CH494284A - Process for the electrolytic deposition of a gold alloy with at least one other common metal and aqueous plating bath for carrying out this process - Google Patents

Process for the electrolytic deposition of a gold alloy with at least one other common metal and aqueous plating bath for carrying out this process

Info

Publication number
CH494284A
CH494284A CH1771068A CH1771068A CH494284A CH 494284 A CH494284 A CH 494284A CH 1771068 A CH1771068 A CH 1771068A CH 1771068 A CH1771068 A CH 1771068A CH 494284 A CH494284 A CH 494284A
Authority
CH
Switzerland
Prior art keywords
carrying
plating bath
gold alloy
electrolytic deposition
common metal
Prior art date
Application number
CH1771068A
Other languages
French (fr)
Inventor
Zuntini Franco
Meyer Andre
Antony Pierre
Original Assignee
Sel Rex Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sel Rex Corp filed Critical Sel Rex Corp
Priority to CH1771068A priority Critical patent/CH494284A/en
Priority to SE16091/69A priority patent/SE366066B/xx
Priority to GB57431/69A priority patent/GB1293356A/en
Priority to IL33414A priority patent/IL33414A/en
Priority to BE742173D priority patent/BE742173A/xx
Priority to AT1106569A priority patent/AT301290B/en
Priority to DE1960047A priority patent/DE1960047C2/en
Priority to FR6940849A priority patent/FR2032280A1/fr
Priority to NL6917849A priority patent/NL6917849A/xx
Priority to ES374007A priority patent/ES374007A1/en
Priority to JP44095127A priority patent/JPS4828260B1/ja
Publication of CH494284A publication Critical patent/CH494284A/en
Priority to US00238473A priority patent/US3764489A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/28—Phosphorus compounds with one or more P—C bonds
    • C07F9/30—Phosphinic acids [R2P(=O)(OH)]; Thiophosphinic acids ; [R2P(=X1)(X2H) (X1, X2 are each independently O, S or Se)]
    • C07F9/32—Esters thereof
    • C07F9/3205—Esters thereof the acid moiety containing a substituent or a structure which is considered as characteristic
    • C07F9/3235—Esters of poly(thio)phosphinic acids
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/66—Arsenic compounds
    • C07F9/70—Organo-arsenic compounds
    • C07F9/74—Aromatic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
CH1771068A 1968-11-28 1968-11-28 Process for the electrolytic deposition of a gold alloy with at least one other common metal and aqueous plating bath for carrying out this process CH494284A (en)

Priority Applications (12)

Application Number Priority Date Filing Date Title
CH1771068A CH494284A (en) 1968-11-28 1968-11-28 Process for the electrolytic deposition of a gold alloy with at least one other common metal and aqueous plating bath for carrying out this process
SE16091/69A SE366066B (en) 1968-11-28 1969-11-24
GB57431/69A GB1293356A (en) 1968-11-28 1969-11-24 Method for the electrolytic deposition of gold alloys and aqueous plating bath therefor
IL33414A IL33414A (en) 1968-11-28 1969-11-24 Electrodeposition of gold alloys
BE742173D BE742173A (en) 1968-11-28 1969-11-25
AT1106569A AT301290B (en) 1968-11-28 1969-11-26 Aqueous bath for the electrolytic deposition of a gold alloy
DE1960047A DE1960047C2 (en) 1968-11-28 1969-11-26 Aqueous acid bath for the galvanic deposition of gold-tin alloys
FR6940849A FR2032280A1 (en) 1968-11-28 1969-11-27
NL6917849A NL6917849A (en) 1968-11-28 1969-11-27
ES374007A ES374007A1 (en) 1968-11-28 1969-11-28 Procedure for the electrolytic deposit of a gold alloy. (Machine-translation by Google Translate, not legally binding)
JP44095127A JPS4828260B1 (en) 1968-11-28 1969-11-28
US00238473A US3764489A (en) 1968-11-28 1972-03-27 Electrodeposition of gold alloys

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH1771068A CH494284A (en) 1968-11-28 1968-11-28 Process for the electrolytic deposition of a gold alloy with at least one other common metal and aqueous plating bath for carrying out this process
US88095069A 1969-11-28 1969-11-28
US23847372A 1972-03-27 1972-03-27

Publications (1)

Publication Number Publication Date
CH494284A true CH494284A (en) 1970-07-31

Family

ID=27177642

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1771068A CH494284A (en) 1968-11-28 1968-11-28 Process for the electrolytic deposition of a gold alloy with at least one other common metal and aqueous plating bath for carrying out this process

Country Status (8)

Country Link
US (1) US3764489A (en)
AT (1) AT301290B (en)
BE (1) BE742173A (en)
CH (1) CH494284A (en)
DE (1) DE1960047C2 (en)
FR (1) FR2032280A1 (en)
GB (1) GB1293356A (en)
NL (1) NL6917849A (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4013523A (en) * 1975-12-24 1977-03-22 Oxy Metal Industries Corporation Tin-gold electroplating bath and process
US4168214A (en) * 1978-06-14 1979-09-18 American Chemical And Refining Company, Inc. Gold electroplating bath and method of making the same
US4331518A (en) * 1981-01-09 1982-05-25 Vulcan Materials Company Bismuth composition, method of electroplating a tin-bismuth alloy and electroplating bath therefor
DE3319772A1 (en) * 1983-05-27 1984-11-29 Schering AG, 1000 Berlin und 4709 Bergkamen BATH FOR GALVANIC DEPOSITION OF GOLD ALLOYS
DE3565697D1 (en) * 1984-07-05 1988-11-24 Siemens Ag Bath and process for electroplating hard gold
DE4224012C1 (en) * 1992-07-21 1993-12-02 Heraeus Gmbh W C Solderable electric contact element - has silver@-tin@ alloy layer below gold@-tin@ solder alloy layer
DE4440176C2 (en) * 1994-02-05 1996-06-27 Heraeus Gmbh W C Bath for the electrodeposition of silver-tin alloys
ES2117995T3 (en) * 1994-02-05 1998-09-01 Heraeus Gmbh W C BATH FOR GALVANIC DEPOSIT OF SILVER-TIN ALLOYS.
DE4406434C1 (en) * 1994-02-28 1995-08-10 Heraeus Gmbh W C Bright gold@-tin@ alloy electroplating bath
US20060237324A1 (en) * 2003-05-21 2006-10-26 Fred Hayward Pulse plating process for deposition of gold-tin alloy
JP2007537358A (en) * 2004-05-11 2007-12-20 テクニック・インコーポレイテッド Electroplating solution for gold-tin eutectic alloy
WO2006078549A1 (en) * 2005-01-21 2006-07-27 Technic, Inc. Pulse plating process for deposition of gold-tin alloy
US10260159B2 (en) * 2013-07-05 2019-04-16 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1111897B (en) * 1957-08-13 1961-07-27 Sel Rex Corp Bath for the galvanic deposition of shiny gold alloy coatings

Also Published As

Publication number Publication date
DE1960047A1 (en) 1970-11-26
US3764489A (en) 1973-10-09
NL6917849A (en) 1970-06-01
GB1293356A (en) 1972-10-18
AT301290B (en) 1972-08-25
BE742173A (en) 1970-05-04
FR2032280A1 (en) 1970-11-27
DE1960047C2 (en) 1983-04-28

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Legal Events

Date Code Title Description
PL Patent ceased