CN103313590A - Surface Mount Technology (SMT) production line - Google Patents
Surface Mount Technology (SMT) production line Download PDFInfo
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- CN103313590A CN103313590A CN2013102533330A CN201310253333A CN103313590A CN 103313590 A CN103313590 A CN 103313590A CN 2013102533330 A CN2013102533330 A CN 2013102533330A CN 201310253333 A CN201310253333 A CN 201310253333A CN 103313590 A CN103313590 A CN 103313590A
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Abstract
The invention discloses a surface mount technology (SMT) production line. The SMT production line comprises printing machines, a connection table, chip mounters and a reflow soldering machine, wherein the printing machines, the connection table, the chip mounters and the reflow soldering machine are arranged in sequence. The number of the printing machines is a lot, a plurality of printing machines are respectively connected with the connection table, the printing machines are full-automatic printing machines, and the chip mounters are a plurality of full-automatic chip mounters. The SMT production line is simple in structure and convenient to install, the device utilization rate and the automation degree are improved by optimizing device combination connecting relations, and production efficiency of SMT production enterprises is greatly improved.
Description
Technical field
The present invention relates to a kind of SMT production line.
Background technology
Along with the raising of personnel selection cost, the automatic improving of enterprise is being accelerated at present, and at the electronic product production field, the SMT project is brought into schedule by enterprise.In the existing SMT line configuration, generally be printing machine, chip mounter, Reflow Soldering, AOI co-ordination.Efficient is to determine the most important technical indicator of the performance of enterprises, how to raise the efficiency, and be enterprise's urgent problem.In SMT production, what general speed was the fastest is chip mounter, is that example speed all can reach per hour 20000 with present common chip mounter.But the speed of printing machine is the time that every block of plate needed about 20 seconds, therefore, and in manufacturing and processing enterprise, processing circuit board quantity is big, but under the fewer situation of surface mount elements, speed depends on printing machine on every circuit board, and the efficient of chip mounter just can not well be brought into play like this.Chip mounter is maximum equipment that drops in the production line, so will fully improve its utilance, the efficient of SMT production line is improved.
Summary of the invention
Technical problem to be solved by this invention is: a kind of SMT production line is provided, by the configuration relation that improves equipment, solved the problem of printing machine and chip mounter speeds match among the SMT.
The present invention adopts following technical scheme for solving the problems of the technologies described above:
A kind of SMT production line comprises the printing machine that sets gradually, the platform of plugging into, chip mounter, Reflow Soldering, and described printing machine comprises at least two, and at least two printing machines are connected with the platform of plugging into respectively.
Described printing machine is full-automatic printer, and described chip mounter is full-automatic chip mounter.
Described chip mounter comprises at least one.
Described chip mounter is two, and two chip mounters set gradually.
Compared with prior art, the present invention has following beneficial effect:
The present invention is simple in structure, and is easy for installation, by the optimization equipment relation of being connected, improved usage ratio of equipment and automaticity, makes the production efficiency of SMT processing enterprise be improved significantly.
Adopt many printing machines, when printing machine wherein breaks down, other printing machines can work on, and do not influence whole SMT production line operation, have reduced the downtime, have improved production efficiency.
Description of drawings
Fig. 1 is the SMT production line block diagram of prior art.
Fig. 2 is SMT production line block diagram of the present invention.
Embodiment
Below in conjunction with accompanying drawing technical scheme of the present invention is elaborated:
As shown in Figure 1, existing SMT production line, comprise the full-automatic printer that sets gradually, the platform of plugging into, first full-automatic chip mounter 1, second full-automatic chip mounter 2, Reflow Soldering, circuit board to be processed at first passes through the full-automatic printer print solder paste, transfer to full-automatic chip mounter by the platform of plugging into again and carry out paster, finish the welding of circuit board then by Reflow Soldering.
Printing machine of the present invention comprises many, and many printing machines are connected with the platform of plugging into respectively, and described printing machine time-sharing work provides the circuit board that prints by the platform of plugging into for described chip mounter.
Present embodiment is the course of work of example explanation SMT production line of the present invention with two printing machines, two chip mounters:
Two printing machines of present embodiment adopt full-automatic printer, and model is GKG-5, and the described platform of plugging into adopts the supporting platform of plugging into of Cologne prestige company, and described first full-automatic chip mounter 1 adopts YAMAHA YS12, and second full-automatic chip mounter 2 adopts YAMAHA YS12p.
The composition of present embodiment SMT production line as shown in Figure 2, the described platform of plugging into, first full-automatic chip mounter 1, second full-automatic chip mounter 2, Reflow Soldering set gradually, two full-automatic printers are connected with the platform of plugging into respectively.
When the circuit board radix big, when surface mount elements is fewer on the circuit board, average every circuit board paster needs 10 seconds Time Calculation, the time of every circuit board print solder paste needs is 20 seconds, be example with 100 circuit boards, total paster time needs 1000 seconds, total print solder paste time is 2000 seconds, therefore the paster of finishing 100 circuit boards needs 1000 seconds at least, but if dispose by the equipment of traditional SMT production line, the intact plate of each paster need wait 10 seconds and could paste next piece plate, finishes the paster time of 100 blocks of plates like this and wants 2000 seconds at least, to finish 100 circuit board paster times spent the shortest in order to reach, then chip mounter needs continuous operation, adopts the allocation plan of present embodiment, and two printing machines are worked simultaneously, the printing of finishing 100 blocks of plates needs 1000 seconds, can guarantee chip mounter, printing machine is always all in work.
Adopt above-described embodiment, operating efficiency is 2 times of traditional SMT production line operating efficiency.
Embodiment two: when the circuit board radix big, surface mount elements is seldom the time on the circuit board, average every circuit board paster needs 5 seconds Time Calculation, the time of every circuit board print solder paste needs is 20 seconds, be example with 100 circuit boards equally, total paster time needs 500 seconds, total print solder paste time is 2000 seconds, therefore the paster of finishing 100 circuit boards needs 500 seconds at least, but if dispose by the equipment of traditional SMT production line, the intact plate of each paster need wait 15 seconds and could paste next piece plate, finishes the paster time of 100 blocks of plates like this and wants 2000 seconds at least, and to finish 100 circuit board paster times spent the shortest in order to reach, then chip mounter needs continuous operation, adopt four printing machines to work simultaneously, the printing of finishing 100 blocks of plates needs 500 seconds, can guarantee chip mounter, printing machine is always all in work.
Adopt chip mounter, the printing machine allocation plan of embodiment 2, operating efficiency is 4 times of traditional SMT production line operating efficiency.
Further, adopt many printing machines, when printing machine wherein breaks down, other printing machines can work on, and do not influence whole SMT production line operation, have reduced the downtime, have improved production efficiency.
When the circuit board radix is big, when surface mount elements is a lot of on the circuit board, can adopt a plurality of chip mounters to work simultaneously.
Claims (4)
1. a SMT production line comprises the printing machine that sets gradually, the platform of plugging into, chip mounter, Reflow Soldering, and it is characterized in that: described printing machine comprises at least two, and at least two printing machines are connected with the platform of plugging into respectively.
2. SMT production line according to claim 1, it is characterized in that: described printing machine is full-automatic printer, described chip mounter is full-automatic chip mounter.
3. SMT production line according to claim 1 and 2, it is characterized in that: described chip mounter comprises at least one.
4. SMT production line according to claim 3, it is characterized in that: described chip mounter is two, and two chip mounters set gradually.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102533330A CN103313590A (en) | 2013-06-25 | 2013-06-25 | Surface Mount Technology (SMT) production line |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013102533330A CN103313590A (en) | 2013-06-25 | 2013-06-25 | Surface Mount Technology (SMT) production line |
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| CN103313590A true CN103313590A (en) | 2013-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013102533330A Pending CN103313590A (en) | 2013-06-25 | 2013-06-25 | Surface Mount Technology (SMT) production line |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684270A (en) * | 2013-11-27 | 2015-06-03 | 三星泰科威株式会社 | System for monitoring and estimating disorder of SMT device and method of operating same |
| CN104684271A (en) * | 2013-11-27 | 2015-06-03 | 三星泰科威株式会社 | A system for monitoring and predicting faults of SMT equipment and a method for operating the same |
| CN105050336A (en) * | 2015-08-27 | 2015-11-11 | 伟创力电子技术(苏州)有限公司 | Surface mount technology (SMT) family production system |
| CN106793557A (en) * | 2017-01-17 | 2017-05-31 | 上海辰竹仪表有限公司 | Material collocation method and device, SMT production methods and production system |
| CN109696894A (en) * | 2018-12-30 | 2019-04-30 | 联想(北京)有限公司 | Production line state judging method and device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102118957A (en) * | 2009-12-30 | 2011-07-06 | 比亚迪股份有限公司 | Collinear production method for printed circuit board and SMT production line |
| CN202652729U (en) * | 2012-06-13 | 2013-01-02 | 无锡商业职业技术学院 | Energy-saving SMT production line |
-
2013
- 2013-06-25 CN CN2013102533330A patent/CN103313590A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102118957A (en) * | 2009-12-30 | 2011-07-06 | 比亚迪股份有限公司 | Collinear production method for printed circuit board and SMT production line |
| CN202652729U (en) * | 2012-06-13 | 2013-01-02 | 无锡商业职业技术学院 | Energy-saving SMT production line |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684270A (en) * | 2013-11-27 | 2015-06-03 | 三星泰科威株式会社 | System for monitoring and estimating disorder of SMT device and method of operating same |
| CN104684271A (en) * | 2013-11-27 | 2015-06-03 | 三星泰科威株式会社 | A system for monitoring and predicting faults of SMT equipment and a method for operating the same |
| CN104684271B (en) * | 2013-11-27 | 2019-05-03 | 韩华精密机械株式会社 | System for monitoring and predicting failure of SMT equipment and method of operating same |
| CN104684270B (en) * | 2013-11-27 | 2019-05-10 | 韩华精密机械株式会社 | System for monitoring and predicting failure of SMT equipment and method of operating same |
| CN105050336A (en) * | 2015-08-27 | 2015-11-11 | 伟创力电子技术(苏州)有限公司 | Surface mount technology (SMT) family production system |
| CN105050336B (en) * | 2015-08-27 | 2018-09-21 | 伟创力电子技术(苏州)有限公司 | A kind of familial production systems of SMT |
| CN106793557A (en) * | 2017-01-17 | 2017-05-31 | 上海辰竹仪表有限公司 | Material collocation method and device, SMT production methods and production system |
| CN106793557B (en) * | 2017-01-17 | 2019-08-20 | 上海辰竹仪表有限公司 | Material configuration method and device, SMT production method and production system |
| CN109696894A (en) * | 2018-12-30 | 2019-04-30 | 联想(北京)有限公司 | Production line state judging method and device |
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Application publication date: 20130918 |