CN100377629C - Adhesive system and method for printed circuit board surface - Google Patents
Adhesive system and method for printed circuit board surface Download PDFInfo
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- CN100377629C CN100377629C CNB2004100368096A CN200410036809A CN100377629C CN 100377629 C CN100377629 C CN 100377629C CN B2004100368096 A CNB2004100368096 A CN B2004100368096A CN 200410036809 A CN200410036809 A CN 200410036809A CN 100377629 C CN100377629 C CN 100377629C
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- printed circuit
- circuit board
- pcb
- heat
- carrier plate
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 239000000853 adhesive Substances 0.000 title claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 claims abstract description 70
- 239000003292 glue Substances 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229920000297 Rayon Polymers 0.000 claims description 22
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 239000006071 cream Substances 0.000 claims description 6
- 230000004807 localization Effects 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 230000000007 visual effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 9
- 230000008569 process Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000012545 processing Methods 0.000 description 6
- 230000006872 improvement Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
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- 230000008901 benefit Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009954 braiding Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000012827 research and development Methods 0.000 description 2
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- 239000002699 waste material Substances 0.000 description 1
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Abstract
The present invention relates to an adhesive system for the surfaces of printed circuit boards and a method thereof, which improves a traditional surface adhesive technique. The method comprises: a plurality of printed circuit boards are arranged on a loading tool board, and are fixed by heat resistant glue; electronic parts are installed on the printed circuit boards by the production line of the traditional surface adhesive technique. The system comprises a positioning module of a machine board, and an assembly and production module, wherein the positioning module of a machine board is positioned on the front end of the assembly and production module; when the printed circuit boards are assembled, the positioning module of a machine board is used firstly, and then the assembly and production module is used, wherein the positioning module of a machine board comprises a visual positioning camera, a movable arm and a holding device, wherein the production and assembly module comprises a distributing machine table of tin paste, an adhesive machine table of electronic part surfaces, and a heating machine table. The system and the method of the present invention enhances the production efficiency, and largely saves the labor cost.
Description
Technical field
The present invention relates to the method and system of a kind of printed circuit board surface adhesive technology (SMT, Surface MountTechnology), can improve the conventional surface adhesive technology, traditional SMT production line is improved to save production cost; And now the indivedual boards with the SMT production line still can use, and the present invention can reduce cost and have obvious effects, can be used for the place of most of SMT production lines.
Background technology
As relevant industry cognitive, it is the project of various in recent years printed circuit board (PCB) assemblings and positive research and development of foundry vendor and construction that SMT production line volume production ability improves, the shortening of the quoting of employed technical approach such as high speed board, different production line adjustment capability, annual repairs service time and production procedure improve or the like the place applicable to various SMT mounting electronic part, are satisfied so that reduce the demand of maintenance cost and time cost; As have the printed circuit-board assembly of numerous small parts, if can use the high speed board then can avoid the waste in many man-hours; Similarly, aspect the improving of mechanical performance, the maintenance period of a certain work board then represent the raising of production capacity, so production cost is minimized if can prolong; Production procedure so far improves the very important improvement project that can be described as, make by accurate industry is special because the board of SMT is many, slightly change, often price is high, but make the improvement of peripheral flow process if cooperate the board characteristic of SMT, then relative cost is lower and achieve noticeable achievement, and the improvement theory at this traditional similar industrial engineering process also can use simultaneously.
And when general printed circuit board (PCB) was assembled, as video signal card, high-order sound card and mobile phone board, mobile computer motherboard etc. had the place of tow sides installing electronic component demand, especially the obviously improvement of demand flow process; Because it is more loaded down with trivial details flow process that tow sides are placed electronic component, consuming time more, the tool space that has greatly improved, the arrangement of its flow process is produced facility and also is the project of each tame engineering manufacturer research and development with cooperating, and the reduction of producing board characteristic and time cost especially the research of each manufacturer improve emphasis.
As shown in Figure 1, in known printed circuit board (PCB) assembly line, a kind of printed circuit-board assembly is arranged, it has the demand of tow sides Assembly part, and this double-edged part is generally quantity and does not wait, and the positive relatively large IC (Integral Circuit) that has sometimes disposes, therefore the configuration of SMT production line is generally: stencil printer-positive SMT high speed machine-positive SMT is general general with machine-reflow stove with machine-reflow stove-turn-over board-stencil printer-reverse side SMT high speed machine-reverse side SMT, yet PCB is entered behind the production line before the turn-over board by stencil printer, the preceding half period operating time of production line and operating time production line second half section of experience, often different, make to produce to have some setbacks.When practical operation SMT production line, the product that has is that positive surface parts is many, and the product that has but is that the reverse side part is many, but the SMT production line is generally fixing and its order conversion seldom, therefore for adapting to product performance, the production procedure arrangement often is difficult to reach the target of high-effect operation SMT board.
Therefore for to make the time of production can cooperate the production line flow process, and can continue the high efficiency running, be necessary that once with a carrier plate multi-disc printed circuit board (PCB) being assembled (pasting) simultaneously goes up electronic component, enter the SMT production line and make tow sides or different product assemble simultaneously, yet this conception is subject to the resistant to elevated temperatures condition restriction of carrier board positioning mechanism palpus again; This is because the SMT part on the printed circuit board (PCB) need must have detent mechanism tool stationkeeping ability and heat-resisting by reflow stove (heating), by the SMT production line, finishes assembling with fixed printed circuit board.Can design though wherein have the mechanism of temperature capacity, yet its processing procedure is quite complicated and be difficult for automation, is unfavorable for a large amount of productions, because the consideration on the cost, and make manufacturer be reluctant to use; But, therefore also be necessary to seek a kind of flow process and have the SMT processing procedure now to replace with bigger production capacity along with the demand market expansion of electronic product.
By above narration as can be known the SMT production line hold the multi-disc printed circuit board (PCB) simultaneously and assemble and have the special saving effect in man-hour.
Heat-resisting viscose glue tool stationkeeping ability newly developed and heat-resisting, heat-resisting and do not solidify when the reflow furnace high-temperature, can bonding printed circuit board (PCB) on the carrier plate with by whole SMT production line, and place and take off printed circuit board (PCB) (PCB) process and save time easily, when using heat-resisting viscose glue, the automatic clamping and placing auxiliary machine of this printed circuit board (PCB) (PCB) has and is easy to be designed to desirable advantage.
Summary of the invention
Main purpose of the present invention is to provide a kind of structure and SMT production procedure method of SMT production system, and can implement by cheap structure and the relevant special-purpose peripheral automaton of cooperation of time cost, can be used for application places such as same series of products, different series product, low-cost high-quality effect can be provided.
In order to achieve the above object, the present invention is with known monolithic printed circuit board (PCB) (PCB, print circuitboard) formula SMT production system is improved as multi-disc PCB on a carrier plate, be used fixedly PCB structure of heat-resisting viscose glue, add the peripheral auxiliary board that cooperates, set out is of value to the SMT of practical application production system more economically, more more has practical value with known technology.
System of the present invention comprises: machine plate locating module; And assembling production module; Wherein this machine plate locating module is positioned at the front end of assembling the production module, and this printed circuit board (PCB) is assembled production module through this through this machine plate locating module earlier again when assembling; Wherein this machine plate locating module is constituted by a machinery equipment, have vision localization camera, mobile arm and clamping apparatus, a plurality of printed circuit board (PCB)s are positioned be provided with heat-resisting viscose glue in the precalculated position of this carrier plate on the carrier plate, in order to this printed circuit board (PCB) is positioned on this carrier plate; Wherein this production and assembly module is constituted by a plurality of machinery equipments, has tin cream and lays board, electronic component surface adhesion board and heating board, so that electronic component is assembled on this printed circuit board (PCB).
Method of the present invention comprises the following step: (1) is located at heat-resisting structure in the precalculated position of carrier plate; (2) a plurality of printed circuit board (PCB)s are located at the precalculated position of carrier plate; (3) transmission of this printed circuit board (PCB) is laid board, electronic component surface adhesion board and heating board through tin cream too, so that electronic component is assembled on this printed circuit board (PCB).
The present invention has following advantage:
1. reduce man-hour, the output value promotes: this point is because multi-disc PCB advances production line simultaneously, can reduce the man-hour (about 0.5sec) of pick and place machine turnover PCB and vision identification location, and then improves the mobility of pick and place machine, makes economic effect reach.
2. produce line and merge, reduce board: the general two-sided production line of PCB tool, the present invention economizes next reflow stove and a pick and place machine at least.
3. minimizing manpower: processing procedure is simplified reduces the artificial nature.
4. subtract the electricity charge and subtract maintenance cost: the subsidiary effect of economizing board equipment.
5. many plate collocation make production scheduling convenient: make things convenient for the adjustment of production management personnel elasticity.
6. the many plates of different PCB collocation can minimizing thread-changing man-hour: the many plates of pcb board of different product are merged required shutdown thread-changing man-hour in the time of to save traditional machine in a large number and change.
7. processing procedure is simplified: can reduce the manpower and the man-hour that cut the pcb board braiding apparatus.
Description of drawings
Fig. 1 is known printed circuit board (PCB) assembly line schematic diagram;
Fig. 2 is a preferred embodiment printed circuit board (PCB) assembly line schematic diagram of the present invention; And
Fig. 3 is a carrier plate point glue subsystem schematic diagram of the present invention.
Embodiment
Please refer to the operation principles of the present invention and the data estimator of the following stated, wherein the present invention utilizes the fixedly principle of multi-disc PCB on the carrier plate of heat-resisting viscose glue, with production line by single face assembling SMT part, this heat-resisting viscose glue can not solidify when meeting the reflow stove, so PCB places and takes off easily the carrier plate, add the peripheral auxiliary board that cooperates, set out is of value to the SMT of practical application production system with saving man-hour.
Please refer to the situation of Fig. 2 for preferred embodiment of the present invention, wherein after quoting heat-resisting viscose glue, configuration the present invention of SMT production line can be embodied as: machine plate locating module-stencil printer-positive SMT high speed machine-positive SMT is general with machine-reflow stove, this kind arrangement is for adapting to the production line that multi-disc PCB assembles together, need not the turn-over board and economizes next reflow stove in the centre, on the carrier plate, then can reuse same SMT production line if the PCB tow sides of same model are placed side by side, by behind this SMT production line, tow sides exchange and can make the PCB assembling be accomplished through production line in for the first time.
Demonstrate principal character of the present invention for understanding, the present invention can be divided into machine plate locating module and assembling production module according to its characteristic; Produce the sequencing of configuration with a whole piece SMT, wherein this machine plate locating module is positioned at the front end of assembling production module, this printed circuit board (PCB) is assembled the production module through this through this machine plate locating module earlier again when assembling, and machine plate locating module utilizes navigation system, makes a plurality of printed circuit board (PCB)s be positioned on the carrier plate to pass through the SMT production line; And wherein this machine plate locating module is constituted by a machinery equipment, has vision localization camera, mobile arm and clamping apparatus, a plurality of printed circuit board (PCB)s are positioned on the carrier plate; And for a SMT production line, wherein this production and assembly module can be a plurality of machinery equipment and constitutes, similar to traditional SMT production line, have tin cream and lay board (can be stencil printer), electronic component surface adhesion board and heating board, so that electronic component is assembled on this printed circuit board (PCB).Enter production line simultaneously and cause the saving in man-hour that production cost is minimized and the superior efficacy that the present invention produced is multi-disc PCB, and can make that economic effect is obvious when producing in a large number, the foundry or the manufacturer of especially general tool SMT production line, continued operation in 24 hours to a collection of subjob is finished and is just stopped to produce line often, thus production capacity to improve effect remarkable.
Still there is following variation in system of the present invention, and wherein this carrier plate can have heat-resisting viscose glue and is located at preposition, with this printed circuit board (PCB) location thereon; Wherein this vision localization camera can be charge coupled device (CCD, Charge Coupled Device) or contact image sensor (CIS, ContractImage Sensor) constitutes in addition, and these two kinds is modal two kinds of imageing sensors; And wherein this heat-resisting viscose glue is formed and be can be silicon (silicon), toluene (toluene) and resin (resin) and constitute, and by the reflow stove time, can not solidify, and make that PCB can be by taking off on the carrier plate, and not stay cull; And wherein this mobile arm can comprise slide rail rod member with horizontal locomotivity and the slide rail rod member with the ability of vertically moving, and generally can be linear bearing and cooperates stepper motor to constitute; And wherein this clamping apparatus is constituted by suction disc type, is convenient to cooperate the vacuum for industrial use source to draw PCB; Wherein this electronic component surface adhesion board comprises high speed machine and middling speed machine, and this high speed machine is bonding at undersized electronic component, and the general electronic component that is used for small size and medium size of middling speed machine is bonding; Wherein this carrier plate has position line bar grid so that this printed circuit board (PCB) location is convenient in addition; And wherein the printed circuit board (PCB) on this carrier plate can be 2 of same model, and be respectively face up with reverse side up; For asking a glue automation, the present invention further can comprise a carrier plate point glue subsystem as shown in Figure 3, makes heat-resisting viscose glue point be located at preposition; Wherein this carrier plate point glue subsystem comprises carrier plate carrier; The heat-resisting adhering machine of point; The initial slaking heater of heat-resisting viscose glue; And carrier plate collecting frame, from front to back make invocation point glue action be able to automation to finish; General heat-resisting viscose glue is reusable more than 20 times, for asking convenient, further comprises the viscose glue cleaning machine, to exceed the heat-resisting viscose glue of access times on the solvent flush away carrier plate.
A kind of printed circuit board surface adhesive technology method of the present invention is used aforesaid system, and it comprises the following step: (1) is located at heat-resisting structure in the precalculated position of carrier plate; (2) a plurality of printed circuit board (PCB)s are positioned over the precalculated position of carrier plate with high-precision mechanism; (3) above-mentioned printed circuit board (PCB) transmission is laid board, electronic component surface adhesion board and heating board through tin cream, so that electronic component is assembled on this printed circuit board (PCB).Wherein this heat-resisting structure can be heat-resisting viscose glue and forms.
The present invention has following advantage:
1. reduce man-hour, the output value promotes: this point is because multi-disc PCB advances production line simultaneously, can reduce the man-hour (about 0.5sec) of pick and place machine turnover PCB and vision identification location, and then improves the mobility of pick and place machine, makes economic effect reach.
2. produce line and merge, reduce board: the general two-sided production line of PCB tool, the present invention economizes next reflow stove and a pick and place machine at least.
3. minimizing manpower: processing procedure is simplified reduces the artificial nature.
4. subtract the electricity charge and subtract maintenance cost: the subsidiary effect of economizing board equipment.
5. many plate collocation make production scheduling convenient: make things convenient for the adjustment of production management personnel elasticity.
6. the many plates of different PCB collocation can minimizing thread-changing man-hour: the many plates of pcb board of different product are merged required shutdown thread-changing man-hour in the time of to save traditional machine in a large number and change.
7. processing procedure is simplified: can reduce the manpower and the man-hour that cut the pcb board braiding apparatus.
The above only is a preferable possible embodiments of the present invention, and is non-so limit claim of the present invention, so the equivalent altered chemical structure that all application specification of the present invention or accompanying drawing content are carried out all in like manner is contained in the scope of the present invention.
Claims (13)
1. printed circuit board surface adhesive system, it comprises:
Machine plate locating module; And
Assembling production module;
Wherein this machine plate locating module is positioned at the front end of assembling the production module, and this printed circuit board (PCB) is assembled production module through this through this machine plate locating module earlier again when assembling;
Wherein this machine plate locating module comprises vision localization camera, mobile arm and clamping apparatus; A plurality of printed circuit board (PCB)s are positioned be provided with heat-resisting viscose glue in the precalculated position of this carrier plate on the carrier plate, in order to this printed circuit board (PCB) is positioned on this carrier plate;
Wherein this production and assembly module comprises tin cream laying board, electronic component surface adhesion board and heating board; So that electronic component is assembled on this printed circuit board (PCB).
2. printed circuit board surface adhesive system as claimed in claim 1 is characterized in that this vision localization camera is made of charge coupled device or contact image sensor.
3. printed circuit board surface adhesive system as claimed in claim 1 is characterized in that this heat-resisting viscose glue composition is made of silicon, toluene and resin.
4. printed circuit board surface adhesive system as claimed in claim 1 is characterized in that this moves arm and includes the slide rail rod member of horizontal locomotivity and the slide rail rod member with the ability of vertically moving.
5. printed circuit board surface adhesive system as claimed in claim 1 is characterized in that this clamping apparatus is constituted by suction disc type.
6. printed circuit board surface adhesive system as claimed in claim 1 is characterized in that this electronic component surface adhesion board comprises that high speed machine and middling speed machine and this high speed machine are bonding at undersized electronic component.
7. printed circuit board surface adhesive system as claimed in claim 1 is characterized in that the printed circuit board (PCB) quantity on this carrier plate is the multi-disc of same model, and can be respectively face up with reverse side up.
8. printed circuit board surface adhesive system as claimed in claim 1 is characterized in that the printed circuit board (PCB) quantity on this carrier plate can be the multi-disc of different model, and can be respectively face up or reverse side up, or both.
9. printed circuit board surface adhesive system as claimed in claim 1 is characterized in that further comprising a carrier plate and is coated with the heat-resistant adhesive system comprehensively, makes heat-resisting viscose glue point be located at preposition.
10. printed circuit board surface adhesive system as claimed in claim 9 is characterized in that this carrier plate is coated with heat-resistant adhesive comprehensively and comprises carrier plate carrier; Heat-resistant adhesive coating glue machine; The initial slaking heater of heat-resisting viscose glue; And carrier plate collecting frame.
11. printed circuit board surface adhesive system as claimed in claim 10 is characterized in that further comprising one super heat-resisting viscose glue cleaning machine, exceeds the heat-resisting viscose glue of access times on can solvent flush away carrier plate.
12. a printed circuit board surface adhering method uses the system as claimed in claim 1, it comprises the following step:
(1) heat-resisting structure is located at the precalculated position of carrier plate;
(2) a plurality of printed circuit board (PCB)s are located at the precalculated position of carrier plate;
(3) transmission of above-mentioned printed circuit board (PCB) is laid board, electronic component surface adhesion board and heating board through tin cream too, so that electronic component is assembled on this printed circuit board (PCB).
13. printed circuit board surface adhering method as claimed in claim 12 is characterized in that this heat-resisting structure is formed by heat-resisting viscose glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100368096A CN100377629C (en) | 2004-04-14 | 2004-04-14 | Adhesive system and method for printed circuit board surface |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100368096A CN100377629C (en) | 2004-04-14 | 2004-04-14 | Adhesive system and method for printed circuit board surface |
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| Publication Number | Publication Date |
|---|---|
| CN1684571A CN1684571A (en) | 2005-10-19 |
| CN100377629C true CN100377629C (en) | 2008-03-26 |
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| CNB2004100368096A Expired - Fee Related CN100377629C (en) | 2004-04-14 | 2004-04-14 | Adhesive system and method for printed circuit board surface |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI323503B (en) | 2005-12-12 | 2010-04-11 | Optopac Co Ltd | Apparatus, unit and method for testing image sensor packages |
| CN105050333B (en) * | 2015-06-25 | 2018-07-03 | 贵州天义技术有限公司 | A kind of electronic component inserts system automatically |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001024127A (en) * | 1999-07-01 | 2001-01-26 | Internatl Business Mach Corp <Ibm> | Local humidity adjustment system, electronic device assembly and its manufacture |
| US6301097B1 (en) * | 1999-07-27 | 2001-10-09 | International Business Machines Corporation | Inflatable sealing system for low temperature electronic module |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001024127A (en) * | 1999-07-01 | 2001-01-26 | Internatl Business Mach Corp <Ibm> | Local humidity adjustment system, electronic device assembly and its manufacture |
| US6301097B1 (en) * | 1999-07-27 | 2001-10-09 | International Business Machines Corporation | Inflatable sealing system for low temperature electronic module |
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| CN1684571A (en) | 2005-10-19 |
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