CH508984A - Kristallträger für einen Halbleiterkristall - Google Patents

Kristallträger für einen Halbleiterkristall

Info

Publication number
CH508984A
CH508984A CH957970A CH957970A CH508984A CH 508984 A CH508984 A CH 508984A CH 957970 A CH957970 A CH 957970A CH 957970 A CH957970 A CH 957970A CH 508984 A CH508984 A CH 508984A
Authority
CH
Switzerland
Prior art keywords
crystal
carrier
semiconductor
semiconductor crystal
crystal carrier
Prior art date
Application number
CH957970A
Other languages
English (en)
Inventor
Masselink Annegien
Maria Bakker Martinus Antonius
Visser Bauke
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of CH508984A publication Critical patent/CH508984A/de

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/492Bases or plates or solder therefor
    • H01L23/4924Bases or plates or solder therefor characterised by the materials
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    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L2224/29Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/291Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/29109Indium [In] as principal constituent
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    • H01L2224/28Structure, shape, material or disposition of the layer connectors prior to the connecting process
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    • H01L2224/29001Core members of the layer connector
    • H01L2224/29099Material
    • H01L2224/291Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L2224/8319Arrangement of the layer connectors prior to mounting
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10T428/12882Cu-base component alternative to Ag-, Au-, or Ni-base component
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    • Y10T428/12986Adjacent functionally defined components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)
  • Laminated Bodies (AREA)
CH957970A 1969-06-27 1970-06-24 Kristallträger für einen Halbleiterkristall CH508984A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL6909889A NL6909889A (de) 1969-06-27 1969-06-27
NL7001030A NL7001030A (de) 1969-06-27 1970-01-24

Publications (1)

Publication Number Publication Date
CH508984A true CH508984A (de) 1971-06-15

Family

ID=26644444

Family Applications (1)

Application Number Title Priority Date Filing Date
CH957970A CH508984A (de) 1969-06-27 1970-06-24 Kristallträger für einen Halbleiterkristall

Country Status (11)

Country Link
US (1) US3707358A (de)
AT (1) AT318005B (de)
BE (1) BE752548A (de)
CA (1) CA923797A (de)
CH (1) CH508984A (de)
DK (1) DK124224B (de)
FR (1) FR2047978B1 (de)
GB (1) GB1315401A (de)
HK (1) HK36776A (de)
NL (2) NL6909889A (de)
SE (1) SE373691B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE34484E (en) * 1978-09-05 1993-12-21 Ngk Spark Plug Co., Ltd. Gold-plated electronic components
JPS6013078B2 (ja) * 1978-09-05 1985-04-04 日本特殊陶業株式会社 金メツキされた電子部品及びその製法
EP0017384B1 (de) * 1979-04-04 1984-02-15 Gec-Marconi Limited Verfahren zur Befestigung von Germanium auf einem Metall
US4268584A (en) * 1979-12-17 1981-05-19 International Business Machines Corporation Nickel-X/gold/nickel-X conductors for solid state devices where X is phosphorus, boron, or carbon
JPS5817649A (ja) * 1981-07-24 1983-02-01 Fujitsu Ltd 電子部品パツケ−ジ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1267686A (fr) * 1959-09-22 1961-07-21 Unitrode Transistor Products Dispositif semi-conducteur
FR1277290A (fr) * 1960-01-13 1961-11-24 Siemens Ag Procédé de fabrication d'un dispositif semi-conducteur

Also Published As

Publication number Publication date
DE2027945B2 (de) 1977-05-18
US3707358A (en) 1972-12-26
DK124224B (da) 1972-09-25
FR2047978A1 (de) 1971-03-19
FR2047978B1 (de) 1974-03-22
BE752548A (fr) 1970-12-28
HK36776A (en) 1976-06-25
AT318005B (de) 1974-09-25
GB1315401A (en) 1973-05-02
CA923797A (en) 1973-04-03
NL6909889A (de) 1970-12-29
NL7001030A (de) 1971-07-27
SE373691B (sv) 1975-02-10
DE2027945A1 (de) 1971-01-07

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