CN100392802C - Safety monitoring mechanism for wafer technique platform - Google Patents
Safety monitoring mechanism for wafer technique platform Download PDFInfo
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- CN100392802C CN100392802C CNB2005100635123A CN200510063512A CN100392802C CN 100392802 C CN100392802 C CN 100392802C CN B2005100635123 A CNB2005100635123 A CN B2005100635123A CN 200510063512 A CN200510063512 A CN 200510063512A CN 100392802 C CN100392802 C CN 100392802C
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- wafer technique
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Abstract
The present invention relates to a safe monitoring mechanism for a wafer technical platform. A vibration or sound or deformation sensor is arranged on a load-shifting device for transporting a wafer on the wafer technical platform, and is used for sensing the vibration or the sound or the curvature or the displacement quantities when the load-shifting device operates. A distinguishing module receives the vibration or the sound or the curvature or the displacement quantities detected by the vibration or sound or deformation sensor, and compares and analyzes the converted digital signal and the preset standard signal ranges. When the distinguishing module compares, analyzes and distinguishes that the digital signal detected by the vibration or sound or deformation sensor exceeds the standard signal range or generates abnormity, an alarm device generates alarm sound and light. Thus, when the load-shifting device of the wafer technical platform initially moves and generates abnormality, the present invention can discover and remove the abnormality in real time, and can effectively and greatly reduce effectiveness generated by fraction defective.
Description
Technical field
The invention relates to a kind of technical field of safety monitoring equipment of semiconductor integrated circuit wafer technique platform, especially finger is a kind of can unusual initial discovery and eliminating that just can be real-time take place in technology, and uses the safety monitoring equipment of the wafer technique platform of the generation that significantly reduces fraction defective.
Background technology
The making of general semiconductor integrated circuit wafer (hereinafter to be referred as wafer), from oxidation (Oxidation), diffusion (Diffusion), little shadow (Photo), etching (Etch), chemical vapor deposition (CVD) to metal wire sputter (Metal Sputter) or the like technology needs repeatedly repetitive cycling, therefore in the wafer technique of this variation and complexity, if do not use the system of systematization and the automation process integration that front and back are relevant together, just can produce very large influence to the quality and the cost of manufacture of product, because wafer can promptly be handled and transmit under vacuum environment, contaminated to avoid being exposed in the air, the fraction defective that just can reduce product effectively produces and reduces the floor space of apparatus.And at present this kind with a plurality of process integrations of wafer in platform together, it is multiple to include Precision5000, Endura, Centura and Producer etc., and the above-mentioned platform of making mainly all is the reative cell that is provided with a plurality of each technology of processing around a center conveying room, and and in this center conveying room, have a shifting apparatus that transmits in each reacting chamber space for wafer, difference therebetween then only is the difference of technology category, quantity and the relevant cooperating equipment of reative cell.
For example Figure 1 shows that Centura technique platform (1), it mainly is to be provided with four reative cells (11) around this center conveying room (10), a cooling chamber (12), an air pressure clean room (13) and two load cell (14), wherein has a shifting apparatus (15) that supplies wafer between each reative cell (11), to transmit in this center conveying room (10), these four reative cells (11) then can be respectively etching, chemical vapour deposition (CVD), high temperature chemical vapor deposition, and the technology of physical vapour deposition (PVD), these two load cell (14) also are connected to a small-sized clean room (16), the wafer of a wafer charger (17) to provide desire to handle then is provided respectively the opposite side of this small-sized clean room (16), and then this wafer is sent to this center conveying room (10) through load cell (14).
No matter be which kind of above-mentioned technique platform, wherein all be to utilize a shifting apparatus bearing wafer, and this wafer transmitted in each reacting chamber space, and present shifting apparatus is generally a mechanical arm, and that this shifting apparatus still exists part is aging, wearing and tearing and the problem of making assembly error, in case it is aging that this part takes place this shifting apparatus, wearing and tearing and the problem of making assembly error, just can have influence on the making of wafer, it may be when sending into wafer reative cell or being taken out by reative cell, inlet with other member such as reative cell takes place, frameworks etc. touch and cause the situation of wafer scratch, and this part is aging, wearing and tearing and making assembly error can not take place in a large number suddenly, and can in drops produce gradually, so be difficult for very much realizing, it may just can be found in characterization processes after all technologies of wafer are finished, and the problematic number of wafers that this technique platform is finished during this may be very many, so can make that just the fraction defective in the wafer technique significantly increases.
Summary of the invention
Main purpose of the present invention is to provide a kind of can unusual initially just finding in real time and get rid of take place shifting apparatus in wafer technique, and uses the safety monitoring equipment of the wafer technique platform that significantly reduces the fraction defective generation.
And the safety monitoring equipment of wafer technique platform of the present invention comprises:
One vibration sensor is located at the transfer of this wafer technique platform and is loaded onto, the vibration that is produced during for this shifting apparatus running of detecting;
One sound inductor is located on the shifting apparatus of this wafer technique platform, the sound that is produced during for this shifting apparatus running of detecting;
One deformation inductor is located on the shifting apparatus of this wafer technique platform, the deformation that is produced during for this shifting apparatus running of detecting;
One discrimination module receives vibration or sound or curvature or the displacement detected from this vibration sensor or sound inductor or deformation inductor, and converts thereof into digital signal, and with the analysis that compares of predefined standard signal scope;
One alarming device goes out be above standard range of signal or take place when unusual of digital signal that this vibration sensor and sound inductor and deformation inductor detected in this discrimination module compare of analysis, then can produce the sound of a caution and light to remind the staff.
So, but just mat itself and take place in the motion of the shifting apparatus of this wafer technique platform unusual initial, just can be in real time with its discovery and eliminating, significantly to reduce the generation of fraction defective in the wafer technique by this.
Description of drawings
Fig. 1 is the floor map of Centura technique platform.
Fig. 2 is the system block diagrams of the present invention's first preferred embodiment.
Fig. 3 is the system block diagrams of the present invention's second preferred embodiment.
The primary clustering symbol description:
1:Centura technique platform 10: center conveying room
11: reative cell 12: cooling chamber
13: air pressure clean room 14: load cell
15: shifting apparatus 16: small-sized clean room
17: wafer charger 2: shifting apparatus
3: vibration sensor 4: the sound inductor
5: deformation inductor 6: discrimination module
60: converting unit 61: storage element
62: arithmetic element 7: alarming device
70: sound attention device 71: the light attention device
8: video camera 9: display
Embodiment
Please referring to shown in Figure 2, it is first preferred embodiment of the safety monitoring equipment of wafer technique platform of the present invention, comprising:
One vibration sensor 3 is located on the shifting apparatus 2 of this wafer technique platform, the vibration that is produced during for these shifting apparatus 2 runnings of detecting;
One sound inductor 4 is located on the shifting apparatus 2 of this wafer technique platform, the sound that is produced during for these shifting apparatus 2 runnings of detecting;
One deformation inductor 5 is located on the shifting apparatus 2 of this wafer technique platform, the curvature or the displacement that are produced during for these shifting apparatus 2 runnings of detecting;
One discrimination module 6, comprise a converting unit 60, one storage element 61 and an arithmetic element 62, this converting unit 60 can be for receiving vibration or sound or curvature or the displacement of being detected from this vibration sensor 3 or sound inductor 4 or deformation inductor 5, and convert thereof into digital signal, this storage element 61 can store in advance or established standards range of signal (vibration frequency of normal range (NR) or sound frequency or curvature or displacement), this arithmetic element 62 is made unusual compare of analysis for receives the standard signal scope that the digital signal changed and this storage element 61 store in advance or set at this converting unit 60, and is preferable differentiation account form with curvature or displacement;
One alarming device 7, include a sound attention device 70 and a light attention device 71, make it go out digital signal that this vibration sensor 3 or sound inductor 4 or deformation inductor 5 detect and be above standard range of signal and take place unusually as a result the time, then can produce the sound of a caution and light to remind the staff in these discrimination module 6 compare of analysis.
See also shown in Figure 3, it is second preferred embodiment of the present invention, its constructional device is roughly identical with first preferred embodiment, main difference only is that this second preferred embodiment more includes at least one video camera 8 and at least one display 9, this video camera 8 can be for the operation of taking described shifting apparatus 2, this display 9 then can be for the content that shows that this video camera 8 is captured, wherein this video camera 8 and display 9 can just be started working when this technique platform activates thereupon, perhaps also can activate when this discrimination module 6 notes abnormalities.
Because the present invention can detect the operation of the shifting apparatus 2 of this wafer technique platform at any time by this vibration sensor 3 or sound inductor 4 or deformation inductor 5, therefore take place unusual initial in the running of this shifting apparatus 2, just can be found in real time and get rid of, so can therefore significantly reduce the generation of fraction defective in the wafer technique.
In sum, the present invention has practicality and the progressive on the industry as can be known, and there is no similar products like or deliver in like product, therefore has novelty, so met the application important document of patent of invention, the spy files an application in accordance with the law.
Claims (11)
1. the safety monitoring equipment of a wafer technique platform is characterized in that comprising:
One deformation inductor is located on the shifting apparatus of this wafer technique platform, the deformation that is produced during for this shifting apparatus running of detecting;
One discrimination module receives the deformation of being detected from this deformation inductor, and converts thereof into digital signal, and with the analysis that compares of predefined standard signal scope;
One alarming device goes out digital signal that this deformation inductor detects in this discrimination module compare of analysis and is above standard range of signal and takes place promptly to produce an alarm signal to remind the staff when unusual.
2. the safety monitoring equipment of a wafer technique platform is characterized in that comprising:
One vibration sensor is located on the shifting apparatus of this wafer technique platform, the vibration that is produced during for this shifting apparatus running of detecting;
One sound inductor is located on the shifting apparatus of this wafer technique platform, the sound that is produced during for this shifting apparatus running of detecting;
One deformation inductor is located on the shifting apparatus of this wafer technique platform, the deformation that is produced during for this shifting apparatus running of detecting;
One discrimination module receives vibration and sound and the deformation detected from this vibration sensor and sound inductor and deformation inductor, and converts thereof into digital signal, and with the analysis that compares of predefined standard signal scope;
One alarming device goes out digital signal that this vibration sensor and sound inductor and deformation inductor detect in this discrimination module compare of analysis and is above standard range of signal and takes place then to produce an alarm signal to remind the staff when unusual.
3. the safety monitoring equipment of wafer technique platform as claimed in claim 1 or 2 is characterized in that, described discrimination module with curvature as differentiating account form.
4. the safety monitoring equipment of wafer technique platform as claimed in claim 1 or 2 is characterized in that, described discrimination module with displacement as differentiating account form.
5. the safety monitoring equipment of wafer technique platform as claimed in claim 1 is characterized in that, described discrimination module comprises:
One converting unit supplies to receive the deformation of being detected from this deformation inductor, and converts thereof into digital signal;
One storage element stores or the established standards range of signal in advance;
One arithmetic element is made unusual compare of analysis for the standard signal scope that digital signal and this storage element at conversion that this converting unit receives store in advance or set.
6. the safety monitoring equipment of wafer technique platform as claimed in claim 2 is characterized in that, described discrimination module comprises:
One converting unit supplies to receive vibration, sound and the deformation of being detected from this vibration sensor, sound inductor and deformation inductor, and converts thereof into digital signal;
One storage element stores or the established standards range of signal in advance;
One arithmetic element is made unusual compare of analysis for the standard signal scope that digital signal and this storage element at conversion that this converting unit receives store in advance or set.
7. the safety monitoring equipment of wafer technique platform as claimed in claim 1 or 2 is characterized in that, described alarming device includes a sound attention device for sending the caution sound.
8. the safety monitoring equipment of wafer technique platform as claimed in claim 1 or 2 is characterized in that, described alarming device includes a light attention device for sending caution light.
9. the safety monitoring equipment of wafer technique platform as claimed in claim 1 or 2, it is characterized in that, more comprise at least one video camera and at least one display, wherein this video camera supplies to take the operation of this shifting apparatus, and this display is for showing the captured content of this video camera.
10. the safety monitoring equipment of wafer technique platform as claimed in claim 9 is characterized in that, described video camera and display activate when this technique platform activates thereupon.
11. the safety monitoring equipment of wafer technique platform as claimed in claim 9 is characterized in that, described video camera and display activate when this discrimination module notes abnormalities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100635123A CN100392802C (en) | 2005-04-08 | 2005-04-08 | Safety monitoring mechanism for wafer technique platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100635123A CN100392802C (en) | 2005-04-08 | 2005-04-08 | Safety monitoring mechanism for wafer technique platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1845297A CN1845297A (en) | 2006-10-11 |
| CN100392802C true CN100392802C (en) | 2008-06-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100635123A Expired - Fee Related CN100392802C (en) | 2005-04-08 | 2005-04-08 | Safety monitoring mechanism for wafer technique platform |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101459099B (en) * | 2007-12-13 | 2010-11-10 | 中芯国际集成电路制造(上海)有限公司 | Wafer kit, monitoring system and method for semi-conductor production process |
| CN107170701B (en) * | 2016-03-07 | 2021-04-09 | 北京北方华创微电子装备有限公司 | Manipulator, semiconductor processing equipment and method for detecting working state of manipulator |
| CN108428642B (en) * | 2017-02-15 | 2021-06-18 | 台湾积体电路制造股份有限公司 | Machine diagnosis tool, wafer processing machine loading port diagnosis tool and method thereof |
| CN109725555B (en) * | 2017-10-30 | 2021-11-30 | 台湾积体电路制造股份有限公司 | Method for monitoring condition of manufacturing machine, semiconductor manufacturing system and monitoring method thereof |
| CN108449580A (en) * | 2018-04-13 | 2018-08-24 | 任阿毛 | Field Monitoring System based on audio frequency component analysis |
| CN111158337A (en) * | 2019-12-16 | 2020-05-15 | 上海集成电路研发中心有限公司 | Device and method for diagnosing running state of integrated circuit equipment |
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| JPH06232228A (en) * | 1993-02-02 | 1994-08-19 | Fujitsu Ltd | Positional deviation inspection method for offset pattern and device thereof |
| JP2001281161A (en) * | 2000-03-30 | 2001-10-10 | Toshiba Corp | Defect inspecting device and inspecting method |
| US20040232313A1 (en) * | 2002-06-07 | 2004-11-25 | Jun Ye | System and method for lithography process monitoring and control |
| CN1553146A (en) * | 2003-05-30 | 2004-12-08 | 友达光电股份有限公司 | Intelligent switchboard controller with running monitoring function and monitoring method thereof |
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2005
- 2005-04-08 CN CNB2005100635123A patent/CN100392802C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232228A (en) * | 1993-02-02 | 1994-08-19 | Fujitsu Ltd | Positional deviation inspection method for offset pattern and device thereof |
| JP2001281161A (en) * | 2000-03-30 | 2001-10-10 | Toshiba Corp | Defect inspecting device and inspecting method |
| US20040232313A1 (en) * | 2002-06-07 | 2004-11-25 | Jun Ye | System and method for lithography process monitoring and control |
| CN1553146A (en) * | 2003-05-30 | 2004-12-08 | 友达光电股份有限公司 | Intelligent switchboard controller with running monitoring function and monitoring method thereof |
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| CN1845297A (en) | 2006-10-11 |
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