FR1267686A - Dispositif semi-conducteur - Google Patents

Dispositif semi-conducteur

Info

Publication number
FR1267686A
FR1267686A FR838949A FR838949A FR1267686A FR 1267686 A FR1267686 A FR 1267686A FR 838949 A FR838949 A FR 838949A FR 838949 A FR838949 A FR 838949A FR 1267686 A FR1267686 A FR 1267686A
Authority
FR
France
Prior art keywords
semiconductor device
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR838949A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UNITRODE TRANSISTOR PRODUCTS
Original Assignee
UNITRODE TRANSISTOR PRODUCTS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US841513A external-priority patent/US3200310A/en
Application filed by UNITRODE TRANSISTOR PRODUCTS filed Critical UNITRODE TRANSISTOR PRODUCTS
Priority to FR838949A priority Critical patent/FR1267686A/fr
Application granted granted Critical
Publication of FR1267686A publication Critical patent/FR1267686A/fr
Priority claimed from US435103A external-priority patent/US3261075A/en
Expired legal-status Critical Current

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Classifications

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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
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    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
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    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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    • H01L2924/01327—Intermediate phases, i.e. intermetallics compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
FR838949A 1959-09-22 1960-09-19 Dispositif semi-conducteur Expired FR1267686A (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR838949A FR1267686A (fr) 1959-09-22 1960-09-19 Dispositif semi-conducteur

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US841513A US3200310A (en) 1959-09-22 1959-09-22 Glass encapsulated semiconductor device
FR838949A FR1267686A (fr) 1959-09-22 1960-09-19 Dispositif semi-conducteur
US435103A US3261075A (en) 1959-09-22 1964-12-10 Semiconductor device

Publications (1)

Publication Number Publication Date
FR1267686A true FR1267686A (fr) 1961-07-21

Family

ID=27245673

Family Applications (1)

Application Number Title Priority Date Filing Date
FR838949A Expired FR1267686A (fr) 1959-09-22 1960-09-19 Dispositif semi-conducteur

Country Status (1)

Country Link
FR (1) FR1267686A (fr)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3247428A (en) * 1961-09-29 1966-04-19 Ibm Coated objects and methods of providing the protective coverings therefor
US3249829A (en) * 1962-05-18 1966-05-03 Transitron Electronic Corp Encapsulated diode assembly
DE1231811B (de) * 1962-04-06 1967-01-05 Bosch Gmbh Robert Halbleiteranordnung
US3300841A (en) * 1962-07-17 1967-01-31 Texas Instruments Inc Method of junction passivation and product
DE1255205B (de) * 1961-08-07 1967-11-30 Itt Ind Ges Mit Beschraenkter Verfahren zum Verkapseln eines mit einer Oxydschicht ueberzogenen Halbleiterkoerpers
DE1273697B (de) * 1963-08-01 1968-07-25 Telefunken Patent Verfahren zum Kontaktieren eines Halbleiterbauelementes
DE1514018A1 (de) * 1964-06-18 1970-08-20 Ibm Verfahren zur Verbesserung der Betriebseigenschaften von Halbleiterbauelementen
FR2047978A1 (fr) * 1969-06-27 1971-03-19 Philips Nv
DE1564530B1 (de) * 1965-06-09 1971-05-06 Rca Corp Verfahren zur herstellung von gleichrichtersaeulen
DE1274736B (de) * 1964-12-03 1974-02-07 Verfahren zur herstellung einer halbleitervorrichtung

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1255205B (de) * 1961-08-07 1967-11-30 Itt Ind Ges Mit Beschraenkter Verfahren zum Verkapseln eines mit einer Oxydschicht ueberzogenen Halbleiterkoerpers
DE1255205C2 (de) * 1961-08-07 1973-03-01 Itt Ind Ges Mit Beschraenkter Verfahren zum Verkapseln eines mit einer Oxydschicht ueberzogenen Halbleiterkoerpers
US3247428A (en) * 1961-09-29 1966-04-19 Ibm Coated objects and methods of providing the protective coverings therefor
DE1231811B (de) * 1962-04-06 1967-01-05 Bosch Gmbh Robert Halbleiteranordnung
US3249829A (en) * 1962-05-18 1966-05-03 Transitron Electronic Corp Encapsulated diode assembly
US3300841A (en) * 1962-07-17 1967-01-31 Texas Instruments Inc Method of junction passivation and product
DE1273697B (de) * 1963-08-01 1968-07-25 Telefunken Patent Verfahren zum Kontaktieren eines Halbleiterbauelementes
DE1514018A1 (de) * 1964-06-18 1970-08-20 Ibm Verfahren zur Verbesserung der Betriebseigenschaften von Halbleiterbauelementen
DE1274736B (de) * 1964-12-03 1974-02-07 Verfahren zur herstellung einer halbleitervorrichtung
DE1274736C2 (de) * 1964-12-03 1974-02-07 Verfahren zur herstellung einer halbleitervorrichtung
DE1564530B1 (de) * 1965-06-09 1971-05-06 Rca Corp Verfahren zur herstellung von gleichrichtersaeulen
FR2047978A1 (fr) * 1969-06-27 1971-03-19 Philips Nv

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