CH404334A - Procédé de métallisation d'un article diélectrique - Google Patents
Procédé de métallisation d'un article diélectriqueInfo
- Publication number
- CH404334A CH404334A CH1481561A CH1481561A CH404334A CH 404334 A CH404334 A CH 404334A CH 1481561 A CH1481561 A CH 1481561A CH 1481561 A CH1481561 A CH 1481561A CH 404334 A CH404334 A CH 404334A
- Authority
- CH
- Switzerland
- Prior art keywords
- metallizing
- dielectric article
- dielectric
- article
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/187—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating means therefor, e.g. baths, apparatus
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US77489A US3194681A (en) | 1960-12-22 | 1960-12-22 | Process for plating through holes in a dielectric material |
Publications (1)
Publication Number | Publication Date |
---|---|
CH404334A true CH404334A (fr) | 1965-12-15 |
Family
ID=22138360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH1481561A CH404334A (fr) | 1960-12-22 | 1961-12-21 | Procédé de métallisation d'un article diélectrique |
Country Status (4)
Country | Link |
---|---|
US (1) | US3194681A (fr) |
CH (1) | CH404334A (fr) |
DE (1) | DE1446214B2 (fr) |
GB (1) | GB918220A (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3374129A (en) * | 1963-05-02 | 1968-03-19 | Sanders Associates Inc | Method of producing printed circuits |
US3532801A (en) * | 1965-02-23 | 1970-10-06 | Burroughs Corp | Method and apparatus for fabricating laminated circuit boards |
US3505103A (en) * | 1965-04-22 | 1970-04-07 | Gen Motors Corp | Method for metal wetting liners |
DE2230578A1 (de) * | 1972-06-22 | 1974-01-17 | Dynamit Nobel Ag | Antistatischer und/oder elektrisch leitfaehiger bodenbelag sowie verfahren zu seiner herstellung |
DE3305564C1 (de) * | 1983-02-15 | 1984-03-22 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum Aufbau von metallisierten Leiterbahnen und Durchkontaktierungen an gelochten Leiterplatten |
DE3741459C1 (de) * | 1987-12-08 | 1989-04-13 | Blasberg Oberflaechentech | Verfahren zur Herstellung durchkontaktierter Leiterplatten |
US4961955A (en) * | 1988-12-20 | 1990-10-09 | Itt Corporation | Solder paste applicator for circuit boards |
JP2875680B2 (ja) * | 1992-03-17 | 1999-03-31 | 株式会社東芝 | 基材表面の微小孔又は微細凹みの充填又は被覆方法 |
US5460859A (en) * | 1992-03-23 | 1995-10-24 | Xerox Corporation | Method and system for dip coating an article having large open areas or a multiplicity of apertures |
US5681441A (en) * | 1992-12-22 | 1997-10-28 | Elf Technologies, Inc. | Method for electroplating a substrate containing an electroplateable pattern |
WO1997027142A1 (fr) * | 1996-01-29 | 1997-07-31 | Electrochemicals Inc. | Melange ultrasonique de compositions aqueuses de carbone conducteur |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2397400A (en) * | 1938-05-27 | 1946-03-26 | Barwich Heinz | Apparatus for and method of producing metallic coatings |
US2454610A (en) * | 1946-08-13 | 1948-11-23 | Narcus Harold | Method for metalization on nonconductors |
US2616994A (en) * | 1948-05-06 | 1952-11-04 | Ibm | Rotary switch |
US2702260A (en) * | 1949-11-17 | 1955-02-15 | Massa Frank | Apparatus and method for the generation and use of sound waves in liquids for the high-speed wetting of substances immersed in the liquid |
US2657667A (en) * | 1950-10-18 | 1953-11-03 | Williams Brothers Company | Pipe boom supporting apparatus |
US2699425A (en) * | 1952-07-05 | 1955-01-11 | Motorola Inc | Electroplating electrical conductors on an insulating panel |
GB760684A (en) * | 1953-01-08 | 1956-11-07 | Metallisation Ltd | Improvements in or relating to the production of electrical conductors by a metal spraying operation |
US2955958A (en) * | 1956-03-05 | 1960-10-11 | Nathan J Brown | Process of treating woven textile fabric with a vinyl chloride polymer |
-
1960
- 1960-12-22 US US77489A patent/US3194681A/en not_active Expired - Lifetime
-
1961
- 1961-11-22 GB GB41763/61A patent/GB918220A/en not_active Expired
- 1961-12-20 DE DE19611446214 patent/DE1446214B2/de active Pending
- 1961-12-21 CH CH1481561A patent/CH404334A/fr unknown
Also Published As
Publication number | Publication date |
---|---|
DE1446214A1 (de) | 1968-11-14 |
US3194681A (en) | 1965-07-13 |
DE1446214B2 (de) | 1970-11-26 |
GB918220A (en) | 1963-02-13 |
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