CA2991695A1 - Heat sink - Google Patents

Heat sink Download PDF

Info

Publication number: CA2991695A1
Authority: CA; Canada
Prior art keywords: heat; heat sink; shell; heat radiation; sink according
Prior art date: 2015-07-10
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

CA2991695A

Other languages

English (en)

French (fr)

Inventor

Hirotake Moriyama

Akihiro Hayashi

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Sumitomo Seika Chemicals Co Ltd

Chiyoda Integre Co Ltd

Original Assignee

Sumitomo Seika Chemicals Co Ltd

Chiyoda Integre Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-07-10

Filing date

2016-07-01

Publication date

2017-01-19

2016-07-01 Application filed by Sumitomo Seika Chemicals Co Ltd, Chiyoda Integre Co Ltd filed Critical Sumitomo Seika Chemicals Co Ltd

2017-01-19 Publication of CA2991695A1 publication Critical patent/CA2991695A1/en

Status Abandoned legal-status Critical Current

Links

230000005855 radiation Effects 0.000 claims abstract description 86
238000001816 cooling Methods 0.000 claims abstract description 43
238000012546 transfer Methods 0.000 claims abstract description 29
229910052751 metal Inorganic materials 0.000 claims description 61
239000002184 metal Substances 0.000 claims description 61
229910052782 aluminium Inorganic materials 0.000 claims description 36
XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 36
229920005989 resin Polymers 0.000 claims description 19
239000011347 resin Substances 0.000 claims description 19
150000002484 inorganic compounds Chemical class 0.000 claims description 16
229910010272 inorganic material Inorganic materials 0.000 claims description 16
VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical class O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
239000010883 coal ash Substances 0.000 claims description 11
229920003002 synthetic resin Polymers 0.000 claims description 11
239000000057 synthetic resin Substances 0.000 claims description 11
PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 9
229920001721 polyimide Polymers 0.000 claims description 9
239000004925 Acrylic resin Substances 0.000 claims description 8
229920000178 Acrylic resin Polymers 0.000 claims description 8
239000009719 polyimide resin Substances 0.000 claims description 8
239000004962 Polyamide-imide Substances 0.000 claims description 7
229910052615 phyllosilicate Inorganic materials 0.000 claims description 7
229920002312 polyamide-imide Polymers 0.000 claims description 7
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
229910052802 copper Inorganic materials 0.000 claims description 6
239000010949 copper Substances 0.000 claims description 6
239000003822 epoxy resin Substances 0.000 claims description 5
229920000647 polyepoxide Polymers 0.000 claims description 5
239000000377 silicon dioxide Substances 0.000 claims description 5
150000001875 compounds Chemical class 0.000 claims description 4
AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 claims description 3
229940043430 calcium compound Drugs 0.000 claims description 3
150000001674 calcium compounds Chemical class 0.000 claims description 3
150000004767 nitrides Chemical class 0.000 claims description 3
LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 2
238000000034 method Methods 0.000 abstract description 9
230000017525 heat dissipation Effects 0.000 abstract description 2
230000001747 exhibiting effect Effects 0.000 abstract 1
239000008199 coating composition Substances 0.000 description 20
238000004519 manufacturing process Methods 0.000 description 17
229910052623 talc Inorganic materials 0.000 description 13
239000000454 talc Substances 0.000 description 12
230000000694 effects Effects 0.000 description 11
239000002253 acid Substances 0.000 description 10
239000004952 Polyamide Substances 0.000 description 9
229920002647 polyamide Polymers 0.000 description 9
230000000052 comparative effect Effects 0.000 description 8
238000005259 measurement Methods 0.000 description 7
SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
238000005452 bending Methods 0.000 description 5
230000015572 biosynthetic process Effects 0.000 description 5
XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
239000002956 ash Substances 0.000 description 4
239000006229 carbon black Substances 0.000 description 4
238000001125 extrusion Methods 0.000 description 4
239000010439 graphite Substances 0.000 description 4
229910002804 graphite Inorganic materials 0.000 description 4
239000000463 material Substances 0.000 description 4
150000002739 metals Chemical class 0.000 description 4
239000005995 Aluminium silicate Substances 0.000 description 3
229920000049 Carbon (fiber) Polymers 0.000 description 3
239000000956 alloy Substances 0.000 description 3
229910045601 alloy Inorganic materials 0.000 description 3
235000012211 aluminium silicate Nutrition 0.000 description 3
239000004917 carbon fiber Substances 0.000 description 3
239000011888 foil Substances 0.000 description 3
239000011521 glass Substances 0.000 description 3
238000005304 joining Methods 0.000 description 3
NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 3
VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
238000002156 mixing Methods 0.000 description 3
239000000203 mixture Substances 0.000 description 3
229920001296 polysiloxane Polymers 0.000 description 3
238000002360 preparation method Methods 0.000 description 3
229910052903 pyrophyllite Inorganic materials 0.000 description 3
239000002966 varnish Substances 0.000 description 3
229920001342 Bakelite® Polymers 0.000 description 2
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
238000013019 agitation Methods 0.000 description 2
125000003118 aryl group Chemical group 0.000 description 2
IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
239000003086 colorant Substances 0.000 description 2
239000000839 emulsion Substances 0.000 description 2
229920006248 expandable polystyrene Polymers 0.000 description 2
PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
229910052737 gold Inorganic materials 0.000 description 2
239000010931 gold Substances 0.000 description 2
239000004519 grease Substances 0.000 description 2
229910052742 iron Inorganic materials 0.000 description 2
239000010445 mica Substances 0.000 description 2
229910052618 mica group Inorganic materials 0.000 description 2
238000012986 modification Methods 0.000 description 2
230000004048 modification Effects 0.000 description 2
229910052759 nickel Inorganic materials 0.000 description 2
229920003986 novolac Polymers 0.000 description 2
239000004033 plastic Substances 0.000 description 2
229920003023 plastic Polymers 0.000 description 2
239000002243 precursor Substances 0.000 description 2
-1 sericite Inorganic materials 0.000 description 2
229920002379 silicone rubber Polymers 0.000 description 2
239000004945 silicone rubber Substances 0.000 description 2
229910052709 silver Inorganic materials 0.000 description 2
239000004332 silver Substances 0.000 description 2
239000000126 substance Substances 0.000 description 2
239000000758 substrate Substances 0.000 description 2
229910052718 tin Inorganic materials 0.000 description 2
239000011135 tin Substances 0.000 description 2
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
239000004593 Epoxy Substances 0.000 description 1
JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
239000004696 Poly ether ether ketone Substances 0.000 description 1
239000004693 Polybenzimidazole Substances 0.000 description 1
239000004695 Polyether sulfone Substances 0.000 description 1
239000004697 Polyetherimide Substances 0.000 description 1
239000004642 Polyimide Substances 0.000 description 1
239000004734 Polyphenylene sulfide Substances 0.000 description 1
XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
RJDOZRNNYVAULJ-UHFFFAOYSA-L [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] Chemical compound [O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[O--].[F-].[F-].[Mg++].[Mg++].[Mg++].[Al+3].[Si+4].[Si+4].[Si+4].[K+] RJDOZRNNYVAULJ-UHFFFAOYSA-L 0.000 description 1
GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
239000002390 adhesive tape Substances 0.000 description 1
239000004760 aramid Substances 0.000 description 1
229920003235 aromatic polyamide Polymers 0.000 description 1
239000000440 bentonite Substances 0.000 description 1
229910000278 bentonite Inorganic materials 0.000 description 1
SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
239000004841 bisphenol A epoxy resin Substances 0.000 description 1
VNSBYDPZHCQWNB-UHFFFAOYSA-N calcium;aluminum;dioxido(oxo)silane;sodium;hydrate Chemical compound O.[Na].[Al].[Ca+2].[O-][Si]([O-])=O VNSBYDPZHCQWNB-UHFFFAOYSA-N 0.000 description 1
229910052799 carbon Inorganic materials 0.000 description 1
238000005266 casting Methods 0.000 description 1
210000005056 cell body Anatomy 0.000 description 1
239000000919 ceramic Substances 0.000 description 1
239000003795 chemical substances by application Substances 0.000 description 1
239000002734 clay mineral Substances 0.000 description 1
239000003245 coal Substances 0.000 description 1
229920001577 copolymer Polymers 0.000 description 1
229930003836 cresol Natural products 0.000 description 1
238000005520 cutting process Methods 0.000 description 1
GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 1
239000006185 dispersion Substances 0.000 description 1
238000004090 dissolution Methods 0.000 description 1
238000001035 drying Methods 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
238000011156 evaluation Methods 0.000 description 1
239000010881 fly ash Substances 0.000 description 1
238000005242 forging Methods 0.000 description 1
ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
229910000271 hectorite Inorganic materials 0.000 description 1
KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 1
150000004679 hydroxides Chemical class 0.000 description 1
229910052500 inorganic mineral Inorganic materials 0.000 description 1
239000011810 insulating material Substances 0.000 description 1
239000011707 mineral Substances 0.000 description 1
239000000178 monomer Substances 0.000 description 1
229910052901 montmorillonite Inorganic materials 0.000 description 1
229910000273 nontronite Inorganic materials 0.000 description 1
239000004843 novolac epoxy resin Substances 0.000 description 1
239000003960 organic solvent Substances 0.000 description 1
238000005192 partition Methods 0.000 description 1
229920002492 poly(sulfone) Polymers 0.000 description 1
229920001230 polyarylate Polymers 0.000 description 1
229920002480 polybenzimidazole Polymers 0.000 description 1
229920002577 polybenzoxazole Polymers 0.000 description 1
229920006393 polyether sulfone Polymers 0.000 description 1
229920002530 polyetherether ketone Polymers 0.000 description 1
229920001601 polyetherimide Polymers 0.000 description 1
229920000642 polymer Polymers 0.000 description 1
229920000069 polyphenylene sulfide Polymers 0.000 description 1
229910000275 saponite Inorganic materials 0.000 description 1
229910021647 smectite Inorganic materials 0.000 description 1
239000007787 solid Substances 0.000 description 1
238000003786 synthesis reaction Methods 0.000 description 1
229910052902 vermiculite Inorganic materials 0.000 description 1
239000010455 vermiculite Substances 0.000 description 1
235000019354 vermiculite Nutrition 0.000 description 1
238000005406 washing Methods 0.000 description 1
239000013585 weight reducing agent Substances 0.000 description 1
238000003466 welding Methods 0.000 description 1

Classifications

- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/06—Coatings; Surface treatments having particular radiating, reflecting or absorbing features, e.g. for improving heat transfer by radiation
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Computer Hardware Design (AREA)
Power Engineering (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Materials Engineering (AREA)
Chemical & Material Sciences (AREA)
General Physics & Mathematics (AREA)
Mechanical Engineering (AREA)
General Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)
Laminated Bodies (AREA)

CA2991695A 2015-07-10 2016-07-01 Heat sink Abandoned CA2991695A1 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2015138934A JP2018139236A (ja)	2015-07-10	2015-07-10	ヒートシンク
JP2015-138934		2015-07-10
PCT/JP2016/069664 WO2017010322A1 (ja)	2015-07-10	2016-07-01	ヒートシンク

Publications (1)

Publication Number	Publication Date
CA2991695A1 true CA2991695A1 (en)	2017-01-19

Family

ID=57756967

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA2991695A Abandoned CA2991695A1 (en)	2015-07-10	2016-07-01	Heat sink

Country Status (9)

Country	Link
US (1)	US20180195816A1 (de)
EP (1)	EP3322270A4 (de)
JP (1)	JP2018139236A (de)
KR (1)	KR20180026735A (de)
CN (1)	CN108029218A (de)
CA (1)	CA2991695A1 (de)
MX (1)	MX2018000332A (de)
TW (1)	TW201719104A (de)
WO (1)	WO2017010322A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2017088809A (ja) *	2015-11-16	2017-05-25	住友精化株式会社	熱放射性塗膜形成用水性分散液、熱放射性塗膜及び放熱シート
WO2019030792A1 (ja)	2017-08-07	2019-02-14	ギガフォトン株式会社	コンデンサの冷却構造及びレーザ装置
JP6816678B2 (ja) *	2017-08-30	2021-01-20	トヨタ自動車株式会社	放熱シート
CN110416808A (zh) *	2019-07-10	2019-11-05	安徽迅科智能技术有限公司	一种弱电***接线器
US11064632B2 (en) *	2019-09-05	2021-07-13	Ldc Precision Engineering Co., Ltd.	Heat-sinking improved structure for evaporators
TWI703295B (zh) *	2019-10-15	2020-09-01	財團法人食品工業發展研究所	複合加熱裝置

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Publication number	Priority date	Publication date	Assignee	Title
US5564496A (en) *	1994-11-01	1996-10-15	United Technologies Corporation	Composite parting sheet
JP2006093546A (ja) *	2004-09-27	2006-04-06	Oki Electric Ind Co Ltd	放熱シート、放熱筒状体およびそれらを用いた放熱構造
JP2006245523A (ja) *	2005-02-04	2006-09-14	Dainippon Printing Co Ltd	放熱シート、及びその製造方法
JP2006253601A (ja) *	2005-03-14	2006-09-21	Oki Electric Ind Co Ltd	放熱装置およびそれを用いた放熱構造
JP5193431B2 (ja) *	2006-04-18	2013-05-08	沖電線株式会社	放熱構造
JP2008091715A (ja) *	2006-10-03	2008-04-17	Techno Associe Co Ltd	放熱筒状体およびこれを用いる放熱構造
US20090303685A1 (en) *	2008-06-10	2009-12-10	Chen H W	Interface module with high heat-dissipation
EP2578982A4 (de) *	2010-05-28	2015-10-28	Toyota Motor Co Ltd	Wärmetauscher und herstellungsverfahren dafür
JP2012078487A (ja) *	2010-09-30	2012-04-19	Sanyo Electric Co Ltd	投写型映像表示装置
JP6292549B2 (ja) *	2013-03-28	2018-03-14	住友精化株式会社	放熱フィルム、熱放射層用分散液、放熱フィルムの製造方法、及び、太陽電池
WO2014157587A1 (ja) *	2013-03-29	2014-10-02	株式会社神戸製鋼所	プレコートアルミニウム板材、アルミニウム板材および車載ｌｅｄ照明用ヒートシンク

2015
- 2015-07-10 JP JP2015138934A patent/JP2018139236A/ja active Pending
2016
- 2016-07-01 KR KR1020187002862A patent/KR20180026735A/ko unknown
- 2016-07-01 US US15/742,800 patent/US20180195816A1/en not_active Abandoned
- 2016-07-01 EP EP16824302.0A patent/EP3322270A4/de not_active Withdrawn
- 2016-07-01 CA CA2991695A patent/CA2991695A1/en not_active Abandoned
- 2016-07-01 WO PCT/JP2016/069664 patent/WO2017010322A1/ja active Application Filing
- 2016-07-01 CN CN201680040737.3A patent/CN108029218A/zh active Pending
- 2016-07-01 MX MX2018000332A patent/MX2018000332A/es unknown
- 2016-07-06 TW TW105121332A patent/TW201719104A/zh unknown

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Publication number	Publication date
US20180195816A1 (en)	2018-07-12
EP3322270A4 (de)	2018-12-26
KR20180026735A (ko)	2018-03-13
EP3322270A1 (de)	2018-05-16
CN108029218A (zh)	2018-05-11
MX2018000332A (es)	2018-06-07
JP2018139236A (ja)	2018-09-06
WO2017010322A1 (ja)	2017-01-19
TW201719104A (zh)	2017-06-01

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