CA2702160A1 - Appareil d'interface electronique et procede et systeme pour sa fabrication - Google Patents

Appareil d'interface electronique et procede et systeme pour sa fabrication Download PDF

Info

Publication number: CA2702160A1
Authority: CA; Canada
Prior art keywords: connection wires; conductors; attaching; chip module; continuous connection
Prior art date: 2007-11-08
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

CA2702160A

Other languages

English (en)

Other versions

CA2702160C (fr

Inventor

Oded Bashan

Guy Shafran

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Linxens Holding SAS

Original Assignee

Individual

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2007-11-08

Filing date

2008-10-23

Publication date

2009-05-14

2007-11-08 Priority claimed from PCT/IL2007/001378 external-priority patent/WO2008129526A2/fr

2008-10-23 Application filed by Individual filed Critical Individual

2008-10-23 Priority claimed from PCT/IL2008/001397 external-priority patent/WO2009060425A2/fr

2009-05-14 Publication of CA2702160A1 publication Critical patent/CA2702160A1/fr

2013-08-13 Application granted granted Critical

2013-08-13 Publication of CA2702160C publication Critical patent/CA2702160C/fr

Status Active legal-status Critical Current

2028-10-23 Anticipated expiration legal-status Critical

Links

238000000034 method Methods 0.000 title claims abstract description 37
238000004519 manufacturing process Methods 0.000 title claims abstract description 29
239000000758 substrate Substances 0.000 claims abstract description 59
239000004020 conductor Substances 0.000 claims abstract description 36
238000007789 sealing Methods 0.000 claims abstract description 7
238000005476 soldering Methods 0.000 claims description 9
239000000853 adhesive Substances 0.000 claims description 6
230000001070 adhesive effect Effects 0.000 claims description 6
238000010030 laminating Methods 0.000 claims description 4
239000010410 layer Substances 0.000 description 57
229910052751 metal Inorganic materials 0.000 description 13
239000000463 material Substances 0.000 description 8
229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 6
229920000915 polyvinyl chloride Polymers 0.000 description 5
239000004800 polyvinyl chloride Substances 0.000 description 5
230000002093 peripheral effect Effects 0.000 description 3
229920000515 polycarbonate Polymers 0.000 description 3
239000004417 polycarbonate Substances 0.000 description 3
230000000717 retained effect Effects 0.000 description 3
239000004831 Hot glue Substances 0.000 description 2
239000002365 multiple layer Substances 0.000 description 2
229910000679 solder Inorganic materials 0.000 description 2
239000002131 composite material Substances 0.000 description 1
238000007906 compression Methods 0.000 description 1
238000006073 displacement reaction Methods 0.000 description 1
238000005516 engineering process Methods 0.000 description 1
238000012966 insertion method Methods 0.000 description 1
238000002844 melting Methods 0.000 description 1
230000008018 melting Effects 0.000 description 1
238000003801 milling Methods 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000007639 printing Methods 0.000 description 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

Credit Cards Or The Like (AREA)

CA2702160A 2007-11-08 2008-10-23 Appareil d'interface electronique et procede et systeme pour sa fabrication Active CA2702160C (fr)

Applications Claiming Priority (5)

Application Number	Priority Date	Filing Date	Title
PCT/IL2007/001378 WO2008129526A2 (fr)	2007-04-24	2007-11-08	Appareil d'interface électronique et procédé et système de fabrication de celui-ci
ILPCT/IL2007/001378		2007-11-08
ILPCT/IL2008/000538		2008-04-17
PCT/IL2008/000538 WO2008129547A2 (fr)	2007-04-24	2008-04-17	Procédé et système de fabrication d'une carte d'interface électronique et carte fabriquée à l'aide de ceux-ci
PCT/IL2008/001397 WO2009060425A2 (fr)	2007-11-08	2008-10-23	Appareil d'interface électronique et procédé et système pour sa fabrication

Publications (2)

Publication Number	Publication Date
CA2702160A1 true CA2702160A1 (fr)	2009-05-14
CA2702160C CA2702160C (fr)	2013-08-13

Family

ID=42238549

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CA2702160A Active CA2702160C (fr)	2007-11-08	2008-10-23	Appareil d'interface electronique et procede et systeme pour sa fabrication

Country Status (3)

Country	Link
KR (1)	KR101103186B1 (fr)
CA (1)	CA2702160C (fr)
MX (1)	MX2010004338A (fr)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP0976104A2 (fr)	1996-03-14	2000-02-02	PAV Card GmbH	Carte a puce, systeme de connexion et procede de production d'une carte a puce
FR2788646B1 (fr)	1999-01-19	2007-02-09	Bull Cp8	Carte a puce munie d'une antenne en boucle, et micromodule associe
GB2371264A (en)	2001-01-18	2002-07-24	Pioneer Oriental Engineering L	Smart card with embedded antenna
US6857552B2 (en)	2003-04-17	2005-02-22	Intercard Limited	Method and apparatus for making smart card solder contacts

2008
- 2008-10-23 CA CA2702160A patent/CA2702160C/fr active Active
- 2008-10-23 KR KR1020107012242A patent/KR101103186B1/ko active IP Right Grant
- 2008-10-23 MX MX2010004338A patent/MX2010004338A/es active IP Right Grant

Also Published As

Publication number	Publication date
KR20100080854A (ko)	2010-07-12
KR101103186B1 (ko)	2012-01-04
CA2702160C (fr)	2013-08-13
MX2010004338A (es)	2010-06-08

Legal Events

Date	Code	Title	Description
2011-01-27	EEER	Examination request

Publication	Publication Date	Title
US8333004B2 (en)	2012-12-18	Electronic interface apparatus and method and system for manufacturing same
AU2018278977B2 (en)	2020-10-22	Chip card manufacturing method, and chip card obtained by said method
CN108885709B (zh)	2022-06-14	制造芯片卡和芯片卡天线支撑件的方法
CA2790395A1 (fr)	2011-08-25	Interconnexion de carte a puce
US10804226B2 (en)	2020-10-13	Method for manufacturing chip cards and chip card obtained by said method
JP4286945B2 (ja)	2009-07-01	接触型非接触型共用ｉｃカードとその製造方法
CA2702160C (fr)	2013-08-13	Appareil d'interface electronique et procede et systeme pour sa fabrication
WO2009060425A2 (fr)	2009-05-14	Appareil d'interface électronique et procédé et système pour sa fabrication
JP2008269648A (ja)	2008-11-06	接触型非接触型共用ｉｃカード
JP2010117833A (ja)	2010-05-27	インレイ及びその製造方法並びに非接触型情報媒体
JP2023150282A (ja)	2023-10-16	デュアルインターフェースｉｃカードおよびその製造方法
JP2023017659A (ja)	2023-02-07	デュアルインターフェースカードおよびその製造方法
JP2023028239A (ja)	2023-03-03	デュアルインターフェースカードおよびその製造方法