CN100365536C

CN100365536C - Memory array module

Info

Publication number: CN100365536C
Application number: CNB2005100881804A
Authority: CN
Inventors: 连世雄
Original assignee: HONGLIAN INT TECH Co Ltd
Current assignee: HONGLIAN INT TECH Co Ltd
Priority date: 2005-07-29
Filing date: 2005-07-29
Publication date: 2008-01-30
Anticipated expiration: 2025-07-29
Also published as: CN1904795A

Abstract

The invention relates to a memory array module that sets two or more linkers, circuitry contact and relative electric components on host computer. The linkers supplies combination location under solderless state for memory and make memory chip electrically connecting to circuitry contact. When the memory at linker place needs to replace or mend, high temperature operation would be avoided and the damaging to other component would be also avoided. It could also take further simplifying replacement or changing other memory chip of different capacity. The effect of easy to mend and low cost would be also realized.

Description

Memory array module

Technical field

The invention provides a kind of memory array module, refer to utilize on the computer main frame panel connector more than two or two to provide the memory chip can be especially in no welding state down in conjunction with locating, and memory array module that can simple and easy replacing memory chip.

Background technology

Arriving along with cyberage, there is increasing electronics technology product to be full of around living environment, provide people in life, the senior enjoyment of each side such as work or amusement and recreation, and in various electronics technology products, with computing machine and people's life the most direct connection is arranged, can in people's life or work, provide information the most easily, also can assist people to handle various documents, draw, computing, every operation such as audio-visual transmission, only can normal operation for computing machine, wherein, just in computing machine, accounted for epochmaking role with memory module, there has not been its computing machine just can't start shooting, peripheral unit also just can't be passed to processor with data, and processor also just can't receive peripheral unit institute requirement, in simple terms, storer is the communication bridge that is used for serving as processor and peripheral unit, the work time pulse of memory module, can accelerate the transmission of processor and peripheral unit data, and the increase of frequency range, then be to allow the data quantity that transmits strengthen, the lifting of memory capacity in addition can effectively increase the space that desire is handled data; So storer needs constantly to promote work time pulse, frequency range and memory capacity, just can catch up with the computing and the data processing of processor high speed degree.

Moreover, the formation of memory module, from 30 early stage stitch SIMM (Single Inline Memory Module) module, the DDR specification DIMM module and the RDRAMRIMM module of main flow up till now, capacity on its memory module all is made up of a plurality of single memory chip, see also Fig. 7, shown in Figure 8, block schematic diagram and stereo appearance figure for prior art, find out by knowing among the figure, usually memory module A goes up weldering with single substrate A1 to be provided with complex memory chip A2, and be provided with plural contact A11 (being commonly called as the golden finger number) in substrate A1 one side, when using, need computer main frame panel B to be provided with corresponding slot B1 with the contact A11 of substrate A1, the contact A11 of monoblock substrate A1 is inserted in the slot B1 be an electric connection, again by the trip B11 of the slot B1 two sides clinching location that substrate A1 is firm, yet, the memory module of above-mentioned prior art is to have many defectives, for example:

(1) the memory chip A2 that uses of prior art is welded on the substrate A1 in the mode of welding, if wherein arbitrary memory chip A2 is when damage or fault, promptly must be with substrate A1 by taking off on the slot B1, utilize the mode of high-temperature digestion again, each pin tip-off with memory chip A2, carry out the sealing-off operation, just the memory chip A2 that damages fault can be taken off by substrate A1, behind the memory chip A2 that more renews, must utilize the mode of high-temperature soldering again, with memory chip A2 reflow again on substrate A1, but, general memory chip A2 is towards miniature, the trend development of light weight and high-density packages, the pin spacing of the following memory chip A2 of phase shape is densification more, so, make memory chip A2 in tip-off, certainly will be difficult more during the reflow operation, and the operation of high temperature influences other peripheral storage chip A2 especially easily, and causes other memory chip A2 easily because of hyperthermia and superheating influence or collide accidentally and damage or fault, and then causes the degree of difficulty of maintenance activity to improve.

(2) no matter the memory chip A2 that prior art is used is when carrying out tip-off or reflow operation, all must carry out in artificial mode, make overall operation quite bother inconvenience, and weld job also must could be implemented by professional practitioner, required labor cost is also quite high, and then increase whole maintenance cost, and the problem that artificial weld job also causes welding easily is improper (as sky weldering, overheated, loose contact etc.), and the fraction defective of memory chip A2 when maintenance promoted, must consume extra more material cost.

(3) the memory module A that uses of prior art must separate with computer main frame panel B and makes processing, and the production that makes memory module A is all different work flows with part configuration on the computer main frame panel B, but the two relation of memory module A and computer main frame panel B, no matter be on specification or hardware, all must cooperatively interact and to use, and memory module A and computer main frame panel B add man-hour at every turn, can only carry out the separate machined operation at single project, so that whole work flow palpus segmentation, subitem carries out, the work flow that just can't meet whole consistentization manufacturing thus, and then make memory module A and computer main frame panel B can't reach the purpose of large production simultaneously, only whole process time be can increase on foot, and puzzlement and trouble in the production operation caused.

Be with, the setting of the above-mentioned memory module of using about prior art still has problems when using, remain to be improved in fact, this is the inventor and is engaged in the direction place of this journey improvement that the dealer desires most ardently.

Summary of the invention

Fundamental purpose of the present invention is to be to provide a kind of memory array module, the connector that utilizes the counter motherboard to be provided with more than two or two provides memory chip combination to locate under no welding state, can be in order to memory chip by taking out on the connector and being changed, to reach easy to repair, to replace effect easily and fast.

For reaching above-mentioned purpose and effect, the technology used in the present invention means are as follows:

A kind of memory array module, be provided with two or more connectors in motherboard, and be laid with default line contacts and relevant electronic component on this motherboard, this connector has hollow base frame, be provided with conducting terminal in the hollow base frame, memory chip is housed in the hollow base frame, and this memory chip bottom has plural circuit junction or inserting foot; Circuit junction and conducting terminal are in contact with one another and form electrically connect, or inserting foot is in contact with one another to form with conducting terminal and electrically connects, default line contacts formation electric connection on conducting terminal and the motherboard.

Conducting medium is positioned in this hollow base frame, and the circuit junction of memory chip and conducting medium are in contact with one another the electric connection that is a vertical transfer closely.

This electronic component is system chipset, central processing unit, bus, slot, socket or connectivity port.

The circuit junction of this memory chip is that the metal material of tin ball, Copper Foil, lead frame or tool characteristics of electrical conductivity is made.

This conducting medium is the anisotropic conductive film material that resin and conductive powder body constitute.

Description of drawings

Fig. 1 is a block schematic diagram of the present invention.

Fig. 2 is the stereo appearance figure of preferred embodiment of the present invention.

Fig. 3 is the side cutaway view of preferred embodiment of the present invention.

Fig. 4 is the stereo appearance figure of another preferred embodiment of the present invention.

Fig. 4 A is the sectional perspective enlarged drawing of another preferred embodiment of the present invention.

Fig. 5 is the present invention's stereo appearance figure of a preferred embodiment again.

Fig. 6 is the present invention's side cutaway view of a preferred embodiment again.

The block schematic diagram that Fig. 7 uses for prior art.

The stereo appearance figure that Fig. 8 uses for prior art.

Symbol description among the figure:

1, motherboard

11, electronic component 12, line contacts

2, connector

20, accommodation space 25, pilot hole

21, conducting medium 251, conducting terminal

22, positioning means 26, lid

23, receiving space 261, button portion

24, jack 262, axial region

241, conducting terminal

3, memory chip

31, circuit junction 32, inserting foot

A, memory module

A1, substrate A2, memory chip

A11, contact

B, computer main frame panel

B1, slot B11, trip

Embodiment

See also shown in Figure 1, be block schematic diagram of the present invention, find out by knowing among the figure, memory array module of the present invention mainly is to be laid with line contacts 12 and associated electrical part 11 on motherboard 1, its electronic component 11 can be system chipset, central processing unit, bus, slot, socket or connectivity port etc., and in the connector 2 that is provided with in addition on the motherboard 1 more than two or two, wherein each connector 2 provides memory chip 3 combination location under no welding state, and memory chip 3 can be formed with default line contacts 12 on the motherboard 1 electrically connect, therefore, the present invention is when motherboard 1 processing circuit etching contact 12, can simultaneously connector 2 required line contacts be laid on the motherboard 1, to simplify motherboard 1 whole work flow, effectively reduce manufacturing cost.

Moreover, in the process that motherboard 1 is using, if when having arbitrary memory chip 3 damage or desire to change the memory chip 3 of different memory capacitys, only need the memory chip 3 that damages or desire is replaced is taken off by corresponding connector 2 places, can change the memory chip 3 under the no welding state immediately, significantly to simplify, to shorten the process and the time of displacement.

Please continue to consult Fig. 2, shown in Figure 3, stereo appearance figure and side cutaway view for preferred embodiment of the present invention, find out by knowing among the figure, connector 2 of the present invention can be hollow base frame, it mainly is formed with the accommodation space 20 that can supply memory chip 3 to insert in the hollow part of connector 2, and accommodation space 20 can further have been inserted conducting medium 21, and line contacts 12 places that make conducting medium 21 be positioned at motherboard 1 are an electric connection, memory chip 3 bottoms then have plural circuit junction 31, insert the accommodation space 20 of connector 2 when memory chip 3 after, can see through the set positioning means 22 of connector 2, with memory chip 3 firm being positioned in the accommodation space 20, and the circuit junction 31 that makes memory chip 3 presses on closely, and formation electrically connects on the conducting medium 21, and allow conducting medium 21 simultaneously to being affixed on the line contacts 12 of motherboard 1, electrical specification by conducting medium 21 vertical transfer, line contacts 12 conductings of being laid on memory chip 3 and the motherboard 1 are formed to be electrically connected, when any memory chip 3 when damage or desire are replaced, can directly memory chip 3 be taken out in the accommodation space 20 of connector 2, can keep in repair or replace operation immediately, moreover, the circuit junction 31 of above-mentioned memory chip 3 can be the tin ball, Copper Foil, the metal material of lead frame or tool characteristics of electrical conductivity is made, and conducting medium 21 then can be the anisotropic conductive film material.

Please continue to consult Fig. 4, shown in Fig. 4 A, stereo appearance figure and sectional perspective enlarged drawing for another preferred embodiment of the present invention, find out by knowing among the figure, the present invention is provided with connector 2 more than two or two in motherboard 1, its connector 2 tops are for having a receiving space 23, and be provided with plural jack 24 in receiving space 23 2 sides, and in each jack 24, all be provided with conducting terminal 241, and make line contacts 12 corresponding on conducting terminal 241 and the motherboard 1 be electric connection, memory chip 3 then can extend plural inserting foot 32 respectively downwards in two sides, when memory chip 3 is pressed in the receiving space 23 of connector 2, the inserting foot 32 of its memory chip 3 is incorporated in the jack 24 of connector 2 for corresponding, and make the inserting foot 32 of memory chip 3 and the conducting terminal 241 in the jack 24 be in contact with one another the formation electric connection, make its memory chip 3 by connector 2 setting and motherboard 1 on line contacts 12 conductings of being laid form and electrically conduct, if during memory chip 3 damage, also can directly memory chip 3 be taken off directly on connector 2 and replace.

Please continue to consult Fig. 5, shown in Fig. 6 figure, be the present invention stereo appearance figure and the side cutaway view of a preferred embodiment again, find out by knowing among the figure, connector 2 structures of the present invention can further be provided with the pilot hole 25 that can supply memory chip 3 to insert in the surface, and be provided with complex conduction terminal 251 in the pilot hole 25, and make line contacts 12 corresponding on conducting terminal 251 and the motherboard 1 be electric connection, but be the lid 26 that is articulated with the turn fixed angle in connector 2 tops in addition, and lid 26 1 sides are provided with button portion 261, then be provided with axial region 262 away from button portion 261 opposite sides, and then lid 26 is raised to rotation in connector 2 one side shafts, cover, and utilize the button portion 261 of lid 26 to fasten closely with connector 2 other sides, when memory chip 3 is inserted in the pilot hole 25 of connector 2, lid 26 can be covered on connector 2, and its lid 26 bottoms are supported be affixed on memory chip 3 tops (shown in Figure 6) as the, the circuit junction 31 that just can make memory chip 3 and complex conduction terminal 251 in the pilot hole 25 are in contact with one another closely and are an excellent electrical property and are connected, when if memory chip wherein 3 damages, just turn lid 26 immediately, memory chip 3 is taken out in pilot hole 25, can carry out non-defective unit changes, maintenance activity is changed fast to reach memory chip 3, the effect of saving servicing time.

Above-mentioned detailed description is at the preferable possible embodiments explanation of the present invention, only each embodiment is not in order to limit claim of the present invention, so, the present invention is for providing memory chip 3 combination location under no welding state at the connector more than two or two 2 on the computer main frame panel 1, and make memory chip 3 be easy to retract, replace, to reach simple and easy maintenance, guarantee the electronic component yield on the motherboard and reduce the effectiveness of replacement cost, all other do not break away from the equalization finished under the disclosed skill spirit to be changed and modifies change, all should be contained in the claim that the present invention contains.

So, the memory array module of the invention described above when reality is used, for having following advantage, as:

(1) memory chip 3 is for seeing through the setting of connector 2, when damaging replacing, need not see through the program of high temperature reflow or fusion sealing-off, can easily memory chip 3 be taken off replacing, again new memory chip 3 is assembled in the connector 2 fast afterwards, make the memory chip 3 and line contacts 12 conductings of motherboard 1 form electric connection, can activate use again for motherboard 1, make that replacing memory chip 3 is quite simple, maintenance is very convenient, so, can make the maintenance personal need not have the operation of can reaching the standard grade of professional technique or special skill.

(2) memory chip 3 on the motherboard 1 is when changing, do not need the memory chip 3 of motherboard 1 is carried out the high-temperature service of reflow or sealing-off, avoid damaging because of hyperthermia and superheating causes memory chip 3, the line contacts 12 or the electronic component 11 that also can not influence on the motherboard 1 damage, can guarantee the yield of electronic component 11 on the motherboard 1, and then can reduce the expense of maintenance, quite meet economic benefit.

(3) motherboard 1 is when processing circuit etching contact 12, can simultaneously connector 2 required line contacts 12 directly be laid on the motherboard 1, and welding during each electronic component 11 on motherboard 1, synchronously connector 2 is welded in the lump, and then the work flow of simplification motherboard 1 integral body, when using, only need memory chip 3 is electrically connected on the connector 2, reaching the work flow of consistentization, and reduce manufacturing cost and the integral product yield is promoted.

(4) the present invention can solve prior art and need cooperate the problem of different types circuit board with memory chip in the memory module, and can save circuit board material and processing cost.

The above only is preferred embodiment of the present invention, non-so promptly limit to claim of the present invention, so the simple and easy modification and the equivalent structure that use instructions of the present invention and graphic content to do such as change, and all should in like manner be contained in the claim of the present invention, close and give Chen Ming.

In sum, the above-mentioned memory array module of the present invention for reaching its effect and purpose really, so the present invention really is the invention of a practicality excellence, for meeting the application important document of patent of invention, is filed an application when using in accordance with the law.

Claims

1. memory array module, it is characterized in that, be provided with two or more connectors in motherboard, and be laid with default line contacts and relevant electronic component on this motherboard, this connector has hollow base frame, be provided with conducting terminal in the hollow base frame, memory chip is housed in the hollow base frame, this memory chip bottom has plural circuit junction or inserting foot; Circuit junction and conducting terminal are in contact with one another and form electrically connect, or inserting foot is in contact with one another to form with conducting terminal and electrically connects, default line contacts formation electric connection on conducting terminal and the motherboard.

2. memory array module as claimed in claim 1 is characterized in that conducting medium is positioned in this hollow base frame, and the circuit junction of memory chip and conducting medium are in contact with one another the electric connection that is a vertical transfer closely.

3. memory array module as claimed in claim 1 or 2 is characterized in that, this electronic component is system chipset, central processing unit, bus, slot, socket or connectivity port.

4. memory array module as claimed in claim 1 is characterized in that, the circuit junction of this memory chip is that the metal material of tin ball, Copper Foil, lead frame or tool characteristics of electrical conductivity is made.

5. memory array module as claimed in claim 2 is characterized in that, this conducting medium is the anisotropic conductive film material that resin and conductive powder body constitute.