CN100336663C - Piezoelectric ink-jet head and its manufacturing method - Google Patents
Piezoelectric ink-jet head and its manufacturing method Download PDFInfo
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- CN100336663C CN100336663C CNB2003101036144A CN200310103614A CN100336663C CN 100336663 C CN100336663 C CN 100336663C CN B2003101036144 A CNB2003101036144 A CN B2003101036144A CN 200310103614 A CN200310103614 A CN 200310103614A CN 100336663 C CN100336663 C CN 100336663C
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Abstract
The present invention provides a piezoelectric ink gun and a manufacturing method thereof. The manufacturing method has the steps that a substrate provided with a first surface and a second surface which are opposite is provided; subsequently, a patterned first conducting layer is formed on the first surface, and is used as a lower electrode; a piezoelectric layer is formed on the first surface and covers the first conducting layer; a protective layer is formed on the piezoelectric layer; a patterned second conducting layer is formed on the protective layer, is corresponding to the first conducting layer, and is used as an upper electrode; the protective layer and the piezoelectric layer are defined in order that the protective layer and the piezoelectric layer become a metal-piezoelectricity-protection-metal laminated structure.
Description
Technical field
The invention relates to a kind of piezoelectric ink-jet head and preparation method thereof, particularly about a kind of piezoelectric ink-jet head of improveing the piezoelectric layer generation type and preparation method thereof.
Background technology
The main operation principles of inkjet technology is divided into thermal bubble type (Thermal bubble) and piezoelectric type (Piezoelectric) two classes.Thermal bubble type is to utilize heater with ink moment gasification, produces high pressure bubble promotion ink and penetrates from nozzle.Piezoelectric type is to utilize to apply voltage system and make piezoelectric ceramics produce deformation, makes its squeezeout ink and produces high pressure, and then ink is sprayed.By contrast, piezoelectric ink-jet head has following advantage: (1) piezoelectric type can not produce chemical change because of high-temperature gasification, therefore has splendid durability.(2) the piezoelectric ceramics reaction speed is fast, can not be subject to heat conduction velocity, therefore can promote print speed.(3) piezoelectric type is controlled the size of drop easily, can improve print quality.
Yet, known piezoelectric ink jet head technology adopt mostly laminated ceramic altogether the burning method form piezoelectric layer, its molding mode comprises powder stock PZT (ZrO for example
2, PbO, TiO
2, other suitable additive) steps such as synthetic, mixings, drying, calcining, pulverizing, granulation, moulding, sintering and polarization, and the accurate contraposition ability of need moulding, its manufacturing process very complicated, degree of difficulty and investment goods are all very high.
Therefore, now developing gradually with silicon is the piezoelectric ink jet head preparation method of substrate.For example, the production method of piezoelectric layer mainly can be divided into two class modes: thick film forming process and film shaped method.The thick film forming process is by wire mark method or laminated ceramic stack manner, once reaches the piezoelectric layer of 20～30 μ m thickness.Its shortcoming is to reach the surface that has good uniformity, and can have problems at interface in the making of its follow-up top electrode, influences piezoelectric property and reduces the acceptance rate of making.On the other hand, film shaped method is to utilize physical vaporous deposition (PVD), chemical vapour deposition technique (CVD) or solution-gel (sol-gel) spin-coating method, its shortcoming is to reach the required thickness of piezoelectric shock layer fast, and for example solution-gel (sol-gel) preparation method must just can reach required thickness through the multiple spin coating process.Such preparation method is not only lost time, and the making acceptance rate is low, and is not suitable in a large amount of productions.
Figure 1A to Fig. 1 C shown for known be the generalized section of the piezoelectric ink-jet head preparation method of substrate with silicon.Shown in Figure 1A, a substrate 10 is provided, for example monocrystal silicon substrate 10, have a relative first surface 11 and a second surface 12.Form a patterning first conductive layer 20 on this first surface 11, for example Ag-Pd alloy, Pt or Au are with as bottom electrode.Then, on this first surface 11, form a piezoelectric layer 30 with the scraper method of forming or wire mark method, lead zirconate-titanate (PZT) for example, and cover this first conductive layer 20.
Shown in Figure 1B, on piezoelectric layer 30, form a patterning second conductive layer 40, for example Ag-Pd alloy, Pt or Au, and corresponding with first conductive layer 20 are with as a top electrode.Then, with little shadow and etching preparation method definition piezoelectric layer 30, making becomes the stack layer of a metal, piezoelectricity, metal structure.
Shown in Fig. 1 C, carry out little shadow and etching step on the second surface 12 to substrate 10, make it form a groove 60, and corresponding to metal, piezoelectricity, stacked laminations of metal structure, wherein this groove is as an inking chamber 60.At last, on the second surface 12 of substrate 10, engage a spray nozzle sheet 70, to form a piezoelectric ink-jet head.
Yet, above-mentioned when on silicon base, making piezoelectric element, because must be through a sintering step, and piezoelectric element many be main material with plumbous zirconates-titanate (PZT), PZT can discharge the gas that contains lead oxide behind oversintering, this lead oxide gas can form lead-silica glass with the silicon base effect, and because silicon substrate has large tracts of land, with lead oxide gas constantly after the effect, make lead oxide gas not enough and cause the sintering of piezoelectric element to finish.
Therefore, how to improve the method for forming of piezoelectric ink jet head and make acceptance rate, become the important topic of current urgent need research to improve.
Summary of the invention
In view of this, the object of the present invention is to provide piezoelectric ink-jet head and preparation method thereof, make piezoelectric layer in conjunction with thick film forming process and film shaped legal system, can the improve above-mentioned preparation method shortcoming of " the thick film forming process can't reach uniform surface; film shaped method must just can reach desired thickness through plural process " improves acceptance rate.
Another object of the present invention is to provide piezoelectric ink-jet head and preparation method thereof; utilize the film of coking in the low temperature (pyrolyze) sintering to be formed on the need high temperature sintering thick film; in the PZT sintering process; the film of coking (pyrolyze)-sintering forms protection; inhibition contains the volatilization of the gas of lead oxide, improves piezoelectric property and promotes and make acceptance rate.
According to above-mentioned purpose, the invention provides a kind of preparation method of piezoelectric ink-jet head, comprising: a substrate is provided, has a relative first surface and a second surface; On this first surface, form a patterning first conductive layer, with as a bottom electrode; On this first surface, form a piezoelectric layer and cover this first conductive layer; On this piezoelectric layer, form a protective layer; On this protective layer, form a patterning second conductive layer and corresponding, with as a top electrode with this first conductive layer; Define this protective layer and this piezoelectric layer, making becomes a metal, piezoelectricity, protection, stacked laminations of metal structure; The second surface of this substrate of etching forms a groove corresponding to this metal, piezoelectricity, protection, stacked laminations of metal structure, and wherein this groove is as an inking chamber; And engage a spray nozzle sheet on the second surface of this substrate, to form a piezoelectric ink-jet head.
According to above-mentioned purpose, the present invention also provides a kind of piezoelectric ink-jet head, comprising: a substrate has a relative first surface and a second surface; One metal, piezoelectricity, protection, stacked laminations of metal structure are positioned on the first surface of this substrate, as the actuating structure of this ink gun; One groove is formed at the second surface of this substrate, corresponding to this metal, piezoelectricity, protection, stacked laminations of metal structure, as an inking chamber; And a spray nozzle sheet, be engaged in this substrate and second surface.
According to the present invention, above-mentioned metal, piezoelectricity, protection, stacked laminations of metal structure also comprise: a patterning first conductive layer is formed on this first surface, as a bottom electrode; One piezoelectric layer is formed on this first surface and covers this conductive layer; One protective layer is formed on this piezoelectric layer; And a patterning second conductive layer, be formed on this protective layer and corresponding, with as a top electrode with this first conductive layer.
Description of drawings
Figure 1A to Fig. 1 C be known be the generalized section of the piezoelectric ink-jet head preparation method of substrate with silicon;
Fig. 2 A to Fig. 2 D is the generalized section of the piezoelectric ink-jet head preparation method of the embodiment of the invention one;
Fig. 3 is in solution-gel (sol-gel) spin-coating method of the embodiment of the invention one, the preparation process figure of PZT solution;
Fig. 4 A to Fig. 4 D is the generalized section of the piezoelectric ink-jet head preparation method of the embodiment of the invention two;
Fig. 5 is in solution-gel (sol-gel) spin-coating method of the embodiment of the invention two, contains the preparation process figure of the PZT solution of micro mist.
The specific embodiment
In order to allow above-mentioned purpose of the present invention, feature and advantage become apparent, cited below particularlyly go out preferred embodiment, and conjunction with figs., be described in detail below:
Embodiment one
Fig. 2 A to Fig. 2 D is depicted as the generalized section of the piezoelectric ink-jet head preparation method of the embodiment of the invention one.Shown in Fig. 2 A, a substrate 100 at first is provided, a monocrystalline silicon for example, present embodiment is selected the Silicon Wafer of general requirements for use, and thickness is between 500～550 μ m.Above-mentioned monocrystal silicon substrate 100 has a relative first surface 101 and a second surface 102.Then, utilize vapour deposition method, sputtering method or physical vaporous deposition (PVD) on first surface 101, to form a conductive layer 120, for example Ag-Pd alloy, Pt or Au.Then with little shadow and etching step definition conductive layer 120, with bottom electrode 120 as actuating structure.Then, with the scraper method of forming or wire mark method, and in 850～950 ℃ sintering, to form a piezoelectric layer 130, lead zirconate-titanate (PZT) for example, 20～30 microns of thickness ranges are on this first surface 101 and cover conductive layer 120.
Shown in Fig. 2 B; utilize solution-gel (sol-gel) spin-coating method; coking in 300～450 ℃ (pyrolyze) and in 850～950 ℃ sintering; compliance forms a protective layer 132 on piezoelectric layer 130; for example lead zirconate-titanate (PZT), zirconia, titanium oxide, calcium oxide and nickel oxide, thickness range is 0.2～1 micron.The making step of top electrode 140 is identical with bottom electrode 120, utilizes vapour deposition method, sputtering method or physical vaporous deposition (PVD) to form a conductive layer 140, and for example Ag-Pd alloy, Pt or Au are on protective layer 132.With little shadow and etching step definition conductive layer 140, come top electrode 140 then as actuating structure.
According to better embodiment of the present invention, the solution preparation process figure of above-mentioned solution-gel (sol-gel) spin-coating method as shown in Figure 3.At first acetate trihydrate lead (Pb acetate trihydrate) is dissolved in 2-methyl ethanol (2-methoxy-ethanol), dehydration in 110 ℃ then.Then propoxyl group zirconium (Zr-propoxide) and titanium isopropoxide (Ti-propoxide) are dissolved in 2-methyl ethanol (2-methoxy-ethanol).Then, after above-mentioned two solution mixing, backflow (reflux) is 2 hours in 120 ℃, in synthermal distillation down, is made into 0.75M at last and contains the excessive lead zirconate-titanate of 20%Pb (PZT (52,48)) solution again.
Shown in Fig. 2 C,, make the stack layer structure of the metal that becomes island, protection, piezoelectricity, metal, as film actuator with little shadow and etching step etch protection layer successively 132 and piezoelectric layer 130.
Shown in Fig. 2 D, carry out the making of inking chamber at last, utilize wet etch method, with KOH etching solution, at monocrystal silicon substrate 100 second surfaces 102, etching one groove 160 is with the usefulness as inking chamber 160.The position of groove 160 is corresponding to the stack layer structure of the metal of island, protection, piezoelectricity, metal, and etching is till remaining 5～20 microns of substrate 100 thickness.Then, engage a spray nozzle sheet 170,, finish piezoelectric ink-jet head at the second surface 102 of substrate 100.
Shown in Fig. 2 D, piezoelectric ink-jet head of the present invention comprises: a substrate 100 has a relative first surface 101 and a second surface 102; One metal, piezoelectricity, protection, stacked laminations of metal structure are positioned on the first surface 101 of substrate 100, as the actuating structure of this ink gun; One groove 160 is formed at the second surface 102 of substrate 100, corresponding to this metal, piezoelectricity, protection, stacked laminations of metal structure, as an inking chamber 160; And a spray nozzle sheet 170, be engaged in the second surface 102 of this substrate 100.
Above-mentioned metal, piezoelectricity, protection, stacked laminations of metal structure also comprise: a patterning first conductive layer 120 is formed on this first surface 101, as a bottom electrode 120; One piezoelectric layer 130 is formed on this first surface 101 and covers conductive layer 120; One protective layer 132 is formed on this piezoelectric layer 130; And a patterning second conductive layer 140, be formed on the protective layer 132 and corresponding, with as a top electrode 140 with first conductive layer 120.
Embodiment two
Fig. 4 A to Fig. 4 D is depicted as the generalized section of the piezoelectric ink-jet head preparation method of the embodiment of the invention two.Shown in Fig. 4 A, a substrate 100 at first is provided, a monocrystalline silicon for example, present embodiment is selected the Silicon Wafer of general requirements for use, and thickness is between 500～550 μ m.Above-mentioned monocrystal silicon substrate 100 has a relative first surface 101 and a second surface 102.Then, utilize vapour deposition method, sputtering method or physical vaporous deposition (PVD) on first surface 101, to form a conductive layer 120, for example Ag-Pd alloy, Pt or Au.Then with little shadow and etching step definition conductive layer 120, with bottom electrode 120 as actuating structure.Then, with the scraper method of forming or wire mark method, and in 850～950 ℃ sintering, to form a piezoelectric layer 130, lead zirconate-titanate (PZT) for example, 20～30 microns of thickness ranges are on this first surface 101 and cover conductive layer 120.
Shown in Fig. 4 B; utilization contains solution-gel (sol-gel) spin-coating method of micro mist, and compliance formation one contains the protective layer 134 of micro mist, for example lead zirconate-titanate (PZT) on piezoelectric layer 130; 0.2～1 micron of thickness range, coking in 300～450 ℃ (pyrolyze) and sintering in 700 ℃.The material of above-mentioned micro mist is low temperature sintering materials such as lead zirconate-titanate (PZT), zirconia, titanium oxide, calcium oxide and nickel oxide preferably, and particle diameter can reduce the sintering temperature of protective layer 134 less than 1 micron.The making step of top electrode 140 is identical with bottom electrode 120, utilizes vapour deposition method, sputtering method or physical vaporous deposition (PVD) to form a conductive layer 140, for example Ag-Pd alloy, Pt or Au on the protective layer 134 that contains micro mist.Then with little shadow and etching step definition conductive layer 140, with top electrode 140 as actuating structure.
The protective layer 134 that contains micro mist has the good characteristic of surface uniformity, covers the function that has having an even surface on the piezoelectric layer 130.And above-mentioned piezoelectric layer 130 can be under the uniform temp condition with the protective layer 134 that contains micro mist, and co-sintered forms.Owing to contain the protective layer 134 of micro mist because of containing low temperature sintering materials such as lead zirconate-titanate (PZT), zinc oxide or zirconia; required sintering temperature is lower; in sintering process; take place earlier fine and close and as the protective layer of piezoelectric layer 130; and the protective layer 134 that contains micro mist contains excess pbo; can suppress and compensate the volatilization of the gas of lead oxide, improve piezoelectric property and promote and make acceptance rate.
According to better embodiment of the present invention, the solution preparation process figure of above-mentioned solution-gel (sol-gel) spin-coating method that contains micro mist as shown in Figure 5.At first acetate trihydrate lead (Pb acetate trihydrate) is dissolved in 2-methyl ethanol (2-methoxy-ethanol), dehydration in 110 ℃ then.Then propoxyl group zirconium (Zr-propoxide) and titanium isopropoxide (Ti-propoxide) are dissolved in 2-methyl ethanol (2-methoxy-ethanol).Then, after above-mentioned two solution mixing, backflow (reflux) is 2 hours in 120 ℃, again in synthermal distillation down, in mixed solution, add second vinegar acetone and stirring in 25 ℃ then, be made into 0.75M at last and contain the excessive lead zirconate-titanate of 20%Pb (PZT (52,48)) solution, add micro mist and dispersant (dispersant) this moment, fully mix forming lead zirconate-titanate (PZT (52, the 48)) solution that contains micro mist.
Shown in Fig. 4 C, contain the protective layer 134 and piezoelectric layer 130 of micro mist with little shadow and etching step etching successively, make the stack layer structure of the metal that becomes island, protection, piezoelectricity, metal, as film actuator.
Shown in Fig. 4 D, carry out the making of inking chamber at last, utilize wet etch method, with KOH etching solution, at the second surface 102 of monocrystal silicon substrate 100, etching one groove 160 is with the usefulness as inking chamber 160.The position of groove 160 is corresponding to the stack layer structure of the metal of island, protection, piezoelectricity, metal, and etching is till remaining 5～20 microns of substrate 100 thickness.Then, engage a spray nozzle sheet 170,, finish piezoelectric ink-jet head at the second surface 102 of substrate 100.
Shown in Fig. 4 D, piezoelectric ink-jet head of the present invention comprises: a substrate 100 has a relative first surface 101 and a second surface 102; One metal, piezoelectricity, protection, stacked laminations of metal structure are positioned on the first surface 101 of substrate 100, as the actuating structure of this ink gun; One groove 160 is formed on the second surface 102 of substrate 100, corresponding to this metal, piezoelectricity, protection, stacked laminations of metal structure, as an inking chamber 160; And a spray nozzle sheet 170, be bonded on the second surface 102 of this substrate 100.
Above-mentioned metal, piezoelectricity, protection, stacked laminations of metal structure also comprise: a patterning first conductive layer 120 is formed on this first surface 101, as a bottom electrode 120; One piezoelectric layer 130 is formed on this first surface 101 and covers conductive layer 120; One contains the protective layer 134 of micro mist, is formed on this piezoelectric layer 130; And a patterning second conductive layer 140, be formed on the protective layer 134 that contains micro mist and corresponding, with as a top electrode 140 with first conductive layer 120.
Feature of the present invention is to combine the thick film forming process with effect and film shaped legal system is made piezoelectric layer, utilize the scraper method of forming or wire mark method to form a piezoelectric thick fast earlier, on piezoelectric thick, form the piezoelectric membrane of a surfacing with solution-gel (sol-gel) spin-coating method, can improve the shortcoming of above-mentioned making, improve acceptance rate.
In addition, because the present invention utilizes a piezoelectric membrane to be formed on the piezoelectric thick, PZT is in sintering process, and piezoelectric membrane takes place fine and close earlier and as protective layer, can suppress to contain the volatilization of the gas of lead oxide, improves piezoelectric property and lifting making acceptance rate.
Though the present invention discloses as above with preferred embodiment; yet it is not to be used for limiting the present invention; any those of ordinary skill in the art; without departing from the spirit and scope of the present invention; change and modification when doing some, so protection scope of the present invention is when being as the criterion with desired scope in accompanying claims.
The drawing reference numeral explanation
Known portions (Figure 1A～Fig. 1 C)
10～substrate; 11～first surface; 12～second surface; 20～the first conductive layers; 30～piezoelectric layer; 40～the second conductive layers; 60～inking chamber; 70～spray nozzle sheet.
The present invention's part (Fig. 2～Fig. 5)
100～substrate; 101～first surface; 102～second surface; 120～the first conductive layers; 130～piezoelectric layer; 132～protective layer; 134～The protective layer that contains micro mist; 140～the second conductive layers; 160～inking chamber; 170～spray nozzle sheet.
Claims (29)
1. the preparation method of a piezoelectric ink-jet head is characterized in that, comprising:
One substrate is provided, has a relative first surface and a second surface;
On described first surface, form a patterning first conductive layer, with as a bottom electrode;
On described first surface, form a thick film piezoelectric layer and cover described first conductive layer;
On described thick film piezoelectric layer, form a film piezo-electric protective layer;
On described film piezo-electric protective layer, form a patterning second conductive layer and corresponding, with as a top electrode with described first conductive layer; And
Define described film piezo-electric protective layer and described thick film piezoelectric layer, making becomes a metal, piezoelectricity, protection, stacked laminations of metal structure.
2. the preparation method of piezoelectric ink-jet head as claimed in claim 1 is characterized in that, described substrate is a monocrystal silicon substrate.
3. the preparation method of piezoelectric ink-jet head as claimed in claim 1 is characterized in that, described first conductive layer is Ag-Pd alloy, Pt or Au.
4. the preparation method of piezoelectric ink-jet head as claimed in claim 1 is characterized in that, described thick film piezoelectric layer is that high temperature sintering material and described film piezo-electric protective layer are low-temp sintered materials.
5. the preparation method of piezoelectric ink-jet head as claimed in claim 1 is characterized in that, forming described thick film piezoelectric layer and be and making and form described film piezo-electric protective layer with thick film is to make of membrane process.
6. the preparation method of piezoelectric ink-jet head as claimed in claim 1 is characterized in that, described thick film piezoelectric layer is made with the lead zirconate-titanate material.
7. the preparation method of piezoelectric ink-jet head as claimed in claim 6 is characterized in that, described lead zirconate-titanate material is made with the scraper method of forming, wire mark method or transfer printing.
8. the preparation method of piezoelectric ink-jet head as claimed in claim 1 is characterized in that, described film piezo-electric protective layer is with the lead zirconate-titanate material or to contain the lead zirconate-titanate of low-temp sintered material made.
9. the preparation method of piezoelectric ink-jet head as claimed in claim 8 is characterized in that, described low-temp sintered material is zinc oxide or zirconia.
10. the preparation method of piezoelectric ink-jet head as claimed in claim 1 is characterized in that, described film piezo-electric protective layer is made with solution-gel method.
11. the preparation method of piezoelectric ink-jet head as claimed in claim 1 is characterized in that, described film piezo-electric protective layer is made with the solution-gel method that contains micro mist.
12. the preparation method of piezoelectric ink-jet head as claimed in claim 11 is characterized in that, the material of described micro mist is lead zirconate-titanate zinc oxide or zirconia micro mist.
13. the preparation method of piezoelectric ink-jet head as claimed in claim 11 is characterized in that, described grain size of micropowder is less than 1 micron.
14. the preparation method of piezoelectric ink-jet head as claimed in claim 1 is characterized in that, described second conductive layer is Ag-Pd alloy, Pt or Au.
15. the preparation method of piezoelectric ink-jet head as claimed in claim 1 is characterized in that, defines described film piezo-electric protective layer and described thick film piezoelectric layer step is to utilize laser cutting, dry-etching or Wet-type etching technology.
16. the preparation method of piezoelectric ink-jet head as claimed in claim 1 is characterized in that, also comprises the following steps:
The second surface of the described substrate of etching forms a groove corresponding to described metal, piezoelectricity, protection, stacked laminations of metal structure, it is characterized in that described groove is as an inking chamber; And
Engage a spray nozzle sheet on the second surface of described substrate, to form a piezoelectric ink-jet head.
17. a piezoelectric ink-jet head is characterized in that, comprising:
One substrate has a relative first surface and a second surface;
One metal, thick film piezoelectricity, film piezo-electric protection, stacked laminations of metal structure are positioned on the first surface of described substrate, as the actuating structure of described ink gun;
One groove is formed at the second surface of described substrate, corresponding to described metal, thick film piezoelectricity, film piezo-electric protection, stacked laminations of metal structure, as an inking chamber; And
One spray nozzle sheet is engaged in the second surface of described substrate.
18. piezoelectric ink-jet head as claimed in claim 17 is characterized in that, described substrate is a monocrystal silicon substrate.
19. piezoelectric ink-jet head as claimed in claim 17 is characterized in that, described metal, piezoelectricity, protection, stacked laminations of metal structure also comprise:
One patterning, first conductive layer is formed on the described first surface, as a bottom electrode;
One thick film piezoelectric layer is formed on the described first surface and covers described conductive layer;
One film piezo-electric protective layer is formed on the described thick film piezoelectric layer; And
One patterning, second conductive layer is formed on the described film piezo-electric protective layer and corresponding with described first conductive layer, with as a top electrode.
20. piezoelectric ink-jet head as claimed in claim 19 is characterized in that, described first conductive layer is Ag-Pd alloy, Pt or Au.
21. piezoelectric ink-jet head as claimed in claim 19 is characterized in that, described thick film piezoelectric layer is that high temperature sintering material and described film piezo-electric protective layer are low-temp sintered materials.
22. piezoelectric ink-jet head as claimed in claim 19 is characterized in that, forming described thick film piezoelectric layer and be and making and form described film piezo-electric protective layer with thick film is to make with membrane process.
23. piezoelectric ink-jet head as claimed in claim 19 is characterized in that, described thick film piezoelectric layer is made with the lead zirconate-titanate material.
24. piezoelectric ink-jet head as claimed in claim 19 is characterized in that, described film piezo-electric protective layer is with the made lead zirconate-titanate material of solution-gel method.
25. piezoelectric ink-jet head as claimed in claim 19 is characterized in that, described film piezo-electric protective layer is with the made lead zirconate-titanate material of the solution-gel method that contains micro mist or contains the lead zirconate-titanate of low-temp sintered material.
26. piezoelectric ink-jet head as claimed in claim 25 is characterized in that, described low-temp sintered material is zinc oxide or zirconia.
27. piezoelectric ink-jet head as claimed in claim 25 is characterized in that, the material of described micro mist is lead zirconate-titanate zinc oxide or zirconia micro mist.
28. piezoelectric ink-jet head as claimed in claim 25 is characterized in that, described grain size of micropowder is less than 1 micron.
29. piezoelectric ink-jet head as claimed in claim 19 is characterized in that, described second conductive layer is Ag-Pd alloy, Pt or Au.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6126273A (en) * | 1998-04-30 | 2000-10-03 | Hewlett-Packard Co. | Inkjet printer printhead which eliminates unpredictable ink nucleation variations |
| US6234608B1 (en) * | 1997-06-05 | 2001-05-22 | Xerox Corporation | Magnetically actuated ink jet printing device |
| CN1408549A (en) * | 2001-09-28 | 2003-04-09 | 飞赫科技股份有限公司 | Piezoelectric ink jet printing head and its producing method |
| CN1408548A (en) * | 2001-09-28 | 2003-04-09 | 飞赫科技股份有限公司 | Piezoelectric ink jet printing head and its producing method |
| CN1433888A (en) * | 2002-01-25 | 2003-08-06 | 飞赫科技股份有限公司 | Method for making main structure body of peizoelectric ink-jet chip |
| TW555653B (en) * | 2003-02-24 | 2003-10-01 | Nanodynamics Inc | Piezoelectric ink-jetting head and its manufacturing method |
-
2003
- 2003-10-31 CN CNB2003101036144A patent/CN100336663C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6234608B1 (en) * | 1997-06-05 | 2001-05-22 | Xerox Corporation | Magnetically actuated ink jet printing device |
| US6126273A (en) * | 1998-04-30 | 2000-10-03 | Hewlett-Packard Co. | Inkjet printer printhead which eliminates unpredictable ink nucleation variations |
| CN1408549A (en) * | 2001-09-28 | 2003-04-09 | 飞赫科技股份有限公司 | Piezoelectric ink jet printing head and its producing method |
| CN1408548A (en) * | 2001-09-28 | 2003-04-09 | 飞赫科技股份有限公司 | Piezoelectric ink jet printing head and its producing method |
| CN1433888A (en) * | 2002-01-25 | 2003-08-06 | 飞赫科技股份有限公司 | Method for making main structure body of peizoelectric ink-jet chip |
| TW555653B (en) * | 2003-02-24 | 2003-10-01 | Nanodynamics Inc | Piezoelectric ink-jetting head and its manufacturing method |
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