CA2377189A1 - Dispositifs microelectriques et leurs procedes de fabrication - Google Patents

Dispositifs microelectriques et leurs procedes de fabrication Download PDF

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Publication number
CA2377189A1
CA2377189A1 CA002377189A CA2377189A CA2377189A1 CA 2377189 A1 CA2377189 A1 CA 2377189A1 CA 002377189 A CA002377189 A CA 002377189A CA 2377189 A CA2377189 A CA 2377189A CA 2377189 A1 CA2377189 A1 CA 2377189A1
Authority
CA
Canada
Prior art keywords
substrate
sacrificial material
diaphragm layer
void
transducer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA002377189A
Other languages
English (en)
Inventor
Peter J. Schiller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
University of Minnesota
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CA2377189A1 publication Critical patent/CA2377189A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0118—Cantilevers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)

Abstract

La présente invention concerne des dispositifs microélectriques, des ensembles substrats à partir desquels on peut fabriquer ces dispositifs, et des procédés de fabrication de ces dispositifs. Cette invention associe les avantages de processus classiques de micro-usinage de volume et de surface utilisant une couche sacrificielle pour créer une technique de système mécanique microélectrique intégré (MEMS) caractérisé par des performances supérieures, un haut rendement, et une tolérance de fabrication. Les dispositifs fabriqués selon cette invention sont, entre autres, des capteurs de pression, des capteurs de vibration, des accéléromètres, des pompes à gaz ou à liquides, des dispositifs résonnants, et des détecteurs infrarouges.
CA002377189A 1999-06-29 2000-06-29 Dispositifs microelectriques et leurs procedes de fabrication Abandoned CA2377189A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14141399P 1999-06-29 1999-06-29
US60/141,413 1999-06-29
PCT/US2000/017988 WO2001000523A1 (fr) 1999-06-29 2000-06-29 Dispositifs microelectriques et leurs procedes de fabrication

Publications (1)

Publication Number Publication Date
CA2377189A1 true CA2377189A1 (fr) 2001-01-04

Family

ID=22495586

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002377189A Abandoned CA2377189A1 (fr) 1999-06-29 2000-06-29 Dispositifs microelectriques et leurs procedes de fabrication

Country Status (4)

Country Link
EP (1) EP1196349A1 (fr)
AU (1) AU5901100A (fr)
CA (1) CA2377189A1 (fr)
WO (1) WO2001000523A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6816301B1 (en) 1999-06-29 2004-11-09 Regents Of The University Of Minnesota Micro-electromechanical devices and methods of manufacture
US20040069067A1 (en) * 2001-02-23 2004-04-15 Guiseppe Mancinone Fluorescence measurement apparatus and method
GB2383546B (en) * 2001-12-28 2006-03-01 Norchip As Fluid manipulation in a microfabricated reaction chamber system
WO2003060157A2 (fr) 2001-12-28 2003-07-24 Norchip As Manipulation de fluide dans un systeme de chambre de reaction microfabrique
DE10320357B4 (de) * 2003-05-07 2010-05-12 Perkinelmer Optoelectronics Gmbh & Co.Kg Strahlungssensor, Wafer, Sensorarray und Sensormodul
US7181281B1 (en) 2003-10-08 2007-02-20 Pacesetter, Inc. ICD using MEMS for optimal therapy
GB2453104B (en) * 2007-09-19 2012-04-25 Wolfson Microelectronics Plc Mems device and process
GB2452941B (en) 2007-09-19 2012-04-11 Wolfson Microelectronics Plc Mems device and process

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4784721A (en) * 1988-02-22 1988-11-15 Honeywell Inc. Integrated thin-film diaphragm; backside etch
JPH0233974A (ja) * 1988-07-22 1990-02-05 Mitsubishi Electric Corp 圧力変換素子の製造方法
US5209119A (en) * 1990-12-12 1993-05-11 Regents Of The University Of Minnesota Microdevice for sensing a force
DE4227819C2 (de) * 1991-08-22 1996-10-17 Yamatake Honeywell Co Ltd Kapazitiver Drucksensor
US5332469A (en) * 1992-11-12 1994-07-26 Ford Motor Company Capacitive surface micromachined differential pressure sensor
JPH08236784A (ja) * 1995-02-23 1996-09-13 Tokai Rika Co Ltd 加速度センサ及びその製造方法
JP3536516B2 (ja) * 1996-02-28 2004-06-14 株式会社ニコン フローティング構造の形成方法

Also Published As

Publication number Publication date
WO2001000523A9 (fr) 2002-07-25
AU5901100A (en) 2001-01-31
WO2001000523A1 (fr) 2001-01-04
EP1196349A1 (fr) 2002-04-17

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Legal Events

Date Code Title Description
FZDE Discontinued