW101127003A patent/TWI555878B/en active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2830014A (en) | 1954-03-22 | 1958-04-08 | Dehydag Gmbh | Electroplating process |
JPS502861B1 (en) * | 1970-05-09 | 1975-01-29 | ||
CH620710A5 (en) * | 1975-10-06 | 1980-12-15 | Fedor Petrovich Potapov | Process for chemical nickel-plating of workpieces having a catalytic surface, and installation for carrying out the process |
GB2155041A (en) * | 1984-03-05 | 1985-09-18 | Omi Int Corp | Aqueous electroless nickel plating |
US20050013928A1 (en) | 2003-07-15 | 2005-01-20 | Tokyo Electron Limited | Electroless plating pre-treatment solution and electroles plating method |
US20060264043A1 (en) * | 2005-03-18 | 2006-11-23 | Stewart Michael P | Electroless deposition process on a silicon contact |
Non-Patent Citations (1)
Title |
---|
DATABASE WPI Week 197508, Derwent World Patents Index; AN 1975-13728W, XP002661625 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2737107B1 (en) | 2011-07-26 | 2015-09-09 | Atotech Deutschland GmbH | Electroless nickel plating bath composition |
US11685999B2 (en) | 2014-06-02 | 2023-06-27 | Macdermid Acumen, Inc. | Aqueous electroless nickel plating bath and method of using the same |
EP3190208A1 (en) * | 2016-01-06 | 2017-07-12 | ATOTECH Deutschland GmbH | Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys |
WO2017118655A1 (en) * | 2016-01-06 | 2017-07-13 | Atotech Deutschland Gmbh | Electroless nickel plating baths comprising aminonitriles and a method for deposition of nickel and nickel alloys |
Also Published As
Publication number | Publication date |
---|---|
EP2737107B1 (en) | 2015-09-09 |
EP2737107A1 (en) | 2014-06-04 |
WO2013013941A1 (en) | 2013-01-31 |
JP6053785B2 (en) | 2016-12-27 |
CN103946420B (en) | 2015-11-25 |
CN103946420A (en) | 2014-07-23 |
KR101936977B1 (en) | 2019-01-09 |
JP2014521834A (en) | 2014-08-28 |
KR20140041762A (en) | 2014-04-04 |
TWI555878B (en) | 2016-11-01 |
US20140150689A1 (en) | 2014-06-05 |
TW201309844A (en) | 2013-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6800121B2 (en) | Electroless nickel plating solutions | |
EP3030688B1 (en) | Electroless nickel plating solution and method | |
EP2737107B1 (en) | Electroless nickel plating bath composition | |
US20220145469A1 (en) | Electroless nickel coatings and compositions and methods for forming the coatings | |
JP2012505964A (en) | Ni-P / Pd stack with reduced stress for bondable wafer surfaces | |
US6824597B2 (en) | Stabilizers for electroless plating solutions and methods of use thereof | |
EP3149223B1 (en) | Aqueous electroless nickel plating bath and method of using the same | |
TW201720955A (en) | Plating bath composition for electroless plating of gold and a method for depositing a gold layer | |
KR101365661B1 (en) | ELECTROLESS Ni-P PLATING SOLUTION AND PLATING METHOD USING THE SAME | |
KR20110113349A (en) | Electroless nikel plating solution, electroless plating method using the same and nikel coating layer prepared by the same | |
US9708693B2 (en) | High phosphorus electroless nickel | |
KR101365662B1 (en) | ELECTROLESS Ni-P PLATING METHOD | |
JP6028165B2 (en) | High pH trivalent chromium colored conversion coating solution and processing method | |
JPH0756075B2 (en) | Electroless tin and tin-lead alloy plating bath |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
AX | Request for extension of the european patent |
Extension state: BA ME |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: WEISSBROD, SEBASTIAN Inventor name: BERA, DR. HOLGER Inventor name: SCHAFSTELLER, DR. BRITTA Inventor name: JANSSEN, BORIS ALEXANDER |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20130731 |