CH623452GA3 - - Google Patents

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Publication number
CH623452GA3
CH623452GA3 CH1537677A CH1537677A CH623452GA3 CH 623452G A3 CH623452G A3 CH 623452GA3 CH 1537677 A CH1537677 A CH 1537677A CH 1537677 A CH1537677 A CH 1537677A CH 623452G A3 CH623452G A3 CH 623452GA3
Authority
CH
Switzerland
Prior art keywords
openings
leads
bonding
components
module
Prior art date
Application number
CH1537677A
Other versions
CH623452B (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of CH623452B publication Critical patent/CH623452B/en
Application filed filed Critical
Priority to CH1537677A priority Critical patent/CH623452B/en
Priority to US05/969,059 priority patent/US4241436A/en
Priority to JP15568678A priority patent/JPS5494364A/en
Priority to FR7835216A priority patent/FR2412225B1/en
Priority to DE19782854273 priority patent/DE2854273A1/en
Publication of CH623452GA3 publication Critical patent/CH623452GA3/xx

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
    • G04D1/00—Gripping, holding, or supporting devices
    • G04D1/005—Gripping, holding, or supporting devices for non-automatic assembly, with automatic transport between workbenches
    • G04D1/0057—Conveyor belts or chains
    • G—PHYSICS
    • G04—HOROLOGY
    • G04C—ELECTROMECHANICAL CLOCKS OR WATCHES
    • G04C3/00—Electromechanical clocks or watches independent of other time-pieces and in which the movement is maintained by electric means
    • G04C3/008—Mounting, assembling of components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49579—Watch or clock making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Clocks (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Electromechanical Clocks (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

An electronic watch module and method of manufacturing the module. The module is formed from a flexible film by forming a set of appropriately located, sized and shaped component openings in the film, forming a second set of terminal lead bonding openings for the components, securing a metallic foil to said film, removing portions of said foil to form a pattern of interconnection leads for said components leaving portions over said bonding openings, locating the components in the respective openings with the component leads in registry with their respective interconnection leads, and bonding the foil leads to the component leads through the bonding openings.
CH1537677A 1977-12-14 1977-12-14 METHOD OF MANUFACTURING AN ELECTRONIC CLOCK PART MODULE AND CLOCK PART MODULE OBTAINED BY IMPLEMENTATION OF THIS PROCESS. CH623452B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CH1537677A CH623452B (en) 1977-12-14 1977-12-14 METHOD OF MANUFACTURING AN ELECTRONIC CLOCK PART MODULE AND CLOCK PART MODULE OBTAINED BY IMPLEMENTATION OF THIS PROCESS.
US05/969,059 US4241436A (en) 1977-12-14 1978-12-13 Method of manufacturing of electronic modules for timepieces and electronic module obtained by carrying out this method
JP15568678A JPS5494364A (en) 1977-12-14 1978-12-14 Method of making electronic module for timepiece* and electronic module
FR7835216A FR2412225B1 (en) 1977-12-14 1978-12-14 ELECTRONIC MODULE FOR WATCHMAKING PARTS AND MANUFACTURING METHOD THEREOF
DE19782854273 DE2854273A1 (en) 1977-12-14 1978-12-14 PROCESS FOR MANUFACTURING ELECTRONIC MODULES FOR WATCHES AND ELECTRONIC MODULES MANUFACTURED BY THIS PROCESS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1537677A CH623452B (en) 1977-12-14 1977-12-14 METHOD OF MANUFACTURING AN ELECTRONIC CLOCK PART MODULE AND CLOCK PART MODULE OBTAINED BY IMPLEMENTATION OF THIS PROCESS.

Publications (2)

Publication Number Publication Date
CH623452B CH623452B (en)
CH623452GA3 true CH623452GA3 (en) 1981-06-15

Family

ID=4408571

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1537677A CH623452B (en) 1977-12-14 1977-12-14 METHOD OF MANUFACTURING AN ELECTRONIC CLOCK PART MODULE AND CLOCK PART MODULE OBTAINED BY IMPLEMENTATION OF THIS PROCESS.

Country Status (5)

Country Link
US (1) US4241436A (en)
JP (1) JPS5494364A (en)
CH (1) CH623452B (en)
DE (1) DE2854273A1 (en)
FR (1) FR2412225B1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56140279A (en) * 1980-04-01 1981-11-02 Citizen Watch Co Ltd Construction of hand type electronic wristwatch
CH644990GA3 (en) * 1981-02-23 1984-09-14
CH638368B (en) * 1981-02-26 Fontainemelon Horlogerie ELECTRONIC WATCH PART.
JPS58219661A (en) * 1982-06-15 1983-12-21 Sharp Corp Card-shaped electronic calculator
US4598337A (en) * 1984-09-17 1986-07-01 Timex Corporation Electronic circuit board for a timepiece
US4796239A (en) * 1986-05-08 1989-01-03 Seikosha Co., Ltd. Circuit unit for timepiece and process for fabricating the same
US5214571A (en) * 1986-12-10 1993-05-25 Miraco, Inc. Multilayer printed circuit and associated multilayer material
US5097390A (en) * 1986-12-10 1992-03-17 Interflex Corporation Printed circuit and fabrication of same
US4961806A (en) * 1986-12-10 1990-10-09 Sanders Associates, Inc. Method of making a printed circuit
FR2616995A1 (en) * 1987-06-22 1988-12-23 Ebauchesfabrik Eta Ag METHOD FOR MANUFACTURING ELECTRONIC MODULES
US5369627A (en) * 1987-07-21 1994-11-29 Seiko Epson Corporation Improvements in bearing and frame structure of a timepiece
US5416752A (en) * 1987-07-21 1995-05-16 Seiko Epson Corporation Timepiece
EP0665706A1 (en) * 1994-01-28 1995-08-02 Molex Incorporated Method of fabricating flat flexible circuits
JP5008873B2 (en) * 2006-02-08 2012-08-22 株式会社 ニコンビジョン Telescope and lens cap

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3387365A (en) * 1965-09-28 1968-06-11 John P. Stelmak Method of making electrical connections to a miniature electronic component
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
US3771711A (en) * 1971-08-20 1973-11-13 Western Electric Co Compliant bonding
JPS5935195B2 (en) * 1975-03-12 1984-08-27 セイコーエプソン株式会社 digital watch
FR2311406A1 (en) * 1975-05-13 1976-12-10 Honeywell Bull Soc Ind IMPROVEMENTS IN THE MANUFACTURING METHODS OF PACKAGING SUPPORTS FOR MICRO-PLATELETS OF INTEGRATED CIRCUITS
CA1058312A (en) * 1975-05-29 1979-07-10 Texas Instruments Incorporated Circuit device packaging technique
US4095412A (en) * 1975-06-16 1978-06-20 Hughes Aircraft Company Flexible cable for digital watch
US4050618A (en) * 1975-06-19 1977-09-27 Angelucci Sr Thomas L Flexible lead bonding apparatus
JPS5292368A (en) * 1976-01-29 1977-08-03 Seiko Instr & Electronics Electronic wrist watch substrate mounting structure
US4064552A (en) * 1976-02-03 1977-12-20 Angelucci Thomas L Multilayer flexible printed circuit tape

Also Published As

Publication number Publication date
FR2412225A1 (en) 1979-07-13
DE2854273C2 (en) 1990-01-11
US4241436A (en) 1980-12-23
FR2412225B1 (en) 1985-08-09
CH623452B (en)
DE2854273A1 (en) 1979-06-28
JPS5494364A (en) 1979-07-26

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