CH541627A - Electro-deposition process of an alloy of rhodium and platinum, bath for implementing this process and object coated with an alloy of rhodium and platinum obtained using this process - Google Patents

Electro-deposition process of an alloy of rhodium and platinum, bath for implementing this process and object coated with an alloy of rhodium and platinum obtained using this process

Info

Publication number
CH541627A
CH541627A CH736072A CH736072A CH541627A CH 541627 A CH541627 A CH 541627A CH 736072 A CH736072 A CH 736072A CH 736072 A CH736072 A CH 736072A CH 541627 A CH541627 A CH 541627A
Authority
CH
Switzerland
Prior art keywords
rhodium
alloy
platinum
electro
bath
Prior art date
Application number
CH736072A
Other languages
French (fr)
Inventor
Michael Martini Albert
Original Assignee
Omf California Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omf California Inc filed Critical Omf California Inc
Publication of CH541627A publication Critical patent/CH541627A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CH736072A 1971-05-25 1972-05-17 Electro-deposition process of an alloy of rhodium and platinum, bath for implementing this process and object coated with an alloy of rhodium and platinum obtained using this process CH541627A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US14680871A 1971-05-25 1971-05-25

Publications (1)

Publication Number Publication Date
CH541627A true CH541627A (en) 1973-09-15

Family

ID=22519083

Family Applications (1)

Application Number Title Priority Date Filing Date
CH736072A CH541627A (en) 1971-05-25 1972-05-17 Electro-deposition process of an alloy of rhodium and platinum, bath for implementing this process and object coated with an alloy of rhodium and platinum obtained using this process

Country Status (9)

Country Link
US (1) US3671408A (en)
BR (1) BR7203327D0 (en)
CA (1) CA1027892A (en)
CH (1) CH541627A (en)
DE (1) DE2226699A1 (en)
FR (1) FR2140231A1 (en)
GB (1) GB1383850A (en)
IT (1) IT958011B (en)
NL (1) NL7206694A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1431548A (en) * 1972-09-21 1976-04-07 Engelhard Ind Ltd Electrodeposition of plantinum
US3833487A (en) * 1972-12-22 1974-09-03 Bell Telephone Labor Inc Electrolytic soft gold plating
US4285784A (en) * 1980-07-10 1981-08-25 The United States Of America As Represented By The Secretary Of The Interior Process of electroplating a platinum-rhodium alloy coating
DE3100997C2 (en) * 1981-01-15 1986-08-14 Degussa Ag, 6000 Frankfurt Bath for the galvanic deposition of rhodium coatings
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
US6306277B1 (en) 2000-01-14 2001-10-23 Honeywell International Inc. Platinum electrolyte for use in electrolytic plating
US8372744B2 (en) 2007-04-20 2013-02-12 International Business Machines Corporation Fabricating a contact rhodium structure by electroplating and electroplating composition
DE102008050135B4 (en) * 2008-10-04 2010-08-05 Umicore Galvanotechnik Gmbh Process for depositing platinum rhodium layers with improved brightness
CN103397358B (en) * 2013-08-01 2016-01-20 江苏协鑫软控设备科技发展有限公司 The electroplate liquid repaired for platinum rhodium thermopair and renovation technique
CN108130566B (en) * 2018-01-31 2019-08-27 西北有色金属研究院 Electroplate liquid and its electro-plating method for nickel base superalloy electroplating surface platinum layer

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL123540C (en) * 1958-08-06
US3515651A (en) * 1966-02-07 1970-06-02 Katsuhiro Ohkubo Plating solutions for rhodium and rhodium alloy platings having low internal stress
US3528895A (en) * 1967-07-10 1970-09-15 Sel Rex Corp Plating low stress bright rhodium

Also Published As

Publication number Publication date
BR7203327D0 (en) 1973-05-10
CA1027892A (en) 1978-03-14
FR2140231A1 (en) 1973-01-12
DE2226699A1 (en) 1972-12-28
US3671408A (en) 1972-06-20
NL7206694A (en) 1972-11-28
GB1383850A (en) 1974-02-12
IT958011B (en) 1973-10-20

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Legal Events

Date Code Title Description
PL Patent ceased