TW503170B - Method for producing injection molded mold with reflective light guide - Google Patents

Abstract

The present invention discloses a method for producing an injection molded mold with a reflective light guide, which comprises: producing a patterned soft photomask from a soft film; using a photolithography to produce the patterned soft photomask into a female mold; coating a silver film on the non-conductive female mold; electroplating the mold to form a mold core, in which the conductive female mold can be electroplated directly. The invented method for injection mold with reflective light guide not only can increase the process efficiency, but also is a simple and economical process.

Description

經濟部智慧財產局員工消費合作社印製 503170 A7 B7 五、發明說明（ί ) 【本發明之領域】 本發明係關於一種反射式導光板之射出成型 模具製法，尤指一種經濟，且適用於不同尺寸反 射式導光板之製法。 【本發明之背景】 習知的導光板製作技術可概分為印刷式與非 印刷式，其中非印刷式導光板係將設計好的導光 圖案直接製作於模具上，採直接射出成型或壓印 製作；而依其模具製作或射出技術之不同又可細 分為化學蝕刻法、精密機械切削法、内部擴散方 式、喷砂方式、及微光刻方式（LIGA)。 上述各種不同導光板製程技術中，印刷式導 光板製程解析度約為1 Ο Ο μ m ^因網點太大而使得 出射光之均勻性不易控制，網點散射之導光模式 因光能損耗造成輝度不佳，而網點也容易因與棱 鏡片或液晶顯示器畫素之干涉作用而降低顯示器 之影像品質5因此在大型液晶顯不器對畫面品質 之要求逐漸嚴格之趨勢下，勢必逐漸為市場所淘 汰0 至於非印刷式導光板製程技術，喷砂與内部 擴散之製程技術因為製程解析度不佳、製程參數 控制不易及再現性不佳等缺點，難以落實光學設 計所制定之規格。因此實際應用並不多。化學蚀 刻法為目前業界常用之導光板射出成型技術，其 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297 ^釐) -----------------訂---------線 (請先閲讀背面之注意事項再填寫本頁) 503170 A7 B7 五、發明說明（2 ) (請先閱讀背面之注意事項再填寫本頁) 製程解析度約在30μηι-40μπι，其製程設備簡單， 可控制網點之大小與密度來提高均勻度，然因其 蝕刻速率不易控制，且僅適用於半球形之導光圖 樣，在輝度之表現上較反射式導光板差，未來在 大尺寸導光板之發展上，將逐漸為微光刻製程技 術所取代。 發明人爰因於此，本於積極發明之精神，亟 思一種可以解決上述問題之「反射式導光板之射 出成型模具製法」，幾經研究實驗終至完成此項 嘉惠世人之發明。 【本發明之概述】 本發明之主要目的係在提供一種反射式導光 板之模具製法，俾能增加製程效率，並具有簡單 及經濟的優點。 經濟部智慧財產局員工消費合作社印製 為達成上述之目的，本發明反射式導光板之 射出成型模具製法之操作步騾係先以軟式底片製 成一具有圖案之軟式光罩，並將光阻劑塗佈於一 基板上。接著，以微影曝光顯影技術將軟式光罩 之圖案轉移至基板上，得到具有圖案之母模；然 後以熱流變將顯影後之光阻劑加熱，使母模表面 圖形平滑；再於母模上蒸鍍或濺鍍一層銀膜；銀 膜上再電鑄一層金屬。電鑄完成後將母模及銀膜 自電鑄金屬層分離。最後，將電鑄金屬層置於電 解液中，使殘留之銀膜剝離。 本紙張尺度適用中國國家標準（CNS)A4規格(210 X 297泰釐) 503170 A7 _B7 五、發明說明（3 ) 上述之母模一般為非導電性，而電解液中尚 包括一剝銀劑，最後可以熔射方法快速增厚模仁。 本發明另一種反射式導光板之射出成型模具 製法之操作步驟與前述大同小異，主要包括先以 軟式底片製成軟式光罩，並將光阻劑塗佈於一基 板上◦接著，以微影曝光顯影技術將軟式光罩之 圖案轉移至基板上，得到具有圖形之母模。然後 以熱流變將顯影後之光阻劑加熱，使母模表面圖 形平滑’再於母模上電禱一層金屬，形成一電轉 模仁。接著將母模與電鑄模仁分離。最後，以二 次翻模技術翻製母模，可得到至少一個模仁。 此種方法主要係用於母模為導電性者，而於 母模與電鑄模仁分離之前，尚可以電化學方式作 純化處理，在電鑄模仁表面形成一層氧化皮模。 最後亦可以熔射方法快速增厚模仁。 簡 1...............1 式第 圖 明 説 單 程 流 作 製 之 具 模 板 光 導 式 射 反 明 發 本 係 圖 -------------------_ 訂---------線^^^ (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 圖 明 説 〇 號無 圖 明 説 細 詳 之 例 施 實 體 具 佳 較 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 503170 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（斗） 本發明利用軟式底片作為光罩 曝朵、 將底片上之導光圖案轉移至光阻卜 万式， ’然狳姐，Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperative 503170 A7 B7 V. Description of the Invention (Field of the Invention) The present invention relates to an injection molding mold manufacturing method for a reflective light guide plate, especially an economical and applicable to different Manufacturing method of size reflective light guide plate. [Background of the present invention] The conventional light guide plate manufacturing technology can be roughly divided into printed and non-printed types. Among them, the non-printed light guide plate is made by designing a light guide pattern directly on a mold, which is directly injection molded or pressed. According to the different mold making or injection technology, it can be subdivided into chemical etching method, precision mechanical cutting method, internal diffusion method, sandblasting method, and microlithography method (LIGA). Among the above-mentioned different light guide plate process technologies, the resolution of the printed light guide plate process is about 1 〇 Ο μ m ^ The uniformity of the emitted light is not easy to control because the dots are too large, and the light guide mode of the dots scatters the brightness due to the loss of light energy Poor, and the dots are also liable to reduce the image quality of the display due to interference with prism lenses or pixels of the LCD display5. Therefore, under the trend that the large LCD monitors have stricter picture quality requirements, they will be gradually eliminated by the market. 0 As for the non-printing light guide plate process technology, the sand blasting and internal diffusion process technology is difficult to implement the specifications formulated by optical design due to the shortcomings of poor process resolution, difficult process parameter control, and poor reproducibility. Therefore, there are not many practical applications. The chemical etching method is a light guide plate injection molding technology commonly used in the industry. Its paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 ^ centimeters) ---------------- -Order --------- line (please read the notes on the back before filling this page) 503170 A7 B7 V. Description of the invention (2) (please read the notes on the back before filling this page) Process analysis The degree is about 30μη-40-40μπι. Its process equipment is simple. It can control the size and density of the dots to improve uniformity. However, it is not easy to control the etching rate, and it is only suitable for hemispherical light guide patterns. It is more reflective in terms of brightness. The type of light guide plate is poor. In the future, the development of large-size light guide plates will gradually be replaced by microlithography process technology. Because of this, the inventor, in the spirit of active invention, urgently thought of a "reflection light guide plate injection molding mold manufacturing method" that can solve the above problems. After several research experiments, he finally completed this invention that benefits the world. [Summary of the present invention] The main purpose of the present invention is to provide a mold manufacturing method of a reflective light guide plate, which can increase the process efficiency, and has the advantages of simplicity and economy. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs In order to achieve the above-mentioned purpose, the operation steps of the method for manufacturing the injection molding mold of the reflective light guide plate of the present invention are to first make a soft mask with a pattern from a soft negative film, and apply a The agent is coated on a substrate. Next, the pattern of the soft mask is transferred to the substrate by lithography exposure and development technology to obtain a patterned master mold; then the developed photoresist is heated with thermal rheology to smooth the surface pattern of the master mold; A layer of silver film is evaporated or sputtered; a layer of metal is electroformed on the silver film. After the electroforming is completed, the master mold and the silver film are separated from the electroforming metal layer. Finally, the electroformed metal layer was placed in an electrolytic solution to peel off the remaining silver film. This paper size applies Chinese National Standard (CNS) A4 specification (210 X 297 Thai) 503170 A7 _B7 V. Description of the invention (3) The above master mold is generally non-conductive, and the electrolyte also contains a silver peeling agent. Finally, the mold can be quickly thickened by the spray method. The operation steps of the manufacturing method of the injection molding mold of another reflective light guide plate of the present invention are similar to the foregoing, which mainly include firstly making a soft photomask from a soft negative film, and coating a photoresist on a substrate. Then, exposure is performed by lithography The developing technology transfers the pattern of the soft mask to the substrate to obtain a master mold with a pattern. Then, the developed photoresist is heated with thermal rheology to make the surface pattern of the master mold smooth, and then a layer of metal is electrically prayed on the master mold to form an electric mold core. The mother mold is then separated from the electroformed mold kernel. Finally, at least one mold core can be obtained by flipping the master mold using the two-fold flipping technique. This method is mainly used for those whose master mold is conductive, and before the master mold is separated from the electroformed mold kernel, it can still be electrochemically purified to form an oxide scale on the surface of the electroformed mold kernel. Finally, the mold core can be quickly thickened by the spray method. Jane 1 ............ 1 The first diagram shows that the single-pass streaming system with a template light guide type anti-reflective hair is shown in this diagram ------------ -------_ Order --------- Line ^^^ (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs There is no detailed example for illustration. The application entity is better than the paper size. It applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). 503170 Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. A7. ) The present invention uses a soft negative film as a photomask to transfer the light guide pattern on the negative film to the photoresist type.

進行熱流變使光阻内聚形成圓滑之、對光PJL •球开:j + 柱形，熱流變製程不僅可使光阻形成_ ^或半圓 表，更可修飾底片上線條邊緣所形成的貝狐狀之外 軟式底片光罩之解析度可達Ι 6μηι，而2 f結構， 用之光罩對準機（KARL SAUSS MA&、 ^明所使 之解批& 1 μιη，故利用底片配合MA6之制扣 啊度為 〜灰程解析、 1 · 6 μηι，在精密電鑄方面，電鑄件盥於 又為 „ '、成挺的尺+这 呈可控制於土〇·2 5 μηι，故利用光微影製程製作母模 並以精密電鑄進行模仁之製作方式，相較於其= 模仁製作技術而言，其製程解析度大幅提高，以 此解析度足以達到反射式（Micro Reflector)導光板 光學設計上之規格要求，另外，底片曝光法之光 微影製程因所採用底片為印刷電路板製程所習 用’其製作容易，因此若須調整導光圖案規格（如 網點大小及分佈密度等）以配合光學設計上提高均 勻性及輝度的要求，底片曝光方式相較於傳統石 英光罩較具彈性，且大幅降低光罩之取得成本， 更由於底片曝光製程在大型導光板之製作上，可 以採用印刷電路板平行光曝光設備取代昂貴的半 導体製程之steppr曝光機。相較於其他如化學蚀刻 或精密機械加工之製程技術，底片曝光法之模仁 製作技術，因可藉改變網點密度而補償與光源因 距離不同而造成均勻度不佳之問題，又因其導光 本紙張尺度適巾國國家標準（CNS)A4規格（210 X 297 ¥釐） ------------- ί請先閱讀背面之注意事項再填寫本頁)Perform thermal rheology to make the photoresist cohesive to form a smooth, light-resistant PJL. • Ball opening: j + cylindrical shape. The thermal rheological process can not only form the photoresist _ ^ or a semi-circular table, but also modify the shell formed by the edges of the lines on the negative The resolution of the soft negative film mask outside the fox shape can reach 1-6 μηι, and the 2 f structure is used with a mask alignment machine (KARL SAUSS MA &, ^ Ming Deconstructed & 1 μιη), so the use of negative film The degree of MA6's buckle is ~ gray range analysis, 1 · 6 μηι. In terms of precision electroforming, the electroformed parts are also „', a very strong ruler + this can be controlled in the soil 0.25 μm, so The photolithography process is used to make the master mold and the precision electroforming is used to make the mold core. Compared to its = mold core production technology, the process resolution is greatly improved, so that the resolution is sufficient to achieve the reflective type (Micro Reflector). The specifications of the optical design of the light guide plate. In addition, the photolithography process of the negative film exposure method is used because the negative film is used in the printed circuit board process. It is easy to make. Etc.) to match optics The design improves the requirements for uniformity and brightness. The film exposure method is more flexible than the traditional quartz mask, and the cost of obtaining the mask is greatly reduced. Furthermore, because the film exposure process is used to produce large light guide plates, printed circuits can be used. The plate parallel light exposure equipment replaces the expensive steppr exposure machine of the semiconductor process. Compared with other process technologies such as chemical etching or precision machining, the mold core production technology of the negative film exposure method can compensate the light source due to the change in the density of the dot The problem of poor uniformity caused by different distances, and due to its light guide, paper size, and national standard (CNS) A4 specifications (210 X 297 ¥ cent) ------------- ί Please (Read the notes on the back before filling out this page)

503170 五、發明說明（r) 圖案具微小的特性及光學鏡面的外表，可降低光 能的損失，提高出射光之輝度，無論就製程解析 度或光學效率（如均勻性及輝度等）而言，此技術 均具備其獨特的優勢。503170 V. Description of the invention (r) The pattern has small characteristics and the appearance of the optical mirror surface, which can reduce the loss of light energy and improve the brightness of the emitted light, regardless of the process resolution or optical efficiency (such as uniformity and brightness) This technology has its unique advantages.

本發明選用之光阻除了為Shipley 5740正型光 阻外’其他如AZ、JSR及NIPPON PAINT等亦適用 於電麵之光阻劑，且塗佈方法亦有SPIN COATING ’ Dip COATING，ROLLER COATING， PRINTING及電著法等，亦適用於本製程之光阻塗 佈’珍晶片及玻離基板在塗佈之前，須先經過三 氯乙烷、丙酮、異丙醇等溶劑之清洗，再經去水 烘烤、Η M D S等塗底動作之後，即可進行光阻之塗 佈。光阻厚度約在3〜5 0 μπι之間，光阻厚度可由 塗佈參數或可選擇不同形式之光阻劑控制。光阻 在進行塗佈之後，須進行軟烤以加速除去光阻劑 中所含的溶劑並可增加光阻對晶片之附著力’軟 烤可於烘箱或加熱板中進行，但建議以在加熱板 上進行軟烤’因於熱板加熱溶劑之蒸發速度决 且因靠近矽晶片之内層光阻之受熱溫度較外層光 阻高，較能有效除去内層之溶劑，避免内層光阻 #爲變 溶劑之殘留而影響光阻對晶片之附著力’ I w曰 後續之曝光顯影製程之解析度，而烘箱供烤□ 層受熱溫度較高，因此外層溶劑會先行蒸^ & , ，# P# 成光阻表面硬化而使得内層溶劑不易除衣 著力、曝光顯影等動作造成不良之影響，此夕卜’ 本紙張尺度適用中國國家標準(CNS)A4規格（210 X 297i釐） I-----------I —丨訂--------線 (請先閲讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 503170 經濟部智慧財產局員工消費合作社印製 五、發明說明（心 軟烤溫度必 完全，殘留 影響後續曝 造成光阻劑 光阻的熱流 一，顯影後 半球狀之外 罩轉移而來 為能讓 容，特舉較 實施例1In addition to the Shipley 5740 positive photoresistor used in the present invention, other photoresistants such as AZ, JSR and NIPPON PAINT are also suitable for electrical surface resists, and the coating method is also SPIN COATING 'Dip COATING, ROLLER COATING, PRINTING and electronic writing methods are also applicable to the photoresist coating of this process. The wafers and glass substrates must be washed with solvents such as trichloroethane, acetone, and isopropanol before coating. After the base coating operations such as water baking and Η MDS, photoresist coating can be performed. The thickness of the photoresist is about 3 ~ 50 μm. The thickness of the photoresist can be controlled by coating parameters or different types of photoresist. After the photoresist is coated, it must be soft baked to accelerate the removal of the solvent contained in the photoresist and increase the photoresist's adhesion to the wafer. The soft baking can be performed in an oven or a hot plate, but it is recommended to heat the photoresist. Soft baking on the plate is due to the evaporation speed of the hot plate heating solvent and because the heating temperature of the inner photoresistor near the silicon wafer is higher than the outer photoresistance. It is more effective to remove the inner layer solvent and avoid the inner layer photoresistance. Residues affect the adhesion of the photoresist to the wafer 'I w refers to the resolution of the subsequent exposure and development process, and the oven is baked. The layer is heated at a high temperature, so the outer solvent will be steamed first. ^ &Amp;,# P # 成The surface of the photoresist is hardened, which makes the inner layer of the solvent difficult to remove clothing, exposure and development, and other adverse effects. At the same time, this paper size applies to China National Standard (CNS) A4 (210 X 297i centimeters) I ----- ------ I — 丨 Order -------- line (please read the precautions on the back before filling out this page) Printed by the Intellectual Property Bureau Employee Consumption Cooperative of Ministry of Economic Affairs 503170 Employee Consumption of Intellectual Property Bureau of Ministry of Economic Affairs Printed by the cooperative (Heart soft roasting temperature must be complete, the residual will affect the subsequent exposure and cause the photoresist. The heat flow of the photoresist. I. After the development, the hemispherical outer cover is transferred.

A7A7

J 須精確控制，溫度太低會造成烘烤不 的溶劑將對附著力造成不良影響，並 光顯影製程，而太高的烘烤溫度則會 的硬化脆裂，造成顯影之困難。此外， 變亦為導光板母模製作之關鍵技術之 之光阻經過熱流變製程後，可以聚成 表，且光阻外緣之毛邊現象（自底片光 )經熱流變處理後會平滑化。 貝备查委員更瞭解本發明之技術内 佳具體貫施例説明如下。 本實施例之反射式導光板模具係適用於8吋以 下之中小尺寸導光板，其製作流程如第1圖所示， 主要步騾詳述如下： (A) 軟式光罩製作 以SPERT- 1 700繪畫軟體繪製導光圖樣並以 ORDOPECH Model 500 Laser Pl〇ter；IGI Lazerwiter Model 2l〇〇F_523nM設備於軟式底片上製作具有圖 案之軟式光罩。 (B) 導光板母模製作 於矽晶片或玻璃基板上塗佈光阻剩，將設計 好的導光板圖案（半球形或半圓拄形）以黃光微影 製程（Photolithography)，以軟式光罩的方式曝光 後，將基板置於顯影液中顯影，使光罩上的圖案 ----------ile^--------訂---------線 Φ (請先閱讀背面之注意事項再填寫本頁) 503170 A7 B7 五、發明說明（〇 ) 轉移至珍晶片或破璃基板上。接著利用熱流變 (Thermal Reflow)方式將顯影過後之光阻劑加熱形 成表面光滑之微透鏡結構。其製程參數及條件概 述如后 ： (1) 母模基板：矽晶片 (2) 晶片清潔： 二鼠乙 fe(TCE，trichloroethane)，50°C 〜65 °C，浸泡6 0〜1 2 0秒 丙酮（Acetone): 50〇C 〜65〇C，浸泡 60 〜120 秒 異丙醇（IPA) : 50°C〜65°C，浸泡60〜120秒 (3) 去水烘烤：1 80°C〜22(TC (於加熱板上）， 60〜120秒 (4) 塗底（Priming):以 HMDS(Hexamethyl d i s i 1 a z a n e)進行晶片表面塗底，並進行烘烤 (180°C〜220°C，60〜120秒）進行脱水反應以增 加光阻對晶片之附著力 (5) 光阻塗佈：以KARL SUSS SU8旋轉塗佈機塗 佈光阻劑S h i p 1 e y 5 7 4 0 (6) 軟烤：90〜125°C (於加熱板上），10〜25分鐘 (7) 曝光·· KARL SUSS ΜA-6光罩對準機 光罩：軟式底片光罩 曝光模式：Soft Contact 光源：CP(UV light)，350mW 曝光時間：5〜25秒 冢紙張尺度適用中國國家標準（CNS)A4規格m〇 x 297各釐了 ' ----------if (請先閱讀背面之注意事項再填寫本頁) * !| 訂·!II - 經濟部智慧財產局員工消費合作社印製J must be precisely controlled. Too low a temperature will cause a solvent that does not bake, which will adversely affect the adhesion, and the photo development process, while too high a bake temperature will harden and crack, which will make development difficult. In addition, the photoresist, which is also a key technology for the production of the light guide plate master mold, can be gathered into a table after the thermo-rheological process, and the burr phenomenon (light from the film) on the outer edge of the photo-resist will be smoothed after the thermo-rheological treatment. The members of the Beibei Committee have a better understanding of the technical details of the present invention. The reflective light guide plate mold of this embodiment is suitable for small and medium-sized light guide plates below 8 inches. The manufacturing process is shown in Figure 1. The main steps are detailed as follows: (A) The soft photomask is manufactured with SPERT-1 700. The drawing software draws the light guide pattern and uses ORDOPECH Model 500 Laser Pl0ter; IGI Lazerwiter Model 21F_523nM equipment to produce a soft mask with a pattern on the soft film. (B) The light guide plate master mold is made on a silicon wafer or a glass substrate and coated with light barriers. The designed light guide plate pattern (hemispherical or semicircular shape) is photolithography and a soft mask is used. After exposure, the substrate is developed in a developing solution to make the pattern on the photomask ---------- ile ^ -------- order --------- line Φ (Please read the precautions on the back before filling in this page) 503170 A7 B7 V. Description of the invention (〇) Transfer to a rare wafer or broken glass substrate. Then the thermal resist is used to heat the developed photoresist to form a smooth microlens structure. The process parameters and conditions are summarized as follows: (1) Mother mold substrate: Silicon wafer (2) Wafer cleaning: Ermofe (TCE, trichloroethane), 50 ° C ~ 65 ° C, immersed for 60 to 120 seconds Acetone: 50 ° C ~ 65 ° C, soak for 60 ~ 120 seconds. Isopropyl alcohol (IPA): 50 ° C ~ 65 ° C, soak for 60 ~ 120 seconds. (3) De-water baking: 1 80 ° C ~ 22 (TC (on a hot plate), 60 ~ 120 seconds (4) Priming): Primer wafer surface with HMDS (Hexamethyl disi 1 azane), and bake (180 ° C ~ 220 ° C) (60 ~ 120 seconds) Dehydration reaction to increase the adhesion of the photoresist to the wafer (5) Photoresist coating: Use KARL SUSS SU8 spin coater to apply the photoresist S hip 1 ey 5 7 4 0 (6) Soft baking: 90 ~ 125 ° C (on hot plate), 10 ~ 25 minutes (7) Exposure ·· KARL SUSS MA-6 mask alignment machine Mask: Soft film mask Exposure mode: Soft Contact Light source: CP (UV light), 350mW Exposure time: 5 ~ 25 seconds. The paper size is applicable to Chinese National Standard (CNS) A4 specifications m〇x 297 centimeters. ---------- if (Please read the Please fill in this page for attention) *! | Order · ! II-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs

經濟部智慧財產局員工消費合作社印製 五、發明說明（s ) (8 )顯影·以顯影劑S h i p 1 e y Μ P 4 5 0及d i p p i n g (浸 泡）方式進行光阻劑之顯影。 (9)熱流變：i25〜18〇〇c，5〜3〇分鐘（於烘箱内）。 (c)導光板母模表面處理 對於石夕晶片、玻璃基板及光阻劑等非導電性 母模表面之處理，主要步騾為導電銀膜鍍製。其 鍍製可以蒸鍍或濺鍍方法為之，選擇銀為導電層 之原因為銀之導電性佳，且後續可以電化學方法 剥離’又因其表面亮度高，在進行剝離後可於模 仁表面獲得較佳之光學鏡面品質，非常適合作為 非導電性母模表面之導電層，本實施例使用之；賤 鍍設備為DENTON VACCUM DESKII，濺鍍條件 為空氣壓力75MILLITOR及電流45MILLIAMP ;產 生銀膜厚度約0.8〜1 .5um ◦ (D)精密電鑄翻模 為加速電鑄模仁之製作，本發明先依表1之電 I尋液組成及操作參數，以2 - 3 A S D之低電流密度進 行母模之電鑄複製2 7 - 4 0小時，除減少角隅處因電 流密度不均而產生電鑄層厚薄不均之問題，並能 有效控制電麵層之内應力，可獲得較精確之複製 品質；接著再以1 2 -1 4 A S D之電流密度進行電鑄作 業約60小時，至電鑄層厚約5-6mm。 表 1 電鑄液組成及操作參數 ϋ値一~ ΐ紙張尺度適用中國國家標準（CI^S)A4規格（210 X 297^釐） I----— — — 1 — — —^®^ - ----- 訂----I---線 (請先閱讀背面之注意事項再填寫本頁) 503170 Α7 Β7 五、發明說明（7 )Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (s) (8) Development · Development of photoresist using the developer Sh i p 1 e y MP 4 50 and dip p i ng (immersion). (9) Thermal rheology: i25 ~ 180c, 5 ~ 30 minutes (in the oven). (c) Surface treatment of light guide plate master mold For the surface treatment of non-conductive master molds such as Shixi wafer, glass substrate and photoresist, the main steps are plating of conductive silver film. Its plating method can be vapor deposition or sputtering. The reason for choosing silver as the conductive layer is that silver has good electrical conductivity and can be peeled off electrochemically in the future. Because of its high surface brightness, it can be used in molds after peeling. The surface has better optical mirror quality, which is very suitable as a conductive layer on the surface of a non-conductive master mold, which is used in this embodiment; the base plating equipment is DENTON VACCUM DESKII, and the sputtering conditions are air pressure 75MILLITOR and current 45MILLIAMP; silver film thickness is produced; About 0.8 ~ 1.5um ◦ (D) Precision electroformed flip mold is used to accelerate the production of electroformed mold cores. According to the composition and operating parameters of the electric search solution in Table 1, the present invention uses a low current density of 2-3 ASD to perform the master mold. The electroformed copying takes 2-7 to 40 hours, in addition to reducing the uneven thickness of the electroformed layer due to the uneven current density at the corners, and can effectively control the internal stress of the electric surface layer to obtain a more accurate copy quality. ; Then, the electroforming operation is performed at a current density of 1 2 -1 4 ASD for about 60 hours, and the thickness of the electroforming layer is about 5-6 mm. Table 1 Composition and operating parameters of electroforming solution ϋ 値 一 ~ ΐThe paper size is applicable to the Chinese National Standard (CI ^ S) A4 specification (210 X 297 ^ cent) I ----— — — 1 — — — ^ ® ^- ----- Order ---- I --- line (please read the notes on the back before filling this page) 503170 Α7 Β7 V. Description of the invention (7)

Ni(NH2S03) · 4H20 450g/L NiCl2 · 6H20 6g/L H3BO3 40g/L pH 4.0 Temperature 50°C Current Density T^lOASD Surfactant STAR FUTURON 0.05〜O.lg/L Stress Reducer STAR CS 1 〜lOml/L (Ε)剥銀表面處理技術 將母模與電鑄層分離後，殘存於鎳模表面之 導電銀模膜採電化學電解剝銀方式，最後並使用 去離子水清洗電鑄模仁。操作條件如表2所示。 表 2 經濟部智慧財產局員工消費合作社印製 張 紙 本 電流密度 〇· 1 〜0.5 ASD 剥銀劑濃度（L ο n a S t r i p A G) 20〜30g/L 氫氧化鉀濃度 8 〜1 2 g/L ΤΛ TT ~~~--—------- 1 8 〜22〇C PH 8.5〜1〇 陰極 ^--—---------- 不銹鋼網 陰陽極面積比 "—-------- 〇·5 : 1 〜2: 1 β )兒模仁溶射增厚 -- 藉 '溶射增厚（Metal Spray)快速製模技術以縮 電禱模仁之製作時程；先將電鑄鎳殼模背面使 金鋼砂粗化，然後熔射一道鎳鋁合金鍵結層， (度適用不ΐ國家標準（CNS)A4規格（210 X 297 β釐） -----------------—訂--------線 (請先閱讀背面之注意事項再填寫本頁) 503170 經濟部智慧財產局員工消費合作社印製 A7 五、發明說明（β ) 著進行後續鋼或鋅増厚層熔射，便得到本發明之 模具。 施例2 本實施例係適用於8〜丨7吋之大型導光板，其 製作/;lb私大致同貫施例1，惟，其中步騾（B)導光 板母模製作方法不同，詳述如下。 (1) 母模基板：破璃基板 (2) 玻璃基板清潔··同實施例1 (3) 去水烘烤：16〇〜220X，60〜120秒（於烘箱中） (4) 塗底（Priming):同（l).(h)步騾條件Ni (NH2S03) 4H20 450g / L NiCl2 6H20 6g / L H3BO3 40g / L pH 4.0 Temperature 50 ° C Current Density T ^ lOASD Surfactant STAR FUTURON 0.05 ~ O.lg / L Stress Reducer STAR CS 1 〜lOml / L ( Ε) After the silver peeling surface treatment technology separates the mother mold from the electroformed layer, the conductive silver mold film remaining on the surface of the nickel mold is electrochemically stripped of silver. Finally, the electroformed mold kernel is cleaned with deionized water. The operating conditions are shown in Table 2. Table 2 Current density of printed sheets printed by employees' cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 0.1 to 0.5 ASD silver stripper concentration (L ο na S trip AG) 20 to 30 g / L Potassium hydroxide concentration 8 to 1 2 g / L ΤΛ TT ~~~ ----------- 1 8 ~ 22〇C PH 8.5 ~ 1〇 Cathode ^ -------------- Stainless steel mesh cathode area ratio " ---------- 〇 · 5: 1 ～ 2: 1 β) Solution injection thickening of children's mold kernels-By using the “Metal Spray” rapid molding technology to reduce the production time of electricity prayer mold kernels ; First roughen the back of the electroformed nickel shell mold with gold grit, and then spray a nickel-aluminum alloy bond layer, (degrees apply to national standard (CNS) A4 specifications (210 X 297 β centimeters) ---- --------------- Order -------- Line (Please read the notes on the back before filling out this page) 503170 Printed by A7, Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs 2. Description of the invention (β) The subsequent injection of thick layers of steel or zinc hafnium can obtain the mold of the present invention. Example 2 This example is applicable to a large light guide plate of 8 to 7 inches. Example 1 is roughly the same as in Example 1, except that step (B) light guide plate mother The manufacturing methods are different, and the details are as follows: (1) Master mold substrate: glass-breaking substrate (2) Glass substrate cleaning ·· Same as in Example 1 (3) Dehydration baking: 16 ～ 220X, 60 ～ 120 seconds (in an oven Middle) (4) Priming: same as (l). (H) Step conditions

(5) 光阻塗佈：採用RDS〇4塗佈棒及BRAIvE 3 525 000 1簡易塗佈設備塗覆Shiply 5 740光阻 於8〜11忖玻璃基板上，其厚度可精密控制於 6〜3 5 um (6) 軟烤：於烘箱中95〜125 Ό烘烤8〜20分鐘 (7) 曝光： 曝光設備：ORC-7 100曝光機 光罩：軟式底片 曝光方式：Contact Aligner 光源：3 3 0〜450nm ; 3 5 0mW 曝光時間：5〜20秒 (8 )顯影··使用S h i ρ 1 y Μ P 4 5 0顯影劑以浸泡 (D i p p i n g)方式進行光阻劑之顯影 (9)熱流變：135〜175 °C，5〜2 5分鐘（於烘箱内） 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297 --------I-------------訂---------•線 (請先閱讀背面之注意事項再填寫本頁) 503170 經濟部智慧財產局員Η消費合作社印製 A7 B7 五、發明說明（"） f施例3 其步驟大致同實施例1，惟，其中之光阻劑 改為 NIPPON PAINT OPTO-ER N-400 及 P-600型光阻。其與實施例2於步騾（5)〜（9)不 同，詳述如下。 (5) 光阻塗佈：採用遠東半自動印刷機ATMA AT-EW800H設備塗佈於玻璃基板上，其厚 度可精確控制於1 0〜40μιη (6) 軟烤：於烘箱中90〜11 5°C烘烤5〜15分鐘 (7) 曝光： 曝光設備：ORC-7100曝光機 光罩：軟式底片 曝光方式：Contact Aligner 光源：3 3 0〜450nm ; 100mJ/cm2，Stouffer Step: 4 〜8 曝光時間：8〜16秒 (8) 顯影：使用 Dynachem 450Diazo Developer 設備，於25°C濃度l%Na2C03(aq)中，噴壓 為1 K g / c m 2顯影3 0〜4 0秒 (9) 熱流變：1 5 0〜2 2 0 °C，2 5〜4 5分鐘（於烘箱内） 复_益例4 本實施例係以上述電鑄翻製之一次母模製作 模具，其與前述實施例不同之處在於導光板母模 本紙張尺度適用中國國家標準（CNS)A4規格（21(^297合釐） I-------------------訂---------線 (請先閱讀背面之注意事項再填寫本頁) 503170 A7 五、發明說明（从） 經濟部智慧財產局員工消費合作社印製(5) Photoresist coating: Use RDS〇4 coating rod and BRAIvE 3 525 000 1 simple coating equipment to coat Shiply 5 740 photoresist on 8 ~ 11 忖 glass substrate, and its thickness can be precisely controlled between 6 ~ 3 5 um (6) Soft roasting: 95 ~ 125 in an oven and bake for 8 ~ 20 minutes (7) Exposure: Exposure equipment: ORC-7 100 Exposure mask: Soft film Exposure method: Contact Aligner Light source: 3 3 0 ~ 450nm; 350mW Exposure time: 5 ~ 20 seconds (8) Development ·· Development of photoresist by dipping using S hi ρ 1 y Μ P 4 50 0 developer (9) Thermal rheology : 135 ~ 175 ° C, 5 ~ 2 5 minutes (in the oven) This paper size is applicable to China National Standard (CNS) A4 specification (210 X 297 -------- I -------- ----- Order --------- • Line (Please read the precautions on the back before filling this page) 503170 Printed by A7 B7, Member of the Consumer Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs 5. Description of Invention (" ) F Example 3 The steps are roughly the same as in Example 1, except that the photoresist is changed to NIPPON PAINT OPTO-ER N-400 and P-600 photoresist. It is the same as that in Example 2 in step (5) ~ (9) Different, as detailed below. (5) Photoresist coating: It is coated on glass substrate by Far East semi-automatic printing machine ATMA AT-EW800H, and its thickness can be accurately controlled at 10 ~ 40μιη (6) Soft baking: baked in an oven at 90 ~ 11 5 ° C5 ~ 15 minutes (7) Exposure: Exposure equipment: ORC-7100 Exposure mask: Soft film exposure method: Contact Aligner Light source: 3 3 0 ~ 450nm; 100mJ / cm2, Stouffer Step: 4 ~ 8 Exposure time: 8 ~ 16 Second (8) Development: Using Dynachem 450 Diazo Developer equipment, in a concentration of 1% Na2C03 (aq) at 25 ° C, the spray pressure is 1 K g / cm 2 to develop 3 0 ~ 4 0 seconds (9) Thermal rheology: 1 5 0 ~ 2 2 0 ° C, 2 5 ~ 4 5 minutes (in the oven) Complex_ benefit Example 4 This embodiment is a mold made from the above-mentioned electroformed primary mold. The difference from the previous embodiment lies in the guide The paper size of the light board master mold is applicable to the Chinese National Standard (CNS) A4 specification (21 (^ 297)) I ------------------- Order ------ --- line (please read the notes on the back before filling this page) 503170 A7 V. Description of invention (from) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs

_B7 表 面 處 理 〇 本 實 施 例 之 導 電 性 母 模 表 面 係 以 電 化 學 方 式 作 鈍 化 處 理 在 電 鑄 模 仁 表 面 形 成 一 層 氧 化 皮 模 9 以 利 後 續 二 次 翻 模 之 脱 模 作 業 再 藉 由 二 次 翻 模 技 術 可 以 製 作 出 許 多 射 出 成 型 用 之 電 鑄 模 仁 如 此 即 可 以 — 個 原 型 母 模 複 製 出 許 多 電 鑄 模 仁 以 取 代 重 複 製 作 母 模 之 製 程 〇 導 電 性 母 模 銑 化 製 程 係 將 母 模 置 於 含 重 鉻 酸 J甲 之 純 化 劑 及 界 面 活 性 劑 之 溶 液 中 ， 溶 液， 組成及操作 條件如表3 所 示 ， 寒化學方法在母模表面 ，生 成 一 眉 r氧 化 皮 膜 膜 厚 約 100- 400A 俾 便 後 續 之 脱 模 作 業 〇 鈍 化 後 之 母 模 用 去 離 子 水 沖 洗 並 吹 乾 ， 經 二 次 翻 模 技 術 翻 製 母 模 可 得 到 許 多 個 模 仁 再 經 由 熔 射 增 厚 模 仁 便 得 到 本 發1 明 之; 漢具| 0 表 5 項 固 操 作 參 數 重 鉻 酸 钾 0. 6g/L 鎳 鈍 化 劑 50 m 1 /L 溫 度 25 〜40〇C 陰 極 欽 網 陰 陽 極 面 積 比 1 • 1 陰 陽 極 電 流 密 度 1 〜5ASD 時 間 0. lm in 本 發 明 方 法 相 較 於 曰 本 Kuraray 公司 專利（US - - - -------— II 餐------- 訂---------線·- {請先閲讀背面之注意事項再填寫本頁) NO. 5,776,63 6)具有下列優點：（1)採用印刷電路 本紙張尺度適用中國國家標準（CNS)A4規格(210 X 297达釐） 503170 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（8 ) 板用軟式底片，其製程快速、簡單且價格便宜；（2) 曝光設備可使用半導體製程光罩對準機及印刷電 路板製程之平行光曝光設備。（3)採用熔射增厚技 術，可有效縮短電鑄模仁之製程（4)模具設計可採 用傳統方式取代昂貴之壓印（STAMPER)製程。 因此，藉由本發明以簡單之軟式底片光罩曝 光，配合精密電鑄翻模之技術，可製作出反射式 導光板之電鑄模仁。經由本製程所製作之反射式 導光板在輝度或均勻性方面均優於印刷法或化學 蚀刻法所製作之散射式導光板，且射出成型之製 程良率亦高於網板印刷之製程，在大尺寸液晶顯 示器高亮度及高均勻性之要求下，勢必成為未來 導光板之製程主流。 综上所陳，本發明無論就目的、手段及功效， 在在均顯示其迥異於習知技術之特徵，為「反射 式導光板之射出成型模具製法」之一大突破。惟 應注意的是，上述諸多實施例僅係為了便於説明 而舉例而已，本發明所主張之權利範圍自應以申 請專利範圍所述為準，而非僅限於上述實施例。 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） II-----I------------訂---------線 (請先閲讀背面之注意事項再填寫本頁)_B7 Surface treatment. The surface of the conductive master mold of this example is electrochemically passivated to form a layer of oxide scale on the surface of the electroformed mold core. Technology can make many electroformed molds for injection molding, so that's it-a prototype master mold copies many electroformed molds to replace the repeated process of making the master mold. The conductive master milling process involves placing the master mold in a heavy weight. The solution, composition, and operating conditions of the chromic acid J forma purifying agent and surfactant are shown in Table 3. The cold chemical method produces an eyebrow oxide film with a film thickness of about 100-400A on the surface of the master mold. The demoulding operation. After passivation, the master mold is rinsed with deionized water and blown dry. After the master mold is converted by the second turning technology, many mold cores can be obtained, and the mold cores can be thickened by spraying. Obtained this invention 1 Mingzhi; Han tools | 0 Table 5 Item solid operating parameters Potassium dichromate 0.6 g / L Nickel passivator 50 m 1 / L Temperature 25 ～ 40〇C Cathode network anode area ratio 1 • 1 Yin Yang Extreme current density 1 ~ 5ASD time 0. lm in The method of the present invention is compared with the patent of the Japanese Kuraray Company (US----------- II meal --------- Order ----- ---- Line ·-{Please read the precautions on the back before filling out this page) NO. 5,776,63 6) Has the following advantages: (1) the use of printed circuit paper size applicable to China National Standard (CNS) A4 specifications ( 210 X 297 Dali) 503170 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (8) Soft film for board, its process is fast, simple and cheap; (2) Exposure equipment can use semiconductor process light Parallel light exposure equipment for mask alignment machine and printed circuit board manufacturing. (3) Adopting shot thickening technology can effectively shorten the process of electroforming mold core. (4) The mold design can replace the expensive STAMPER process with traditional methods. Therefore, by using the simple soft film photomask exposure of the present invention and the technology of precision electroformed flip mold, the electroformed mold core of the reflective light guide plate can be manufactured. The reflective light guide plate produced by this process is superior to the diffuse light guide plate produced by printing or chemical etching in terms of brightness or uniformity, and the yield of injection molding is higher than that of screen printing. Under the requirements of high brightness and high uniformity of large-size liquid crystal displays, it is bound to become the mainstream of the light guide plate process in the future. To sum up, the present invention, regardless of the purpose, means, and effect, shows its characteristics that are quite different from the conventional technology, and is a major breakthrough in the "method for manufacturing injection molding molds for reflective light guide plates". It should be noted that the above-mentioned embodiments are merely examples for the convenience of description. The scope of the claimed rights of the present invention should be based on the scope of the patent application, rather than being limited to the above-mentioned embodiments. This paper size applies to China National Standard (CNS) A4 specification (210 X 297 mm) II ----- I ------------ Order --------- Line ( (Please read the notes on the back before filling out this page)

Claims (1)

/u/ u 、申請專利範圍 經濟部智慧財產局員工消費合作社印製 I 一種反射式導光板之射出成型模具製法，其步 驟包括： (A) 以軟式底片製成一具有圖案之軟式光罩， 並將光阻劑塗佈於一基板上； (B) 以微影曝光顯影技術將該軟式光軍之^圖木 轉移至該基板上，得到具有圖案之母模； (C) 以熱流變將顯影後之光阻劑加熱’使母模 表面圖形平滑· (D) 於該母模上蒸鍍或濺鍍一層銀膜； (Ε)於該銀膜上電鑄一層金屬； (F) 將該母模及銀膜自該電鑄金屬層分離；以 及 (G) 將該電鑄金屬層置於電解液中，使殘留之 銀膜剥離。 2·如申請專利範園第丨項所述之製法，其中該母模 為非導電性。 3 ·如申請專利範圍第丨項所述之製法，其中該步驟 (G)之電解液中包括一剝銀劑。 4·如申請專利範園第1項所述之製法，其中該步驟 (G)之後更包括步騾（G1)，熔射增厚該模仁。 5· —種反射式導光板之射出成型模具製法；其步 騾包括： (A)以軟式底片製成軟式光罩，並將光阻劑塗 佈於一基板上； ' 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297丨舍釐） -----------if------- —訂---------線{ (請先閱讀背面之注意事項再填寫本頁) 503170 A8 B8 --^-------- 六、申請專利範圍 (B) 以微影曝光顯影技術將該軟式光罩之圖案轉 移至該基板上，得到具有圖形之母模； (C) 以熱流變將顯影後之光p旦劑加熱，使母模表 面圖形平滑； (D) 於該母模上電鑄一層金屬，形成一電鑄模 仁； (E )將該母模與該電鑄模仁分離，以及 (F)以二次翻模技術翻製該母模，得到至少一個 模仁。 6·如申請專利範圍第5項所述之製法，其中該母模 為導電性。 7 ·如申請專利範圍第5項所述之製法，其中該步騾 (D)之後更包括步騾（D1)，以電化學方式作鈍化 處理，在電鑄模仁表面形成一層氧化皮模。 8·如申請專利範圍第5項所述之製法’其中該步騾 (F)之後更包括步驟（F1)，熔射增厚該模仁。 I n n n ϋ n I n n n l l m i n n IB n n l 一 0V n n n n (請先閱讀背面之注意事項再填寫本頁) V.V 線< 經濟部智慧財產局員工消費合作社印制π 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 2971弇釐〉The scope of the patent application is printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economics. I. A method for making injection molding molds for reflective light guide plates. The steps include: (A) making a soft mask with a pattern from a soft film, and using a photoresist. The agent is coated on a substrate; (B) the soft light army figure is transferred to the substrate by lithography exposure and development technology to obtain a patterned master mold; (C) the light after development is developed by thermal rheology Resist heating 'to smooth the surface pattern of the master mold. (D) Evaporate or sputter a silver film on the master mold; (E) electroform a layer of metal on the silver film; (F) place the master mold and silver The film is separated from the electroformed metal layer; and (G) placing the electroformed metal layer in an electrolytic solution to peel off the remaining silver film. 2. The method according to item 丨 of the patent application park, wherein the master mold is non-conductive. 3. The manufacturing method as described in item 丨 of the patent application scope, wherein the electrolytic solution in step (G) includes a silver stripping agent. 4. The method according to item 1 of the patent application park, wherein after step (G), step (G1) is further included, and the mold core is thickened by spraying. 5 · —A method for producing an injection molding mold for a reflective light guide plate; the steps include: (A) making a soft photomask from a soft negative film, and coating a photoresist on a substrate; Standard (CNS) A4 specification (210 X 297 丨 rounded) ----------- if ------- —Order --------- line {(Please read first Note on the back, please fill out this page again) 503170 A8 B8-^ -------- 6. Scope of patent application (B) The pattern of the soft mask is transferred to the substrate by lithography exposure and development technology, A master mold with a pattern is obtained; (C) the developed photo-denier is heated with thermal rheology to smooth the surface pattern of the master mold; (D) an electroformed layer of metal is formed on the master mold to form an electroformed mold core; ( E) Separating the mother mold from the electroformed mold core, and (F) re-molding the mother mold by a second mold turning technique to obtain at least one mold core. 6. The manufacturing method according to item 5 of the scope of patent application, wherein the master mold is conductive. 7. The manufacturing method as described in item 5 of the scope of patent application, wherein step (D) further includes step (D1), which is electrochemically passivated to form an oxide scale on the surface of the electroformed mold. 8. The manufacturing method according to item 5 of the scope of patent application, wherein step (F) further includes step (F1), and the mold core is thickened by spraying. I nnn ϋ n I nnnllminn IB nnl-0V nnnn (Please read the notes on the back before filling this page) VV line < Printed by the Intellectual Property Bureau of the Ministry of Economic Affairs's Consumer Cooperatives π This paper size applies to Chinese National Standard (CNS) A4 Specifications (210 X 2971 弇)