CN100377629C - Adhesive system and method for printed circuit board surface - Google Patents
Adhesive system and method for printed circuit board surface Download PDFInfo
- Publication number
- CN100377629C CN100377629C CNB2004100368096A CN200410036809A CN100377629C CN 100377629 C CN100377629 C CN 100377629C CN B2004100368096 A CNB2004100368096 A CN B2004100368096A CN 200410036809 A CN200410036809 A CN 200410036809A CN 100377629 C CN100377629 C CN 100377629C
- Authority
- CN
- China
- Prior art keywords
- printed circuit
- circuit board
- pcb
- heat
- carrier plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000853 adhesive Substances 0.000 title claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 claims abstract description 70
- 239000003292 glue Substances 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920000297 Rayon Polymers 0.000 claims description 22
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 239000006071 cream Substances 0.000 claims description 6
- 230000004807 localization Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 230000000007 visual effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000006872 improvement Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 230000007306 turnover Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009954 braiding Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001149 cognitive effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100368096A CN100377629C (en) | 2004-04-14 | 2004-04-14 | Adhesive system and method for printed circuit board surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2004100368096A CN100377629C (en) | 2004-04-14 | 2004-04-14 | Adhesive system and method for printed circuit board surface |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1684571A CN1684571A (en) | 2005-10-19 |
CN100377629C true CN100377629C (en) | 2008-03-26 |
Family
ID=35263628
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100368096A Expired - Fee Related CN100377629C (en) | 2004-04-14 | 2004-04-14 | Adhesive system and method for printed circuit board surface |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100377629C (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI323503B (en) | 2005-12-12 | 2010-04-11 | Optopac Co Ltd | Apparatus, unit and method for testing image sensor packages |
CN105050333B (en) * | 2015-06-25 | 2018-07-03 | 贵州天义技术有限公司 | A kind of electronic component inserts system automatically |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001024127A (en) * | 1999-07-01 | 2001-01-26 | Internatl Business Mach Corp <Ibm> | Local humidity adjustment system, electronic device assembly and its manufacture |
US6301097B1 (en) * | 1999-07-27 | 2001-10-09 | International Business Machines Corporation | Inflatable sealing system for low temperature electronic module |
-
2004
- 2004-04-14 CN CNB2004100368096A patent/CN100377629C/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001024127A (en) * | 1999-07-01 | 2001-01-26 | Internatl Business Mach Corp <Ibm> | Local humidity adjustment system, electronic device assembly and its manufacture |
US6301097B1 (en) * | 1999-07-27 | 2001-10-09 | International Business Machines Corporation | Inflatable sealing system for low temperature electronic module |
Also Published As
Publication number | Publication date |
---|---|
CN1684571A (en) | 2005-10-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: HONGQICHANG SCIENCE & TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CHANG SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20070629 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20070629 Address after: Taoyuan County of Taiwan Province Applicant after: D-TEK Technology Co.,Ltd. Address before: Taoyuan County of Taiwan Province Applicant before: CHANGLIN SCIENCE AND TECHNOLOG |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: HONGQI NEW TECHNOLOGY CO., LTD. Free format text: FORMER NAME: HONGQI CHANGLIN TECHNOLOGY CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: China Taiwan Taoyuan County Patentee after: D-TEK TECHNOLOGY Co.,Ltd. Address before: Taoyuan County of Taiwan Province Patentee before: D-TEK Technology Co.,Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080326 |