CH616277A5 - Semiconductor diode device for generating or for receiving radiation. - Google Patents
Semiconductor diode device for generating or for receiving radiation. Download PDFInfo
- Publication number
- CH616277A5 CH616277A5 CH851377A CH851377A CH616277A5 CH 616277 A5 CH616277 A5 CH 616277A5 CH 851377 A CH851377 A CH 851377A CH 851377 A CH851377 A CH 851377A CH 616277 A5 CH616277 A5 CH 616277A5
- Authority
- CH
- Switzerland
- Prior art keywords
- semiconductor
- diode device
- semiconductor diode
- carrier
- window
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
- H01L25/042—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2641540A DE2641540C2 (de) | 1976-09-15 | 1976-09-15 | Lumineszenzdiodenzeile zur Erzeugung eines sehr feinen Rasters von Lichtpunkten |
Publications (1)
Publication Number | Publication Date |
---|---|
CH616277A5 true CH616277A5 (en) | 1980-03-14 |
Family
ID=5987987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH851377A CH616277A5 (en) | 1976-09-15 | 1977-07-11 | Semiconductor diode device for generating or for receiving radiation. |
Country Status (7)
Country | Link |
---|---|
AT (1) | AT368321B (sv) |
CH (1) | CH616277A5 (sv) |
DE (1) | DE2641540C2 (sv) |
FR (1) | FR2365214A1 (sv) |
IT (1) | IT1084435B (sv) |
NL (1) | NL7709752A (sv) |
SE (1) | SE7709857L (sv) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3520231A1 (de) * | 1984-06-11 | 1985-12-12 | Harison Electric Co. Ltd., Imabari, Ehime | Lichtaussendende dioden-anordnung |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5659260A (en) * | 1979-09-26 | 1981-05-22 | Siemens Ag | Charged latent image forming device for electronic printing |
DE3048288A1 (de) * | 1980-12-20 | 1982-07-29 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Anordnung aus wenigstens einem lichtemittierendem halbleiterbauelement |
EP0074719B1 (en) * | 1981-08-11 | 1986-03-12 | Xerox Corporation | Imaging device |
DE3429107C2 (de) * | 1983-08-08 | 1996-12-12 | Canon Kk | Bildaufzeichnungsgerät |
DE3438949C2 (de) * | 1983-10-25 | 1994-03-10 | Canon Kk | Druckvorrichtung |
US4929965A (en) * | 1987-09-02 | 1990-05-29 | Alps Electric Co. | Optical writing head |
KR910003735B1 (ko) * | 1988-12-17 | 1991-06-10 | 삼성전자 주식회사 | 발광장치 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3290539A (en) * | 1963-09-16 | 1966-12-06 | Rca Corp | Planar p-nu junction light source with reflector means to collimate the emitted light |
DE1614846B2 (de) * | 1967-07-26 | 1976-09-23 | Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm | Halbleiterdiodenanordnung |
JPS5113621B2 (sv) * | 1972-08-10 | 1976-05-01 | ||
JPS5223717B2 (sv) * | 1972-05-02 | 1977-06-25 | ||
US3911431A (en) * | 1973-01-22 | 1975-10-07 | Tokyo Shibaura Electric Co | Light-emitting display device |
-
1976
- 1976-09-15 DE DE2641540A patent/DE2641540C2/de not_active Expired
-
1977
- 1977-07-11 CH CH851377A patent/CH616277A5/de not_active IP Right Cessation
- 1977-07-20 AT AT0526477A patent/AT368321B/de not_active IP Right Cessation
- 1977-09-01 SE SE7709857A patent/SE7709857L/sv unknown
- 1977-09-05 NL NL7709752A patent/NL7709752A/xx not_active Application Discontinuation
- 1977-09-07 IT IT27310/77A patent/IT1084435B/it active
- 1977-09-08 FR FR7727201A patent/FR2365214A1/fr active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3520231A1 (de) * | 1984-06-11 | 1985-12-12 | Harison Electric Co. Ltd., Imabari, Ehime | Lichtaussendende dioden-anordnung |
Also Published As
Publication number | Publication date |
---|---|
DE2641540C2 (de) | 1981-10-29 |
SE7709857L (sv) | 1978-03-16 |
AT368321B (de) | 1982-10-11 |
DE2641540A1 (de) | 1978-03-16 |
ATA526477A (de) | 1982-01-15 |
FR2365214A1 (fr) | 1978-04-14 |
NL7709752A (nl) | 1978-03-17 |
FR2365214B1 (sv) | 1982-11-19 |
IT1084435B (it) | 1985-05-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |